WO2012056269A1

WO2012056269A1 - A light emitting diode light module with its module housing as a heat sink

Info

Publication number: WO2012056269A1
Application number: PCT/IB2010/054871
Authority: WO
Inventors: Wen Chin Chen; Daniel Beasley; Kong Yeow Lai; Yong Kong Khor; Ming Cheang Leow
Original assignee: Iq Group Sdn Bhd
Priority date: 2010-10-28
Filing date: 2010-10-28
Publication date: 2012-05-03
Also published as: DE212010000229U1; CN203517653U

Abstract

A light emitting diode light module (100) includes a thermally conductive module housing (15) which is hinged to the top of a circuit box (200) electrically connected to a sensor (300). The module housing (15) is an extrusion or a casting. Heat generated from a light emitting diode light source is transferred to the module housing (15) acting as a heat sink. The upper portion (151) of the module housing (15) defines a tube-like enclosure or an open enclosure. The middle portion (152) of the module housing (15) defines an open mounting space which receives a light emitting diode light assembly. The bottom portion (153) of the module housing (15) incorporates a hinge mechanism (22). Light emitted therefrom is adjustably focused.

Description

Title of Invention: A LIGHT EMITTING DIODE LIGHT

MODULE WITH ITS MODULE HOUSING AS A HEAT SINK

Technical Field

[1] The present invention relates generally to a light emitting diode light apparatus

comprising a light emitting diode light module, a circuit box and a sensor. It refers specifically to the light emitting diode light module comprising a thermally conductive module housing and various other components; and the module housing therein acts as a heat sink.

Background Art

[2] Light emitting diodes are widely used in lighting engineering. Except for small low power light emitting diodes, heat sinks must always be designed and used to keep the light emitting diode temperature within the limits recommended by the manufacturer. Good heat dissipation increases the life of light emitting diodes and improves their performance.

[3] Currently, fin elements are most used as a heat sinking means, which is in contact with one or more light emitting diode light sources. A main disadvantage of using fin elements is that these fin elements are externally visible on a light emitting diode light housing and often affect the aesthetics of the light emitting diode light housing.

[4] There are also several patents on heat sink designs for light emitting diodes. Some of them are listed below to explain the background of relevant heat sinking knowledge.

[5] United States Patent Number 6517218 teaches a light emitting diode integrated heat sink. An electrically driven light emitting diode assembly comprises a light emitting diode, first and second electrical leads for conducting electricity to and from the light emitting diode, and a heat sink.

[6] United States Patent Number 7679096 teaches an integrated light emitting diode heat sink for use with a high output light emitting diode light source. The heat sink is used with a light emitting diode and conical reflector. The heat sink has a cylindrical back end holding the light emitting diode. The heat sink includes a conically shaped wall having an inner surface, an outer surface and an open front end. The open front end has a rim with notches. The reflector has a front flat surface with arms which are fixed in the notches with a fastener. The heat sink includes a plurality of slits formed at the inner and outer surfaces extending between the back and front ends.

Summary of the Invention

[7] As a primary object, the present invention is to provide a thermally conductive

module housing therein a light emitting diode light module, which acts as a heat sink. [8] Another object of the present invention is to equip the light emitting diode light module with or without a motion and/or dusk activation sensor electrically connected to a circuit box, thus making up a light emitting diode light apparatus.

[9] The other object of the present invention is to adjust the position of the light emitting diode light module in a wide range of angles.

[10] This primary object and other objects are achieved by a light emitting diode light apparatus comprising essentially a light emitting diode light module hinged to the top of a circuit box electrically connected to a sensor. A thermally conductive module housing, either an extrusion or a casting, is in contact with at least one light emitting diode light source whereby the heat generated from the light emitting diode(s) is transferred to the thermally conductive module housing as a heat sink. As a result, the light module becomes compact, slim and aesthetic. The upper portion of the module housing defines a tube-like enclosure or an open enclosure. The middle portion of the module housing defines an open mounting space which receives a light emitting diode light assembly. The bottom portion of the module housing defines an open enclosure to incorporate and engage a hinge mechanism which allows the light module to pivot and rotate to allow positioning in a wide range of angles. The light emitted from the light module can be adjustably focused.

Brief Description of the Drawings

[11] In order that the present invention may be more readily understood, the following description is given, by way of examples, of a thermally conductive module housing, either an extrusion or a casting. Reference will be made to the accompanying drawings, in which:

[12] Figure la is a perspective view of a light emitting diode light module, mounted on a circuit box electrically connected to a sensor, making up a light emitting diode light apparatus.

[13] Figure lb is a front view of the light emitting diode light apparatus as shown in

Figure la.

[14] Figure lc is a side view of the light emitting diode light apparatus as shown in Figure la.

[15] Figure Id is an exploded diagram of a light emitting diode light module assembled from a thermally conductive extrusion module housing and various other components.

[16] Figure le is a side cross-section assembled view of the light emitting diode light module as shown in Figure Id, showing the heat flow directions.

[17] Figure If is a perspective view of the light emitting diode light module with external fin elements, which is mounted on a circuit box electrically connected to a sensor.

[18] Figure 2a is a perspective view of a thermally conductive casting module housing.

[19] Figure 2b is a front view of the thermally conductive casting module housing as shown in Figure 2a.

[20] Figure 2c is a perspective back view of the thermally conductive casting module

housing as shown in Figure 2a.

[21] Figure 2d is a side view of the thermally conductive casting module housing in cross- section, showing the heat flow directions.

[22] Figure 2e is a perspective back view showing partially one side cross-section of the thermally conductive casting module housing as shown in Figure 2a.

Disclosure of Invention

Detailed Description

[23] According to the present invention, a light emitting diode light module (100)

includes essentially a thermally conductive module housing (15) which is preferably an extrusion or a casting, along with other components. To facilitate better understanding, common components and elements in extrusion and casting module housing (15) are given like numerals.

[24] Referring to Figures la, lb and lc, the light emitting diode light module (100) is hinged to the top of a circuit box (200) electrically connected to a sensor (300). The technology to effect a hinge mechanism (22) is well known. The sensor (300) is electrically connected to a known motion and/or dusk activation circuitry. This circuitry is also known and will not be further elaborated.

[25] Referring to Figure Id, various other components in relative positions ready to be assembled to make up the light emitting diode light module (100) are illustrated. The components can be grouped broadly into a thermally conductive extrusion module housing (15), a light emitting diode light assembly and a hinge element (18).

[26] The upper portion (151) of the extrusion module housing (15) defines a tube-like enclosure. The empty space therein the tube-like enclosure provides an air cooling or insulation effect. The tube-like enclosure is also continuously extruded with the rest of the portions, namely the middle portion (152) and the bottom portion (153).

[27] The middle portion (152) of the extrusion module housing (15) defines an open

mounting space which receives a light emitting diode light assembly which will be explained later.

[28] The bottom portion (153) of the extrusion module housing (15) defines an open

enclosure to incorporate and engage a hinge mechanism (22) which allows the assembled light emitting diode light module (100) to pivot and rotate to allow positioning in a wide range of angles. In other words, the light emitting diode light module (100) equipped with a light emitting diode light window (20) is tiltable and adjustable. Since the thermally conductive extrusion module housing (15) is preferably curved, light emitted from the light window (20) in the middle portion (152) of the extrusion module housing (15) can be adjustably focused.

[29] As a result of the teaching of the present invention, the light emitting diode light module (100) becomes compact, slim and aesthetic.

[30] There is a thickened substrate (21) in the middle portion (152) of the extrusion

module housing (15) which is in contact with a metal core printed circuit board (7) carrying at least one light emitting diode light source. The light from the light emitting diode light source is collected and collimated by a reflector (5). This collected and collimated light is directed to at least one light emitting diode lens (2). The light emitting diode lens (2) is mounted thereon the light emitting diode light window (20) provided on a frame (1). These components and gaskets including a lens gasket (3) and a reflector gasket (6) collectively constitute the above mentioned light emitting diode light assembly.

[31] Referring to Figure le, short arrows are drawn to indicate the heat flow directions in the extrusion module housing (15). The light emitting diode light source is therefore in contact with the extrusion module housing (15) which makes up the light emitting diode light module (100), whereby the heat generated from the light emitting diode light source is transferred to the extrusion module housing (15) acting as a heat sink. The present design of using a module housing (15) as a heat sink can dissipate heat generated from at least one light emitting diode. Number or power of light emitting diodes used ultimately determine the dimensions of the light emitting diode light module (100).

[32] Where more powerful light emitting diode light is to be emitted as in Figure If, more heat is generated. A plurality of short fin elements (400) are additionally fitted to the back of the extrusion module housing (15), to dissipate the extra heat. Since majority of heat generated is already dissipated by the original heat sink design of the extrusion module housing (15), the dimensions of these fin elements (400) are much reduced. In other words, when the nominal power of light emitting diode has increased, a plurality of short fin elements (400) are integrally provided at the back of the extrusion module housing (15).

[33] Figures 2a to 2e illustrate various views of a light emitting diode light module (100) including essentially a casting module housing (15), a light emitting diode light assembly and other components. Fin elements (400) are built-in and hidden from view.

[34] Referring to Figure 2c, the upper portion (151) of the casting module housing (15) defines an open enclosure. The empty air space provides an air cooling or insulation effect. The open enclosure is also continuously casted with the rest of the portions, namely the middle portion (152) and the bottom portion (153).

[35] The middle portion (152) of the casting module housing (15) defines an open

mounting space which receives a light emitting diode light assembly previously explained.

[36] The bottom portion (153) of the casting module housing (15) defines an open

enclosure. A hinge element (9) is disposed at the back of the casting module housing (15) towards its base. The hinge element (9) subsequently incorporates and engages the hinge mechanism (22). As previously explained, this hinge mechanism (22) allows the light emitting diode light module (100) to pivot and rotate to allow positioning in a wide range of angles. In other words, the light emitting diode light module (100) equipped with a light emitting diode light window (20) is tiltable and adjustable.

[37] Referring to Figures 2d and 2e, the above casting design includes a plurality of fin elements (400) which are disposed at the open spaces provided by its upper portion (151) and its bottom portion (153). The compartmentized air spaces provide further air cooling or insulation effect. It is important to note that these fin elements (400) are hidden from view.

Claims

[Claim 1] A light emitting diode light apparatus comprising a light emitting diode light module (100), a circuit box (200) equipped with or without a motion and/or dusk activation sensor (300) is characterized in that the light emitting diode light module (100) comprises essentially a thermally conductive module housing (15), a light emitting diode light assembly and a hinge element (9, 18), and with various other components;

the light emitting diode light module (100) is hinged to the top of the circuit box (200); and

a light emitting diode light source therein the light emitting diode light assembly is in contact with the module housing (15),

whereby heat generated from the light emitting diode light source is transferred to the module housing (15) acting as a heat sink.

[Claim 2] A light emitting diode light module (100) with a thermally conductive module housing (15) as in Claim 1 in which

the upper portion (151) of the module housing (15) defines a tube-like enclosure or an open enclosure;

the middle portion (152) of the module housing (15) defines an open mounting space which receives a light emitting diode light assembly; the bottom portion (153) of the module housing (15) defines an open enclosure to incorporate and engage a hinge mechanism (22).

[Claim 3] A light emitting diode light module (100) with a thermally conductive module housing (15) as in Claim 2 in which

the light emitting diode light assembly includes a light emitting diode light source, a metal core printed circuit board (7), a reflector gasket (6), a reflector (5), a light emitting diode lens (2), a lens gasket (3) and a frame (1) with a light emitting diode light window (20).

[Claim 4] A light emitting diode light module (100) with a thermally conductive module housing (15) as in Claim 3 in which the hinge mechanism (22) allows the light emitting diode light module (100) to pivot and rotate to allow positioning in a wide range of angles; and the light module (100) with the light emitting diode light window (20) is tiltable and adjustable, whereby light emitted from the light emitting diode light window (20) is adjustably focused.

[Claim 5] A light emitting diode light module (100) with a thermally conductive module housing (15) as in Claim 2 in which the module housing (15) is an extrusion.

A light emitting diode light module (100) with a thermally conductive module housing (15) as in Claim 5 in which a plurality of fin elements (400) are additionally disposed at the back of the extrusion module housing (15).

A light emitting diode light module (100) with a thermally conductive module housing (15) as in Claim 2 in which the module housing (15) is a casting.

A light emitting diode light module (100) with a thermally conductive module housing (15) as in Claim 7 in which

a plurality of fin elements (400) are disposed at the open spaces provided by the upper portion (151) and the bottom portion (153) of the casting module housing (15),

whereby the compartmentized air spaces provide further air cooling or insulation effect, and said fin elements (400) are built in and hidden from view.