CS39192A3 - Electrical connector contact being protected by a polymerized film andprocess for producing thereof - Google Patents
Electrical connector contact being protected by a polymerized film andprocess for producing thereof Download PDFInfo
- Publication number
- CS39192A3 CS39192A3 CS92391A CS39192A CS39192A3 CS 39192 A3 CS39192 A3 CS 39192A3 CS 92391 A CS92391 A CS 92391A CS 39192 A CS39192 A CS 39192A CS 39192 A3 CS39192 A3 CS 39192A3
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- contact
- film
- polymer
- electrical connector
- irradiation
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 26
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 25
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 239000011229 interlayer Substances 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 9
- 229920006254 polymer film Polymers 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229920000620 organic polymer Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 4
- 239000010953 base metal Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 230000010287 polarization Effects 0.000 claims description 2
- 239000002998 adhesive polymer Substances 0.000 claims 1
- 229920002717 polyvinylpyridine Polymers 0.000 claims 1
- YARNEMCKJLFQHG-UHFFFAOYSA-N prop-1-ene;styrene Chemical class CC=C.C=CC1=CC=CC=C1 YARNEMCKJLFQHG-UHFFFAOYSA-N 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 51
- 238000002329 infrared spectrum Methods 0.000 description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 14
- 238000011282 treatment Methods 0.000 description 12
- 229910052786 argon Inorganic materials 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910001369 Brass Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000010951 brass Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 150000002825 nitriles Chemical class 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- -1 for example Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000029142 excretion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007363 ring formation reaction Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- WGHUNMFFLAMBJD-UHFFFAOYSA-M tetraethylazanium;perchlorate Chemical compound [O-]Cl(=O)(=O)=O.CC[N+](CC)(CC)CC WGHUNMFFLAMBJD-UHFFFAOYSA-M 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/068—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using ionising radiations (gamma, X, electrons)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/931—Conductive coating
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9101604A FR2672738A1 (fr) | 1991-02-12 | 1991-02-12 | Contact pour connecteur electrique protege par un film de polymere et son procede de fabrication. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CS39192A3 true CS39192A3 (en) | 1992-09-16 |
Family
ID=9409613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS92391A CS39192A3 (en) | 1991-02-12 | 1992-02-10 | Electrical connector contact being protected by a polymerized film andprocess for producing thereof |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5350323A (cg-RX-API-DMAC7.html) |
| EP (1) | EP0500415B1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP3359652B2 (cg-RX-API-DMAC7.html) |
| CA (1) | CA2060672C (cg-RX-API-DMAC7.html) |
| CS (1) | CS39192A3 (cg-RX-API-DMAC7.html) |
| DE (1) | DE69210443T2 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2672738A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6568073B1 (en) | 1991-11-29 | 2003-05-27 | Hitachi Chemical Company, Ltd. | Process for the fabrication of wiring board for electrical tests |
| US6133534A (en) * | 1991-11-29 | 2000-10-17 | Hitachi Chemical Company, Ltd. | Wiring board for electrical tests with bumps having polymeric coating |
| JPH0767971B2 (ja) * | 1992-06-23 | 1995-07-26 | 忠男 宇野 | 立体形シートブロック集積装置 |
| DE19642563C1 (de) * | 1996-10-15 | 1998-02-26 | Siemens Ag | Chipkarte mit einer Kontaktzone sowie Verfahren zur Herstellung einer solchen Chipkarte |
| KR100267229B1 (ko) | 1997-09-03 | 2000-10-16 | 윤종용 | 인쇄회로기판의금도금단자부오염방지방법 |
| FR2821575B1 (fr) * | 2001-03-02 | 2003-10-24 | Commissariat Energie Atomique | Procede de greffage organique localise sans masque sur des protions conductrices ou semiconductrices de surfaces composites |
| FR2843828A1 (fr) | 2002-08-26 | 2004-02-27 | Commissariat Energie Atomique | Support de garniture et procede de garniture selective de plages conductrices d'un tel support |
| FR2851181B1 (fr) * | 2003-02-17 | 2006-05-26 | Commissariat Energie Atomique | Procede de revetement d'une surface |
| CN112510464A (zh) * | 2020-12-23 | 2021-03-16 | 重庆新原港科技发展有限公司 | 电子深度保护剂在提高连接器耐磨性中的应用 |
| CN112700926A (zh) * | 2020-12-23 | 2021-04-23 | 重庆新原港科技发展有限公司 | 一种电子深度保护剂涂覆方法及其应用 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2480314A1 (fr) * | 1980-04-11 | 1981-10-16 | Commissariat Energie Atomique | Procede de depot par electropolymerisation de films minces organiques sur des surfaces conductrices de l'electricite en particulier sur des surfaces metalliques, et films minces ainsi obtenus |
| EP0041381A1 (en) * | 1980-06-02 | 1981-12-09 | British Aerospace Public Limited Company | Altering the electro-conductive properties of material |
| DE3044111A1 (de) * | 1980-11-24 | 1982-06-24 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung von elektrisch leitfaehigen polymeren und deren verwendung in der elektrotechnik und zur antistatischen ausruestung von kunststoffen |
| US4687274A (en) * | 1984-05-10 | 1987-08-18 | Massachusetts Institute Of Technology | Electrical contacts |
| JPS6265767A (ja) * | 1985-09-17 | 1987-03-25 | Kansai Paint Co Ltd | 鋼材への塗装法 |
| EP0310668B1 (en) * | 1987-04-23 | 1995-04-19 | Sumitomo Electric Industries Limited | Ceramic-coated electric connection terminal |
| DE3834526A1 (de) * | 1988-10-11 | 1990-04-12 | Zipperling Kessler & Co | Verfahren zur herstellung duenner schichten aus leitfaehigen polymeren sowie verwendung der beschichteten substrate |
-
1991
- 1991-02-12 FR FR9101604A patent/FR2672738A1/fr active Granted
-
1992
- 1992-02-05 CA CA002060672A patent/CA2060672C/en not_active Expired - Fee Related
- 1992-02-10 DE DE69210443T patent/DE69210443T2/de not_active Expired - Fee Related
- 1992-02-10 EP EP92400338A patent/EP0500415B1/fr not_active Expired - Lifetime
- 1992-02-10 CS CS92391A patent/CS39192A3/cs unknown
- 1992-02-12 JP JP02492592A patent/JP3359652B2/ja not_active Expired - Fee Related
-
1993
- 1993-06-03 US US08/071,380 patent/US5350323A/en not_active Expired - Lifetime
-
2002
- 2002-03-05 JP JP2002058912A patent/JP2002260762A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0500415B1 (fr) | 1996-05-08 |
| US5350323A (en) | 1994-09-27 |
| FR2672738B1 (cg-RX-API-DMAC7.html) | 1995-04-07 |
| JP2002260762A (ja) | 2002-09-13 |
| FR2672738A1 (fr) | 1992-08-14 |
| JPH04324269A (ja) | 1992-11-13 |
| DE69210443T2 (de) | 1996-12-05 |
| DE69210443D1 (de) | 1996-06-13 |
| CA2060672C (en) | 2002-01-15 |
| CA2060672A1 (en) | 1992-08-13 |
| JP3359652B2 (ja) | 2002-12-24 |
| EP0500415A1 (fr) | 1992-08-26 |
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