CN2896794Y - Circuit-board with differential signal transmission structure - Google Patents
Circuit-board with differential signal transmission structure Download PDFInfo
- Publication number
- CN2896794Y CN2896794Y CN 200620006623 CN200620006623U CN2896794Y CN 2896794 Y CN2896794 Y CN 2896794Y CN 200620006623 CN200620006623 CN 200620006623 CN 200620006623 U CN200620006623 U CN 200620006623U CN 2896794 Y CN2896794 Y CN 2896794Y
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- Prior art keywords
- differential signal
- patterned conductive
- wiring board
- signal line
- conductive layer
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Abstract
A circuit board that comprises a plurality of patterned conducting layers and a plurality of insulating layers, wherein the patterned conducting layers comprise one primary patterned conducting layer and at least one secondary patterned conducting layer; the primary patterned conducting layer is provided with at least one pair of differential signal lines; the secondary patterned conducting layer is provided with at least one non-wiring area; projection of the said differential signal line on the secondary patterned conducting layer overlaps at least part of the projection of the said differential signal line on the non-wiring area. Besides, each insulating layer is positioned between adjacent patterned conducting layers; the said circuit board has a differential signal transmission structure to improve performance of the differential signal lines in transmission of high-speed and high-frequency signals.
Description
Technical field
The utility model relates to a kind of differential signal transmission structure, and particularly relevant for a kind of wiring board (wiring board) with differential signal transmission structure.
Background technology
Generally speaking, existing in order to carrying and the wiring board that is electrically connected a plurality of electronic components mainly be by a plurality of patterned conductive layers (patterned conductive layer) and a plurality of insulating barrier (insulating layer) be superimposed constitute.Wherein, definition forms these patterned conductive layers through lithography by copper foil layer (copper foil).These insulating barriers are disposed at respectively between adjacent these patterned conductive layers, in order to isolate these patterned conductive layers.In addition, see through conduction duct (conductive via) and being electrically connected to each other between these overlapped patterned conductive layers.In addition, also configurable various electronic components on the surface of wiring board (for example active element or passive component), and reach the purpose of electronic signal transmission (electrical signal propagation) by the wiring board internal wiring.
Please refer to Fig. 1, it illustrates the side-looking generalized section of existing a kind of wiring board.Existing wiring board 100 comprises four layer pattern conductive layers 110, three-layer insulated layer 120 and a plurality of conductions duct 130.The patterned conductive layer 110 (a) of the superiors has pair of differential holding wire 112 and 114, this is used for transmitting high speed and high-frequency signal to differential signal line 112 and 114, the patterned conductive layer 110 (b) that is positioned at the superiors' patterned conductive layer 110 (a) below then is ground plane, and it is as these reference planes to differential signal line 112 and 114 (reference plane).Each insulating barrier 120 is disposed between adjacent these patterned conductive layers 110, and one of them of these insulating barriers 120 run through in each conduction duct 130, and these patterned conductive layers 110 at least wherein two by these conduction ducts 130 one of them and be electrically connected mutually.
If existing wiring board 100 is during as the base plate for packaging of a chip packing-body (not illustrating), this is to differential signal line 112 and 114 intermediaries as transmission signals between the internal wiring of base plate for packaging and the chip, therefore this must mate (match) to differential signal line 112 and 114 is electrically connected the place with the internal wiring of base plate for packaging impedance (impedance), and this also must mate differential signal line 112 and 114 is electrically connected the place with chip impedance.
Yet, under the trend that the wiring density of wiring board 100 increases, this dwindles the distance between differential signal line 112 and 114, therefore when transmitting high speed and high-frequency signal, this impedance operator to differential signal line 112 and 114 is affected, that is this coupling capacitance to differential signal line 112 and 114 (coupling capacitance) increases and to make this impedance to differential signal line 112 and 114 descend, so cause this to differential signal line 112 and 114 and the circuit of other electron component (for example chip) between the generation impedance do not match (impedance mismatch) phenomenon and reduce this quality to differential signal line 112 and 114 transmitting high speeds and high-frequency signal.Therefore, under the trend that product size is dwindled, how effectively utilizing the winding space of wiring board is the problem that must solve to promote this quality to differential signal line 112 and 114 transmitting high speeds and high-frequency signal.
The utility model content
A purpose of the present utility model provides a kind of wiring board, and it has the differential signal transmission structure, to promote the quality of differential signal line to transmitting high speed and high-frequency signal.
For reaching above-mentioned or other purpose, the utility model proposes a kind of wiring board, it comprises a plurality of patterned conductive layers and a plurality of insulating barrier.These patterned conductive layers comprise one first patterned conductive layer and at least one second patterned conductive layer, first patterned conductive layer has at least one pair of differential signal line, second patterned conductive layer has at least one non-wiring region, and this overlaps in the projection and the non-wiring region of second patterned conductive layer at least to differential signal line.In addition, each insulating barrier is disposed between adjacent these patterned conductive layers.
For above-mentioned and other purpose, feature and advantage of the present utility model can be become apparent, a plurality of embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 illustrates the side-looking generalized section of existing a kind of wiring board;
Fig. 2 illustrates the schematic side view of the chip packing-body of the utility model first embodiment;
Fig. 3 A illustrates the side-looking generalized section of the base plate for packaging of Fig. 2;
Fig. 3 B illustrates the schematic top plan view of partial component of the base plate for packaging of Fig. 3 A;
Fig. 4 illustrates the side-looking generalized section of a kind of base plate for packaging of the utility model second embodiment.
Description of reference numerals
100: wiring board
110,110 (a), 110 (b), 210,210 (a), 210 (b), 210 (c), 310 (b), 310 (c), 310 (d): patterned conductive layer
112,114,212,214,312,314: differential signal line
120,220: insulating barrier
130,230: the conduction duct
200,300: base plate for packaging
216,316,318: non-wiring region
B: projection
C: chip
CP: chip packing-body
D: differential signal transmission structure
L1, L2: length
S1, S2: side
W1: width
W2: spacing
Embodiment
By the narration of background technology as can be known, under the trend that the wiring density of wiring board increases, differential signal line between distance dwindle, so differential signal line between coupling capacitance increase, the right impedance that therefore makes differential signal line descend and cause differential signal line to and the circuit of other electron component (for example chip) between produce the unmatched phenomenon of impedance.
Please refer to Fig. 2, it illustrates the schematic side view of the chip packing-body of the utility model first embodiment.The chip packing-body CP of first embodiment comprises a chip C and a base plate for packaging 200.Chip C is disposed on the base plate for packaging 200 and is electrically connected to base plate for packaging 200.As shown in Figure 2, chip C is electrically connected with base plate for packaging 200 by a plurality of projection B, but chip C also can be electrically connected with base plate for packaging 200 by many bonding wires, but does not illustrate with drawing.
Please refer to Fig. 3 A and Fig. 3 B, wherein Fig. 3 A illustrates the side-looking generalized section of the base plate for packaging of Fig. 2, and Fig. 3 B illustrates the schematic top plan view of partial component of the base plate for packaging of Fig. 3 A.The base plate for packaging 200 of first embodiment comprises a plurality of interlaced overlapping patterned conductive layers 210 (Fig. 3 A only schematically illustrates four layers) and a plurality of insulating barriers 220 (Fig. 3 A only schematically illustrates three layers).Each insulating barrier 220 is disposed between adjacent these patterned conductive layers 210, that is these patterned conductive layers 210 are superimposed with these insulating barriers 220, and these patterned conductive layers 210 comprise one first patterned conductive layer 210 (a) and one second patterned conductive layer 210 (b).First patterned conductive layer 210 (a) has at least one pair of differential signal line 212 and 214, the second patterned conductive layers 210 (b) have at least one non-wiring region 216.
In addition, this overlaps in the projection and the non-wiring region 216 of second patterned conductive layer 210 (b) at least to differential signal line 212 and 214, and in other words, by Fig. 3 A and 3B as can be known, non-wiring region 216 is positioned at this below to differential signal line 212 and 214.In addition, this to differential signal line 212 and 214 and non-wiring region 216 constitute (compose) differential signal transmission structure D, it is characterized by this to differential signal line 212 and 214 and this non-wiring region 216 not in the same plane, and this overlaps at least to the projection and the non-wiring region 216 of differential signal line 212 and 214 on the plane at these non-wiring region 216 places.
The pair of differential holding wire 212 of the base plate for packaging 200 of first embodiment and 214 is when transmitting high speed and high-frequency signal, owing to second patterned conductive layer 210 (b) below differential signal line 212 and 214 is had non-wiring region 216 at this, thus this to differential signal line 212 and 214 with as increasing and coupling capacitance (coupling capacitance) reduction with reference to the distance of the electric field (electric field) between the 3rd patterned conductive layer 210 (c) on plane.Therefore, this impedance (impedance) of the base plate for packaging 200 of first embodiment to differential signal line 212 and 214 to promote and this to differential signal line 212 and 214 and chip C between the unmatched phenomenon of impedance be improved.In view of the above, this return loss to differential signal line 212 and 214 (return loss) promotes and inserts loss (insertion loss) and reduces, and then makes this be improved to the high speed of differential signal line 212 and 214 transmission quality with high-frequency signal.In addition, base plate for packaging 200 can and then dwindle this spacing to differential signal line 212 and 214 by the function of above-mentioned differential signal transmission structure D, so the volume of base plate for packaging 200 can more dwindle and still can keep this quality to the signal transmission of differential signal line 212 and 214.
In first embodiment, this is L2 to differential signal line 212 and 214 one of them length between the two-end-point on first patterned conductive layer 210 (a); This for example is this to one of them more than 40 percent or 40 percent of raw footage L2 of differential signal line 212 and 214 to differential signal line 212 and 214 in the overlapping length L 1 of the projection of second patterned conductive layer 210 (b) and non-wiring region 216, in other words, overlapping length L 1 is more than or equal to 0.4 with the ratio of raw footage L2.In addition, the width W 1 of the non-wiring region 216 of base plate for packaging 200 can more than or equal to this to differential signal line 212 and 214 apart farthest dual-side S1 and the spacing W2 of S2.Second patterned conductive layer 210 (b) with non-wiring region 216 of base plate for packaging 200 can be bus plane or ground plane.In addition, the base plate for packaging 200 of first embodiment more comprises a plurality of conductions duct 230, and one of them of these insulating barriers 220 run through in each conduction duct 230, and these patterned conductive layers 210 at least wherein two by these conduction ducts 230 at least one of them and be electrically connected mutually.In addition, these patterned conductive layers 210 are for example formed through lithography definition by copper foil layer, and the material of insulating barrier 220 for example is glass epoxy resin (FR-4) or epoxy resin (epoxy resin), and the material in duct 230 of conducting electricity then for example is a copper.
Among above-mentioned first embodiment, differential signal transmission structure D is applied in the base plate for packaging 200 of a chip packing-body CP.In this mandatory declaration is that the differential signal transmission structure D with above-mentioned functions also can be applicable to other electric installation, for example in wiring board, ceramic substrate or the relevant wiring of semiconductor device.
Please refer to Fig. 4, it illustrates the side-looking generalized section of a kind of base plate for packaging of the utility model second embodiment.The difference of second embodiment and first embodiment is, second patterned conductive layer 310 (b) of the base plate for packaging 300 of second embodiment has non-wiring region 316 and 318 respectively with the 3rd patterned conductive layer 310 (c), so this is to differential signal line 312 and 314 and as coupling capacitance more reduces with reference to the electric field distance between the 4th patterned conductive layer 310 (d) (can be bus plane or ground plane) on plane more increases, therefore compare with first embodiment, this high speed to differential signal line 312 and 314 is preferable with the transmission quality of high-frequency signal.
It must be emphasized that at this patterned conductive layer that has non-wiring region among first embodiment and second embodiment is respectively one deck and two-layer.But in other embodiments, the number of plies with patterned conductive layer of non-wiring region can change to some extent according to designer's demand, and in other words, first embodiment and second embodiment are non-limiting the utility model in order to give an example.
In sum, the utlity model has following advantage:
(1) owing to the right spacing of differential signal line of differential signal transmission structure can be dwindled, so can save the wiring space of the electric installation of using this differential signal transmission structure.
(2) use the wiring board of this differential signal transmission structure when transmitting high speed and high-frequency signal, owing to the patterned conductive layer below the differential signal line is had non-wiring region at this, so this promotes impedance of differential signal line, and then make this obtain to promote to the high speed of differential signal line quality with high-frequency signal transmission.
(3) owing to the right spacing of differential signal line of differential signal transmission structure can be dwindled, so can increase the possibility of designer's wires design.
Though the utility model discloses as above with a plurality of embodiment; right its is not in order to limit the utility model; any those skilled in the art; in not breaking away from spirit and scope of the present utility model; when can doing a little change and retouching, therefore protection range of the present utility model with appending claims the person of being defined be as the criterion.
Claims (9)
1. wiring board is characterized in that comprising:
A plurality of patterned conductive layers, interlaced overlapping, those patterned conductive layers comprise one first patterned conductive layer and at least one second patterned conductive layer, this first patterned conductive layer has at least one pair of differential signal line, this second patterned conductive layer has at least one non-wiring region, and this is overlapped with this non-wiring region in the projection of this second patterned conductive layer at least to differential signal line; And
A plurality of insulating barriers, respectively this insulating barrier is disposed between adjacent those patterned conductive layers.
2. wiring board as claimed in claim 1 is characterized in that, this is this more than 40 percent or 40 percent of raw footage to one of differential signal line to differential signal line in the overlapping length of the projection of this second patterned conductive layer and this non-wiring region.
3. wiring board as claimed in claim 1 is characterized in that, the width of this non-wiring region is more than or equal to this spacing to the apart dual-side farthest of differential signal line.
4. wiring board as claimed in claim 1 is characterized in that, this second patterned conductive layer is bus plane or ground plane.
5. wiring board as claimed in claim 1 is characterized in that, this wiring board is circuit board or base plate for packaging.
6. wiring board as claimed in claim 1 is characterized in that, more comprises a plurality of conductions duct, and respectively one of those insulating barriers are run through in this conduction duct, and those patterned conductive layers at least two is mutual electrical connections by those conduction ducts at least one.
7. wiring board as claimed in claim 5 is characterized in that, this wiring board is in order to configuration and be electrically connected to a chip.
8. wiring board as claimed in claim 7 is characterized in that this wiring board is electrically connected with this chip by a plurality of projections.
9. wiring board as claimed in claim 7 is characterized in that this wiring board is electrically connected with this chip by many bonding wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620006623 CN2896794Y (en) | 2006-03-02 | 2006-03-02 | Circuit-board with differential signal transmission structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620006623 CN2896794Y (en) | 2006-03-02 | 2006-03-02 | Circuit-board with differential signal transmission structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2896794Y true CN2896794Y (en) | 2007-05-02 |
Family
ID=38066366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620006623 Expired - Lifetime CN2896794Y (en) | 2006-03-02 | 2006-03-02 | Circuit-board with differential signal transmission structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2896794Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103841749A (en) * | 2012-11-23 | 2014-06-04 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN107765920A (en) * | 2017-10-26 | 2018-03-06 | 惠科股份有限公司 | Signal transmitting apparatus and display device |
| CN111031668A (en) * | 2019-11-21 | 2020-04-17 | 苏州浪潮智能科技有限公司 | Concave winding differential wire, printed circuit board and design method |
| CN111739422A (en) * | 2020-06-29 | 2020-10-02 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN113660764A (en) * | 2020-05-12 | 2021-11-16 | 鹏鼎控股(深圳)股份有限公司 | Circuit board |
-
2006
- 2006-03-02 CN CN 200620006623 patent/CN2896794Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103841749A (en) * | 2012-11-23 | 2014-06-04 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN107765920A (en) * | 2017-10-26 | 2018-03-06 | 惠科股份有限公司 | Signal transmitting apparatus and display device |
| CN111031668A (en) * | 2019-11-21 | 2020-04-17 | 苏州浪潮智能科技有限公司 | Concave winding differential wire, printed circuit board and design method |
| CN113660764A (en) * | 2020-05-12 | 2021-11-16 | 鹏鼎控股(深圳)股份有限公司 | Circuit board |
| CN113660764B (en) * | 2020-05-12 | 2022-12-20 | 鹏鼎控股(深圳)股份有限公司 | Circuit board |
| CN111739422A (en) * | 2020-06-29 | 2020-10-02 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070502 |
|
| EXPY | Termination of patent right or utility model |