DD250090A5 - Verfahren zur herstellung von prepregs und von metallkasiertem leiterplatten-basismaterial und vorrichtung zur durchfuehrung des verfahrens - Google Patents

Verfahren zur herstellung von prepregs und von metallkasiertem leiterplatten-basismaterial und vorrichtung zur durchfuehrung des verfahrens Download PDF

Info

Publication number
DD250090A5
DD250090A5 DD86295230A DD29523086A DD250090A5 DD 250090 A5 DD250090 A5 DD 250090A5 DD 86295230 A DD86295230 A DD 86295230A DD 29523086 A DD29523086 A DD 29523086A DD 250090 A5 DD250090 A5 DD 250090A5
Authority
DD
German Democratic Republic
Prior art keywords
webs
base material
press
metal foil
zone
Prior art date
Application number
DD86295230A
Other languages
German (de)
English (en)
Inventor
Lothar Schwarz
Friedel Ueberberg
Rudolf Kuehne
Dieter Fischer
Original Assignee
����������@�����������@���Kk��
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ����������@�����������@���Kk�� filed Critical ����������@�����������@���Kk��
Publication of DD250090A5 publication Critical patent/DD250090A5/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/04—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band
    • B30B5/06—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of an endless band co-operating with another endless band
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027—Pressing using at least one press band
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
DD86295230A 1985-10-15 1986-10-13 Verfahren zur herstellung von prepregs und von metallkasiertem leiterplatten-basismaterial und vorrichtung zur durchfuehrung des verfahrens DD250090A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH443085 1985-10-15

Publications (1)

Publication Number Publication Date
DD250090A5 true DD250090A5 (de) 1987-09-30

Family

ID=4275985

Family Applications (1)

Application Number Title Priority Date Filing Date
DD86295230A DD250090A5 (de) 1985-10-15 1986-10-13 Verfahren zur herstellung von prepregs und von metallkasiertem leiterplatten-basismaterial und vorrichtung zur durchfuehrung des verfahrens

Country Status (15)

Country Link
EP (1) EP0225451A3 (zh)
JP (1) JPS62142619A (zh)
KR (1) KR870004648A (zh)
CN (1) CN86107577A (zh)
AU (1) AU6387486A (zh)
BR (1) BR8605030A (zh)
DD (1) DD250090A5 (zh)
DK (1) DK490186A (zh)
FI (1) FI864145A (zh)
HU (1) HUT44054A (zh)
IL (1) IL80277A0 (zh)
NO (1) NO864089L (zh)
PT (1) PT83551A (zh)
YU (1) YU175486A (zh)
ZA (1) ZA867746B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0447642A1 (de) * 1990-03-22 1991-09-25 Bayer Ag Verfahren zum kontinuierlichen Herstellen von laminierten Flächengebilden
DE102008039869B4 (de) * 2008-08-27 2016-11-03 Benteler Sgl Gmbh & Co. Kg Verfahren zum Herstellen von Leichtbauteilen
DE102010008530B4 (de) 2010-02-18 2021-12-09 Siempelkamp Maschinen- Und Anlagenbau Gmbh Anlage zum Herstellen von Fördergurten mit Stahlseileinlage

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01218092A (ja) * 1988-02-26 1989-08-31 Toshiba Corp 印刷配線基板の製造方法
US5167997A (en) * 1989-05-05 1992-12-01 Gould Inc. Protected conductive foil assemblage and procedure for preparing same using static electrical forces
GB9514955D0 (en) * 1995-07-21 1995-09-20 Interconnection Systems Limite Improvements in or relating to printed circuit board manufacture
JP2001138437A (ja) * 1999-11-17 2001-05-22 Sumitomo Bakelite Co Ltd 積層板の製造方法
ES2219174B1 (es) * 2003-03-27 2006-02-01 Chemplate Materials, S.L. "procedimiento para la fabricacion de placas para circuitos impresos y maquina para el mismo".
CN103963395A (zh) * 2013-01-29 2014-08-06 上海杰事杰新材料(集团)股份有限公司 一种彩色连续纤维/聚丙烯复合板材及其制备方法
JP2016079173A (ja) * 2014-10-15 2016-05-16 日本合成化学工業株式会社 新規ピリジン系化合物、それを用いたアニオン硬化性化合物用硬化剤、硬化性組成物及び硬化物
JP6735230B2 (ja) * 2015-03-19 2020-08-05 東レ株式会社 樹脂含浸繊維束の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681171A (en) * 1968-08-23 1972-08-01 Hitachi Ltd Apparatus for producing a multilayer printed circuit plate assembly
US3687894A (en) * 1970-07-23 1972-08-29 William G Collings A composition of a liquid epoxy resin, a polyhydroxyl material and a hardener
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
JPS57196598A (en) * 1981-05-29 1982-12-02 Hitachi Ltd Method of producing multilayer printed board
CA1276358C (en) * 1984-01-31 1990-11-13 Dieter H. Klein Epoxy resin for preparing electric laminates
DE3413434A1 (de) * 1984-04-10 1985-10-17 Dielektra GmbH, 5000 Köln Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0447642A1 (de) * 1990-03-22 1991-09-25 Bayer Ag Verfahren zum kontinuierlichen Herstellen von laminierten Flächengebilden
DE102008039869B4 (de) * 2008-08-27 2016-11-03 Benteler Sgl Gmbh & Co. Kg Verfahren zum Herstellen von Leichtbauteilen
DE102010008530B4 (de) 2010-02-18 2021-12-09 Siempelkamp Maschinen- Und Anlagenbau Gmbh Anlage zum Herstellen von Fördergurten mit Stahlseileinlage

Also Published As

Publication number Publication date
YU175486A (en) 1988-06-30
ZA867746B (en) 1988-06-29
IL80277A0 (en) 1987-01-30
JPS62142619A (ja) 1987-06-26
EP0225451A2 (de) 1987-06-16
FI864145A0 (fi) 1986-10-14
KR870004648A (ko) 1987-05-11
BR8605030A (pt) 1987-07-14
CN86107577A (zh) 1987-04-29
EP0225451A3 (de) 1989-07-19
AU6387486A (en) 1987-04-16
FI864145A (fi) 1987-04-16
NO864089D0 (no) 1986-10-14
NO864089L (no) 1987-04-21
DK490186A (da) 1987-04-16
HUT44054A (en) 1988-01-28
DK490186D0 (da) 1986-10-14
PT83551A (pt) 1987-05-29

Similar Documents

Publication Publication Date Title
EP0158027B2 (de) Verfahren zum Herstellen von kupferkaschiertem Basismaterial für Leiterplatten
DE3785226T2 (de) Kontinuierliches verfahren zur herstellung von leiterplatten.
DE69320197T2 (de) Verfahren zur herstellung einer ud-verstärkten leiterplatte
DE69102377T2 (de) Harzimpregnierverfahren für ein Fasersubstrat und Vorrichtung.
DE2410409C3 (de) Verfahren zur Herstellung von Schichtstoffen
DE3238160C2 (de) Verfahren und Vorrichtung zur kontinuierlichen Herstellung von Kupferdeckschicht-Laminatplatten
DD250090A5 (de) Verfahren zur herstellung von prepregs und von metallkasiertem leiterplatten-basismaterial und vorrichtung zur durchfuehrung des verfahrens
DE3840704A1 (de) Verfahren zur erzeugung eines kupferplattierten schichtstoffs
EP0397976A2 (de) Verfahren zur Herstellung von Verbundwerkstoffen
DE2417420B2 (de) Verfahren zur herstellung von verstaerkten harzlaminaten
WO2008055458A1 (de) Verfahren zur herstellung von blattfedern aus einem faserverbundwerkstoff
DE69509227T2 (de) Verfahren zur herstellung einer mehrschichtigen leiterplatte aus schichten verstärkt mit längsgerichteten fasern, schichten verstärkt mit quergerichteten fasern und mindestens einer metallenen mittelschicht
DE3714997C2 (zh)
DE69307948T2 (de) Verfahren zur Herstellung eines kupferkaschierten Laminats
DE2040035A1 (de) Verfahren zur Herstellung von mit Metall plattierten Schichtstoffen
WO1997017199A1 (de) Laminatmaterial für leiterplatten sowie verfahren zu seiner herstellung
EP2851182B1 (de) 1K-System, daraus herzustellende Erzeugnisse und Verfahren zur Herstellung von Faserverbundhalbzeugen und -bauteilen mit dem 1K-System
EP0019754A1 (de) Verfahren zum Verbinden eines Flächengebildes aus thermoplastischem Kunststoff mit einem Polyesterfaservlies
EP0558547B1 (de) Verfahren zur herstellung von kupferkaschierten basismaterialtafeln
DE8560011U1 (de) Vorrichtung zum Herstellen von metallkaschiertem Basismaterial für Leiterplatten
EP0158343B1 (de) Verfahren zur Herstellung von mehrschichtigen Schichtpressstoffen und die dabei erhaltenen Schichtpressstoffe
DE4110219A1 (de) Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
EP0130312A2 (de) Kontinuierliches Verfahren zur Herstellung metallkaschierter Schichtpressstoffe
AT388167B (de) Verfahren zur herstellung einer im wesentlichen nicht orientierten folie mit aufgerauhter oberflaeche und verwendung derselben
EP4404443A1 (de) Verfahren zum herstellen eines verbunds aus elektroblechen