CN2757332Y - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN2757332Y CN2757332Y CN 200420118608 CN200420118608U CN2757332Y CN 2757332 Y CN2757332 Y CN 2757332Y CN 200420118608 CN200420118608 CN 200420118608 CN 200420118608 U CN200420118608 U CN 200420118608U CN 2757332 Y CN2757332 Y CN 2757332Y
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- CN
- China
- Prior art keywords
- heat
- conducting unit
- package assembling
- circuit board
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat radiation apparatus with multiple conduction paths in order to reinforce the capability of the heat radiation and can be particularly used for the encapsulation assembly of multiple encapsulation modules (MPM), wherein the encapsulation assembly is arranged on one side of a circuit plate. The heat radiation apparatus comprises a first heat conduction unit, a first heat source contacting the encapsulation assembly, a second heat conduction unit, a second heat source penetrating the circuit plate to contact the encapsulation assembly and a heat conduction bridging unit penetrating the circuit plate and connecting the first and second heat conduction units.
Description
Technical field
The relevant a kind of heat abstractor of the utility model refers in particular to a kind of heat abstractor and can be applicable to have the package assembling of multiple thermal source and provide a plurality of heat dissipation path with the reinforcement heat dissipation.
Prior art
Because the developing rapidly of electronic equipment, the chip in order to processing instruction in the electronic equipment is more and more complicated, in addition with a plurality of Chip Packaging in a package assembling.Therefore the radiating requirements of package assembling is more and more important; The package assembling that has more installs a fin additional with distribute heat in its bottom surface except being provided with one chip in end face; The package assembling that has then respectively is provided with at least one chip respectively at end face and bottom surface.Therefore providing good radiator structure distributing the heat that package assembling is produced, is very important for the performance of electronic equipment.
See also Fig. 1, be the side-looking constitutional diagram of the radiator structure of prior art.When the heat abstractor 8 of the prior art is applied to the package assembling 82 of the multiple package module of a tool (MPM, Multiple PackagingModule), mainly by a radiator 84.Yet this package assembling 82 has two overlapping thermals source, and chip 828 was arranged at the end face and an infrabasal plate 822 bottom surfaces of a upper substrate 824 respectively as second thermal source under last chip 825 reached as first thermal source.This radiator 84 just is contacted with last chip 825 heat radiations of a fin 826 for its below.Wherein this radiator 84 normally is fixed in a circuit board 9 by a plurality of screw rods 86.In above-mentioned prior art, the heat of this second thermal source (following chip) 828 passes approach must reach this fin 826 again through going up chip 825, causes these package assembling 82 integral heat sinks bad and improve the temperature of running.
Another side is for strengthening heat-sinking capability, and prior art adds a fan 88 usually and gives active heat removal.Yet this fan 88 can produce reliability issues because its life-span is limited, and especially in the host computer system of fault tolerant not, fan is to influence the very big factor of reliability; Moreover fan can produce noise, gives the unhappy impression of people; Another side, fan also increase whole cost.
The height of this heat abstractor also is subject to enclosure space.With regard to radiating efficiency, this heat abstractor can't provide preferable heat to pass approach, and its hot biography approach need could arrive casing itself through the cross-ventilation in the casing, and wherein air is the non-conductor of heat, and therefore the heat that is produced lodges in the casing easily.
As from the foregoing, above-mentioned known heat abstractor in practical application, obviously has inconvenience and exists with disappearance, and can treat in addition improver.
The utility model content
Main purpose of the present utility model provides a kind of heat abstractor, and it mainly provides a heat abstractor and has multiple conducting path to strengthen heat-sinking capability, can be applicable to the package assembling of multiple package module (MPM) especially.
Another purpose of the present utility model provides a kind of heat abstractor, does not need the active radiating subassembly of fan, improves the electronic product reliability issues thus, prolongs the useful life of integral product.
In order to achieve the above object, a kind of heat abstractor of the present utility model comprises first heat-conducting unit, second heat-conducting unit, reaches the heat conduction bridge-jointing unit.This first heat-conducting unit contacts first thermal source of a package assembling, and is positioned at the same side of circuit board with this package assembling; This second heat-conducting unit runs through this circuit board and contacts second thermal source of this package assembling and be positioned at the opposite side of this circuit board; This heat conduction bridge-jointing unit runs through this circuit board and connects first and second heat-conducting unit.
Now cooperate graphic preferred embodiment of the present utility model to be described in detail as follows, but these explanations only are to be used for illustrating this creation, but not the interest field of this creation is done any restriction.
Description of drawings
Fig. 1: be the side-looking constitutional diagram of the radiator structure of prior art.
Fig. 2: be the side-looking exploded view of heat abstractor of the present utility model.
Fig. 3: be the side-looking constitutional diagram of heat abstractor of the present utility model.
Fig. 4: the side schematic view that is assembled in casing for heat abstractor of the present utility model.
Fig. 5: be the side view cutaway drawing of another embodiment of heat abstractor of the present utility model.
Fig. 6: be the side-looking constitutional diagram of heat abstractor the 3rd embodiment of the present utility model.
[primary clustering symbol description]
(known)
Heat abstractor 8
Package assembling 82 radiators 84
Screw rod 86 fans 88
Circuit board 9
(the utility model)
First heat-conducting unit 14,14a
Connecting portion 144a projection 145
Connecting hole 146 fins 148
Second heat-conducting unit 16,16b fin 162
Auxiliary radiating device 15 heat conduction bridge-jointing units 18
Through hole 20,24 connecting holes 22
Embodiment
See also Fig. 2 and Fig. 3, be the side-looking exploded view and the side-looking constitutional diagram of heat abstractor of the present utility model.The utility model provides a kind of heat abstractor 1 to be installed on the circuit board 2, the package assembling 82 of the multiple package module of particularly suitable one tool (MPM, Multiple Packaging Module).
This cited package assembling 82 of present embodiment is arranged at a side of this circuit board 2, in order to be responsible for the instruction of computing and processing electronic installation.Wherein this package assembling 82 has upper substrate 824 and is arranged at the last chip 825 of these upper substrate 824 end faces.The end face that should go up chip 825 has a fin (heat spreader) 826, and chip 825 becomes first thermal source on this.In addition, this package assembling 82 also has second thermal source 828 that an infrabasal plate 822 and places these infrabasal plate 822 bottom surfaces.Among this embodiment, this second thermal source 828 is another chip, but this chip also can add a fin in addition.Above-mentioned package assembling only is one of the cited applicable embodiment of the utility model, and the applicable object of the utility model is not limited thereto kind of a package assembling certainly, is the package assembling that can be applicable to a plurality of thermal source of tool.Therefore so long as package assembling that more than one chip is set is all applicable.
One of feature of the present utility model is a heat-conducting unit 14 and this package assembling 82 relatively are arranged at the opposite side of this circuit board 2, and passes this circuit board 2 and be connected to second thermal source 828 of these package assembling 82 bottoms.This heat-conducting unit 14 mainly has a body 142, this body 142 is can extend to than this circuit board 2 also greatly, even as shown in this embodiment fit in this circuit board 2, thus can also be as the supporting component of the rigidity of this circuit board 2 to avoid the warpage of this circuit board 2.For being contacted with the bottom of this package assembling 82, in the present embodiment, be to be provided with at least one through hole 20 at this circuit board 2, this through hole 20 is communicated in second thermal source 828 of these package assembling 82 bottoms, provide these package assembling 82 another thermally conductive pathways to supply the heat that chip produced of its bottom to guide thus, and need not be through going up chip 825.This heat-conducting unit 14 has a junction 144 contacting this second thermal source 828, and relatively is arranged at the opposite side of this circuit board 2 with this package assembling 82.This body 142 of this heat-conducting unit 14 is tabular and has vast area of dissipation, can effectively the heat of being guided by this connecting portion 144 be distributed.The utility model provides this package assembling 82 another initiative good hot channels thus.
In the practical application, the utility model can include only above-mentioned structure.In other words, this heat abstractor 1 of the present utility model can include only this heat-conducting unit 14, can cooperate existing on the market at present heat abstractor, and the good hot channel of package assembling of multiple thermal source is provided.So the utility model can shorten the heat conduction path of this package assembling 82, the shortcut of these second thermal source, 828 1 heat radiations is provided, and improves heat dispersion.In other words, this heat-conducting unit 14 in the utility model can be used as second heat-conducting unit.
Please continue to consult Fig. 2 and Fig. 3, the utility model can be designed to have first heat-conducting unit 16 and second heat-conducting unit 14 simultaneously, this first heat-conducting unit 16 is by this fin 826 of these package assembling 82 tops of contact, to guide and to distribute the heat of this first thermal source (going up chip) 825.In the present embodiment, this first heat-conducting unit 16 is to be connected in this second heat-conducting unit 14 by a plurality of heat conduction bridge-jointing units 18, and this heat conduction bridge-jointing unit 18 also can be with heat guiding structure partly to this second heat-conducting unit 14.Wherein this circuit board 2 and this second heat-conducting unit 14 respectively are provided with a plurality of connecting holes 22,146 and pass and be connected in this second heat-conducting unit 14 separately for this heat conduction bridge-jointing unit 18.This heat conduction bridge-jointing unit 18 can be a screw rod, perhaps can be one-body moldedly by these second heat-conducting unit, 14 upwardly extending connecting-rod bodies.Wherein the side of this second heat-conducting unit 14 can also be connected with at least one auxiliary radiating device 15, and this auxiliary radiating device can be that a radiator (heat sink) is with auxiliary heat dissipation.
See also Fig. 4, be assembled in the side schematic view of casing for heat abstractor of the present utility model.The utility model is except providing this second heat-conducting unit 14, reaching this first heat-conducting unit 16 as the heat radiation approach, and this heat abstractor 1 more can flexibly cooperate one to be assembled in peripheral casing 3 to strengthen heat dispersion.Wherein, this second heat-conducting unit 14 can directly be connected to a housing 32 of this casing 3, and it is own to pass to housing 32 again through the cross-ventilation in the casing 3.This is beyond one's reach by general radiator structure, and the utility model can solve in the prior art heat radiation approach thus needs improve radiating efficiency via the problem of the air in the casing to casing itself.The utility model even can omit this housing 32 replace these housings 32 by this second heat-conducting unit 14, and this auxiliary radiating device 15 can be in order to substitute side housing.
Therefore learn by above-mentioned, this first heat-conducting unit 16 in the utility model, and this second heat-conducting unit 14 can have multiple mode to select.For example, this second heat-conducting unit 14 can be heat pipe (heat pipe), and heat pipe is filled with the heat-conducting liquid of circulation in pipe, can conduct to heat long-range well.Heat pipe can be applied to height-limited electronic equipment especially, for example is applied to heat radiating device of notebook computer.This second heat-conducting unit 14 also can be the metal heat-conducting piece of a tool good coefficient.This second heat-conducting unit also can be to be formed with a plurality of fins and to become a radiator (heat sink) (as shown in Figure 6), and radiator then can be applicable to highly more unrestricted electronic product, provides better radiating efficiency by bigger area of dissipation.Same, this first heat-conducting unit 16 can be heat pipe (heat pipe) or radiator (heatsink) (as shown in Figure 6).
See also Fig. 5, be the side view cutaway drawing of another embodiment of heat abstractor of the present utility model.For avoiding important circuit layout, this circuit board 2 can be provided with a plurality of through holes 24 in the utility model, and wherein the connecting portion 144a of this second heat-conducting unit 14 has a plurality of projection 145 corresponding extending in these a plurality of through holes 24.This connecting portion can be connected in this second heat-conducting unit 14 one-body moldedly in the utility model.Make for convenient, this connecting portion can be to be installed on this second heat-conducting unit 14 in the mode that is embedded.
See also Fig. 6, be the side-looking constitutional diagram of heat abstractor the 3rd embodiment of the present utility model.In the 3rd embodiment, heat-conducting unit 14a is to be that a radiator has a plurality of radiating fins 148, and this radiating fin 148 is stretched out by this main part 142; Wherein the first heat-conducting unit 16b one has the radiator of a plurality of radiating fins 162.
Therefore mat heat abstractor of the present utility model characteristics that can produce and function through put in order as after:
One, heat abstractor of the present utility model has multiple conducting path, and preferable heat-sinking capability is provided.Therefore relatively, the heat-sinking capability for the heat conducting component on each path requires lower; And can reduce heat transfer resistance with more conducting path.
Two, heat abstractor of the present utility model effectively utilizes the space of back of circuit board, can strengthen heat dissipation.This second heat-conducting unit can also be avoided this circuit board bending as a rigid plane to fix this circuit board.
Three, heat abstractor of the present utility model is specially adapted to the package assembling of multiple package module (MPM), and each overlapping thermal source is provided, that is each chip (chips) all can obtain effectively cooling.Even do not need the active radiating subassembly (active cooling element) of fan, improve the electronic product reliability issues thus, prolong the useful life of integral product.
When four, heat abstractor of the present utility model is used heat pipe as heat-conducting unit, more be not subjected to the restriction of assembly on enclosure space and the machine plate.The utility model also provides casing as direct radiating subassembly, can solve with the problem of air as conductor.
In sum, the real important document that meets novel patent of this creation is filed an application in accordance with the law.Only the above revealer of institute only is the utility model preferred embodiment, and from the interest field that can not limit this creation with this, therefore the equalization of being done according to the utility model patent claim changes or modifies, and still belongs to the scope that the utility model is contained.Still ask the juror to find time in the midst of pressing affairs and sift, and expect and grant a patent early to encourage creation, the true feeling moral just.
Claims (10)
1, a kind of heat abstractor, be applied to the heat radiation of a package assembling, it is characterized in that: this package assembling is installed on a side of a circuit board, this heat abstractor includes the opposite side that a heat-conducting unit and this package assembling relatively are arranged at this circuit board, and this heat-conducting unit passes this circuit board and is connected to the thermal source of this package assembling bottom.
2, heat abstractor as claimed in claim 1 is characterized in that: this package assembling has at least one chip.
3, heat abstractor as claimed in claim 1 is characterized in that: this package assembling is the package assembling of a multiple package module.
4, heat abstractor as claimed in claim 1 is characterized in that: this package assembling has a substrate and a plurality of chip, and one of them chip is arranged at the end face of this substrate, and wherein another chip is arranged at the bottom surface of this substrate.
5, heat abstractor as claimed in claim 1 is characterized in that: this circuit board is provided with at least one through hole that corresponds to this package assembling bottom thermal source, and this heat-conducting unit has a junction and passes this through hole.
6, heat abstractor as claimed in claim 5 is characterized in that: this circuit board is provided with a plurality of through holes, and wherein this connecting portion of this heat-conducting unit has that a plurality of projections are corresponding to be extended in these a plurality of through holes.
7, heat abstractor as claimed in claim 1 is characterized in that: the side of this heat-conducting unit is connected with at least one auxiliary radiating device.
8, heat abstractor as claimed in claim 1 is characterized in that: this heat-conducting unit directly is connected to a casing.
9, heat abstractor as claimed in claim 1 is characterized in that: this heat-conducting unit is second heat-conducting unit, and further has the thermal source that one first heat-conducting unit is connected to this package assembling top.
10, heat abstractor as claimed in claim 9, it is characterized in that: further have at least one heat conduction bridge-jointing unit and connect this first heat-conducting unit in this second heat-conducting unit, wherein this circuit board is provided with at least one connecting hole, and this heat conduction bridge-jointing unit passes this connecting hole respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420118608 CN2757332Y (en) | 2004-11-19 | 2004-11-19 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420118608 CN2757332Y (en) | 2004-11-19 | 2004-11-19 | Heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2757332Y true CN2757332Y (en) | 2006-02-08 |
Family
ID=35965716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420118608 Expired - Lifetime CN2757332Y (en) | 2004-11-19 | 2004-11-19 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2757332Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102438423A (en) * | 2010-08-19 | 2012-05-02 | 苹果公司 | Internal frame optimized for stiffness and heat transfer |
| TWI503656B (en) * | 2012-09-07 | 2015-10-11 | Inventec Corp | Heat dissipating structure |
-
2004
- 2004-11-19 CN CN 200420118608 patent/CN2757332Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102438423A (en) * | 2010-08-19 | 2012-05-02 | 苹果公司 | Internal frame optimized for stiffness and heat transfer |
| US9049801B2 (en) | 2010-08-19 | 2015-06-02 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
| TWI503656B (en) * | 2012-09-07 | 2015-10-11 | Inventec Corp | Heat dissipating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20141119 Granted publication date: 20060208 |