CO2019005186A1 - Sistema electroquímico para electrodepositar metales a partir de un campo magnético inducido - Google Patents
Sistema electroquímico para electrodepositar metales a partir de un campo magnético inducidoInfo
- Publication number
- CO2019005186A1 CO2019005186A1 CO2019005186A CO2019005186A CO2019005186A1 CO 2019005186 A1 CO2019005186 A1 CO 2019005186A1 CO 2019005186 A CO2019005186 A CO 2019005186A CO 2019005186 A CO2019005186 A CO 2019005186A CO 2019005186 A1 CO2019005186 A1 CO 2019005186A1
- Authority
- CO
- Colombia
- Prior art keywords
- magnetic field
- winding
- induced magnetic
- electrochemical system
- electroplating metals
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/86—Regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
La presente invención se encuentra dirigida a un dispositivo o sistema (A) electroquímico para electrodepositar metales a partir de un campo magnético inducido, en donde dicho sistema comprende un recipiente cilíndrico (1) el cual tiene en la cara externa de sus paredes un embobinado (2), que genera un campo magnético (3) verticalmente uniforme, en donde dicho campo magnético (3) es solenoide y se concentra en su centro en un campo uniforme; un campo eléctrico (4) formado entre una placa cátodo (6) en donde se realiza la electrodeposición y una placa ánodo (7) y en donde la bobina formada por el embobinado (2) tiene dos extremos: donde se inicia el enrollado y donde termina y se inicia de abajo hacia arriba, conectándose el polo negativo de una fuente que alimenta el embobinado (2) en el extremo inferior y el polo positivo en el extremo superior de dicho embobinado (2) y en donde dicha placa cátodo (6) está rodeada por la placa ánodo (7).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CO2019005186A CO2019005186A1 (es) | 2019-05-21 | 2019-05-21 | Sistema electroquímico para electrodepositar metales a partir de un campo magnético inducido |
PCT/IB2020/054831 WO2020234823A1 (es) | 2019-05-21 | 2020-05-21 | Sistema electroquímico para electrodepositar metales a partir de un campo magnético inducido |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CO2019005186A CO2019005186A1 (es) | 2019-05-21 | 2019-05-21 | Sistema electroquímico para electrodepositar metales a partir de un campo magnético inducido |
Publications (1)
Publication Number | Publication Date |
---|---|
CO2019005186A1 true CO2019005186A1 (es) | 2019-11-21 |
Family
ID=68580965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CO2019005186A CO2019005186A1 (es) | 2019-05-21 | 2019-05-21 | Sistema electroquímico para electrodepositar metales a partir de un campo magnético inducido |
Country Status (2)
Country | Link |
---|---|
CO (1) | CO2019005186A1 (es) |
WO (1) | WO2020234823A1 (es) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3272727A (en) * | 1962-08-23 | 1966-09-13 | Ibm | Process for electroplating magnetic alloy onto a platinized chromium substrate |
JPH06128795A (ja) * | 1991-02-15 | 1994-05-10 | Mitsubishi Heavy Ind Ltd | 電気めっき方法 |
JPH0741996A (ja) * | 1993-07-31 | 1995-02-10 | Sony Corp | 電着めっき装置 |
CN201053039Y (zh) * | 2007-03-29 | 2008-04-30 | 上海大学 | 制备球状纳晶镍铁镀层的电沉积装置 |
CN102677137B (zh) * | 2011-12-24 | 2015-03-18 | 河南科技大学 | 一种金属电沉积装置 |
CN205741269U (zh) * | 2016-05-19 | 2016-11-30 | 贵州理工学院 | 一种强磁场下下置式搅拌电镀装置 |
-
2019
- 2019-05-21 CO CO2019005186A patent/CO2019005186A1/es unknown
-
2020
- 2020-05-21 WO PCT/IB2020/054831 patent/WO2020234823A1/es active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2020234823A1 (es) | 2020-11-26 |
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