CN100479123C - Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof - Google Patents
Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof Download PDFInfo
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- CN100479123C CN100479123C CNB2004100517071A CN200410051707A CN100479123C CN 100479123 C CN100479123 C CN 100479123C CN B2004100517071 A CNB2004100517071 A CN B2004100517071A CN 200410051707 A CN200410051707 A CN 200410051707A CN 100479123 C CN100479123 C CN 100479123C
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Abstract
The invention discloses a welding head structure of plane double sliders parallel two-degree freedom plate-sticking machine and its relative operation process. Wherein, the guide rail of said welding head structure of plate-sticking machine is mounted on the frame while two driving units are individually drive the left and right sliders to make straight reciprocating motion along said guide rail; these two sliders are hinged to the welding head base via three groups of connecting bar; the motion of two sliders generates the curve and straight motion of welding head base on the working surface; the welding head base has a welding head nozzle to complete the motions of picking crystal slice on the slice-picking point, transmitting crystal slice and welding crystal slice on several slice-welding points while it has the welding function with multiple slice-welding points. The inventive welding head structure has relative independency, which can meet applications of different slice-welding machines via changing control strategy or changing the program in a certain working range.
Description
Technical field
The present invention relates to semiconductor element in making key equipment---the soldering tip mechanism of wafer die Bonder, the present invention are specifically related to plane double-slider parallel institution two degrees of freedom die Bonder welding head structure and course of action.
Background technology
Soldering tip is the core component of die Bonder, its function be with on the wafer the wafer of cutting and separating pick up, transmit and be positioned over that (as: lead frame, pcb board etc.) carry out paste weld on the carrier.For this reason, soldering tip mechanism belongs to the transmission mechanism of two-freedom (Y, Z), needs to travel to and fro between picking up part and two positions of dice bonding part accurately, reposefully, finishes and picks up wafer, transmits actions such as wafer, weldbonding wafer.Picking up with the necessary straight line transmission of weldbonding wafer stroke very for a short time, only is 1～3mm.The stroke that transmits wafer is but very big, and is general relevant with the diameter of wafer.The wafer current diameter has reached 12 inches, promptly more than the 250mm, and also has the trend that constantly increases.Commonly used multiple soldering tip mechanism on the market, all adopt traditional serial mechanism form: travel to and fro between the motion of picking up part and dice bonding part, promptly in the Y direction, be to make the Y slide block, drive Y slide block moving linearly by ball screw by the motor that is fixed on the frame by parts such as guide rail, ball screw nut, linear bearings.Another motor that is fixed on the Y slide block picks up sheet and weld tabs action through what corresponding straight-line motion mechanism formed soldering tip Z direction.Under the mating reaction of Y and Z motor, soldering tip is finished predefined weldbonding action.But because the drive motors and the motion of the motion of Z direction are to be assemblied in accompany movement on the Y slide block, the ratio that the quality of this motor accounts for whole soldering tip moving-mass is very big, thereby the movement inertia of soldering tip is bigger.The quality that reduces slide block or soldering tip is restricted to reduce movement inertia, so the influence of impacting of being moved of the soldering tip speed of serial mechanism can't improve.In addition, the soldering tip end of serial mechanism can only be a cantilever design, the rigidity deficiency.The effective way of head it off is: adopt parallel institution, promptly a kind of plane double-slider two degrees of freedom welding head structure all is installed on the fixed frame two driver elements, realizes the self-movement of soldering tip two-freedom.
Summary of the invention
In order to overcome shortcomings such as having die Bonder straight line transmission series connection motion soldering tip mechanism kinematic inertia is big, rigidity deficiency now, reach the purpose of multiple spot weldbonding; The invention provides a kind of plane double-slider two degrees of freedom welding head structure of parallel institution form, this structure can be finished from wafer and pick up wafer, is placed on the diverse location of appointment then at a high speed, accurately, realizes weldbonding sheet process; And two driver elements all are fixed on the frame, and moving mass is light, and action is impacted little, and rigidity is big.
The characteristics of plane provided by the invention double-slider parallel institution two degrees of freedom die Bonder welding head structure are: guide rail is fixed on the frame, two slide blocks were done to move toward complex line along guide rail about two driver elements drove respectively, by three groups of connecting rods two slide blocks are hinged together with bonding tip seat, curve and the rectilinear motion of bonding tip seat at working face synthesized in moving of two slide blocks, suction nozzle of bonding tip is installed on the bonding tip seat, finishes suction nozzle of bonding tip and pick up wafer at picking up part, transmit wafer and in the action of a plurality of dice bonding part weldbonding wafers.
The driver element that above-mentioned driving sliding block moves as straight line is linear electric motors or ball guide screw nat constructional device.
Above-mentioned slide block (2), connecting rod (6), connecting rod (7) and the hinged formation parallelogram sturcutre of bonding tip seat (9) make to remain plumbness with the vertically arranged suction nozzle of bonding tip of bonding tip seat in the plane motion process.
Between above-mentioned suction nozzle of bonding tip and the bonding tip seat buffer unit is arranged.
The course of action of plane of the present invention double-slider parallel institution two degrees of freedom die Bonder welding head structure comprises the steps:
1) left and right sides slide block moves to the guide rail left end, soldering tip is come the picking up part top, left and right sides slide block relatively moves, soldering tip vertically moves down, suction nozzle on the soldering tip contacts with wafer on the wafer, and suction nozzle adsorbs contiguous wafer under the effect of vacuum, and left and right sides slide block moves in the other direction then, the wafer picking action is finished in the suction nozzle pan-up;
2) left and right sides slide block is right-hand mobile to guide rail respectively, finishes the wafer handling action; In this process, left and right sides slide block moves by speed change separately, forms a curvilinear soldering tip movement locus;
3) at the right-hand member of guide rail, left and right sides slide block relatively moves, and soldering tip vertically moves down again, and the wafer weldbonding that suction nozzle will adsorb is on bearing substrate, and left and right sides slide block moves again in the other direction then, moves on the suction nozzle of bonding tip head, finishes the action of wafer weldbonding;
4) left and right sides slide block moves to left end respectively, makes suction nozzle of bonding tip get back to the picking up part top, for next circulation is prepared.
The scheme that the present invention adopts is as shown in drawings: drive left slider (2) by left driver element (1) and do to move toward complex line along guide rail (4).In like manner, right driver element (5) drives right slide block (3) and does to move toward complex line along guide rail (4).Be hinged to parallelogram sturcutre by long connecting rods (6) such as left slider, two and (7) bonding tip seat (9), the direction of the same left slider of bonding tip seat (9) (2) is parallel all the time.Right slide block (3) is hinged together by the right-hand member transverse axis of connecting rod (8) with bonding tip seat.When about two slide blocks when relatively moving with certain speed, the suction nozzle of bonding tip (10) that is fixed on the bonding tip seat moves as vertical direction, when about two slide blocks do when mobile in the same way with identical speed, suction nozzle of bonding tip moves as horizontal direction.When about the speed and the direction of two slide blocks move by certain Changing Pattern, can form the desired special exercise curve of weldbonding wafer (11).The left end point of curve is the picking up part of suction nozzle of bonding tip, and right endpoint is a dice bonding part.Suction nozzle of bonding tip can have suction-operated to wafer by vacuum.This programme can be easily according to the requirement of weldbonding sheet, two slide blocks about control have at specific picking up part suction nozzle of bonding tip and pick up wafer and in the function of many dice bonding parts weld tabs.
The invention has the beneficial effects as follows, two driver elements all are installed on the frame, reduce the weight of soldering tip greatly, help improving the soldering tip shuttle speed and improve dynamic property; Moving respectively of two slide blocks controlled by two driver elements, and the movement locus of the synthetic soldering tip of their characteristics of motion can be realized multiple spot weldbonding sheet easily.Whole welding head structure has relative independentability, in certain working range, by changing the application scenario that control strategy or reprogramming just can be applicable to different die Bonder.
Description of drawings
Fig. 1 is a structure chart of the present invention
Among the figure: 1 left driver element; 2 left sliders; 3 right slide blocks; 4 guide rails; 5 right driver elements; 6,7,8 connecting rods; 9 bonding tip seats; 10 soldering tips; 11 movement locus;
Embodiment
In the accompanying drawings, solid line represents that soldering tip is in picking up part (PICK), and dotted line is represented dice bonding part (BOND).Expression has a picking up part and four dice bonding parts in the accompanying drawing.In working range, the displacement of Y direction and Z direction and the quantity of dice bonding part can adjust as requested.
Slide block (2) can slide along guide rail (4), obtains the power that straight line moves by driver element (1).In like manner, slide block (3) obtains power and mobile along guide rail (4) from driver element (5); Difference articulated two connecting rods (6) and (7) can rotate around transverse axis on two transverse axis on the slide block (2).The other end of connecting rod forms the parallelogram sturcutre that slide block (2), connecting rod (6), (7) and bonding tip seat (9) are formed with bonding tip seat hinge knot.In the plane motion process, bonding tip seat is all the time with slide block or guide rail keeping parallelism state.Guide rail (4) is fixed on the frame, and location status is constant, and therefore the pose state of vertically arranged suction nozzle of bonding tip remains vertically on bonding tip seat, to satisfy the requirement of picking up sheet and weld tabs.Suction nozzle of bonding tip is with there being vertical buffer unit, to guarantee to pick up the dynamic and static demand of sheet and weld tabs between the bonding tip seat.
The job order of soldering tip mechanism mainly comprises steps such as picking up wafer, transmission wafer, weldbonding wafer.The first step, left and right sides slide block moves to the guide rail left end, and soldering tip is come picking up part top, and left and right sides slide block relatively moves, and soldering tip vertically moves down, and the suction nozzle on the soldering tip contacts with wafer on the wafer, and suction nozzle adsorbs contiguous wafer under the effect of vacuum.Left and right sides slide block moves in the other direction then, and the wafer picking action is finished in the suction nozzle pan-up; In second step, left and right sides slide block is right-hand mobile to guide rail respectively, finishes the wafer handling action; In this process, left and right sides slide block moves by speed change separately, forms a curvilinear soldering tip movement locus.In the 3rd step, at the right-hand member of guide rail, left and right sides slide block relatively moves, and soldering tip vertically moves down again, and the wafer weldbonding that suction nozzle will adsorb is on bearing substrate.Left and right sides slide block moves again in the other direction then, moves on the suction nozzle of bonding tip head, finishes the action of wafer weldbonding; In the 4th step, left and right sides slide block moves to left end respectively, makes suction nozzle of bonding tip get back to the picking up part top, for next circulation is prepared.
Claims (4)
1. plane double-slider parallel institution two degrees of freedom die Bonder welding head structure, it is characterized in that, guide rail (4) is fixed on the frame, two driver elements (1,5) drive respectively about two slide blocks (2,3) do to move along guide rail (4) toward complex line, above-mentioned left slider (2), first connecting rod (6), second connecting rod (7) and bonding tip seat (9) hinge knot form parallelogram sturcutre, make and in the plane motion process, remain plumbness with the vertically arranged suction nozzle of bonding tip of bonding tip seat, above-mentioned right slide block (3) is hinged with the right-hand member of bonding tip seat by third connecting rod (8), moving of two slide blocks synthesized bonding tip seat at binary curve of working face and rectilinear motion, suction nozzle of bonding tip is installed on the bonding tip seat, finishes suction nozzle of bonding tip and pick up wafer at picking up part, transmit wafer and in the action of a plurality of dice bonding part weldbonding wafers.
2. plane according to claim 1 double-slider parallel institution two degrees of freedom die Bonder welding head structure is characterized in that: driving the driver element that above-mentioned slide block moves as straight line is linear electric motors or ball guide screw nat constructional device.
3. plane according to claim 1 double-slider parallel institution two degrees of freedom die Bonder welding head structure is characterized in that: between above-mentioned suction nozzle of bonding tip and the bonding tip seat buffer unit is arranged.
4. the method with the described plane of claim 1 double-slider parallel institution two degrees of freedom die Bonder welding head structure weldbonding wafer is characterized in that comprising the steps:
1) left and right sides slide block moves to the guide rail left end, soldering tip is come the picking up part top, left and right sides slide block relatively moves, soldering tip vertically moves down, suction nozzle on the soldering tip contacts with wafer on the wafer, and suction nozzle adsorbs contiguous wafer under the effect of vacuum, and left and right sides slide block moves in the other direction then, the wafer picking action is finished in the suction nozzle pan-up;
2) left and right sides slide block is right-hand mobile to guide rail respectively, finishes the wafer handling action, and in this process, left and right sides slide block moves by speed change separately, forms a curvilinear soldering tip movement locus;
3) at the right-hand member of guide rail, left and right sides slide block relatively moves, and soldering tip vertically moves down again, and the wafer weldbonding that suction nozzle will adsorb is on bearing substrate, and left and right sides slide block moves again in the other direction then, moves on the suction nozzle of bonding tip head, finishes the action of wafer weldbonding;
4) left and right sides slide block moves to left end respectively, makes suction nozzle of bonding tip get back to the picking up part top, for next circulation is prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100517071A CN100479123C (en) | 2004-09-30 | 2004-09-30 | Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100517071A CN100479123C (en) | 2004-09-30 | 2004-09-30 | Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof |
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| Publication Number | Publication Date |
|---|---|
| CN1755909A CN1755909A (en) | 2006-04-05 |
| CN100479123C true CN100479123C (en) | 2009-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100517071A Active CN100479123C (en) | 2004-09-30 | 2004-09-30 | Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102128249B (en) * | 2011-03-17 | 2013-12-04 | 中国神华能源股份有限公司 | Transmission device |
| CN102548237B (en) * | 2011-12-31 | 2014-07-16 | 广东工业大学 | Follow-up surface mounting head of direct-drive high-speed and high-efficiency feeder |
| CN102886777B (en) * | 2012-10-25 | 2015-05-06 | 浙江理工大学 | Two-degree-of-freedom parallel mechanism with large horizontal displacement |
| CN103522287A (en) * | 2013-10-31 | 2014-01-22 | 北华航天工业学院 | Flat horizontal type 2-DOF (two degrees of freedom) redundant actuation parallel translation robot mechanism |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5516026A (en) * | 1993-11-26 | 1996-05-14 | Toshiba Automation Co., Ltd. | Pellet bonding apparatus |
| CN1423316A (en) * | 2001-12-05 | 2003-06-11 | Esec贸易公司 | Apparatus for mounting semiconductor chip |
| CN2742572Y (en) * | 2004-09-30 | 2005-11-23 | 广东工业大学 | Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism |
-
2004
- 2004-09-30 CN CNB2004100517071A patent/CN100479123C/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5516026A (en) * | 1993-11-26 | 1996-05-14 | Toshiba Automation Co., Ltd. | Pellet bonding apparatus |
| CN1423316A (en) * | 2001-12-05 | 2003-06-11 | Esec贸易公司 | Apparatus for mounting semiconductor chip |
| CN2742572Y (en) * | 2004-09-30 | 2005-11-23 | 广东工业大学 | Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism |
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| Publication number | Publication date |
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| CN1755909A (en) | 2006-04-05 |
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Owner name: ASSETS MANAGEMENT CO., LTD. OF GUANGDONG UNIVERSIT Free format text: FORMER OWNER: GUANGDONG INDUSTRY UNIVERSITY Effective date: 20150421 |
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Effective date of registration: 20150421 Address after: 510090, No. 729, Dongfeng East Road, Yuexiu District, Guangdong 201-204, building 2, building, Guangdong University of Technology, Guangzhou, China Patentee after: Guangdong great works asset management Co., Ltd. Address before: 510090 No. 729 Dongfeng East Road, Guangdong, Guangzhou Patentee before: Guangdong University of Technology |
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Effective date of registration: 20160729 Address after: 528225, Nanhai Town, Nanhai District, Guangdong, Foshan Nanhai Software Technology Park (R & D building, A) room 401-12 Patentee after: FOSHAN GUANGDONG TECHNOLOGY UNIVERSITY CNC EQUIPMENT TECHNOLOGY DEVELOPMENT CO., LTD. Address before: 510090, No. 729, Dongfeng East Road, Yuexiu District, Guangdong 201-204, building 2, building, Guangdong University of Technology, Guangzhou, China Patentee before: Guangdong great works asset management Co., Ltd. |