CS201119B1 - Fluid cooler particularly for cooling the capacitous semiconductor parts - Google Patents

Description

In the past it has been very rarely used for cooling power semiconductor components of liquid coolers, since air cooling was much simpler at relatively low power losses of components. Due to the ever-increasing demand for heat dissipation, the dimensions of the air coolers have increased, so that at present the devices using as cooling air are incomparably larger than those with liquid cooling systems.

Semiconductor device designers are starting to use fluids as coolants because they provide much greater cooling capacity than air-cooled and safely cope with shock and transient states, as their thermal inertia makes it possible to absorb short thermal impulses only a slight increase in temperature.

Liquid cooling also significantly reduces the noise that is the original phenomenon of air-cooled equipment, since noise can be easily reduced or even eliminated by placing the heat exchanger and pump outside the operator's area. These advantages are partially diminished by the relatively high complexity of the liquid-cooling and z-systems

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- 2 resulting from the need for maintenance, which results in increased operating costs.

Despite these complications, liquid cooling by forced circulation is undoubtedly a perspective technique for cooling power semiconductor devices.

The known liquid coolers are usually designed with straight channels of the inner tubular spaces, in particular because of the simplicity of the manufacturing technology. In these channels formed in a thermally conductive material, e.g. copper, a laminar layer is formed at the tube walls to reduce heat transfer from the cooling medium, e.g. water, to the radiator base material, and the radiator then exhibits a slightly higher thermal resistance.

The liquid cooler according to the invention overcomes the above-mentioned drawbacks and solves the problem by providing the coolant inlets formed by two thin-walled tubes interconnected by at least two connecting tubes, the assembly being located inside the metal block forming the bearing surfaces of the radiator and supplying electric current.

In the liquid cooler according to the invention, there is sufficient turbulence of the flowing cooling liquid and hence higher coefficients of heat transfer from the cooling medium to the cooler material. Due to the cooler volume, good use of expensive and scarce copper is achieved, which consists only of thin-walled tubes inside a massive aluminum block. The liquid cooler according to the invention is applicable to both single-sided and double-sided cooled semiconductor components.

The accompanying drawings show examples of an embodiment of a liquid cooler r according to the invention, wherein in Fig. 1 the cooler is shown in front view in partial section and in Fig. 2 in plan view in partial section. The coolant inlets 2 consist of two mutually parallel thin-walled copper tubes interconnected by a series of mutually parallel copper tubes 2. substantially perpendicular to the inlets 2. The whole thus formed is cast or sprayed into aluminum, the surface of which forms the radiator bearing surface and the inlet electric current. The use of aluminum block 2 saves copper deficiency while maintaining good heat sink properties. The versatility of the liquid cooler according to the invention makes it particularly suitable for use in power electronics and other applications in which high heat energy densities are required.

Claims (1)

SUBJECT OF THE INVENTION A liquid cooler, in particular for cooling power semiconductor devices, characterized in that the coolant inlets (2, 2) formed by two thin-walled tubes are interconnected by at least two connecting tubes (3), the assembly being located inside the metal block (1). forming the bearing surfaces of the cooler and at the same time supply of electric current.