CN2750369Y - 散热模组 - Google Patents

散热模组 Download PDF

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Publication number
CN2750369Y
CN2750369Y CNU2004200956642U CN200420095664U CN2750369Y CN 2750369 Y CN2750369 Y CN 2750369Y CN U2004200956642 U CNU2004200956642 U CN U2004200956642U CN 200420095664 U CN200420095664 U CN 200420095664U CN 2750369 Y CN2750369 Y CN 2750369Y
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China
Prior art keywords
heat
heat radiation
radiation module
fan
heat pipe
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Expired - Lifetime
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CNU2004200956642U
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English (en)
Inventor
吕昌岳
余泰成
陈杰良
林志泉
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNU2004200956642U priority Critical patent/CN2750369Y/zh
Priority to US11/283,285 priority patent/US7254019B2/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种用于笔记型电脑的散热模组,包括至少一风扇及至少一热管,其中该热管的吸热段设于风扇与笔记型电脑机壳上的散热孔之间,而其冷凝段设于笔记型电脑显示器上。本实用新型在使用时,风扇运行产生的气流携带发热元件产生的热量流经散热孔时,热管的吸热段吸收气流中的部分热量而使气流及散热孔附近区域的温度降低,可以避免散热孔附近区域的温度过高。

Description

散热模组
【技术领域】
本实用新型是关于一种散热模组,尤其是指一种可将笔记型电脑产生的热量均匀散发的散热模组。
【背景技术】
目前,笔记型电脑日益轻、薄、短小,而其产生的热量随着功能不断增强也越来越多,这就要求提供一种体积小且散热效果好的散热装置以确保其正常工作。
热管具有体积小、热传导能力强的特点,故业界通常将热管用于笔记型电脑散热。中国台湾专利公告第332687号揭示一种用于笔记型电脑的热管型散热模组。其中热管的吸热段与发热元件接触以将发热元件产生的热量吸收,其冷凝段设在机壳上的散热孔处以便将吸收的热量迅速排出机壳。现行的笔记型电脑散热模组中的元件如风扇、热管等都设在笔记型电脑的机壳内。这种散热布局可将发热元件产生的热量快速散发,从而确保元件能够正常工作。但是,这种散热布局使发热元件产生的热量都通过散热孔排出,将会使临近散热孔处的机壳的温度明显高于其它部分,导致机壳局部的温度过高。
故,需提供一种可使发热元件产生的热量均匀散发,避免机壳的局部温度过高的散热模组。
【发明内容】
本实用新型的目的在于提供一种可使发热元件产生的热量均匀散发的散热模组。
本实用新型的目的是通过以下技术方案实现的:本实用新型散热模组用于笔记型电脑散热,包括至少一风扇及至少一热管,其中热管的吸热段设于风扇与笔记型电脑机壳上的散热孔之间,而其冷凝段设于笔记型电脑显示器上。风扇运行产生的气流经散热孔排出笔记型电脑的机壳。
本实用新型在使用时,风扇运行产生的气流携带发热元件产生的热量流经散热孔时,热管的吸热段吸收气流中的部分热量而使气流及散热孔附近区域的温度降低,可以避免散热孔附近区域的温度过高。
下面参照附图结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是本实用新型散热模组示意图。
图2是图1中的局部放大图。
【具体实施方式】
图1及图2所示为本实用新型散热模组用于笔记型电脑的示意图,该笔记型电脑包括一主机机体1及一显示器2。其中主机机体1的机壳上设有散热孔3。本实用新型散热模组包括一风扇4及一热管5。
风扇4设于散热孔3附近区域,风扇4运行产生的气流可通过散热孔3排出机壳外部。
热管5包括一呈蛇型的吸热段52及设于笔记型电脑显示器2后部的一冷凝段54。其中吸热段52设于风扇4与散热孔3之间,可与风扇4运行产生的强制气流进行热交换而吸收热量。此外,还可将热管5的吸热段52制成矩形、多边形、圆形、椭圆形等,也可以将其压成扁平状以增加其吸热面积。由于笔记型电脑在使用过中不断开、合,故热管5的吸热段52与冷凝段54之间可通过软管连接,也可采用其它习知技术使热管5的吸热段52及冷凝段54可以进行开、合运动。
本实用新型散热模组在使用时,风扇4运行产生的气流携带发热元件产生的热量流经散热孔3排出机壳。在气流流经散热孔3时,热管5的吸热段52吸收气流中的部分热量而使气流及散热孔3附近区域的温度降低,可以避免散热孔3附近区域的温度过高。热管5将吸收的热量经由其冷凝段54传导至显示器2后部进行散发。为进一步增强冷凝段54的散热效果,可将冷凝段54与一散热板相连以增加其散热面积。
上述为本实用新型散热模组的一具体实施例,在本实施例中仅显示在一散热孔3处设置本新型散热模组,根据需要,可在多个散热孔3处分别布置本实用新型散热模组,以更好的将热量均匀散发,提高使用者的舒适度。

Claims (3)

1.一种用于笔记型电脑的散热模组,包括至少一风扇及至少一热管,其特征在于:热管的吸热段设于风扇与笔记型电脑机壳上的散热孔之间,而其冷凝段设于笔记型电脑显示器上。
2.如权利要求1所述的用于笔记型电脑的散热模组,其特征在于:热管的吸热段呈蛇形。
3.如权利要求1或2所述的用于笔记型电脑的散热模组,其特征在于:热管的吸热段呈板状。
CNU2004200956642U 2004-11-19 2004-11-19 散热模组 Expired - Lifetime CN2750369Y (zh)

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CNU2004200956642U CN2750369Y (zh) 2004-11-19 2004-11-19 散热模组
US11/283,285 US7254019B2 (en) 2004-11-19 2005-11-17 Heat dissipation module for hinged mobile computer

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US10802556B2 (en) 2018-04-13 2020-10-13 Dell Products L.P. Information handling system thermal fluid hinge
US10579112B2 (en) * 2018-04-13 2020-03-03 Dell Products L.P. Graphite thermal conduit spring
US10802555B2 (en) 2018-04-13 2020-10-13 Dell Products L.P. Information handling system thermally conductive hinge
US10969841B2 (en) 2018-04-13 2021-04-06 Dell Products L.P. Information handling system housing integrated vapor chamber
US10936031B2 (en) 2018-04-13 2021-03-02 Dell Products L.P. Information handling system dynamic thermal transfer control
US10401926B1 (en) * 2018-04-13 2019-09-03 Dell Products L.P. Information handling system housing thermal conduit interfacing rotationally coupled housing portions
US10551888B1 (en) 2018-08-13 2020-02-04 Dell Products L.P. Skin transition thermal control for convertible information handling systems

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US7254019B2 (en) 2007-08-07

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Expiration termination date: 20141119

Granted publication date: 20060104