CN2750621Y - Metal based circuit board - Google Patents
Metal based circuit board Download PDFInfo
- Publication number
- CN2750621Y CN2750621Y CN 200420046957 CN200420046957U CN2750621Y CN 2750621 Y CN2750621 Y CN 2750621Y CN 200420046957 CN200420046957 CN 200420046957 CN 200420046957 U CN200420046957 U CN 200420046957U CN 2750621 Y CN2750621 Y CN 2750621Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- components
- metal base
- base circuit
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a metal based circuit board, which is composed of a metal base board, an insulating isolation layer, copper foil, tin solder, etc., wherein the insulating isolation layer is arranged between the inner wall of a through hole of the metal based circuit board and pins of components which are needed to be inserted and welded, making the metal base plate isolated from the pins of the components. The utility model can expand the ranges of use of the metal based circuit board, making the metal based circuit board conveniently and widely used like an ordinary circuit board.
Description
Technical field
The utility model relates to a kind of metal base circuit board, the method that especially aluminium base, copper base, iron-based wiring board through hole are inserted the weldering components and parts.
Background technology
Metal base circuit board is by metal substrate, insulating barrier and the Copper Foil pressing is bonding forms, and at present, known purposes is the application that is used for high power device, is beneficial to the heat radiation of power device, keeps the stable of power device work, prolongs the useful life of power device.Because metal substrate is a conductor, directly through hole is inserted the weldering components and parts, and therefore, the application of metal current base circuit board is that single face pastes weldering, has limited the scope of application, and has needed special equipment just can finish, and has limited the application of metal base circuit board greatly.But metal can be used for scope widely, and good thermal diffusivity is arranged, and is particularly suitable for powerful wiring board.
The utility model content
Can not insert the defective of welding components and parts by through hole in order to overcome existing metal base circuit board, the utility model provides a kind of metal base circuit board, metal base circuit board can be used, greatly the purposes of expanded metal base circuit board as the common line plate.
The concrete technical scheme that the utility model provides: there is dielectric isolation layer in a kind of metal base circuit board between the components and parts pin that the through-hole wall and the need of metal base circuit board are inserted weldering.The metal substrate and the insulation of components and parts pin of metal base circuit board are isolated.
The beneficial effects of the utility model are the same with the common line plate when being to allow metal base circuit board use to be used easily, can have good thermal diffusivity again simultaneously, can increase the service life for high-power wiring board, enlarges application.
Description of drawings
Fig. 1 is that metal circuit board of the present utility model is inserted weldering components and parts schematic diagram.
1a is a Copper Foil in the accompanying drawing 1, and 1b is an insulating barrier, and 1c is a metal substrate, and 2 is dielectric isolation layer, and 3 is components and parts, and 4 is pin, and 5 is scolding tin.
Embodiment
Metal substrate of the present utility model can be by Copper Foil 1a, and insulating barrier 1b and metal substrate 1c form.Embodiment comprises two kinds: 1, adhere to dielectric isolation layer 2 at the through-hole wall of metal base circuit board; 2, plug in components and parts 3 pins that weld at need and put dielectric isolation layer; Thereby the pin 4 of components and parts 3 and the metal substrate 1c insulation of metal base circuit board are isolated, and scolding tin 5 is fixing then, is able to the same purpose of using with the common line plate.And in execution mode 1, the method that dielectric isolation layer is set at through-hole wall can have several modes such as physics coating, chemical composition coating or electrochemical conversion film.
Claims (4)
1, a kind of metal base circuit board is characterized in that: have insulating barrier between the through-hole wall on the wiring board and the pin of components and parts.
2, metal base circuit board according to claim 1, it is characterized in that: the insulating barrier between described wiring board through-hole wall and the components and parts is the dielectric isolation layer that through-hole wall adheres to.
3, metal base circuit board according to claim 1, it is characterized in that: the insulating barrier between described wiring board through-hole wall and the components and parts is the dielectric isolation layer that is overlapping on the components and parts pin.
4, metal base circuit board as claimed in claim 2 is characterized in that: the dielectric isolation layer that described through-hole wall adheres to is the physics overlay, or chemical composition coating, or the electrochemical conversion film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420046957 CN2750621Y (en) | 2004-06-15 | 2004-06-15 | Metal based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420046957 CN2750621Y (en) | 2004-06-15 | 2004-06-15 | Metal based circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2750621Y true CN2750621Y (en) | 2006-01-04 |
Family
ID=35823997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420046957 Expired - Fee Related CN2750621Y (en) | 2004-06-15 | 2004-06-15 | Metal based circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2750621Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102610709A (en) * | 2011-01-19 | 2012-07-25 | 旭德科技股份有限公司 | Package carrier and method for manufacturing the same |
| CN104284533A (en) * | 2008-09-28 | 2015-01-14 | 华为技术有限公司 | Multilayer circuit board, manufacturing method of multilayer circuit board and communication device |
-
2004
- 2004-06-15 CN CN 200420046957 patent/CN2750621Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104284533A (en) * | 2008-09-28 | 2015-01-14 | 华为技术有限公司 | Multilayer circuit board, manufacturing method of multilayer circuit board and communication device |
| CN102610709A (en) * | 2011-01-19 | 2012-07-25 | 旭德科技股份有限公司 | Package carrier and method for manufacturing the same |
| CN102610709B (en) * | 2011-01-19 | 2014-12-24 | 旭德科技股份有限公司 | Package carrier and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Peng Jinan Document name: Notification of Termination of Patent Right |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |