CS145991A3 - Method for soldering printed circuit boards by dipping and apparatus for making the same - Google Patents

Method for soldering printed circuit boards by dipping and apparatus for making the same

Info

Publication number
CS145991A3
CS145991A3 CS911459A CS145991A CS145991A3 CS 145991 A3 CS145991 A3 CS 145991A3 CS 911459 A CS911459 A CS 911459A CS 145991 A CS145991 A CS 145991A CS 145991 A3 CS145991 A3 CS 145991A3
Authority
CS
Czechoslovakia
Prior art keywords
dipping
making
printed circuit
same
circuit boards
Prior art date
Application number
CS911459A
Other languages
English (en)
Inventor
Dieter Dr Ing Friedrich
Gitta Friedrich
Original Assignee
Friedrich Dieter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Friedrich Dieter filed Critical Friedrich Dieter
Publication of CS145991A3 publication Critical patent/CS145991A3/cs

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CS911459A 1990-05-18 1991-05-17 Method for soldering printed circuit boards by dipping and apparatus for making the same CS145991A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4016107A DE4016107A1 (de) 1990-05-18 1990-05-18 Verfahren zum tauchbeloten von leiterplatten

Publications (1)

Publication Number Publication Date
CS145991A3 true CS145991A3 (en) 1992-04-15

Family

ID=6406762

Family Applications (1)

Application Number Title Priority Date Filing Date
CS911459A CS145991A3 (en) 1990-05-18 1991-05-17 Method for soldering printed circuit boards by dipping and apparatus for making the same

Country Status (13)

Country Link
EP (1) EP0457346A1 (cs)
JP (1) JPH06503681A (cs)
BG (1) BG97083A (cs)
BR (1) BR9106468A (cs)
CA (1) CA2083135A1 (cs)
CS (1) CS145991A3 (cs)
DE (1) DE4016107A1 (cs)
FI (1) FI925201A0 (cs)
HU (1) HUT63293A (cs)
IE (1) IE911691A1 (cs)
PL (1) PL293482A1 (cs)
PT (1) PT97706A (cs)
WO (1) WO1991019414A2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7845540B2 (en) 2005-08-30 2010-12-07 Micron Technology, Inc. Systems and methods for depositing conductive material into openings in microfeature workpieces

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3810653C1 (cs) * 1988-03-29 1989-05-18 Dieter Dr.-Ing. Friedrich
US4889275A (en) * 1988-11-02 1989-12-26 Motorola, Inc. Method for effecting solder interconnects

Also Published As

Publication number Publication date
HU9203537D0 (en) 1993-03-01
WO1991019414A3 (de) 1992-03-05
JPH06503681A (ja) 1994-04-21
BG97083A (bg) 1993-12-24
DE4016107A1 (de) 1991-11-21
PL293482A1 (en) 1992-10-19
BR9106468A (pt) 1993-05-18
FI925201A (fi) 1992-11-16
CA2083135A1 (en) 1991-11-19
EP0457346A1 (de) 1991-11-21
WO1991019414A2 (de) 1991-12-12
PT97706A (pt) 1993-06-30
IE911691A1 (en) 1991-11-20
HUT63293A (en) 1993-07-28
FI925201A0 (fi) 1992-11-16

Similar Documents

Publication Publication Date Title
GB2131331B (en) Method and apparatus for mounting multilead components on a circuit board
GB2104649B (en) Apparatus and method for examining printed circuit board provided with electronic parts
GB8415816D0 (en) Cage apparatus for printed circuit boards
JPS57149799A (en) Method and device for producing multilayer printed circuit board
EP0478320A3 (en) Method for manufacturing printed circuit board
DE3476037D1 (en) Robotic hand and method for manipulating printed circuit boards
EP0469788A3 (en) Method and apparatus for reflow-soldering of print circuit boards
EP0231795A3 (en) Method for making printed circuit boards
DE3166594D1 (en) Method and apparatus for automatically mounting non-lead electronic components on printed-circuit or similar boards
DE3279675D1 (en) Method and device for soldering printed board
DE3176951D1 (en) Printed circuit board and method for fabricating the same
EP0206063A3 (en) Method and apparatus for correcting printed circuit boards
GB2248970B (en) Method for masking through holes during the manufacture of printed circuit boards
HK54883A (en) Apparatus for soldering printed circuit boards carrying circuit components
EP0491492A3 (en) Method and apparatus for solder leveling of printed circuit boards
GB2091493B (en) Method and apparatus for making printed circuit boards
DE3264873D1 (en) Soldering apparatus for printed circuit board
EP0522335A3 (en) Method for the removal of components from printed circuit boards
GB2244815B (en) A method for inspecting printed circuit boards with through-holes
JPS57139993A (en) Method and device for soldering printed board
ZA889270B (en) Apparatus and method for the manufacture of printed circuit board and prototypes
EP0464926A3 (en) Process and disposition for assembling printed circuit boards
CS145991A3 (en) Method for soldering printed circuit boards by dipping and apparatus for making the same
AU5536394A (en) Method and apparatus for soldering circuit boards
EP0457339A3 (en) Method and apparatus for the production of circuit boards