CN85102289A

CN85102289A - A kind of epoxy resin insulation material

Info

Publication number: CN85102289A
Application number: CN 85102289
Authority: CN
Inventors: 张东华
Original assignee: Changchun Institute of Applied Chemistry of CAS
Current assignee: Changchun Institute of Applied Chemistry of CAS
Priority date: 1985-04-01
Filing date: 1985-04-01
Publication date: 1986-08-20

Abstract

Resins, epoxy adopts new curing system, has improved the performance of epoxy resin component, and the gelatin viscosity before solidifying is low, and the usage period is long, and viscosity changes little in time, is applicable to electrical equipment, the encapsulation of electronics unit, device and embedding.

Description

A kind of epoxy resin insulation material

The present invention belongs to the amine curing epoxy resin insulating material.

Resins, epoxy is widely used in the encapsulation of electrical equipment, electronic component, device.The effect of the packaged material of film capacitor is to guarantee the Element Technology index in the electronic component, and in use keeps stable performance, and therefore the over-all propertieies such as electricity, machinery and technology to material require high.The used for epoxy resin aliphatic amide is made solidifying agent, and the usage period is short, and volatile, toxicity is big, and pungent taste is arranged; Aromatic amine is a solid, is difficult at normal temperatures mixing, and the solidification value height, though solubilizing agent can extend using period, solvent easily remains in the resin, occurs bubble after the curing, inapplicable encapsulation and embedding electric product and electronic component.United States Patent (USP) 4201854(1980) reported N, N-dialkyl group-N '-aryl diamine is made epoxy curing agent, has improved the toxicity of aliphatic amide, smell and usage period, but raw material sources difficulty, price are more expensive, industrial practical significance is little.United States Patent (USP) 4321351(1982) announced a kind of epoxy casting material, the following usage period of room temperature is 50 minutes, does not obviously satisfy the requirement of industrial production to the usage period.Use general amine curing agent, because gel is fast, waste of material is big, and viscosity changes greatly in time, and the product design dimensional uniformity after sealing is bad.Healthy effect to the people is also bigger in addition.

The invention provides the novel curing system of a kind of Resins, epoxy, its major ingredient is the N-(2-hydroxypropyl) curing system that aniline (code name is NC-1) and 2.4.6-three (dimethylamino methyl) phenol are formed, structural formula is as follows:

1、

It is characterized in that containing in the NC-1 solidifying agent under secondary hydroxyl and a secondary amine that directly links to each other with phenyl ring, these two group normal temperature, difficulty and epoxy reaction add NC-1 in Resins, epoxy, and behind the altax F-30, viscosity is low under the normal temperature, and viscosity changes little in time.This is because DMP-30 is the ternary tertiary amine, and hydrogen atom produces hydrogen bond on the N atom of tertiary amine and the secondary hydroxyl, thereby does not show katalysis at normal temperatures, and glue viscosity in 2 hours changes little, and the usage period is more than 4 hours.And when 100-130 ℃ of temperature, got final product gel in 10-15 minute, and can solidify in 30 minutes, after fixing just reached completely solidified in 2 hours again.The boiling point height of NC-1 and DMP-30, not volatile, non-stimulated flavor, this health to the operator also is very favourable.This curing system preparation is simple in addition, and raw material sources are abundant, and price is low.

Epoxy resin cured product prescription provided by the invention is as follows:

Composition consumption (parts by weight)

Resins, epoxy 100

NC-1 8-25

DMP-30 0.5-5

Solidification value 90-130 ℃

0.5-2 hour set time

Epoxy resin cured product provided by the present invention has good electrical properties and mechanical property, and to compare compound viscosity with based epoxy resin low with existing, long, non-stimulated flavor of usage period, and temperature coefficient of viscosity is little.Under specified temp, set time is short, is suitable for the packaging process requirement that electrical condenser is produced, and adopts packaged material of the present invention can save the Resins, epoxy materials, alleviates product weight, good product consistency, reduces cost, brings economic benefit to production.

This material also can be used for the encapsulation and the perfusion of motor, transformer, instrument, various electronic components except that being used for film capacitor encapsulation, make product have the superior isolation performance and shield.

Claims

1, a kind of is the epoxy resin encapsulating material of solidifying agent by amine, it is characterized in that epoxy curing agent by N-(2-hydroxypropyl) aniline and 2,4, the curing system that 6-three (dimethylamino methyl) phenol is formed.

2, by claim 1 described packaged material, it is characterized in that said solidifying agent N-(2-hydroxypropyl) aniline, shared parts by weight are 8-25 in prescription.

3, by claim 1 described packaged material, it is characterized in that described promotor 2.46-three (dimethylamino methyl) phenol, shared parts by weight are 0.5-5 in prescription.

4, by the described packaged material of claim 1.2.3, it is characterized in that solidification value is 90-130 ℃, set time be 0.5-2 hour for good.