DD279979B5 - Vorrichtung fuer die Ultraschallkontaktierung - Google Patents

Vorrichtung fuer die Ultraschallkontaktierung Download PDF

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Publication number
DD279979B5
DD279979B5 DD30014887A DD30014887A DD279979B5 DD 279979 B5 DD279979 B5 DD 279979B5 DD 30014887 A DD30014887 A DD 30014887A DD 30014887 A DD30014887 A DD 30014887A DD 279979 B5 DD279979 B5 DD 279979B5
Authority
DD
German Democratic Republic
Prior art keywords
pin
axis
bonding head
bonding
drum
Prior art date
Application number
DD30014887A
Other languages
German (de)
English (en)
Inventor
Manfred Dipl-Ing Bansemir
Original Assignee
Css Semiconductor Equipment Gm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Css Semiconductor Equipment Gm filed Critical Css Semiconductor Equipment Gm
Priority to DD30014887A priority Critical patent/DD279979B5/de
Priority to DE19873739957 priority patent/DE3739957A1/de
Priority to HU875426A priority patent/HU199037B/hu
Priority to US07/130,053 priority patent/US4792079A/en
Priority to FR8717817A priority patent/FR2611155B3/fr
Priority to CH607/88A priority patent/CH673727A5/de
Publication of DD279979B5 publication Critical patent/DD279979B5/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
DD30014887A 1987-02-25 1987-02-25 Vorrichtung fuer die Ultraschallkontaktierung DD279979B5 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DD30014887A DD279979B5 (de) 1987-02-25 1987-02-25 Vorrichtung fuer die Ultraschallkontaktierung
DE19873739957 DE3739957A1 (de) 1987-02-25 1987-11-25 Vorrichtung fuer die ultraschall-drahtkontaktierung
HU875426A HU199037B (en) 1987-02-25 1987-12-02 Apparatus for bonding with ultrasonic sound
US07/130,053 US4792079A (en) 1987-02-25 1987-12-08 Apparatus for ultrasonic wire bonding
FR8717817A FR2611155B3 (fr) 1987-02-25 1987-12-21 Dispositif de soudage aux ultrasons notamment pour des composants semi-conducteurs avec un guidage axial et radial de la tete de soudage rotative
CH607/88A CH673727A5 (fr) 1987-02-25 1988-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD30014887A DD279979B5 (de) 1987-02-25 1987-02-25 Vorrichtung fuer die Ultraschallkontaktierung

Publications (1)

Publication Number Publication Date
DD279979B5 true DD279979B5 (de) 1994-07-21

Family

ID=5587006

Family Applications (1)

Application Number Title Priority Date Filing Date
DD30014887A DD279979B5 (de) 1987-02-25 1987-02-25 Vorrichtung fuer die Ultraschallkontaktierung

Country Status (6)

Country Link
US (1) US4792079A (fr)
CH (1) CH673727A5 (fr)
DD (1) DD279979B5 (fr)
DE (1) DE3739957A1 (fr)
FR (1) FR2611155B3 (fr)
HU (1) HU199037B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2789384B2 (ja) * 1990-10-16 1998-08-20 株式会社新川 タブテープへの半導体素子接合方法及び超音波ボンデイング装置
DE19601599C1 (de) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Anordnung zur Führung von Drähten
US5897048A (en) * 1996-11-08 1999-04-27 Asm Assembly Automation Ltd. Radial wire bonder and selectable side view inspection system
US6296172B1 (en) 2000-03-28 2001-10-02 General Electric Company Method of sealing disk slots for turbine bucket dovetails
DE10101236A1 (de) * 2001-01-12 2002-07-25 Schunk Ultraschalltechnik Gmbh Verfahren und Vorrichtung zum Verbinden von Leitern
US7320423B2 (en) * 2002-11-19 2008-01-22 Kulicke And Soffa Industries, Inc. High speed linear and rotary split-axis wire bonder
US7320424B2 (en) * 2004-05-05 2008-01-22 Kulicke And Soffa Industries, Inc. Linear split axis wire bonder
CN101052493A (zh) * 2004-09-22 2007-10-10 库利克和索夫工业公司 用于引线接合机接合头的运动控制装置
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
FR3033854A1 (fr) * 2015-03-18 2016-09-23 Skf Ab Palier a roulement, notamment pour retroviseur de vehicule automobile

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4239144A (en) * 1978-11-22 1980-12-16 Kulicke & Soffa Industries, Inc. Apparatus for wire bonding
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion

Also Published As

Publication number Publication date
CH673727A5 (fr) 1990-03-30
HUT49238A (en) 1989-08-28
US4792079A (en) 1988-12-20
FR2611155A1 (fr) 1988-08-26
DE3739957A1 (de) 1988-09-08
FR2611155B3 (fr) 1989-07-28
HU199037B (en) 1989-12-28

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EPAE Change in the person, name or address of the patentee
UW Conversion of economic patent into exclusive patent
NPI Change in the person, name or address of the patentee (addendum to changes before extension act)
EP Request for examination under paragraph 12(1) filed
B5 Patent specification, 2nd publ. accord. to extension act
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
ENJ Ceased due to non-payment of renewal fee