CN2829318Y - Radiation base module set - Google Patents
Radiation base module set Download PDFInfo
- Publication number
- CN2829318Y CN2829318Y CN 200520106505 CN200520106505U CN2829318Y CN 2829318 Y CN2829318 Y CN 2829318Y CN 200520106505 CN200520106505 CN 200520106505 CN 200520106505 U CN200520106505 U CN 200520106505U CN 2829318 Y CN2829318 Y CN 2829318Y
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- heat
- heat conduction
- implantation piece
- base module
- backplane level
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat radiation base seat module and is provided with a base seat, wherein the base seat is provided with a metal heat radiation fin group. A flat surface bottom plate layer assembly composed of a plurality of graphite layers is arranged in the base seat, and an implantation component with the high-heat conduction characteristic vertical to the flat surface bottom plate layer assembly is nested in the flat surface bottom plate layer assembly. The implantation component can be made of heat conduction graphite composite material, metal heat conduction composite material without directivity or composite heat conduction material generating the phase change because of the heat, and the periphery of the bottom plate layer assembly is sheathed with a heat conduction frame with the non-directivity high-heat conduction characteristic. When the heat radiation base seat module is used, the implantation component is applied to the position of the heat source and is caused to rapidly absorb and conduct the heat generated by the heat source. Because a graphite layer has the specific directivity in the process of conducting the heat, the heat is immediately delivered toward the periphery to the heat conduction frame through the horizontal graphite layer when the heat conduction enters into the implantation component. Then the heat is rapidly diffused to the outside world by heat radiation fins.
Description
Technical field
The utility model is a kind of cooling base module, this module mainly is the backplane level assembly that graphite linings made up by the high thermal conduction characteristic of in-plane tool, and be nested in the implantation piece of plane bottom plate layer assembly and vertical with it tool high thermal conductivity, add the cooperation of the heat conduction frame of the high thermal conduction characteristic of non-directivity, make heat conduct out by thermal source rapidly by implantation piece and via the backplane level assembly, and heat is distributed to the peripheral external world, and unlikely being trapped on the thermal source by the heat conduction frame.
Background technology
Recent years electronic product, constantly develop towards high-density packages and multifunction direction, make heat dissipation problem become very thorny problem, these electronic building bricks are not if make appropriate heat radiation countermeasure, not only can't bring into play performance, when serious even can cause the heat of machine intimate to explode and cause consequence such as electronic product instability.
Always, relevant electronic product is for suppressing the rising of electronic component temperature in its use, the normal high metal fins of heat conductivity efficient such as copper, aluminium that use, the heat that this its electronic component of fin conductive is taken place is shed it according to the temperature difference of its temperature with outer gas by the surface.
But that a kind of heat dissipation metal module no matter, all can be along with the area of electronic component and the speed of the heat that produces, and add large volume, but strengthen its volume, then can increase its weight, especially the development at electronic product develops towards light, thin, short, little, miniaturization, the inside of electronic product can provide as the space of dispelling the heat by inadequate, more the weight because of fin increases, and then the electronic component that is pressed against under it is damaged by pressure, or other situation produces.
For this reason, promptly have a kind of graphite that utilizes to occur as the patent of heat sink material, it is a United States Patent (USP) the 6th, 758, No. 263 patents, please refer to shown in Figure 1ly, it comprises the graphite base 100 on a plane, and this base 100 has the high thermal conduction characteristic that is parallel to thermal source, this base 100 is provided with a hole 101, embedded a high thermal conductivity implantation piece 110 at this hole 101, this implantation piece 110 can be metallic copper, and is equipped with most radiating fins 120 parallel to each other on this base 100.
This kind device construction, though can replace metal as base by graphite, and alleviate the weight of radiating seat, because of though graphite has high thermal conductivity, but conducting when hot is to have directivity (anisotropic), so, when base 100 absorbs hot that implantation pieces 110 are conducted, this base 100 has high thermal conductivity because of only having the thermal source of being parallel to direction, but the passage that there is no high heat conduction conducts heat to radiating fin 120, therefore also heat can't be spread to the external world rapidly by radiating fin, and cause heat can rest on base 100, cause electronic building brick impaired, even can't start.
For improving the various shortcomings of above-mentioned known devices structure, the inventor is through the permanent research and experiment of making great efforts, and development and Design goes out a kind ofly can conduct heat rapidly finally, and with thermal diffusion to extraneous, increase the cooling base module of radiating effect.
Summary of the invention
The purpose of this utility model, be to provide a kind of cooling base module, it is provided with a pedestal, this pedestal is made up of backplane level assembly and heat conduction frame, this backplane level assembly is made up of to the graphite linings that its plane has high thermal conduction characteristic majority, and this backplane level assembly in position is provided with hole to embed implantation piece, this implantation piece can by with the graphite composite material of the mutual vertical conduction heat of heat conduction direction of backplane level assembly, or do not have a metal heat-conducting composite material of directivity, or have Yin Re and produce the heat-conductive composite material of phase change or formed by this three's composite material; In addition, this backplane level assembly and tight involution have a heat conduction frame, moreover, can be provided with a radiating fin group on this pedestal, when using with order, implantation piece directly can be abutted in core place, near-thermal source, make heat by implantation piece conduction, and when implantation piece the time, heat can be conducted along its plane bearing of trend at the backplane level assembly of implantation piece periphery in conduction heat, then be sent to the heat conduction frame by the backplane level assembly, and then rapidly that thermal diffusion is extremely extraneous, so, not only can be made by Heat Conduction Materials such as graphite composite materials because of pedestal, and can alleviate the weight of entire heat dissipation module, and can make the unlikely puzzlement that is trapped on the pedestal of heat.
Another purpose of the present utility model, be to provide a kind of cooling base module, the backplane level assembly of this pedestal is stepped, cooperate with it and also be provided with relatively as stair-stepping convex body in the heat conduction frame that cooperates with it, the convex body of heat conduction frame can closely be nested in respectively on the different graphite linings of backplane level assembly, and then heat conduction frame and backplane level assembly are closely connected together.
A purpose more of the present utility model, be to provide a kind of cooling base module, its implantation piece can be the lamellar body coiling and forms, or can be the block that flat board is composited, or by three-dimensional three-dimensional space skeleton shape structure and fill direction-free Heat Conduction Material and formed, or formed by the block of tool phase change composite material.
Description of drawings
Fig. 1: be the schematic diagram of known devices.
Fig. 2: be the schematic perspective view of the utility model one embodiment.
Fig. 3: be the perspective exploded view of the utility model one embodiment.
Fig. 4: be the schematic top plan view of the utility model one embodiment.
Fig. 5: the sectional schematic diagram when implementing for the utility model one embodiment.
Fig. 6: be the sectional schematic diagram of the utility model second embodiment.
Fig. 7: be the schematic perspective view of the utility model the 3rd embodiment.
Fig. 8: be the schematic perspective view of the utility model the 4th embodiment.
Fig. 9: be the schematic perspective view of the utility model the 5th embodiment.
Figure 10: be the sectional schematic diagram of the utility model the 6th embodiment.
Drawing reference numeral:
Graphite linings 12 holes 13
Conducting strip 14 radiating fin groups 20
Bottom 21 fins 22
Recess 34 heat conduction frames 40
Convex body 41 heat-conducting glues (cream) 50
Embodiment
The utility model is a kind of cooling base module, see also shown in Fig. 2,3,4,5, it is the utility model one embodiment, these pedestal 10 tops are provided with a radiating fin group 20, this radiating fin group 20 is provided with a bottom 21, in present embodiment is a flat board, and this bottom 21 is provided with the fin 22 of most marshallings.
This pedestal 10 is made up of a backplane level assembly 11 and the heat conduction frame 40 that is hollow, and this backplane level assembly 11 is made up of the graphite linings 12 that most its in-plane of layer have high thermal conduction characteristic, again these graphite linings 12 from down to up area can dwindle gradually, and as stepped arrangement, and this backplane level assembly 11 in position is provided with one and runs through the whole hole 13 of graphite linings 12, be nested with an implantation piece 30 in this hole 13, in the implantation piece 30 of present embodiment is (but to be familiar with the metal heat-conducting composite material that this skill person can the non-directivity of tool by the reel scroll that forms of the graphite lamellar body of filling the phase change Heat Conduction Material, or have Yin Re and the heat-conductive composite material that produces phase change substitute), and this implantation piece 30 is close to its lateral section with quick conduction heat and is bordering on the thermal source place, and it is vertical mutually with backplane level assembly 11, and this implantation piece 30 can be coated with heat-conducting glue (cream) 50 with hole 13 joints, this heat-conducting glue (cream) 50 can melt because of high temperature, and the generation phase change, and then implantation piece 30 and backplane level assembly 11 tightening seals are lumped together.
In addition, these backplane level assembly 11 peripheral sleeves are connected to a heat conduction frame 40 that can be hollow, in present embodiment is the copper alloy frame, be provided with in this heat conduction frame 40 and can be most individual stair-stepping convex bodys 41 that are arranged in, these convex bodys 41 can be nested in respectively on the graphite linings 12 different in the backplane level assembly 11,11 of these convex bodys 41 and backplane level assemblies can be coated with the heat-conducting glue (cream) 50 of tool phase change again, and heat conduction frame 40 and backplane level assembly 11 peripheries are closely connected together.
Again, this heat conduction frame 40 go up down or the upper and lower opening place can be in backplane level assembly 11 be placed in heat conduction frame 40 after, post a conducting strip 14 to strengthen fixedly engaging of heat conduction frame 40 and plinth course assembly 11.
During use, please refer to shown in Figure 5, the utility model directly can be abutted on the processor 60 of heating, make implantation piece 30 directly recline closely at heating processor 60 thermal source core places, heat is outwards conducted along implantation piece 30 placing directions, and when implantation piece 30 when conducting heat to radiating fin group 20, implantation piece 30 also conducts heat to the backplane level assembly 11 of periphery, and this backplane level assembly 11 can be with heat along its plane bearing of trend conduction, then be sent to heat conduction frame 40 by backplane level assembly 11, and then rapidly heat is diffused to the external world by radiating fin group 20, so, not only can all make, and can alleviate the weight of entire heat dissipation module, and can make unlikely being trapped on the pedestal 10 of heat because of backplane level assembly 11 and implantation piece 30 by the graphite heat conducting composite material.
Please refer to shown in Figure 6ly, be second embodiment of the present utility model, can be provided with a radiating fin group 20 on this pedestal 10, this radiating fin group 20 is provided with a bottom 21, and this bottom 21 is provided with the fin 22 of most marshallings.
This pedestal 10 is made up of a backplane level assembly 11 and heat conduction frame 40, and this backplane level assembly 11 is made up of the graphite linings 12 that most its in-plane of layer have high thermal conduction characteristic, and this backplane level assembly 11 in position is provided with one and runs through the whole hole 13 of graphite linings 12, be nested with an implantation piece 30 in this hole 13, can (but be familiar with the metal heat-conducting composite material that this skill person can the non-directivity of tool by the reel scroll that form of the graphite lamellar body of filling the phase change Heat Conduction Material in this implantation piece 30 of present embodiment, or have Yin Re and the heat-conductive composite material that produces phase change substitute), because of this implantation piece 30 is close to the thermal source place with the lateral section that it has quick conduction heat, and with in backplane level assembly 11 mutual vertical materials, and this implantation piece 30 can be coated with heat-conducting glue (cream) 50 with hole 13 joints, this heat-conducting glue (cream) 50 can melt because of high temperature, and the generation phase change, and then implantation piece 30 and backplane level assembly 11 are closely linked.
In addition, these backplane level 11 peripheral involutions have a face closure adjacent to radiating fin group 20, and adjacent to the face opening of thermal source, and be the heat conduction frame 40 of " ㄇ type ", in present embodiment is the copper alloy frame, be provided with in this heat conduction frame 40 and can be most individual stair-stepping convex bodys 41 that are arranged in, these convex bodys 41 can be nested in respectively on the graphite linings 12 different in the backplane level assembly 11,11 of these convex bodys 41 and backplane level assemblies are coated with the heat-conducting glue (cream) 50 of tool phase change again, and heat conduction frame 40 and backplane level assembly 11 peripheries are closely connected together.
Again, the opening part of this heat conduction frame 40 can be in plinth course assembly 11 be placed in heat conduction frame 40 after, post a conducting strip 14 to strengthen the heat conduction and the driving fit of heat conduction frame 40 and processor 60.
Please refer to shown in Figure 7, be the 3rd embodiment of the present utility model, this pedestal 10 is made up of a backplane level assembly 11 and heat conduction frame 40, in this pedestal 10 hole 13 is arranged again, and put an implantation piece 30 in this hole 13, implantation piece 30 in present embodiment is made up of most upright tabular graphite linings by one, and be provided with the hole slot 31 that majority runs through in this implantation piece 30, and be equipped with metallic rod body 32 in this hole slot 31, to strengthen implantation piece 30 wears direction along metallic rod body 32 heat-conducting effect, during use, the one lateral section storing of the 30 graphite tool quick conductive of the implantation piece in the nested pedestal 10 is gone up on the thermal source (not shown), have specific direction with the upright tabular graphite linings of implantation piece 30 and conduct heat and metallic rod body 32 non-directivity conduction thermal characteristicss fast, conduct heat to backplane level assembly 11 and heat conduction frame 40, and conduct heat to the external world.
Please refer to Fig. 8, be the 4th embodiment of the present utility model, this pedestal 10 is made up of a backplane level assembly 11 and heat conduction frame 40, in this pedestal 10 hole 13 is arranged again, and put an implantation piece 30 in this hole 13, its implantation piece 30 is the three-dimensional three-dimensional space skeleton shape structure that graphite or alloy composite materials are formed in present embodiment, and in this structure, fill non-directional Heat Conduction Material, the quick conduction thermal characteristics that has specific direction because of graphite composite material, so when forming with the structure of three-dimensional three-dimensional space skeleton shape again, can reach direction-free Rapid Thermal transport properties, and heat is outwards conducted, when heat during in outside conduction, this implantation piece 30 can conduct heat to each layer graphite in the backplane level assembly 11 simultaneously, conduct thermal characteristics fast by the plane of each layer graphite again, and conduct heat to the external world.
Please refer to shown in Figure 9, be the 5th embodiment of the present utility model, pedestal 10 is made up of a backplane level assembly 11 and heat conduction frame 40, on backplane level assembly 11 in this pedestal 10 has, the recess 34 that inwardly concaves down, be provided with most the hole slots 31 that penetrate in this recess 34, this recess 34 can be circle again, square or be Any shape, and this recess 34 can be put an implantation piece 30, this implantation piece 30 is a metallic rod body 32, and this metallic rod body 32 is provided with most the needle bodies 33 that outwards protrude out, this needle body 33 just can closely be arranged in the hole slot 31, to strengthen implantation piece 30 wears direction along needle body 33 heat-conducting effect, and this metallic rod body 32 and backplane level assembly 11 is vertical mutually and be seated on the thermal source, and, heat is conducted to each layer graphite in the backplane level assembly 11 by thermal source by the needle body 33 of metallic rod body 32 when heat during in outside conduction, conduct thermal characteristics fast by the plane of each layer graphite again, conduct heat to heat conduction frame 40, and conduct heat to the external world.
Please refer to shown in Figure 10, be the utility model the 6th embodiment, this pedestal 10 is made up of a backplane level assembly 11 and heat conduction frame 40, in this pedestal 10 hole 13 is arranged, be nested with an implantation piece 30 in this hole 13 again, its implantation piece 30 is one-body molded with heat conduction frame 40, in its heat conduction frame of present embodiment is Cu alloy material, during use, pedestal 10 is seated on the thermal source,, conducts to each layer graphite in the backplane level assembly 11 by implantation piece 30 when heat during in outside conduction, conduct thermal characteristics fast by the plane of each layer graphite again, and conduct heat to the external world.
In sum, the utility model belongs to initiative on contoured article, structure, device, and can improve the various shortcomings of known technology, can promote effect in the use.
Claims (13)
1. cooling base module is characterized in that this module includes:
One pedestal;
One backplane level assembly, it is arranged on the pedestal, and this backplane level assembly is made up of the graphite linings that most its in-plane of layer have high thermal conduction characteristic;
One heat conduction frame is nested on the backplane level assembly periphery;
One implantation piece, it is nested in the backplane level assembly, and this implantation piece is for having high thermal conduction characteristic material.
2. cooling base module as claimed in claim 1 is characterized in that: implantation piece is formed by the graphite composite material that has a high thermal conduction characteristic with its vertical direction of backplane level assembly.
3. cooling base module as claimed in claim 1 is characterized in that: implantation piece is formed by the upright tabular graphite composite material layer of most sheets, and is provided with the hole slot that majority runs through in this implantation piece, and is equipped with metallic rod body in this hole slot.
4. cooling base module as claimed in claim 1, it is characterized in that: implantation piece is a metallic rod body, this backplane level assembly is provided with most the hole slots that run through again, and this metallic rod body is provided with most the needle bodies that outwards protrude out, and this needle body just can closely be arranged in the hole slot on the backplane level assembly.
5. cooling base module as claimed in claim 1 is characterized in that: implantation piece is the metal heat-conducting composite material of non-directivity.
6. cooling base module as claimed in claim 1 is characterized in that: implantation piece is to have the heat-conductive composite material that Yin Re produces phase change.
7. cooling base module as claimed in claim 1 is characterized in that: implantation piece can be reeled by the graphite lamellar body of filling the phase change Heat Conduction Material and be formed.
8. cooling base module as claimed in claim 1 is characterized in that: implantation piece can be three-dimensional three-dimensional space skeleton shape loose structure and fills non-directional Heat Conduction Material combination.
9. cooling base module as claimed in claim 1 is characterized in that: implantation piece can be integrally formed with the heat conduction frame.
10. cooling base module as claimed in claim 1 is characterized in that: the heat conduction frame is the copper alloy frame.
11. cooling base module as claimed in claim 1 is characterized in that: the heat conduction frame is end sealing, and a relative end with it is open shape, and is the ㄇ type.
12. cooling base module as claimed in claim 1 is characterized in that: the heat conduction frame is an aluminum alloy frame.
13. cooling base module as claimed in claim 1, it is characterized in that: the graphite linings of backplane level assembly can be arranged in stepped, and also be provided with as stair-stepping convex body in the heat conduction frame that cooperates with it, the convex body of heat conduction frame can be nested in respectively on the different graphite linings of backplane level, and then heat conduction frame and backplane level are combined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520106505 CN2829318Y (en) | 2005-08-23 | 2005-08-23 | Radiation base module set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520106505 CN2829318Y (en) | 2005-08-23 | 2005-08-23 | Radiation base module set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2829318Y true CN2829318Y (en) | 2006-10-18 |
Family
ID=37080866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520106505 Expired - Fee Related CN2829318Y (en) | 2005-08-23 | 2005-08-23 | Radiation base module set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2829318Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100556264C (en) * | 2007-08-07 | 2009-10-28 | 哈尔滨工程大学 | A kind of preparation method of graphite-metal compound heat dispersion base material |
| WO2014036738A1 (en) * | 2012-09-10 | 2014-03-13 | 北京中石伟业科技股份有限公司 | Heat exchanger |
| CN109310005A (en) * | 2017-07-26 | 2019-02-05 | 哈尔滨工业大学（威海） | A kind of graphite composite circuit board |
-
2005
- 2005-08-23 CN CN 200520106505 patent/CN2829318Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100556264C (en) * | 2007-08-07 | 2009-10-28 | 哈尔滨工程大学 | A kind of preparation method of graphite-metal compound heat dispersion base material |
| WO2014036738A1 (en) * | 2012-09-10 | 2014-03-13 | 北京中石伟业科技股份有限公司 | Heat exchanger |
| CN109310005A (en) * | 2017-07-26 | 2019-02-05 | 哈尔滨工业大学（威海） | A kind of graphite composite circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |