CN2893619Y - Heat tube device for electronic refrigerator - Google Patents
Heat tube device for electronic refrigerator Download PDFInfo
- Publication number
- CN2893619Y CN2893619Y CN 200620059710 CN200620059710U CN2893619Y CN 2893619 Y CN2893619 Y CN 2893619Y CN 200620059710 CN200620059710 CN 200620059710 CN 200620059710 U CN200620059710 U CN 200620059710U CN 2893619 Y CN2893619 Y CN 2893619Y
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- China
- Prior art keywords
- pipe
- heat
- electronic refrigerator
- wall
- refrigerator according
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- Expired - Lifetime
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat-pipe device used in the electronic fridge comprises a heat-pipe arranged on the heat-end of the refrigeration-semiconductor. A wing-piece is arranged on the heat-pipe. And the heat-pipe comprises a vaporization-pipe used for vaporizing the refrigerant and a condensation-pipe used for condensing the refrigerant. The heat-pipe is connected with the heat-end of the refrigeration-semiconductor through a prefab liquid-cavity which comprises a left cavity and a right cavity. The two cavities are respectively connected with the vaporization-pipe and the condensation-pipe and are communicated with each other through a connection pipe. A heat-transmitting outer-wall which is jointed with the semiconductor heat-end is arranged outside the liquid-cavity. The heat-transmitting outer-wall is connected with an installation base-board, and after threaded through the base-board the vaporization-pipe and the condensation-pipe are respectively connected with the two cavities. The utility model combines the copper prefab liquid-cavity with the aluminium heat-transmitting outer-wall into a whole through casting. On the basis of guaranteeing the strength of liquid-cavity, the heat-transmitting efficiency is greatly enhanced. The productive efficiency and the finished-product rate of the structure are both very high, which quite fits the industrialization production.
Description
Technical field
The utility model relates to a kind of heat-pipe apparatus of electronic refrigerator.
Background technology
The heat pipe of common electronic refrigerator fits by a reservoir chamber and refrigeration semiconductor hot junction, the practice of this reservoir chamber is varied, wherein have kind of reservoir chamber's structure be directly on copper or the aluminum substrate drawing go out cavity, this manufacture craft and structure are all relatively simple, but yield rate is lower, and the cavity sides wall thickness that pulls out differs, and heat transfer efficiency is not ideal enough, the also bad control of quality makes the user not too satisfied.
The utility model content
The purpose of this utility model is to provide a kind of heat-pipe apparatus of simple and reasonable, production efficiency is high, steady quality and heat exchanger effectiveness are good electronic refrigerator, to overcome weak point of the prior art.
Press the heat-pipe apparatus of a kind of electronic refrigerator of this purpose design, comprise the heat pipe that is arranged on the refrigeration semiconductor hot junction, heat pipe is provided with fin, heat pipe comprises evaporation tube that is used for the refrigeration working medium evaporation and the condenser pipe that is used for the refrigeration working medium condensation, its architectural feature is that heat pipe joins by a prefabricated liquid storage cylinder and a refrigeration semiconductor hot junction, two chambers about this liquid storage cylinder comprises, evaporation tube and condenser pipe join with two chambers respectively, between two chambers by being connected communicating pipe.
The outside of above-mentioned liquid storage cylinder is provided with a heat conduction outer wall, and this heat conduction outer wall and semiconductor hot junction fit.
Above-mentioned a heat conduction outer wall and an installation base plate join, and evaporation tube and condenser pipe join with two chambers after passing installation base plate respectively.
Above-mentioned installation base plate is provided with the pilot hole of two to six symmetric arrangement.
The chamber wall of above-mentioned liquid storage cylinder is a copper, and the heat conduction outer wall is an aluminum, copper liquid storage cylinder and aluminum heat conduction outer wall by the cast or die casting after become one.
Above-mentioned evaporation tube and condenser pipe join with two chamber tops respectively, are positioned at the middle and lower part of two chambers communicating pipe.
Two above-mentioned chambers are respectively column structure.
The extension that is inclined upwardly respectively of above-mentioned evaporation tube and condenser pipe, wherein, it is bigger than the angle of inclination of condenser pipe that evaporation tube is positioned at the angle of inclination of leading portion part.
Above-mentioned evaporation tube and condenser pipe join with a four-way pipe respectively.
The distance in the chamber of above-mentioned liquid storage cylinder and refrigeration semiconductor hot junction is 1～10mm.
The utility model is become one with prefabricated liquid storage cylinder made of copper and aluminum heat conduction outer wall by cast, is guaranteeing to have improved heat transfer efficiency greatly on the liquid storage cylinder cavity intensity based; And the production efficiency of this structure and yield rate are all quite high, are very suitable for suitability for industrialized production.
The distance in the chamber of liquid storage cylinder and refrigeration semiconductor hot junction can be set to 1～10mm as required in the utility model, has also increased the scope of application of this product greatly.
It is bigger than the angle of inclination of condenser pipe that evaporation tube is positioned at leading portion angle of inclination partly in the utility model, this structural design is guaranteeing under the prerequisite that the gaseous state refrigeration working medium can externally dispel the heat rapidly, in its condensation process, flowing of liquid refrigeration working medium is slow relatively, be convenient to abundant condensation, carry out enough preparations for effectively circulating next time.
Installation base plate in the utility model both can be made separately, also can be simultaneously and heat conduction outer wall moulding by casting together.
The utility model is simple and reasonable, production efficiency is high, steady quality and heat exchanger effectiveness are good.
Description of drawings
Fig. 1 is the utility model one embodiment master's TV structure schematic diagram.
Fig. 2 is the plan structure schematic diagram of Fig. 1.
Fig. 3 is the backsight structural representation of Fig. 1.
Fig. 4 is the A-A sectional structure schematic diagram of Fig. 3.
Fig. 5 is the amplification perspective view of prefabricated liquid storage cylinder.
Fig. 6 becomes the structural representation of one after for prefabricated liquid storage cylinder and the cast of heat conduction outer wall.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described.
Referring to Fig. 1-Fig. 6, the heat-pipe apparatus of this electronic refrigerator, comprise the heat pipe that is arranged on the refrigeration semiconductor hot junction, heat pipe is provided with fin, heat pipe comprises evaporation tube 1 that is used for the refrigeration working medium evaporation and the condenser pipe 2 that is used for the refrigeration working medium condensation, heat pipe joins by a prefabricated liquid storage cylinder and a refrigeration semiconductor hot junction, two chambers about this liquid storage cylinder comprises, evaporation tube 1 and condenser pipe 2 join with two chamber tops respectively, be connected by communicating pipe 5 between two chambers, communicating pipe 5 is positioned at the middle and lower part of two chambers.Two chambers are respectively column structure.
The outside of liquid storage cylinder is provided with a heat conduction outer wall 6, and this heat conduction outer wall and semiconductor hot junction fit.A heat conduction outer wall 6 and an installation base plate 6.1 join, and evaporation tube 1 and condenser pipe 2 pass installation base plate 6.1 backs respectively and join with two chambers.Installation base plate 6.1 is provided with the pilot hole 6.1.1 of four symmetric arrangement.Wherein, the chamber wall of liquid storage cylinder is a copper, and the heat conduction outer wall is an aluminum, copper liquid storage cylinder and aluminum heat conduction outer wall by the cast or die casting after become one.The distance in the chamber of liquid storage cylinder and refrigeration semiconductor hot junction is 1～10mm.The extension that is inclined upwardly respectively of evaporation tube 1 and condenser pipe 2, wherein, it is bigger than the angle of inclination of condenser pipe 2 that evaporation tube 1 is positioned at the angle of inclination of leading portion part.Evaporation tube 1 and condenser pipe 2 join with a four-way pipe 3 respectively.
Among the figure, 7 for installing location-plate.
Claims (10)
1. the heat-pipe apparatus of an electronic refrigerator, comprise the heat pipe that is arranged on the refrigeration semiconductor hot junction, heat pipe is provided with fin, heat pipe comprises evaporation tube that is used for the refrigeration working medium evaporation and the condenser pipe that is used for the refrigeration working medium condensation, it is characterized in that described heat pipe joins by a prefabricated liquid storage cylinder and a refrigeration semiconductor hot junction, two chambers about this liquid storage cylinder comprises, evaporation tube (1) and condenser pipe (2) join with two chambers respectively, are connected by communicating pipe (5) between two chambers.
2. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that the outside of described liquid storage cylinder is provided with a heat conduction outer wall (6), and this heat conduction outer wall and semiconductor hot junction fit.
3. the heat-pipe apparatus of electronic refrigerator according to claim 2 is characterized in that a described heat conduction outer wall and an installation base plate (6.1) join, and evaporation tube (1) and condenser pipe (2) join with two chambers after passing installation base plate respectively.
4. the heat-pipe apparatus of electronic refrigerator according to claim 3 is characterized in that described installation base plate (6.1) is provided with the pilot hole (6.1.1) of two to six symmetric arrangement.
5. the heat-pipe apparatus of electronic refrigerator according to claim 2, the chamber wall that it is characterized in that described liquid storage cylinder is a copper, and the heat conduction outer wall is an aluminum, and copper liquid storage cylinder and aluminum heat conduction outer wall are become one after by cast or die casting.
6. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that described evaporation tube (1) and condenser pipe (2) join with two chamber tops respectively, and communicating pipe (5) is positioned at the middle and lower part of two chambers.
7. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that described two chambers are respectively column structure.
8. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that the extension that is inclined upwardly respectively of described evaporation tube (1) and condenser pipe (2), and wherein, it is bigger than the angle of inclination of condenser pipe that evaporation tube is positioned at the angle of inclination of leading portion part.
9. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that described evaporation tube (1) and condenser pipe (2) join with a four-way pipe (3) respectively.
10. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that the chamber of described liquid storage cylinder and the distance in refrigeration semiconductor hot junction are 1～10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620059710 CN2893619Y (en) | 2006-05-27 | 2006-05-27 | Heat tube device for electronic refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620059710 CN2893619Y (en) | 2006-05-27 | 2006-05-27 | Heat tube device for electronic refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2893619Y true CN2893619Y (en) | 2007-04-25 |
Family
ID=38061780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620059710 Expired - Lifetime CN2893619Y (en) | 2006-05-27 | 2006-05-27 | Heat tube device for electronic refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2893619Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329866A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold end heat exchange device thereof |
-
2006
- 2006-05-27 CN CN 200620059710 patent/CN2893619Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329866A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold end heat exchange device thereof |
| CN104329866B (en) * | 2014-03-28 | 2017-02-15 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold end heat exchange device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070425 |
|
| EXPY | Termination of patent right or utility model |