CY1121483T1 - Ραβδος φωτος led - Google Patents

Ραβδος φωτος led

Info

Publication number
CY1121483T1
CY1121483T1 CY20191100187T CY191100187T CY1121483T1 CY 1121483 T1 CY1121483 T1 CY 1121483T1 CY 20191100187 T CY20191100187 T CY 20191100187T CY 191100187 T CY191100187 T CY 191100187T CY 1121483 T1 CY1121483 T1 CY 1121483T1
Authority
CY
Cyprus
Prior art keywords
led light
light source
support base
electrically conductive
metal plates
Prior art date
Application number
CY20191100187T
Other languages
English (en)
Inventor
Ming Chen
Yonghong Qiu
Liang Guo
Jiye Wu
Original Assignee
Shanghai Sansi Electronics Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Sansi Electronics Engineering Co., Ltd. filed Critical Shanghai Sansi Electronics Engineering Co., Ltd.
Publication of CY1121483T1 publication Critical patent/CY1121483T1/el

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)

Abstract

Μια ράβδος φωτός LED περιλαμβάνει πολλές πηγές φωτός LED (1) και μία βάση στήριξης ράβδου πηγής φωτός (2). Η βάση στήριξης της πηγής φωτός (2) είναι κατασκευασμένη από μονωτικό και θερμικά αγώγιμο υλικό. Ένα ηλεκτρικό στρώμα που έχει μερικές ηλεκτρικά αγώγιμες μεταλλικές πλάκες είναι ενσωματωμένο σε ένα εσωτερικό μέρος της βάσης στήριξης της πηγής φωτός (2). Οι πηγές φωτός LED (1) συγκολλούνται στις ηλεκτρικά αγώγιμες μεταλλικές πλάκες για να διαμορφώσουν ένα ηλεκτρικά αγώγιμο ηλεκτρικό κύκλωμα. Οι πλευρές φωτισμού των πηγών φωτός LED (1) εκτίθενται σε μια επιφάνεια της βάσης στήριξης της πηγής φωτός (2). Η βάση στήριξης της πηγής φωτός (2) και οι ηλεκτρικά αγώγιμες μεταλλικές πλάκες διαμορφώνονται σε ένα σύνολο. Κάθε πηγή φωτός LED (1) καλύπτεται από φακούς (4).
CY20191100187T 2010-12-28 2019-02-13 Ραβδος φωτος led CY1121483T1 (el)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010106199913A CN102537747A (zh) 2010-12-28 2010-12-28 Led灯条

Publications (1)

Publication Number Publication Date
CY1121483T1 true CY1121483T1 (el) 2020-05-29

Family

ID=45470356

Family Applications (1)

Application Number Title Priority Date Filing Date
CY20191100187T CY1121483T1 (el) 2010-12-28 2019-02-13 Ραβδος φωτος led

Country Status (7)

Country Link
US (1) US8764245B2 (el)
EP (1) EP2472173B1 (el)
JP (1) JP5382959B2 (el)
CN (1) CN102537747A (el)
CY (1) CY1121483T1 (el)
ES (1) ES2713848T3 (el)
SI (1) SI2472173T1 (el)

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WO2014028823A1 (en) * 2012-08-16 2014-02-20 Leading Energy Designs, Ltd. Led bracket apparatus for high-output led lighting systems
CN103104841B (zh) * 2013-01-23 2015-03-04 石振宇 具有高散热性能的led灯单元体及其模组化的大功率led灯具
CN103175013A (zh) * 2013-03-05 2013-06-26 福建省锐驰电子科技有限公司 一种散热型led灯条
US9400087B2 (en) 2013-03-12 2016-07-26 Abl Ip Holding Llc Externally mounted shield for LED luminaire
CN103712084A (zh) * 2014-01-10 2014-04-09 苏州承腾电子科技有限公司 一种led灯带
CN104100954B (zh) * 2014-08-07 2017-01-25 东莞市闻誉实业有限公司 组合式条形散热器以及组合式led照明灯
CN104100953B (zh) * 2014-08-07 2017-07-11 东莞市闻誉实业有限公司 Led路灯散热器以及led路灯
CN104290253B (zh) * 2014-09-04 2017-04-12 万林华 Led灯条管道加工机
USD768888S1 (en) * 2015-06-11 2016-10-11 Osram Gmbh LED lighting module
CN105226172B (zh) * 2015-09-08 2017-07-14 李峰 防水封装结构及其一体成型处理工艺
CN105351765A (zh) * 2015-12-02 2016-02-24 广州市莱帝亚照明科技有限公司 一种led光条模组的制造方法
CN105605470A (zh) * 2016-02-19 2016-05-25 德清弘昌照明电器有限公司 一种带散热装置的led装饰灯条
KR200485494Y1 (ko) * 2016-10-10 2018-01-15 박상희 엘이디 pl 조명장치
CN106402741A (zh) * 2016-10-17 2017-02-15 成都尚智恒达科技有限公司 户外照明灯的灯体组件
US10286627B2 (en) 2016-11-01 2019-05-14 Charter Nex Films, Inc. Reusable, non-adhesive protective cover

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328469Y2 (el) * 1985-04-25 1991-06-19
US6988819B2 (en) * 2003-09-05 2006-01-24 Guide Corporation Lamp housing containing an integrated LED support structure
JP2005129638A (ja) * 2003-10-22 2005-05-19 Tokai Rika Co Ltd 回路装置およびその製造方法
CA2554863C (en) * 2004-01-28 2012-07-10 Tir Systems Ltd. Directly viewable luminaire
US7572027B2 (en) * 2005-09-15 2009-08-11 Integrated Illumination Systems, Inc. Interconnection arrangement having mortise and tenon connection features
CN100478609C (zh) * 2006-07-18 2009-04-15 安提亚科技股份有限公司 高功率led光条结构
US8052303B2 (en) * 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
CN101145592B (zh) * 2006-09-13 2010-09-29 佰鸿工业股份有限公司 高散热性发光二极管装置
JP4941207B2 (ja) * 2007-09-28 2012-05-30 日亜化学工業株式会社 照明ユニットおよびそれを用いた照明灯
TWM341793U (en) * 2007-10-19 2008-10-01 Semiconductor Device Solution Inc Lamp structure with wireless control
CN201363590Y (zh) * 2009-01-22 2009-12-16 上海开腾信号设备有限公司 光型饱满柔和的大功率led光源及使用该光源的大功率led照明灯
CN201589132U (zh) * 2009-07-09 2010-09-22 上海三思电子工程有限公司 镂空结构的led路灯
CN201555082U (zh) * 2009-11-25 2010-08-18 东莞勤上光电股份有限公司 铜柱散热led灯具
CN201964221U (zh) * 2010-12-28 2011-09-07 嘉善晶辉光电技术有限公司 一种防水led灯条

Also Published As

Publication number Publication date
EP2472173A2 (en) 2012-07-04
JP5382959B2 (ja) 2014-01-08
ES2713848T3 (es) 2019-05-24
EP2472173A3 (en) 2014-12-24
US8764245B2 (en) 2014-07-01
EP2472173B1 (en) 2018-12-05
US20120162977A1 (en) 2012-06-28
CN102537747A (zh) 2012-07-04
JP2012142280A (ja) 2012-07-26
SI2472173T1 (sl) 2019-03-29

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