DD161115A3 - Halbleiter-modul - Google Patents

Halbleiter-modul Download PDF

Info

Publication number
DD161115A3
DD161115A3 DD81229458A DD22945881A DD161115A3 DD 161115 A3 DD161115 A3 DD 161115A3 DD 81229458 A DD81229458 A DD 81229458A DD 22945881 A DD22945881 A DD 22945881A DD 161115 A3 DD161115 A3 DD 161115A3
Authority
DD
German Democratic Republic
Prior art keywords
kopnyca
nyhkty
nyhkt
noyhkty
κορ
Prior art date
Application number
DD81229458A
Other languages
German (de)
English (en)
Inventor
Michal Pellant
Jiri Lanka
Timotej Simko
Original Assignee
Ckd Praha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Praha filed Critical Ckd Praha
Publication of DD161115A3 publication Critical patent/DD161115A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Thyristors (AREA)
DD81229458A 1980-06-10 1981-04-21 Halbleiter-modul DD161115A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS804087A CS214034B1 (en) 1980-06-10 1980-06-10 Semiconductor modulus

Publications (1)

Publication Number Publication Date
DD161115A3 true DD161115A3 (de) 1984-10-24

Family

ID=5382853

Family Applications (1)

Application Number Title Priority Date Filing Date
DD81229458A DD161115A3 (de) 1980-06-10 1981-04-21 Halbleiter-modul

Country Status (3)

Country Link
CS (1) CS214034B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DD (1) DD161115A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3123036A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406528A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
DE3621994A1 (de) * 1986-07-01 1988-01-14 Bbc Brown Boveri & Cie Leistungshalbleitermodul
DE9413550U1 (de) * 1994-08-23 1996-01-11 Dylec Ltd., Saint Peter Port, Guernsey Halbleiteranordnung mit wenigstens einem Halbleiterbauelement
FR2754390A1 (fr) * 1996-10-07 1998-04-10 Gec Alsthom Transport Sa Module de puissance a composants electroniques semi-conducteurs de puissance et interrupteur de forte puissance comportant au moins un tel module de puissance
DE102004058946B4 (de) * 2004-12-08 2009-06-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Hilfsanschluss
EP2489956B2 (de) * 2011-02-21 2020-09-09 Gerdes Holding GmbH & Co. KG Kühleinrichtung eines elektrischen, sich erwärmenden Bauelements

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3363150A (en) * 1964-05-25 1968-01-09 Gen Electric Glass encapsulated double heat sink diode assembly
GB1183291A (en) * 1968-02-14 1970-03-04 Siemens Ag Rectifier Arrangement
DE2456955A1 (de) * 1974-12-02 1976-07-08 Licentia Gmbh Anordnung fuer aus leiterplatten zusammengesetzte dioden- und gleichrichterschaltungen
JPS583386B2 (ja) * 1975-10-11 1983-01-21 株式会社日立製作所 ソウホウコウセイホトサイリスタ
DE2639974A1 (de) * 1976-09-04 1978-03-09 Thermoplan Waermetechnische An Vorrichtung zum verschwelen von abfaellen aller art
DE2641032C2 (de) * 1976-09-11 1982-09-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Stromrichtermodul
DE2728564A1 (de) * 1977-06-24 1979-01-11 Siemens Ag Halbleiterbauelement
US4160992A (en) * 1977-09-14 1979-07-10 Raytheon Company Plural semiconductor devices mounted between plural heat sinks
DE2819327C2 (de) * 1978-05-03 1984-10-31 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit

Also Published As

Publication number Publication date
CS214034B1 (en) 1982-04-09
DE3123036C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-05-03
DE3123036A1 (de) 1982-03-18

Similar Documents

Publication Publication Date Title
DD161115A3 (de) Halbleiter-modul
Kahane et al. Carbon, nitrogen, sulfur and silicon isotopic ratios in the envelope of IRC+ 10216
Schult Effect of pressure on the Curie temperature of titanomagnetites [(1− x)· Fe3O4− x· TiFe2O4]
Lan et al. Geochemistry, U-Pb zircon geochronology and Sm-Nd isotopes of the Xincai banded iron formation in the southern margin of the North China Craton: implications on Neoarchean seawater compositions and solute sources
GB2152954B (en) Soldering device with flux exhibiting colour temperature change
IE37596B1 (en) 21-substituted 3alpha-hydroxy pregnanes
Wu et al. Trace element geochemistry, oxygen isotope and U–Pb geochronology of multistage scheelite: Implications for W-mineralization and fluid evolution of Shizhuyuan W–Sn deposit, South China
Franzen et al. The X-ray photoelectron spectra of MnS, MnSe, and MnTe
JPS5727494A (en) Magneto-optical storage element
GB1270584A (en) Sterilized package
DE2521163C2 (de) Einrichtung zur ermittlung einer der drehzahl oder dem drehwinkel einer achse entsprechenden groesse
DE10356224A1 (de) Taktscheibenbefestigung
IL26063A (en) Coating composition for a can body
Kourov et al. Specific features of the electrical resistivity of half-metallic ferromagnets Co2 Me Al (Me= Ti, V, Cr, Mn, Fe)
DE102005057641B4 (de) Turbomolekularvakuumpumpe mit berührungsloser Rotortemperaturmessung
Pattrick et al. The oxidation state of copper and cobalt in carrollite, CuCo2S4
EP0678646A1 (de) Vorrichtung zur Erfassung der Drehbewegung eines Zahn- oder Nockenrads
DE202016101523U1 (de) Sensorgehäuse
US275498A (en) Treatment of caustic soda
US1913494A (en) Auxiliary gear mechanism for meter transmission
DE19822946A1 (de) Verfahren und Vorrichtung zum Feststellen der Drehfeldrichtung hinter einem Drehstrom-Frequenzumrichter
DE10159437B4 (de) Drehwinkelsensor
Zaghloul et al. Post-Aswan High Dam changes of the Nile Delta coast, east of Ras El Bar, interpreted from aerial photographs
JPS56129264A (en) Coal tar epoxy resin paint
DE1815419C (de) Verfahren zum Messen der Starke einer auf einem Trager aufgedampften Schicht und Anordnung zur Ausübung dieses Ver fahrens

Legal Events

Date Code Title Description
ENJ Ceased due to non-payment of renewal fee