CN2770094Y - 可隔绝电气干扰的电晶体结构 - Google Patents

可隔绝电气干扰的电晶体结构 Download PDF

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Publication number
CN2770094Y
CN2770094Y CNU2005200281707U CN200520028170U CN2770094Y CN 2770094 Y CN2770094 Y CN 2770094Y CN U2005200281707 U CNU2005200281707 U CN U2005200281707U CN 200520028170 U CN200520028170 U CN 200520028170U CN 2770094 Y CN2770094 Y CN 2770094Y
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wafer
layer
conductor layer
adhesion layer
lead frame
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资重兴
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Liang Xiwei
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资重兴
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Priority to EP05103998A priority patent/EP1684346A2/en
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Abstract

本实用新型公开了一种可隔绝电气干扰的电晶体结构，其包括有至少一晶片，在该晶片的电讯接点面依序设有一封装绝缘层、第一黏着层、导体层及第二黏着层，该导体层藉以第一黏着层及第二黏着层固定于二二黏着层之间，并以最外侧的第二黏着层黏固一导线架，导体层介于晶片与导线架之间，晶片的电讯接点及导线架的各引脚间分别以复数导线构成相互电性连接，该晶片至少一电讯接点是以导体电性连接于导体层以及导线架的引脚，藉此组成可隔绝电气干扰的电晶体结构，本实用新型由于设有导体层，可隔绝电气杂讯、降低电磁波干扰、增进传输速率、强化晶体封装结构，可作为共通接地回路，以及增进散热速率。

Description

可隔绝电气干扰的电晶体结构
技术领域
本实用新型涉及一种可隔绝电气干扰的电晶体结构。
背景技术
习知的晶片封装结构如图1所示，是于一晶垫20上置设有一晶片10，于该晶片10两侧设有可对外导通电性的导线架30，其中该导线架30是为复数引脚301排列构成，在晶片10的接点及导线架30的复数引脚301间设有金线40连接，并于晶片10外部设有一绝缘性的封胶体50，藉此保护晶片10、金线40等内部元件，而且达成固定作用。
但是，众所周知，任何电子产品在运作使用时，均会产生电磁波干扰、杂讯(包括散弹杂讯、闪烁杂讯、突波杂讯、热杂讯、分配杂讯等)及高温等情形，其中大部分杂讯的产生是源于电磁波干扰的情况，因而影响电子系统的稳定性；但是，电磁波干扰并不能完全克服，是必须透过电子元件适当的电路规划或屏蔽、接地等结构设计，使电磁波干扰降低至标准数值之下，以达成电磁相容设计的目的。然而，上述习知的晶片封装结构，无防止电磁波干扰的结构设计，因此在降低电磁波干扰的目的下，即难以符合现今电子产品的电磁相容的高标准要求。
实用新型内容
本实用新型的目的是要解决上述晶片封装结构存在的易受电磁波干扰的问题，而提供一种可克服上述缺点的可隔绝电气干扰的电晶体结构。
本实用新型包括有至少一晶片，在该晶片的电讯接点面依序设有一第一黏着层、一导体层及一第二黏着层，该导体层藉以第一黏着层及第二黏着层固定于二黏着层之间，并以最外侧的第二黏着层黏固一导线架，导体层介于晶片与导线架之间，晶片的电讯接点及导线架的各引脚间分别以复数导线构成相互电性连接，该晶片至少一电讯接点是以导体电性连接于导体层以及导线架的引脚，藉此组成可隔绝电气干扰的电晶体结构，本实用新型由于设有导体层，可隔绝电气杂讯、降低电磁波干扰、增进传输速率、强化晶体封装结构，可作为共通接地回路，以及增进散热速率。
附图说明
图1为习知晶片封装结构的剖视示意图。
图2为本实用新型的剖视示意图。
图3为本实用新型的仰视示意图。
图4为本实用新型的立体分解示意图。
图5为本实用新型的封胶体的实施例剖视示意图。
图6为本实用新型之矩阵式晶片封装结构的仰视示意图。
图7为本实用新型的另一实施例剖视示意图。
具体实施方式
请参阅图2、图3、图4所示，本实用新型之实施例包括有一晶片1、一选择性设置的封装绝缘层2、第一黏着层3、第二黏着层3’、一导体层4及一导线架5，并于组成之后实施有连接于导体层4及导线架5的导线6及导体6’，以及该晶片1外部的封胶体7结构，其中，该晶片1的电讯接点11该面依序设有一选择性设置的封装绝缘层2、一第一黏着层3、一导体层4及一第二黏着层3’，使该导体层4藉以第一黏着层3及第二黏着层3’的黏性，固定于二黏着层3、3’之间，并以最外侧的第二黏着层3’黏固一由复数引脚51所构成的导线架5，令该导体层4介于晶片1与导线架5之间，藉此，并令该晶片1的电讯接点11及导线架5的各引脚51间分别以复数导线6构成相互电性连接，请参阅图3所示，且该晶片1其中至少一电讯接点11是以至少一导体6’电性连接于导体层4以及导线架5的引脚51，并可进一步在该晶片1选定处实施有一封胶体7构成密封结构，即组成可隔绝电气干扰的电晶体结构。
如上所述，其中选择性设置的封装绝缘层2，可为一种封装树脂构成如环氧化合物；该第一黏着层3、第二黏着层3’可为一种液态干燥后可形成黏固的物质如胶水等或胶带等；该导体层4可为金属片或金属膜或导电纤维等各种导电性材料构成，藉由导体6’连接于晶片1的电讯接点11，故可作为接地面(GND)或电源面(Power)；该导线架5是由金属材料冲压形成，并构成有复数支相互分离而可对外连结电性的引脚51，以使该复数导线6可分别电性连接于晶片1的电讯接点11及导线架5的各引脚51间；而所述的导体6’也可为以导线连接形态构成，藉此即能运用该导体层4设于晶片1及导线架5之间的屏蔽结构，以及晶片1其中至少一电讯接点11以导体6’电性连接于导体层4的接地结构，进一步达成电气杂讯的隔绝、降低电磁波干扰、增进传输速率、强化晶体封装结构，可作为共通接地回路，以及增进散热速率的效果。
请参阅图2、图3、图6所示，在晶片1的一选定面两侧或四周(矩阵状态)分别依序设有一选择性设置的封装绝缘层2、一第一黏着层3、一导体层4、一第二黏着层3’及导线架5，使该晶片1电讯接点11该面中间具有一镂空部12，藉此在该镂空部12中实施复数导线6分别连接于晶片1各电讯接点11及导线架5的引脚51间，并于镂空部12处实施有一封胶体7将该镂空部12及导线6完全密封，藉此即组成可应用于电路板上等设备的封装晶片，利用所述的导体层4介于晶片1与导线架5中间的屏蔽结构，及晶片1至少一电讯接点11以导体6’电性连接于该导体层4及导线架5至少一引脚51的接地结构，而具有上述的多重功效。
请参阅图5所示，晶片1电讯接点11该面以一选择性设置的封装绝缘层2、一第一黏着层3、一导体层4、一第二黏着层3’及导线架5构成中间一镂空部12，在该镂空部12中实施复数导线6分别连接于晶片1各电讯接点11及导线架5的引脚51间之后，并可在该整个晶片1周围实施有完全密封的封胶体7’，以藉封胶体7’更臻保护该晶片1及其它构件的稳固，并藉该导体层4介于晶片1与导线架5中间隔绝结构，而具有上述的多重功效增进。本实用新型的特征在于，该晶片1选定面依序设有一第一黏着层3、一导体层4、一第二黏着层3’及导线架5，运用导体层4实现所述的电气杂讯隔绝、降低电磁波干扰、增进传输速率、强化晶体封装结构，可作为共通接地回路，以及增进散热速率等效果，至于该封装绝缘层2则可选择性的设置或不设置，如图7所示，且该导线6及导体6’的连接位置或封胶体7、7’的封装形态等，均可依实际需求而略加改变空间形态，故举凡以本实用新型特征所为的简易变更、置换而实现相同功效者，均应为本实用新型的权利要求所含盖。

Claims (5)

1、一种可隔绝电气干扰的电晶体结构，其特征在于：其包括有至少一晶片，在该晶片的电讯接点面依序设有一第一黏着层、一导体层及一第二黏着层，该导体层藉以第一黏着层及第二黏着层固定于二黏着层之间，并以最外侧的第二黏着层黏固一导线架，导体层介于晶片与导线架之间，晶片的电讯接点及导线架的各引脚间分别以复数导线构成相互电性连接，该晶片至少一电讯接点是以导体电性连接于导体层以及导线架的引脚。
2、按照权利要求1所述的一种可隔绝电气干扰的电晶体结构，其特征在于：所述的晶片两侧或四周分别依序设有第一黏着层、导体层、第二黏着层及导线架，该晶片中间形成有一镂空部，在该镂空部中实施导线及导体连接于所述晶片、导线架、导体层间，并于镂空部处设有一封胶体将构成密封。
3、按照权利要求1或2所述的一种可隔绝电气干扰的电晶体结构，其特征在于：所述的导体为导线。
4、按照权利要求1或2所述的一种可隔绝电气干扰的电晶体结构，其特征在于：所述的第一黏着层及第二黏着层为一种液态干燥后形成黏固的物质；所述的导体层为金属片或金属膜或导电纤维；所述的导线架由金属材料冲压形成，并形成有复数支相互分离而可对外连结电性的引脚。
5、按照权利要求1或2所述的一种可隔绝电气干扰的电晶体结构，其特征在于：所述的晶片与第一黏着层之间设有一封装绝缘层，该封装绝缘层为液态干燥后构成黏固的物质或封装树脂或塑胶材料。
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CN101795524B (zh) * 2009-12-31 2013-06-19 浙江阳光照明电器集团股份有限公司 一种紧凑型支架灯具

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CN101236957B (zh) * 2007-01-31 2010-11-10 精材科技股份有限公司 芯片封装模块的导电层构造及其制造方法

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