CN302527184S - 衬底处理装置用旋转器 - Google Patents

衬底处理装置用旋转器

Info

Publication number
CN302527184S
CN302527184S CN201330098036.4 CN302527184S CN 302527184 S CN302527184 S CN 302527184S CN 302527184 S CN302527184 S CN 302527184S
Authority
CN
China
Prior art keywords
substrate processing
spinner
design
product
processing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201330098036.4
Other languages
English (en)
Inventor
加贺谷彻
嶋田宽哲
阿部贤卓
Original Assignee
株式会社日立国际电气
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立国际电气 filed Critical 株式会社日立国际电气
Application granted granted Critical
Publication of CN302527184S publication Critical patent/CN302527184S/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

1.本外观设计产品的名称为衬底处理装置用旋转器。2.本外观设计产品安装在对晶片进行处理的衬底处理装置上使用,将保持晶片的舟皿载置于其旋转部上来使舟皿旋转。3.本外观设计产品的设计要点在于产品的形状。4.指定立体图1为最能表明设计要点的视图。
CN201330098036.4 2012-11-30 2013-03-25 衬底处理装置用旋转器 Expired - Lifetime CN302527184S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012-029397 2012-02-14

Publications (1)

Publication Number Publication Date
CN302527184S true CN302527184S (zh) 2013-08-07

Family

ID=

Similar Documents

Publication Publication Date Title
WO2012166770A3 (en) Heated wafer carrier profiling
SG11201604486XA (en) Semiconductor wafer processing methods and apparatus
EP2772948A3 (en) Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices
EP2953157A4 (en) GRIP SUPPORTS AND COMPOSITE WAFER FOR A SEMICONDUCTOR COMPONENT
SG11201401955YA (en) Wafer support apparatus and semiconductor processing device having same
TWD159673S (zh) 基板處理裝置用廻轉器
PH12016501682A1 (en) Reel support device
TWI562233B (en) Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatus
FR3027445B1 (fr) Appareil et procede de support, appareil de mesure, et procede de fabrication d'article
SG11201608239RA (en) Semiconductor wafer weighing apparatus and methods
CN302527184S (zh) 衬底处理装置用旋转器
CN302511072S (zh) 衬底处理装置用旋转器
CN302511074S (zh) 衬底处理装置用旋转器
CN302511073S (zh) 衬底处理装置用旋转器
TWD182149S (zh) 基板處理裝置之溫度測定器之部分
FR3011379B1 (fr) Procede de preparation d'un substrat de silicium recristallise a gros cristallites
EP3098852A4 (en) Wafer level semiconductor device and manufacturing method thereof
DE112015000944A5 (de) Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen
DE102016100548B8 (de) Prozessieren eines Halbleiterbauelements
CN302413611S (zh) 用于半导体设备检查装置的卡盘台
DE112015000939A5 (de) Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen
CN302064211S (zh) 薄型平行手爪(带橡胶制外罩)
CN302373035S (zh) 上下料机(管式pecvd)
FR3030626B1 (fr) Dispositif d'accouplement en rotation robuste entre arbres tournants
CN302279789S (zh) 分切机(超越型)

Legal Events

Date Code Title Description
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20181203

Main classification number: 15-99

Address after: Tokyo, Japan

Patentee after: KOKUSAI ELECTRIC Corp.

Address before: Tokyo, Japan

Patentee before: HITACHI KOKUSAI ELECTRIC Inc.

CX01 Expiry of patent term

Granted publication date: 20130807

Main classification number: 15-99