CR20230208A - Fundente y pasta soldadora - Google Patents

Fundente y pasta soldadora

Info

Publication number
CR20230208A
CR20230208A CR20230208A CR20230208A CR20230208A CR 20230208 A CR20230208 A CR 20230208A CR 20230208 A CR20230208 A CR 20230208A CR 20230208 A CR20230208 A CR 20230208A CR 20230208 A CR20230208 A CR 20230208A
Authority
CR
Costa Rica
Prior art keywords
flux
molecular weight
nonionic surfactant
solder paste
surfactant
Prior art date
Application number
CR20230208A
Other languages
English (en)
Inventor
Yasuhiro KAJIKAWA
Yo Yamada
Hiroshi Sugii
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of CR20230208A publication Critical patent/CR20230208A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un fundente que contiene de 1 a 10% en peso de un activador de ácido sulfónico orgánico, 10 a 40% en peso de un tensioactivo no iónico de alto peso molecular que es un tensioactivo no iónico que tiene un peso molecular promedio en masa de peso molecular de más de 1.200 y 5 a 75% en peso de un tensioactivo no iónico de bajo peso molecular que es un tensioactivo no iónico que tiene un peso molecular promedio en masa de peso molecular de 1.200 o menos, en el que el contenido del tensioactivo no iónico de bajo peso molecular es igual o mayor que el contenido del activador de ácido sulfónico orgánico. Este fundente no contiene tensioactivo catiónico o contiene más de 0% en peso y 5% en peso o menos del tensioactivo catiónico. Una pasta de soldadura que contiene este fundente y un metal de soldadura a base Sn
CR20230208A 2020-11-30 2021-10-14 Fundente y pasta soldadora CR20230208A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020198369A JP6933825B1 (ja) 2020-11-30 2020-11-30 フラックスおよびソルダペースト
PCT/JP2021/038088 WO2022113556A1 (ja) 2020-11-30 2021-10-14 フラックスおよびソルダペースト

Publications (1)

Publication Number Publication Date
CR20230208A true CR20230208A (es) 2023-06-23

Family

ID=77550006

Family Applications (1)

Application Number Title Priority Date Filing Date
CR20230208A CR20230208A (es) 2020-11-30 2021-10-14 Fundente y pasta soldadora

Country Status (5)

Country Link
US (1) US11945055B2 (es)
JP (1) JP6933825B1 (es)
CN (1) CN116438033B (es)
CR (1) CR20230208A (es)
WO (1) WO2022113556A1 (es)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3660127A (en) * 1969-08-11 1972-05-02 Lake Chemical Co Flux for use in soldering of stainless steels
US4151015A (en) * 1977-12-02 1979-04-24 Lake Chemical Company Flux for use in soldering
JPS60127096A (ja) 1983-12-12 1985-07-06 Nippon Telegr & Teleph Corp <Ntt> マイクロエレクトロニクス部品接合用フラツクス
JP2722256B2 (ja) * 1989-08-31 1998-03-04 ニホンハンダ株式会社 クリームはんだ
US5011546A (en) 1990-04-12 1991-04-30 International Business Machines Corporation Water soluble solder flux and paste
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
JPH07136794A (ja) 1993-11-18 1995-05-30 Daiwa Tokushu Kk はんだ付け用フラックス
JPWO2002038328A1 (ja) 2000-11-10 2004-03-11 日立化成工業株式会社 水溶性フラックス組成物及びハンダ付部品の製造方法
CN101596656B (zh) * 2009-07-02 2011-11-02 东莞市中实焊锡有限公司 一种无铅焊接用水清洗助焊剂及其制备方法
CN102166689B (zh) * 2011-03-30 2013-05-22 浙江强力焊锡材料有限公司 一种无卤素无铅焊锡膏及其所用助焊剂
CN104070308A (zh) 2014-06-23 2014-10-01 华南理工大学 无卤素免清洗光亮型焊锡丝用松香基助焊剂及其制备方法
CN105855518B (zh) 2016-06-21 2018-01-16 金锢电气有限公司 一种铜铝导体的生产方法
CN106078091A (zh) 2016-06-21 2016-11-09 金锢电气有限公司 一种铜铝导电块的生产工艺
CN107584233A (zh) * 2017-09-29 2018-01-16 苏州宙璎电子有限公司 一种环保免清洗水基助焊剂

Also Published As

Publication number Publication date
CN116438033A (zh) 2023-07-14
WO2022113556A1 (ja) 2022-06-02
JP6933825B1 (ja) 2021-09-08
US11945055B2 (en) 2024-04-02
CN116438033B (zh) 2023-10-31
JP2022086400A (ja) 2022-06-09
US20230302585A1 (en) 2023-09-28

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