DD279979B5 - Vorrichtung fuer die Ultraschallkontaktierung - Google Patents
Vorrichtung fuer die Ultraschallkontaktierung Download PDFInfo
- Publication number
- DD279979B5 DD279979B5 DD30014887A DD30014887A DD279979B5 DD 279979 B5 DD279979 B5 DD 279979B5 DD 30014887 A DD30014887 A DD 30014887A DD 30014887 A DD30014887 A DD 30014887A DD 279979 B5 DD279979 B5 DD 279979B5
- Authority
- DD
- German Democratic Republic
- Prior art keywords
- pin
- axis
- bonding head
- bonding
- drum
- Prior art date
Links
- 238000003466 welding Methods 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims abstract description 3
- 230000000977 initiatory effect Effects 0.000 claims 1
- 210000003128 head Anatomy 0.000 description 31
- 238000005286 illumination Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 235000008694 Humulus lupulus Nutrition 0.000 description 1
- 244000025221 Humulus lupulus Species 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 210000001061 forehead Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD30014887A DD279979B5 (de) | 1987-02-25 | 1987-02-25 | Vorrichtung fuer die Ultraschallkontaktierung |
DE19873739957 DE3739957A1 (de) | 1987-02-25 | 1987-11-25 | Vorrichtung fuer die ultraschall-drahtkontaktierung |
HU875426A HU199037B (en) | 1987-02-25 | 1987-12-02 | Apparatus for bonding with ultrasonic sound |
US07/130,053 US4792079A (en) | 1987-02-25 | 1987-12-08 | Apparatus for ultrasonic wire bonding |
FR8717817A FR2611155B3 (fr) | 1987-02-25 | 1987-12-21 | Dispositif de soudage aux ultrasons notamment pour des composants semi-conducteurs avec un guidage axial et radial de la tete de soudage rotative |
CH607/88A CH673727A5 (fr) | 1987-02-25 | 1988-02-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD30014887A DD279979B5 (de) | 1987-02-25 | 1987-02-25 | Vorrichtung fuer die Ultraschallkontaktierung |
Publications (1)
Publication Number | Publication Date |
---|---|
DD279979B5 true DD279979B5 (de) | 1994-07-21 |
Family
ID=5587006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DD30014887A DD279979B5 (de) | 1987-02-25 | 1987-02-25 | Vorrichtung fuer die Ultraschallkontaktierung |
Country Status (6)
Country | Link |
---|---|
US (1) | US4792079A (fr) |
CH (1) | CH673727A5 (fr) |
DD (1) | DD279979B5 (fr) |
DE (1) | DE3739957A1 (fr) |
FR (1) | FR2611155B3 (fr) |
HU (1) | HU199037B (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2789384B2 (ja) * | 1990-10-16 | 1998-08-20 | 株式会社新川 | タブテープへの半導体素子接合方法及び超音波ボンデイング装置 |
DE19601599C1 (de) * | 1995-08-15 | 1997-02-20 | Hesse & Knipps Gmbh | Anordnung zur Führung von Drähten |
US5897048A (en) * | 1996-11-08 | 1999-04-27 | Asm Assembly Automation Ltd. | Radial wire bonder and selectable side view inspection system |
US6296172B1 (en) | 2000-03-28 | 2001-10-02 | General Electric Company | Method of sealing disk slots for turbine bucket dovetails |
DE10101236A1 (de) * | 2001-01-12 | 2002-07-25 | Schunk Ultraschalltechnik Gmbh | Verfahren und Vorrichtung zum Verbinden von Leitern |
US7320423B2 (en) * | 2002-11-19 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | High speed linear and rotary split-axis wire bonder |
US7320424B2 (en) * | 2004-05-05 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | Linear split axis wire bonder |
CN101052493A (zh) * | 2004-09-22 | 2007-10-10 | 库利克和索夫工业公司 | 用于引线接合机接合头的运动控制装置 |
US8129220B2 (en) | 2009-08-24 | 2012-03-06 | Hong Kong Polytechnic University | Method and system for bonding electrical devices using an electrically conductive adhesive |
FR3033854A1 (fr) * | 2015-03-18 | 2016-09-23 | Skf Ab | Palier a roulement, notamment pour retroviseur de vehicule automobile |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4239144A (en) * | 1978-11-22 | 1980-12-16 | Kulicke & Soffa Industries, Inc. | Apparatus for wire bonding |
FR2466936A1 (fr) * | 1979-09-28 | 1981-04-10 | Cii Honeywell Bull | Appareil de cablage a la surface d'un substrat d'interconnexion |
-
1987
- 1987-02-25 DD DD30014887A patent/DD279979B5/de not_active IP Right Cessation
- 1987-11-25 DE DE19873739957 patent/DE3739957A1/de not_active Withdrawn
- 1987-12-02 HU HU875426A patent/HU199037B/hu not_active IP Right Cessation
- 1987-12-08 US US07/130,053 patent/US4792079A/en not_active Expired - Fee Related
- 1987-12-21 FR FR8717817A patent/FR2611155B3/fr not_active Expired
-
1988
- 1988-02-18 CH CH607/88A patent/CH673727A5/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CH673727A5 (fr) | 1990-03-30 |
HUT49238A (en) | 1989-08-28 |
US4792079A (en) | 1988-12-20 |
FR2611155A1 (fr) | 1988-08-26 |
DE3739957A1 (de) | 1988-09-08 |
FR2611155B3 (fr) | 1989-07-28 |
HU199037B (en) | 1989-12-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EPAE | Change in the person, name or address of the patentee | ||
UW | Conversion of economic patent into exclusive patent | ||
NPI | Change in the person, name or address of the patentee (addendum to changes before extension act) | ||
EP | Request for examination under paragraph 12(1) filed | ||
B5 | Patent specification, 2nd publ. accord. to extension act | ||
RPV | Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act) | ||
RPV | Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act) | ||
RPV | Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act) | ||
RPV | Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act) | ||
ENJ | Ceased due to non-payment of renewal fee |