CN107765920A - Signal transmitting apparatus and display device - Google Patents

Signal transmitting apparatus and display device Download PDF

Info

Publication number
CN107765920A
CN107765920A CN201711022849.9A CN201711022849A CN107765920A CN 107765920 A CN107765920 A CN 107765920A CN 201711022849 A CN201711022849 A CN 201711022849A CN 107765920 A CN107765920 A CN 107765920A
Authority
CN
China
Prior art keywords
conductive pattern
insulating barrier
electrically connected
display module
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711022849.9A
Other languages
Chinese (zh)
Other versions
CN107765920B (en
Inventor
何怀亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Original Assignee
HKC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HKC Co Ltd filed Critical HKC Co Ltd
Priority to CN201711022849.9A priority Critical patent/CN107765920B/en
Priority to PCT/CN2017/111206 priority patent/WO2019080208A1/en
Publication of CN107765920A publication Critical patent/CN107765920A/en
Application granted granted Critical
Publication of CN107765920B publication Critical patent/CN107765920B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13452Conductors connecting driver circuitry and terminals of panels
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Human Computer Interaction (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present embodiments relate to a kind of signal transmitting apparatus and display device, the signal transmitting apparatus includes:Insulative substrate;Connecting portion, it is arranged in insulative substrate, is electrically connected with system;First conductive pattern, is arranged in insulative substrate, is electrically connected with display module and connecting portion;Second conductive pattern, it is arranged on the first conductive pattern, is electrically connected with display module and the first conductive pattern;3rd conductive pattern, it is arranged on the second conductive pattern, is electrically connected with display module and the second conductive pattern;Insulating barrier, it is arranged between the first conductive pattern, the second conductive pattern and the 3rd conductive pattern, and for insulating and being bonded the first conductive pattern, the second conductive pattern and the 3rd conductive pattern;Interlayer conduction structure, is arranged in insulating barrier, the second conductive pattern and the 3rd conductive pattern is electrically connected to system by the first conductive pattern.

Description

Signal transmitting apparatus and display device
Technical field
The present embodiments relate to signal transmission technology field, particularly relates to the letter for being related to several printed circuit board (PCB)s composition Number transmitting device, and the display device with the signal transmitting apparatus.
Background technology
In general, the liquid crystal touch control device (hereinafter referred to as liquid crystal touch control device) with touch controllable function includes system, liquid crystal Display panel, contact panel and light source.In the structure of typical liquid crystal touch control device, liquid crystal display panel, contact panel and light The signal in source is to be transmitted respectively via different flexible printed wiring boards.As shown in figure 1, the LCD in display module 10 The signal of plate, contact panel and light source is to be transmitted respectively via flexible printed wiring board 102,104,106.It is however, described soft Printed circuit board (PCB) is in transmission signal to system, it is necessary to is electrically connected with system via three ports respectively, this, which is configured, causes system The enough spaces of necessary indwelling set port, cause the size of device to be restricted.
In addition, in the prior art, as shown in Fig. 2 the mode for attempting to welding has been invented, by flexible printed wiring board 104 and 106 with being soldered on flexible printed wiring board 102, to be electrically connected with and converge signal whole to flexible printed wiring board 102 Afterwards, then via connection end 1020 transmit to system.Therefore, system need only indwelling a port space, improve above mentioned problem.
However, welding process be belong in processing procedure be easier to produce become because the step of, the environmental factor meeting in manufacturing process The effect of machinery welding is had influence on, and the effect of human weld is more difficult to grasp.Therefore, if can find using beyond welding Mode reaches above-mentioned effect, can should more improve above-mentioned technology.
The content of the invention
Technical problems to be solved of the embodiment of the present invention are to provide a kind of signal transmitting apparatus, with improve device size by To limitation and welding process in easily produce become because the problem of.
The further technical problems to be solved of the embodiment of the present invention are to provide a kind of display device, to improve device size Be restricted with welding process easily produce become because the problem of.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of signal transmitting apparatus first, including:
Insulative substrate;
Connecting portion, it is arranged in the insulative substrate, is electrically connected with system;
First conductive pattern, is arranged in the insulative substrate, is electrically connected with display module and the connecting portion;
Second conductive pattern, it is arranged on the described first conductive pattern, electrically connects with display module and the first conductive pattern Connect;
3rd conductive pattern, it is arranged on the described second conductive pattern, electrically connects with display module and the second conductive pattern Connect;
Insulating barrier, it is arranged between the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern, and uses In insulating and be bonded the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern;
Interlayer conduction structure, it is arranged in the insulating barrier, is electrically connected with the first conductive pattern, the second conductive pattern And the 3rd conductive pattern, the described second conductive pattern and the 3rd conductive pattern is passed through the described first conductive pattern electricity Property is connected to system.
Alternatively, the interlayer conduction structure is included in the insulating barrier formation vertically oriented aperture there-through, and the through hole Hole wall on conductive coating is set.
Alternatively, the material of the coating is to be selected from metal and conductive plastics.
Alternatively, the insulating barrier and the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern Sample is by making the preceding oligomer solution before the insulating barrier solidification be formed by curing the insulating barrier to be bonded.
Alternatively, the material of the insulating barrier is polyimides.
On the other hand, the embodiment of the present invention also provides a kind of display device, including:
Display module;And
System;
Wherein, the display module and the system are electrically connected with by signal transmitting apparatus, and the signal transmitting apparatus includes:
Insulative substrate;
Connecting portion, it is arranged in the insulative substrate, is electrically connected with the system;
First conductive pattern, is arranged in the insulative substrate, is electrically connected with the display module and the connecting portion;
Second conductive pattern, it is arranged on the described first conductive pattern, with the display module and the first conductive pattern electricity Property connection;
3rd conductive pattern, it is arranged on the described second conductive pattern, with the display module and the second conductive pattern electricity Property connection;
Insulating barrier, it is arranged between the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern, and uses In insulating and be bonded the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern;
Interlayer conduction structure, it is arranged in the insulating barrier, passes through the described second conductive pattern and the 3rd conductive pattern The first conductive pattern is electrically connected to the system.
Alternatively, the interlayer conduction structure is included in the insulating barrier formation vertically oriented aperture there-through, and the through hole Hole wall on conductive coating is set.
Alternatively, the material of the coating is to be selected from metal and conductive plastics.
Alternatively, the insulating barrier and the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern Sample is by making the preceding oligomer solution before the insulating barrier solidification be formed by curing the insulating barrier to be bonded.
Alternatively, the material of the insulating barrier is polyimides.
Another aspect, the embodiment of the present invention also provide a kind of display device, including:
Display module;And
System;
Wherein, the display module and the system are electrically connected with by signal transmitting apparatus, and the signal transmitting apparatus includes:
Insulative substrate;
Connecting portion, it is arranged in the insulative substrate, is electrically connected with the system;
First conductive pattern, is arranged in the insulative substrate, is electrically connected with the display module and the connecting portion;
Second conductive pattern, it is arranged on the described first conductive pattern, with the display module and the first conductive pattern electricity Property connection;
3rd conductive pattern, it is arranged on the described second conductive pattern, with the display module and the second conductive pattern electricity Property connection;
Insulating barrier, it is arranged between the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern, and uses It is by making the insulation with the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern in insulation Preceding oligomer solution before layer solidification is formed by curing the insulating barrier and is bonded;
Interlayer conduction structure, it is included in the vertically oriented aperture there-through that the insulating barrier is formed, is arranged in the insulating barrier, makes institute State the second conductive pattern and the 3rd conductive pattern is electrically connected to the system by the described first conductive pattern.
By using above-mentioned technical proposal, the embodiment of the present invention at least has the advantages that:The embodiment of the present invention is led to Cross and use other modes instead to substitute the connected mode of several circuit boards of welding, the change in foregoing welding process can be avoided because making It is not error-prone in processing procedure, and then lift the yield of product.In addition, using the signal transmitting apparatus of the embodiment of the present invention, compared to Welding can more lift the bonding strength between several described circuit boards.
Brief description of the drawings
Fig. 1 is the structural representation of existing liquid crystal touch control device.
Fig. 2 is the structure schematic side view of existing liquid crystal touch control device.
Fig. 3 is the structure schematic side view of display device in one embodiment of the invention.
Fig. 4 is the structure schematic side view of display device in one embodiment of the invention.
Fig. 5 is the structure schematic side view of display device in one embodiment of the invention.
Fig. 6 is the manufacture method flow chart of the signal transmitting apparatus in one embodiment of the invention.
Embodiment
Illustrative embodiments are more fully described hereinafter with reference to accompanying drawing;However, they can embody simultaneously in different forms It is not construed as being limited to embodiment described in text.On the contrary, these embodiments are provided so that the disclosure is thorough and complete, And it will intactly convey the scope of the invention to those skilled in the art.
In the description of the present application, it is to be understood that the instruction such as term " on ", " under ", "left", "right", " interior ", " outer " Orientation or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of description the application and simplification retouched State, rather than imply signified device or component there must be a specific orientation, therefore it is not intended that limitation to the application.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected;Can To be mechanical connection or electric connection;Can be joined directly together, can also be indirectly connected by intermediary.Term " chimeric ", " insertion " should be interpreted broadly, and can be dismountable for example, it may be being partially submerged into, can be completely embedded into It is embedded etc..For the ordinary skill in the art, above-mentioned term in this application specific can be understood with concrete condition Implication.
In an embodiment of the present invention, there is provided a kind of non-composite formula signal transmitting apparatus, as shown in figure 3, soft including first The property flexible printed wiring board 120 of printed circuit board (PCB) 110 and second.First flexible printed wiring board 110 can be electrically connected with display mould Block 100 and system (not represented in figure), and several port parts 202 are provided with the first flexible printed wiring board 110.Port The circuit of the flexible printed wiring board 110 of portion 202 and first is electrically connected with, and makes other assemblies soft by port part 202 and first Property printed circuit board (PCB) 102 is electrically connected with.Second flexible printed wiring board 120 is electrically connected with display module 100, and is provided with port Connector 201.The circuit of the flexible printed wiring board 120 of port connectors 201 and second is electrically connected with, and other assemblies is passed through Port part 202 is electrically connected with the first flexible printed wiring board 110.The above-mentioned matching port part 202 of port connectors 201, two It can fix or dismantle on demand between person.Any known presence such as port connectors 201 are pluggable, chimeric or utilization shell fragment, trip Mode be connected with port part 202, and the state in electric connection in connection, make to be provided with the of port connectors 201 Two flexible printed wiring boards 120 are electrically connected with the first flexible printed wiring board 110 with port part 202.
In the above-described embodiments, port part 202 can be single or multiple, and may be provided at the first flexible printed wiring board 110 either side.For example, port part 202 may be provided at upper surface, lower surface, the surrounding of the first flexible printed wiring board 110 Edge or other settable positions.But above-mentioned setting must at least ensure that port part 202 can be with the first flexible printed wiring board 110 Circuit is electrically connected with, so that signal is inputted or be output to the first flexible printed wiring board 110 by port part 202.
On the other hand, port connectors 201 can be single or multiple, and may be provided at the second flexible printed wiring board 120 Either side.For example, port part 202 may be provided at upper surface, lower surface, the edge of the second flexible printed wiring board 120 Or other settable positions.But above-mentioned setting must at least ensure that port connectors 201 can be with the second flexible printed wiring board 120 Circuit be electrically connected with, so that signal is inputted or is output to the first flexible printed wiring board 110 by port connectors 201.
By connectivity port connector 201 and port part 202, the first flexible printed wiring board 110 can be with the second soft print Printed circuit board 120 is electrically connected with.The position set according to port connectors 201 and port part 202, the first flexible printed wiring board 110 and second flexible printed wiring board 120 can correspond to carry out different settings.For example, the first flexible printed wiring board 110 can be with Two flexible printed wiring boards 120 are generally aligned in the same plane and adjoined each other;Or first flexible printed wiring board 110 can with it is second soft Property printed circuit board (PCB) 120 is located at Different Plane;Or first flexible printed wiring board 110 can be with the second flexible printed wiring board 120 partly overlap.However, actual disposition mode is not limited to this, but at least need to reach make the first flexible printed wiring board 110 with The effect that second flexible printed wiring board 120 is electrically connected with.
In an embodiment of the present invention, the first flexible printed wiring board 110 can be directly connected to display module 100, or not It is directly connected to display module 100.In the case where being directly connected to display module 100, the first flexible printed wiring board 110 can be direct By the reception signal of display module 100;In the case of the display module 100 that is not directly connected, the first flexible printed wiring board 110 can Display module 10 is electrically connected with by the second flexible printed wiring board 120, port connectors 201 and port part 202, with from display The reception signal of module 100.The also settable connecting portion 500 of first flexible printed wiring board 110, is for electrically connecting to system.And lead to Connecting portion 500 is crossed to transmit to system.
Second flexible printed wiring board 120 can be electrically connected with the light source or contact panel (the not table in figure of display module 100 Show), the touching signals that the light signal and/or transmission contact panel that transmission light source provides provide.Second flexible printed wiring board 120 can be arranged on the not homonymy of display module 100 with the first flexible printed wiring board 110, or can be with the first soft printing electricity Road plate 110 is arranged on the same side of display module 100.
Alternatively, first flexible printed wiring board 110 and second flexible printed wiring board 120 further pass through Alignment mark fixes relative position.Alternatively, in addition to port connectors 201 and port part 202, the first flexible printed wiring board 110 and second flexible printed wiring board 120 after by alignment mark, can be strengthened by mode well known in the art Link between the two, with fixed relative position between the two.
In addition, the signal transmitting apparatus of the present invention can further comprise the 3rd flexible printed wiring board 130.3rd soft print Printed circuit board 130 can have identical function with the second flexible printed wiring board 120.That is, the 3rd flexible printed wiring board 130 can be electrically connected with the light source of display module 100 or contact panel (not represented in figure), the light signal that transmission light source provides And/or the touching signals that transmission contact panel provides.Similarly, the 3rd flexible printed wiring board 130 can be with the first soft printing Circuit board 110 is arranged on the not homonymy of display module 100, or can be arranged on display mould with the first flexible printed wiring board 110 The same side of block 100.3rd flexible printed wiring board 130 also can be arranged on display module with the second flexible printed wiring board 120 100 not homonymy, or the same side of display module 100 can be arranged on the second flexible printed wiring board 120.
Alternatively, the 3rd flexible printed wiring board 130 can transmit different letters respectively from the second flexible printed wiring board 120 Number.For example, the settable light source for making the 3rd flexible printed wiring board 130 be electrically connected with display module 100, transmission light source signal, And the contact panel for making the second flexible printed wiring board 120 be electrically connected with display module 100 is set, transmit touching signals.
In another embodiment of the invention, can also be by the way that the signal transmitting apparatus of described above be arranged on into liquid crystal display To transmission signal in device, and then provide a kind of liquid crystal display device of improvement.
Than the above described, can also be optimized according to actual state and demand for wherein several components, more Add enhancing advantages of the present invention, will hereafter be illustrated with different embodiments.
In one embodiment, there is provided a kind of combined type signal transmitting apparatus.For above-mentioned first flexible printed wiring board 110th, the configuration relation between the second flexible printed wiring board 120 and the 3rd flexible printed wiring board 130 optimizes, without using The structure of port connectors 201 and port part 202 is electrically connected with above three, but directly by the first flexible printed wiring board 110th, it is integrated into the combined type signal of sandwich construction on the second flexible printed wiring board 120 and the 3rd flexible printed wiring board 130 Transmitting device 700.As shown in figure 4, will be soft with the first flexible printed wiring board 110, the second flexible printed wiring board 120 and the 3rd Property printed circuit board (PCB) 130 equivalent flexible printed wiring board respectively with the first flexible printed wiring board 111, the second soft printing electricity The flexible printed wiring board 131 of road plate 121 and the 3rd represents, to be separated with previous embodiment.Combined type signal transmitting apparatus 700 is First flexible printed wiring board 111, the second flexible printed wiring board 121 and the 3rd flexible printed wiring board 131 is overlapping, and The sandwich construction of insulating barrier 300 is set between three.Wherein, insulating barrier 300 sets several through holes 310, and sets respectively conductive Post 320 makes the first flexible printed wiring board 111, the second flexible printed wiring board separated in several above-mentioned through holes 310 121 and the 3rd it can be electrically connected between flexible printed wiring board 131.Alternatively, the first flexible printed wiring board 110 can be used instead rigid Circuit board.In addition, insulating barrier 300 also can be further set under the first flexible printed wiring board 111.
The material of insulating barrier 300 can be for example:Polyimides, polyethylene terephthalate glycol, poly- naphthalenedicarboxylic acid Glycol ester or other insulating materials commonly used in this field.Conductive pole 320 can be conducting resinl, anisotropic conductive film or other The conductive material that field is commonly used.
For example, the second flexible printed wiring board 121 can be electrically connected with the light source of display module 100, the 3rd soft print Printed circuit board 131 can be electrically connected with the contact panel of display module 100.Second flexible printed wiring board 121 and the 3rd soft print Printed circuit board 131 is electrically connected with by the conductive pole 320 being arranged in through hole 310 and then with the first flexible printed wiring board 111, Further it is electrically connected with by connecting portion 500 and system.However, above are only example, the configuration actually implemented can be according to need Ask and be adjusted.For example, the second flexible printed wiring board 121 can be similarly disposed at first with the 3rd flexible printed wiring board 131 Same plane on flexible printed wiring board 111, and the above method is respectively adopted and electrically connects with the first flexible printed wiring board 111 Connect.
In an exemplary embodiment of the present invention, there is provided a kind of slim combined type signal transmitting apparatus.Similarly, for upper State matching somebody with somebody between the first flexible printed wiring board 110, the second flexible printed wiring board 120 and the 3rd flexible printed wiring board 130 The relation of putting optimizes.By the first flexible printed wiring board 110, the second flexible printed wiring board 120 and the 3rd soft printing electricity The composite soft printed circuit board (PCB) for the sandwich construction that application is similar in a upper embodiment is integrated on road plate 130, is formed slim multiple Box-like signal transmitting apparatus 800, structure is as shown in Figure 5.In Figure 5, slim combined type signal transmitting apparatus 800 includes and first Circuit of first conductive pattern 112 of the circuit equivalent of flexible printed wiring board 110 and the second flexible printed wiring board 120 etc. The second conductive pattern 122 and the 3rd conductive pattern 132 with the circuit equivalent of the 3rd flexible printed wiring board 130 of effect.Wherein, First conductive pattern 112 may be disposed in any insulative substrate (not indicated in figure), and is provided with and leads in insulative substrate Electric portion 500, it is electrically connected with said structure.
In the bottom of slim combined type signal transmitting apparatus 800 and above-mentioned first conductive pattern 112, the second conductive pattern 122 and the 3rd insulating barrier 400 is set between conductive pattern 132, and interlayer conduction structure 410 is set wherein, make first conductive It is electrically connected between pattern 112, the second conductive 122 and the 3rd conductive pattern 132 of pattern by interlayer conduction structure 410.Interlayer The formation of conducting structure 410, it is included in insulating barrier 400 and forms at least one through hole, and the hole wall of the through hole is via change Learn and electroplating technology forms conductive coating.The material of coating can be metal or conductive plastics, or other equally have The material of electric conductivity.The coating is electrically connected with the conductive pattern of interlayer conducting structure upper strata and lower floor, it is electrically connected each other Connect.
Slim combined type signal transmitting apparatus 800 ground different from the combined type signal transmitting apparatus 700 of previous embodiment Fang Shi, the first conductive pattern 112, the second conductive 122 and the 3rd conductive pattern 132 of pattern are formed by copper foil impressing, its thickness Much smaller than the first foregoing flexible printed wiring board 111, the second flexible printed wiring board 121 and the 3rd flexible printed wiring board 131.Therefore, the integral thickness of slim combined type signal transmitting apparatus 800 is smaller than combined type signal transmitting apparatus 700.
In addition, though the insulating barrier 400 of slim combined type signal transmitting apparatus 800 can be made up of homogenous material, it is formed It is divided into two parts, the insulating barrier of respectively original as solid-state, and the liquid dielectric layer before solidification, wherein, insulating barrier 400 Material can be polyimides.Insulating barrier 400 is provided in the first conductive pattern 112, the second conductive conductive pattern of pattern 122 and the 3rd Between sample 132.The preceding aggressiveness that uncured liquid polyimides is coated between insulating barrier 400 and above-mentioned three kinds of conductive patterns is molten Material before liquid, that is, the solidification of insulating barrier 400, and can make its solidification via the organic solvent in heating stepses removal solution Form insulating barrier 400.The insulating barrier 400 set through the above way can more be used as auxiliary fitting in addition to insulation effect The adhesion material of first conductive pattern 112, the second conductive 122 and the 3rd conductive pattern 132 of pattern, pass slim combined type signal The structure of defeated device 800 is more firm.In a word, the signal transmitting apparatus of the present embodiment can by such as Fig. 6 flow manufacturing, Wherein step S11 to S17 is will briefly to be described the step of described above, and merely illustrative step, it is appropriate to make on demand Modification.
Similarly, present invention additionally comprises used by the way that the signal transmitting apparatus of described above is arranged in liquid crystal display device With transmission signal, and then a kind of liquid crystal display device is provided, and the liquid crystal display device can have above-mentioned signal transmitting apparatus Each embodiment possessed by benefit and effect.While the signal laser propagation effect of circuit board is not influenceed, change circuit board Set-up mode, by reducing the port being connected with system, and exempt this change of welding step because of larger processing procedure, can more reduce out Wrong probability, improve product yield.
Wherein, the signal transmitting apparatus of described above can also be arranged in other electronic installations, be not limited to display device, When applied to display device, the species of display device can be LCD display device, OLED display, QLED display devices, Curved-surface display device or other display devices.
What said above is described in detail according to preferred embodiment of the present invention, the right being not intended to limit the present invention Scope.Relevant art has usually intellectual and all should be understood that under the technical principle and spirit without prejudice to the present invention, can Above-described embodiment is modified and changed.Therefore the interest field of the present invention should be as described in appended claims.

Claims (10)

  1. A kind of 1. signal transmitting apparatus, it is characterised in that including:
    Insulative substrate;
    Connecting portion, it is arranged in the insulative substrate, is electrically connected with system;
    First conductive pattern, is arranged in the insulative substrate, is electrically connected with display module and the connecting portion;
    Second conductive pattern, it is arranged on the described first conductive pattern, with the display module and the first conductive pattern electricity Property connection;
    3rd conductive pattern, it is arranged on the described second conductive pattern, with the display module and the second conductive pattern electricity Property connection;
    Insulating barrier, it is arranged between the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern, and uses In insulating and be bonded the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern;
    Interlayer conduction structure, it is arranged in the insulating barrier, passes through the described second conductive pattern and the 3rd conductive pattern The first conductive pattern is electrically connected to the system.
  2. 2. signal transmitting apparatus as claimed in claim 1, it is characterised in that the interlayer conduction structure is included in the insulation Layer forms vertically oriented aperture there-through, and conductive coating is set on the hole wall of the through hole.
  3. 3. signal transmitting apparatus as claimed in claim 2, it is characterised in that the material of the coating is to be selected from metal and conduction Plastics.
  4. 4. signal transmitting apparatus as claimed in claim 1, it is characterised in that the insulating barrier and the described first conductive pattern, The second conductive pattern and the 3rd conductive pattern are by making the preceding oligomer solution before the insulating barrier solidification solidify shape It is bonded into the insulating barrier.
  5. 5. signal transmitting apparatus as claimed in claim 1, it is characterised in that the material of the insulating barrier is polyimides.
  6. A kind of 6. display device, it is characterised in that including:
    Display module;And
    System;
    Wherein, the display module and system are electrically connected with by signal transmitting apparatus, and the signal transmitting apparatus includes:
    Insulative substrate;
    Connecting portion, it is arranged in the insulative substrate, is electrically connected with the system;
    First conductive pattern, is arranged in the insulative substrate, is electrically connected with the display module and the connecting portion;
    Second conductive pattern, it is arranged on the described first conductive pattern, with the display module and the first conductive pattern electricity Property connection;
    3rd conductive pattern, it is arranged on the described second conductive pattern, with the display module and the second conductive pattern electricity Property connection;
    Insulating barrier, it is arranged between the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern, and uses In insulating and be bonded the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern;
    Interlayer conduction structure, it is arranged in the insulating barrier, is electrically connected with the first conductive pattern, the second conductive pattern And the 3rd conductive pattern, the described second conductive pattern and the 3rd conductive pattern is passed through the described first conductive pattern electricity Property is connected to the system.
  7. 7. display device as claimed in claim 6, it is characterised in that the interlayer conduction structure is included in the insulating barrier shape Into vertically oriented aperture there-through, and conductive coating is set, the material of the coating is to be selected from the hole wall of the through hole Metal and conductive plastics.
  8. 8. display device as claimed in claim 6, it is characterised in that the insulating barrier and the described first conductive pattern, described Second conductive pattern and the 3rd conductive pattern are by making the preceding oligomer solution before the insulating barrier solidification be formed by curing institute State insulating barrier and be bonded.
  9. 9. display device as claimed in claim 6, it is characterised in that the material of the insulating barrier is polyimides.
  10. A kind of 10. display device, it is characterised in that including:
    Display module;And
    System;
    Wherein, the display module and system are electrically connected with by signal transmitting apparatus, and the signal transmitting apparatus includes:
    Insulative substrate;
    Connecting portion, it is arranged in the insulative substrate, is electrically connected with the system;
    First conductive pattern, is arranged in the insulative substrate, is electrically connected with the display module and the connecting portion;
    Second conductive pattern, it is arranged on the described first conductive pattern, with the display module and the first conductive pattern electricity Property connection;
    3rd conductive pattern, it is arranged on the described second conductive pattern, with the display module and the second conductive pattern electricity Property connection;
    Insulating barrier, it is arranged between the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern, and uses It is by making the insulation with the described first conductive pattern, the second conductive pattern and the 3rd conductive pattern in insulation Preceding oligomer solution before layer solidification is formed by curing the insulating barrier and is bonded;
    Interlayer conduction structure, it is included in the vertically oriented aperture there-through that the insulating barrier is formed, is arranged in the insulating barrier, makes institute State the second conductive pattern and the 3rd conductive pattern is electrically connected to the system by the described first conductive pattern.
CN201711022849.9A 2017-10-26 2017-10-26 Signal transmission device and display device Active CN107765920B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201711022849.9A CN107765920B (en) 2017-10-26 2017-10-26 Signal transmission device and display device
PCT/CN2017/111206 WO2019080208A1 (en) 2017-10-26 2017-11-15 Signal transmission apparatus and display apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711022849.9A CN107765920B (en) 2017-10-26 2017-10-26 Signal transmission device and display device

Publications (2)

Publication Number Publication Date
CN107765920A true CN107765920A (en) 2018-03-06
CN107765920B CN107765920B (en) 2020-01-14

Family

ID=61270813

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711022849.9A Active CN107765920B (en) 2017-10-26 2017-10-26 Signal transmission device and display device

Country Status (2)

Country Link
CN (1) CN107765920B (en)
WO (1) WO2019080208A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738570B (en) * 2020-11-19 2021-09-01 英業達股份有限公司 Signal transmitting module and foldable electronic device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2896794Y (en) * 2006-03-02 2007-05-02 威盛电子股份有限公司 Circuit-board with differential signal transmission structure
CN102346587A (en) * 2010-08-03 2012-02-08 明兴光电股份有限公司 Touch panel
CN102945846A (en) * 2012-09-28 2013-02-27 京东方科技集团股份有限公司 Array substrate, manufacturing method thereof and display device
CN103887272A (en) * 2012-12-24 2014-06-25 日月光半导体制造股份有限公司 Electronic module and manufacturing method thereof
CN103915443A (en) * 2013-04-02 2014-07-09 上海天马微电子有限公司 Array substrate, preparation method thereof and liquid crystal display panel
CN104461112A (en) * 2013-09-17 2015-03-25 胜华科技股份有限公司 Touch pad and touch display device
US9048322B2 (en) * 2012-11-19 2015-06-02 Samsung Display Co., Ltd. Display substrate and method of manufacturing the same
CN104754868A (en) * 2013-12-30 2015-07-01 深南电路有限公司 Circuit board and implementation method for interlayer interconnection structure thereof and processing method for circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100527536C (en) * 2007-06-20 2009-08-12 友达光电股份有限公司 Electronic device, and circuit signal connection terminal module including therein and manufacturing method
CN101763186B (en) * 2008-12-23 2011-10-05 胜华科技股份有限公司 Touch control panel
CN103838415A (en) * 2012-11-24 2014-06-04 宝宸(厦门)光学科技有限公司 Flexible touch panel structure and manufacture method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2896794Y (en) * 2006-03-02 2007-05-02 威盛电子股份有限公司 Circuit-board with differential signal transmission structure
CN102346587A (en) * 2010-08-03 2012-02-08 明兴光电股份有限公司 Touch panel
CN102945846A (en) * 2012-09-28 2013-02-27 京东方科技集团股份有限公司 Array substrate, manufacturing method thereof and display device
US9048322B2 (en) * 2012-11-19 2015-06-02 Samsung Display Co., Ltd. Display substrate and method of manufacturing the same
CN103887272A (en) * 2012-12-24 2014-06-25 日月光半导体制造股份有限公司 Electronic module and manufacturing method thereof
CN103915443A (en) * 2013-04-02 2014-07-09 上海天马微电子有限公司 Array substrate, preparation method thereof and liquid crystal display panel
CN104461112A (en) * 2013-09-17 2015-03-25 胜华科技股份有限公司 Touch pad and touch display device
CN104754868A (en) * 2013-12-30 2015-07-01 深南电路有限公司 Circuit board and implementation method for interlayer interconnection structure thereof and processing method for circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738570B (en) * 2020-11-19 2021-09-01 英業達股份有限公司 Signal transmitting module and foldable electronic device

Also Published As

Publication number Publication date
CN107765920B (en) 2020-01-14
WO2019080208A1 (en) 2019-05-02

Similar Documents

Publication Publication Date Title
US8383948B2 (en) Flex-rigid wiring board and method for manufacturing the same
US6525718B1 (en) Flexible circuit board and liquid crystal display device incorporating the same
US8609991B2 (en) Flex-rigid wiring board and method for manufacturing the same
US8275223B2 (en) Opto-electrical hybrid wiring board and method for manufacturing the same
US9860978B1 (en) Rigid-flex board structure
US7952676B2 (en) Connection structures capable of reducing distortion of signal
CN110308519B (en) Optical fiber circuit board, manufacturing method thereof and optical transmission device
MX2011013097A (en) Circuit board and manufacturing method thereof.
US20110155460A1 (en) Substrate and substrate bonding device using the same
CN107831610A (en) Signal transmitting apparatus and display device
CN102246608A (en) Wiring board and method for manufacturing same
WO2015014048A1 (en) Rigid-flex printed circuit board and manufacturing method therefor
CN107817633A (en) Signal transmitting apparatus and display device
KR20150110522A (en) Component-embedded substrate and method for manufacturing same
CN107765920A (en) Signal transmitting apparatus and display device
CN107831609A (en) The manufacture method of signal transmitting apparatus and the manufacture method of display device
CN103596381B (en) A kind of manufacture method of printed circuit board (PCB)
US20140160696A1 (en) Display module with dual power lines
JP2010212466A (en) Method of manufacturing junction structure
JP2006344887A (en) Printed-wiring board and manufacturing method therefor
US20070285905A1 (en) Electronic device, display apparatus, flexible circuit board and fabrication method thereof
CN105407656B (en) A kind of method and printed circuit board of the manufacture of printed circuit board interlayer interconnection architecture
TWI388262B (en) Fabrication method of rigid-flex circuit board
TW202114502A (en) Flexible and rigid composite circuit board
JP2008076930A (en) Display device and manufacturing method therefor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant