CN202041109U - Superconductive microcirculation groove-type flat heat pipe - Google Patents
Superconductive microcirculation groove-type flat heat pipe Download PDFInfo
- Publication number
- CN202041109U CN202041109U CN2011200152580U CN201120015258U CN202041109U CN 202041109 U CN202041109 U CN 202041109U CN 2011200152580 U CN2011200152580 U CN 2011200152580U CN 201120015258 U CN201120015258 U CN 201120015258U CN 202041109 U CN202041109 U CN 202041109U
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- heat pipe
- plate heat
- microcirculation
- superconduction
- flat
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Abstract
The utility model relates to the heat exchange technical field, especially to a superconductive microcirculation groove-type flat heat pipe which is formed by integral extrusion moulding. More than one through hole is arranged side by side on the flat heat pipe and sequentially filled with working media. Both ends of the flat heat pipe are sealed to form an integral flat heat pipe, and a plurality of trapezoid or circular grooves and supporting structures are arranged on the inner walls of the through holes. The grooves form capillary structures, and the transition between supporting structures and the upper and lower wall surfaces is fillet. The flat heat pipe, light and small, has the advantages of small thermal resistance, rapid thermal response, large heat transfer amount, simple structure and high structure strength. Moreover, the flat heat pipe can be easily formed through extrusion moulding, and can be used under a non-gravitational field.
Description
Technical field
The utility model relates to the heat transfer technology field, relates in particular to a kind of superconduction microcirculation slot type flat-plate heat pipe.
Background technology
Along with the develop rapidly of industries such as IT, communication, LED, solar energy, wherein the heating power of used electronic element is also improving constantly, and utilizes traditional radiating subassembly to be difficult to well solve relevant hot arraign topic.
Now heat-transferring assembly is mainly based on heat pipe in the radiating module, and the general structure of conventional heat pipe is, has the pipe of certain diameter, and is sealed at both ends after the inner can working medium.Heat pipe has the heat exchange efficiency height, characteristics such as volume is little, cost is low, reliability height for other heat exchange structure.
And traditional heat pipe is in order to increase and the contacting or welding effect of thermal source or other assembly, generally to flatten processing, and the heat pipe after flattening, again output little, the transmission range of hot transmission quantity short, flatten problems such as yielding, that structural strength is low, especially flattening 2.0mm when following, heat conveyance performance significantly decays.The application provides a kind of superconduction microcirculation slot type flat-plate heat pipe for this reason, and it is big to have thermal resistance Xiao ﹑ thermal response Kuai Su ﹑ heat output Da ﹑ Ti Ji in light weight Xiao ﹑ Jie structure Jian Dan ﹑ structural strength, and extrusion modling is simple and easy, can be in characteristics such as agravic runnings after the match.
Summary of the invention
The utility model provides a kind of superconduction microcirculation slot type flat-plate heat pipe, and technical problem to be solved is after conventional heat pipe is flattened, and the hot transmission quantity that is produced is little, transmission range short, flatten defectives such as yielding, that structural strength is low.
The technical solution of the utility model is:
A kind of superconduction microcirculation slot type flat-plate heat pipe includes an above through hole, and be marked with working medium in through hole in the described flat-plate heat pipe, thereby sealed at both endsly forms whole flat-plate heat pipe, and is provided with groove at described through-hole wall, forms capillary structure between the adjacent trenches.
Described through hole is arranged side by side in described flat-plate heat pipe.
Include two above through holes in the described flat-plate heat pipe and arrange side by side, described each through-hole wall is provided with groove successively, forms capillary structure between the adjacent trenches.
The cross sectional shape of described through hole is oval, is fillet at the angle of cut of horizontal wall surface up and down and internal vertical direction, the formation supporting construction.
The cross sectional shape of described groove is circular or trapezoidal.
In the inwall circumference of described through hole, evenly be provided with some grooves.
The used material of described flat-plate heat pipe is aluminium or copper.
Described groove for described slab construction be that one extruding forms.
Technique effect of the present utility model is:
This by the monolithic extruded flat-plate heat pipe structure that forms, dull and stereotyped inside is provided with one or more through holes, through-hole wall is provided with groove, thereby groove becomes capillary structure, and each relatively independent through hole is marked with working medium successively, dull and stereotyped flat tube is sealed at both ends, form a plurality of independently seal chambers, to constitute multichannel microcirculation heat pipe structure.
Microchannel configuration both provided capillary force for working medium is back to evaporation ends from colling end, had constituted liquid reflux channel simultaneously, and the dried wet channel of steam and liquid refrigerant is separated, thereby had guaranteed the heat transfer property energy of superconduction microcirculation slot type flat-plate heat pipe.The while microchannel configuration, it is big to have structural strength, the easy characteristics of extrusion modling.
And this flat-plate heat pipe forms by an extrusion modling, has certain fillet supporting construction, can well strengthen the structural strength of flat tube, improve general heat pipe owing to flatten the top and bottom depression that shaping causes, or because the not strong problem of structural strength that hollow structure caused.
Superconduction microcirculation slot type flat-plate heat pipe is combined by a plurality of independently microcirculation heat pipes, topmost advantage is that not only its heat exchange surface is much larger than conventional heat pipe, and because the relative conventional heat pipe of superconduction microcirculation slot type flat-plate heat pipe has bigger evaporation gas flow area, can satisfy in the backflow capillary force under the prerequisite of condensate liquid backflow requirement, can effectively improve the defeated heat of maximum of superconduction microcirculation slot type flat-plate heat pipe, and can satisfy the heat dissipation problem of multiple spot thermal source, has uniformity of temperature profile, thermal resistance is little, thermal response is quick, heat output is big, volume in light weight is little, simple in structure, structural strength is big, and extrusion modling is simple and easy, can be in characteristics such as agravic runnings after the match.
Description of drawings
Fig. 1 is the profile of the utility model first embodiment.
Fig. 2 is the profile of the utility model second embodiment.
Wherein, each Reference numeral representative is as follows: 1-plate frame 2-through hole 3-groove 4-fillet
The specific embodiment
Relevant detailed description of the present utility model and technology contents, conjunction with figs. is described as follows.
As shown in Figure 1, first embodiment of the present utility model.This superconduction microcirculation slot type flat-plate heat pipe, adopting aluminium or copper is material, the one extrusion molding.Flat-plate heat pipe comprises the plate frame 1 of extruding, comprises one group of through hole that is arranged side by side 2 in the plate frame 1, is marked with working medium in the through hole 2, sealed at both ends, the cross sectional shape of each through hole 2 is oval, is fillet 4 at the angle of cut of horizontal wall surface up and down and internal vertical direction, the formation supporting construction.Evenly be provided with groove 3 in the inwall circumference of through hole 2, the cross sectional shape of groove is trapezoidal, forms capillary structure.
As shown in Figure 2, second embodiment of the present utility model.This superconduction microcirculation slot type flat-plate heat pipe, adopting aluminium or copper is material, the one extrusion molding.Flat-plate heat pipe comprises the plate frame 1 of extruding, comprises one group of through hole that is arranged side by side 2 in the plate frame 1, is marked with working medium in the through hole 2, sealed at both ends, the cross sectional shape of each through hole 2 is oval, is fillet 4 at the angle of cut of horizontal wall surface up and down and internal vertical direction, the formation supporting construction.Evenly be provided with groove 3 in the inwall circumference of through hole 2, the cross sectional shape of groove is circular, forms capillary structure.
Claims (8)
1. a superconduction microcirculation slot type flat-plate heat pipe is characterized in that, includes an above through hole in the described flat-plate heat pipe, and in through hole, be marked with working medium, thereby sealed at both endsly form whole flat-plate heat pipe, described through-hole wall is provided with groove, thereby groove forms capillary structure.
2. a kind of superconduction microcirculation slot type flat-plate heat pipe as claimed in claim 1 is characterized in that used material is aluminium or copper.
3. a kind of superconduction microcirculation slot type flat-plate heat pipe as claimed in claim 1 is characterized in that, described groove is for forming with described slab construction one extruding.
4. as claim 1,2 or 3 described a kind of superconduction microcirculation slot type flat-plate heat pipes, it is characterized in that described through hole is arranged side by side in described flat-plate heat pipe.
5. a kind of superconduction microcirculation slot type flat-plate heat pipe as claimed in claim 4 is characterized in that include two above through holes in the described flat-plate heat pipe and be arranged side by side, described each through-hole wall is provided with groove successively, thereby groove forms capillary structure.
6. a kind of superconduction microcirculation slot type flat-plate heat pipe as claimed in claim 5 is characterized in that, in the inwall circumference of described through hole, evenly is provided with some grooves.
7. a kind of superconduction microcirculation slot type flat-plate heat pipe as claimed in claim 6 is characterized in that, the cross sectional shape of described through hole is oval, and the angle of cut of horizontal wall surface and internal vertical direction forms fillet, the formation supporting construction up and down.
8. a kind of superconduction microcirculation slot type flat-plate heat pipe as claimed in claim 7 is characterized in that, the cross sectional shape of described groove is circular or trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200152580U CN202041109U (en) | 2011-01-18 | 2011-01-18 | Superconductive microcirculation groove-type flat heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200152580U CN202041109U (en) | 2011-01-18 | 2011-01-18 | Superconductive microcirculation groove-type flat heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202041109U true CN202041109U (en) | 2011-11-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200152580U Expired - Lifetime CN202041109U (en) | 2011-01-18 | 2011-01-18 | Superconductive microcirculation groove-type flat heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202041109U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179775A (en) * | 2013-02-28 | 2013-06-26 | 中国科学院高能物理研究所 | Superconducting accelerator, superconducting cavity for same and manufacturing method of superconducting accelerator |
| CN104457359A (en) * | 2015-01-02 | 2015-03-25 | 季弘 | Plate type heat pipe with separation channels |
| CN104792206A (en) * | 2015-04-24 | 2015-07-22 | 江劲松 | Plate type heat pipe with special-shaped grooves |
-
2011
- 2011-01-18 CN CN2011200152580U patent/CN202041109U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179775A (en) * | 2013-02-28 | 2013-06-26 | 中国科学院高能物理研究所 | Superconducting accelerator, superconducting cavity for same and manufacturing method of superconducting accelerator |
| CN104457359A (en) * | 2015-01-02 | 2015-03-25 | 季弘 | Plate type heat pipe with separation channels |
| CN104457359B (en) * | 2015-01-02 | 2016-06-29 | 季弘 | There is the plate-type heat-pipe of split tunnel |
| CN104792206A (en) * | 2015-04-24 | 2015-07-22 | 江劲松 | Plate type heat pipe with special-shaped grooves |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: DONGGUAN GUOYAN INDUSTRIAL LTD Effective date: 20121101 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20121101 Address after: 100048 A, block 72, West Third Ring Road North, Beijing, Haidian District, 2709 Patentee after: State Energy Research (Beijing) Steady-State Heat and Mass Transfer Technology Research Institute Co., Ltd. Patentee after: Dongguan State Industry Co., Ltd. Address before: 100048 A, block 72, West Third Ring Road North, Beijing, Haidian District, 2709 Patentee before: State Energy Research (Beijing) Steady-State Heat and Mass Transfer Technology Research Institute Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20111116 |
|
| CX01 | Expiry of patent term |