CS638382A1 - Zarizeni k vysoce produktivnimu rozprasovani na principu plazmatronu - Google Patents

Zarizeni k vysoce produktivnimu rozprasovani na principu plazmatronu

Info

Publication number
CS638382A1
CS638382A1 CS826383A CS638382A CS638382A1 CS 638382 A1 CS638382 A1 CS 638382A1 CS 826383 A CS826383 A CS 826383A CS 638382 A CS638382 A CS 638382A CS 638382 A1 CS638382 A1 CS 638382A1
Authority
CS
Czechoslovakia
Prior art keywords
vysoce
rozprasovani
produktivnimu
principu
plazmatronu
Prior art date
Application number
CS826383A
Other languages
Czech (cs)
Other versions
CS245743B1 (en
Inventor
Wolfgang Erbkamm
Johannes Hartung
Volkmar Spreitz
Klaus Goedicke
Ullrich Heisig
Gerhard Kuehn
Siegfried Schiller
Guenther Beister
Hans Christian Hecht
Original Assignee
Wolfgang Erbkamm
Johannes Hartung
Volkmar Spreitz
Klaus Goedicke
Ullrich Heisig
Gerhard Kuehn
Siegfried Schiller
Guenther Beister
Hans Christian Hecht
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfgang Erbkamm, Johannes Hartung, Volkmar Spreitz, Klaus Goedicke, Ullrich Heisig, Gerhard Kuehn, Siegfried Schiller, Guenther Beister, Hans Christian Hecht filed Critical Wolfgang Erbkamm
Publication of CS638382A1 publication Critical patent/CS638382A1/en
Publication of CS245743B1 publication Critical patent/CS245743B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
CS826383A 1981-10-02 1982-09-02 Apparatus for high-duty spraying based on the principle of plasmatron CS245743B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD23381781A DD217964A3 (en) 1981-10-02 1981-10-02 DEVICE FOR HIGH-RATE SCREENING ACCORDING TO THE PLASMATRON PRINCIPLE

Publications (2)

Publication Number Publication Date
CS638382A1 true CS638382A1 (en) 1985-04-16
CS245743B1 CS245743B1 (en) 1986-10-16

Family

ID=5533920

Family Applications (1)

Application Number Title Priority Date Filing Date
CS826383A CS245743B1 (en) 1981-10-02 1982-09-02 Apparatus for high-duty spraying based on the principle of plasmatron

Country Status (3)

Country Link
CS (1) CS245743B1 (en)
DD (1) DD217964A3 (en)
DE (1) DE3229969A1 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8700620A (en) * 1987-03-16 1988-10-17 Hauzer Holding CATHODE ARC VAPORIZATION DEVICE AND METHOD FOR ITS OPERATION.
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
BE1003701A3 (en) * 1990-06-08 1992-05-26 Saint Roch Glaceries Rotary cathode.
CA2089149C (en) * 1990-08-10 2002-11-26 Eric R. Dickey Shielding for arc suppression in rotating magnetron sputtering systems
US5106474A (en) * 1990-11-21 1992-04-21 Viratec Thin Films, Inc. Anode structures for magnetron sputtering apparatus
US5108574A (en) * 1991-01-29 1992-04-28 The Boc Group, Inc. Cylindrical magnetron shield structure
DE4107505A1 (en) * 1991-03-08 1992-09-10 Leybold Ag METHOD FOR OPERATING A SPUTTER, AND DEVICE FOR CARRYING OUT THE METHOD
DE4117367C2 (en) * 1991-05-28 1999-11-04 Leybold Ag Method for generating a homogeneous removal profile on a rotating target of a sputtering device
US5364518A (en) * 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target
DE4117518C2 (en) * 1991-05-29 2000-06-21 Leybold Ag Device for sputtering with a moving, in particular rotating, target
US5571393A (en) * 1994-08-24 1996-11-05 Viratec Thin Films, Inc. Magnet housing for a sputtering cathode
US5527439A (en) * 1995-01-23 1996-06-18 The Boc Group, Inc. Cylindrical magnetron shield structure
DE19610253C2 (en) * 1996-03-15 1999-01-14 Fraunhofer Ges Forschung Atomizing device
DE10145201C1 (en) * 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Device for coating substrates having a curved surface contains a pair of rectangular magnetron sources and substrate holders arranged in an evacuated chamber
DE10213043B4 (en) * 2002-03-22 2008-10-30 Von Ardenne Anlagentechnik Gmbh Tubular magnetron and its use
DE10234858A1 (en) * 2002-07-31 2004-02-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device for producing a magnetron discharge, especially for magnetron sputtering, in the coating of substrates has a unit producing a magnetic field having a fixed position relative to the outer target limit in the region of the outer pole
EP1626433B1 (en) * 2004-08-10 2007-02-21 Applied Materials GmbH & Co. KG Magnetron sputtering device, cylinder cathode and a method of applying thin multi-component films to a substrate
US20070089982A1 (en) * 2005-10-24 2007-04-26 Hendryk Richert Sputtering target and method/apparatus for cooling the target
US7504011B2 (en) * 2005-10-24 2009-03-17 Guardian Industries Corp. Sputtering target and method/apparatus for cooling the target
US7842355B2 (en) 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
ATE499697T1 (en) † 2006-11-14 2011-03-15 Applied Materials Inc MAGNETRON SPUTTER SOURCE, SPUTTER COATING SYSTEM AND METHOD FOR COATING A SUBSTRATE
US8182662B2 (en) 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
CN101994093B (en) * 2009-08-14 2013-08-21 鸿富锦精密工业（深圳）有限公司 Magnetron sputtering device
DE102010040759B4 (en) * 2010-09-14 2015-10-08 Von Ardenne Gmbh Cooling arrangement for targets of sputter sources
DE102011075543B4 (en) * 2011-05-10 2015-10-08 Von Ardenne Gmbh Arrangement for cooling an elongate magnetron
DE102012203152A1 (en) * 2012-02-29 2013-08-29 Von Ardenne Anlagentechnik Gmbh Method and apparatus for reactive magnetron sputtering a transparent metal oxide layer
EP2746424B1 (en) 2012-12-21 2018-10-17 Oerlikon Surface Solutions AG, Pfäffikon Evaporation source
EP2778253B1 (en) 2013-02-26 2018-10-24 Oerlikon Surface Solutions AG, Pfäffikon Cylindrical evaporation source

Also Published As

Publication number Publication date
DD217964A3 (en) 1985-01-23
DE3229969A1 (en) 1983-04-21
CS245743B1 (en) 1986-10-16

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