CN2742572Y - Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism - Google Patents
Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism Download PDFInfo
- Publication number
- CN2742572Y CN2742572Y CN 200420093649 CN200420093649U CN2742572Y CN 2742572 Y CN2742572 Y CN 2742572Y CN 200420093649 CN200420093649 CN 200420093649 CN 200420093649 U CN200420093649 U CN 200420093649U CN 2742572 Y CN2742572 Y CN 2742572Y
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- welding head
- bonding tip
- freedom
- wafer
- bonding
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Abstract
The utility model discloses a two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism. The structural extensible guide of the welding head of the sticking machine is fixedly installed on the frame, two drive units separately drive two left and right slide blocks to perform reciprocating linear translation along the extensible guide, two slide blocks are hinged with the weld headstock by three groups of linkage rods, and the movement of the two slide blocks synthesizes curve and linear motion of the weld headstock in work planar. The weld headstock is provided with a suction nozzle of the welding head to complete the movement of picking wafer, transferring wafer at the picking chip point and welding wafer at a plurality of sticking point and has the bonding weld function at multi-sticking point. The welding head framework has relative independentability and can be applied to different application of the sticking machine by changing control strategy or program at a definite range.
Description
Technical field
The utility model relates to key equipment---the soldering tip mechanism of wafer die Bonder in the semiconductor element manufacturing, and the utility model is specifically related to plane double-slider parallel institution two degrees of freedom die Bonder welding head structure.
Background technology
Soldering tip is the core component of die Bonder, its function be with on the brilliant garden the wafer of cutting and separating pick up, transmit and be positioned over that (as: lead frame, pcb board etc.) carry out paste weld on the carrier.For this reason, soldering tip mechanism belongs to the transmission mechanism of two-freedom (Y, Z), needs to travel to and fro between picking up part and two positions of dice bonding part accurately, reposefully, finishes and picks up wafer, transmits actions such as wafer, weldbonding wafer.Picking up with the necessary straight line transmission of weldbonding wafer stroke very for a short time, only is 1～3mm.The stroke that transmits wafer is but very big, and is general relevant with the diameter of wafer.Present brilliant garden diameter has reached 12 inches, promptly more than the 250mm, and also has the trend that constantly increases.Commonly used multiple soldering tip mechanism on the market, all adopt traditional serial mechanism form: travel to and fro between the motion of picking up part and dice bonding part, promptly in the Y direction, be to make the Y slide block by parts such as guide rail, ball screw nut, linear bearings, the motor that is fixed on the frame drives Y slide block moving linearly by ball screw.Another motor that is fixed on the Y slide block picks up sheet and weld tabs action through what corresponding straight-line motion mechanism formed soldering tip Z direction.Under the mating reaction of Y and Z motor, soldering tip is finished predefined weldbonding action.But because the drive motors and the motion of the motion of Z direction are the accompany movements that is assemblied on the Y slide block, the ratio that the quality of this motor accounts for whole soldering tip moving-mass is very big, thereby the movement inertia of soldering tip is bigger.The quality that reduces slide block or soldering tip is restricted to reduce movement inertia, so the influence of impacting of being moved of the soldering tip speed of serial mechanism can't improve.In addition, the soldering tip end of serial mechanism can only be a cantilever design, the rigidity deficiency.The effective way of head it off is: adopt parallel institution, promptly a kind of plane double-slider two degrees of freedom welding head structure all is installed on the fixed frame two driver elements, realizes the self-movement of soldering tip two-freedom.
Summary of the invention
In order to overcome shortcomings such as having die Bonder straight line transmission series connection motion soldering tip mechanism kinematic inertia is big, rigidity deficiency now, reach the purpose of multiple spot weldbonding; The utility model provides a kind of plane double-slider two degrees of freedom welding head structure of parallel institution form, this structure can be finished from wafer and pick up wafer, be placed on the diverse location of appointment then at a high speed, accurately, realize weldbonding sheet process: and two driver elements all are fixed on the frame, moving mass is light, action is impacted little, and rigidity is big.
The characteristics of the plane double-slider parallel institution two degrees of freedom die Bonder welding head structure that the utility model provides are: guide rail is fixed on the frame, two slide blocks were done to move toward complex line along guide rail about two driver elements drove respectively, by three groups of connecting rods two slide blocks are hinged together with bonding tip seat, moving of two slide blocks synthesized bonding tip seat at binary curve of working face and rectilinear motion, suction nozzle of bonding tip is installed on the bonding tip seat, finishes suction nozzle of bonding tip and pick up wafer at picking up part, transmit wafer and in the action of a plurality of dice bonding part weldbonding wafers.
The driver element that above-mentioned driving sliding block moves as straight line is linear electric motors or ball guide screw nat constructional device.
Above-mentioned slide block (2), connecting rod (6), connecting rod (7) and the hinged formation parallelogram sturcutre of bonding tip seat (9) make to remain plumbness with the vertically arranged suction nozzle of bonding tip of bonding tip seat in the plane motion process.
Between above-mentioned suction nozzle of bonding tip and the bonding tip seat buffer unit is arranged.
The scheme that the utility model adopts is as shown in drawings: drive left slider (2) by left driver element (1) and do to move toward complex line along guide rail (4).In like manner, right driver element (5) drives right slide block (3) and does to move toward complex line along guide rail (4).Left slider is hinged by long connecting rods (6) such as two groups and (7) bonding tip seat (9), the formation parallelogram sturcutre.Thereby the direction of the same left slider of bonding tip seat (9) (2) is parallel all the time.Right slide block (3) is hinged together by the right-hand member transverse axis of connecting rod (8) with bonding tip seat.When about two slide blocks when relatively moving with certain speed, the suction nozzle of bonding tip (10) that is fixed on the bonding tip seat moves as vertical direction, when about two slide blocks do when mobile in the same way with identical speed, suction nozzle of bonding tip moves as horizontal direction.When about the speed and the direction of two slide blocks move by certain Changing Pattern, can form the desired special exercise curve of weldbonding wafer (11).The left end point of curve is the picking up part of suction nozzle of bonding tip, and right endpoint is a dice bonding part.Suction nozzle of bonding tip can have suction-operated to wafer by vacuum.This programme can be easily according to the requirement of weldbonding sheet, two slide blocks about control have at specific picking up part suction nozzle of bonding tip and pick up wafer and in the function of many dice bonding parts weld tabs.
The beneficial effects of the utility model are: two driver elements all are installed on the frame, reduce the weight of soldering tip greatly, help improving the soldering tip shuttle speed and improve dynamic property; Moving respectively of two slide blocks controlled by two driver elements, and the movement locus of the synthetic soldering tip of their characteristics of motion can be realized multiple spot weldbonding sheet easily; Whole welding head structure has relative independentability, in certain working range, by changing the application scenario that control strategy or reprogramming just can be applicable to different die Bonder.
Description of drawings
Fig. 1 is a structure chart of the present utility model
Among the figure: 1 left driver element; 2 left sliders; 3 right slide blocks; 4 guide rails; 5 right driver elements; 6,7,8 connecting rods; 9 bonding tip seats; 10 soldering tips; 11 movement locus;
Embodiment
In the accompanying drawings, solid line represents that soldering tip is in picking up part (PICK), and dotted line is represented dice bonding part (BOND).Expression has a picking up part and four dice bonding parts in the accompanying drawing.In working range, the displacement and the dice bonding part quantity of Y direction and Z direction can adjust as requested.
Slide block (2) can slide along guide rail (4), obtains the power that straight line moves by driver element (1).In like manner, slide block (3) obtains power and mobile along guide rail (4) from driver element (5); Difference articulated two groups of connecting rods (6) and (7) can rotate around transverse axis on two transverse axis on the slide block (2).The other end of connecting rod is hinged with bonding tip seat, forms the parallelogram sturcutre that slide block (2), connecting rod (6), (7) and bonding tip seat (9) are formed.In the plane motion process, bonding tip seat is all the time with slide block or guide rail keeping parallelism state.Guide rail (4) is fixed on the frame, and location status is constant, and therefore the pose state of vertically arranged suction nozzle of bonding tip remains vertically on bonding tip seat, to satisfy the requirement of picking up sheet and weld tabs.Suction nozzle of bonding tip is with there being vertical buffer unit, to guarantee to pick up the dynamic and static demand of sheet and weld tabs between the bonding tip seat.
The job order of soldering tip mechanism mainly comprises steps such as picking up wafer, transmission wafer, weldbonding wafer.The first step, left and right sides slide block moves to the guide rail left end, and soldering tip is come picking up part top, and left and right sides slide block relatively moves, and soldering tip vertically moves down, and the suction nozzle on the soldering tip contacts with wafer on the wafer, and suction nozzle adsorbs contiguous wafer under the effect of vacuum; Left and right sides slide block moves in the other direction then, and the wafer picking action is finished in the suction nozzle pan-up; In second step, left and right sides slide block is right-hand mobile to guide rail respectively, finishes the wafer handling action; In this process, left and right sides slide block moves by speed change separately, forms a curvilinear soldering tip movement locus.In the 3rd step, at the right-hand member of guide rail, left and right sides slide block relatively moves, and soldering tip vertically moves down again, and the wafer weldbonding that suction nozzle will adsorb is on bearing substrate; Left and right sides slide block moves again in the other direction then, moves on the suction nozzle of bonding tip head, finishes the action of wafer weldbonding; In the 4th step, left and right sides slide block moves to left end respectively, makes suction nozzle of bonding tip get back to the picking up part top, for next circulation is prepared.
Claims (4)
1. plane double-slider parallel institution two degrees of freedom die Bonder welding head structure, it is characterized in that: guide rail is fixed on the frame, two slide blocks were done to move toward complex line along guide rail about two driver elements drove respectively, by three groups of connecting rods two slide blocks are hinged together with bonding tip seat, curve and the rectilinear motion of bonding tip seat at working face synthesized in moving of two slide blocks, suction nozzle of bonding tip is installed on the bonding tip seat, finishes suction nozzle of bonding tip and pick up wafer at picking up part, transmit wafer and in the action of a plurality of dice bonding part weldbonding wafers.
2. plane according to claim 1 double-slider parallel institution two degrees of freedom die Bonder welding head structure, it is characterized in that: the driver element that above-mentioned driving sliding block moves as straight line is linear electric motors or ball guide screw nat constructional device.
3. plane according to claim 1 double-slider parallel institution two degrees of freedom die Bonder welding head structure, it is characterized in that: above-mentioned slide block (2), connecting rod (6), connecting rod (7) and the hinged formation parallelogram sturcutre of bonding tip seat (9) make to remain plumbness with the vertically arranged suction nozzle of bonding tip of bonding tip seat in the plane motion process.
4. plane according to claim 1 double-slider parallel institution two degrees of freedom die Bonder welding head structure is characterized in that: between above-mentioned suction nozzle of bonding tip and the bonding tip seat buffer unit is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420093649 CN2742572Y (en) | 2004-09-30 | 2004-09-30 | Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420093649 CN2742572Y (en) | 2004-09-30 | 2004-09-30 | Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2742572Y true CN2742572Y (en) | 2005-11-23 |
Family
ID=35478038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420093649 Expired - Fee Related CN2742572Y (en) | 2004-09-30 | 2004-09-30 | Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2742572Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100479123C (en) * | 2004-09-30 | 2009-04-15 | 广东工业大学 | Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof |
| CN103288035A (en) * | 2013-06-05 | 2013-09-11 | 河南工业大学 | Silicon micro plane flexible connecting rod mechanism manufactured on semiconductor chip |
| CN107081672A (en) * | 2017-06-26 | 2017-08-22 | 北京交通大学 | A kind of parallel lapping device |
-
2004
- 2004-09-30 CN CN 200420093649 patent/CN2742572Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100479123C (en) * | 2004-09-30 | 2009-04-15 | 广东工业大学 | Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof |
| CN103288035A (en) * | 2013-06-05 | 2013-09-11 | 河南工业大学 | Silicon micro plane flexible connecting rod mechanism manufactured on semiconductor chip |
| CN103288035B (en) * | 2013-06-05 | 2017-02-08 | 河南工业大学 | Silicon micro plane flexible connecting rod mechanism manufactured on semiconductor chip |
| CN107081672A (en) * | 2017-06-26 | 2017-08-22 | 北京交通大学 | A kind of parallel lapping device |
| CN107081672B (en) * | 2017-06-26 | 2019-10-22 | 北京交通大学 | A kind of parallel grinding device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |