CN2675356Y - Sticking machine welding head mechanism capable of swinging and translating in inclined plane - Google Patents
Sticking machine welding head mechanism capable of swinging and translating in inclined plane Download PDFInfo
- Publication number
- CN2675356Y CN2675356Y CN 200320119229 CN200320119229U CN2675356Y CN 2675356 Y CN2675356 Y CN 2675356Y CN 200320119229 CN200320119229 CN 200320119229 CN 200320119229 U CN200320119229 U CN 200320119229U CN 2675356 Y CN2675356 Y CN 2675356Y
- Authority
- CN
- China
- Prior art keywords
- connecting rod
- suction nozzle
- wafer
- swinging
- clinoplain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a welding head mechanism of a sheet sticking machine capable of swinging and translating in an inclined plane. A parallelogram arm swinging mechanism is arranged in the inclined plane which is decided by a sheet picking position and a sheet sticking position, the arm swinging mechanism is driven by an arm swinging motor which is fixed on a machine frame through a crank connecting rod, and the parallel movement of a suction head is kept, the action of wafer transportation is realized. Two swinging extreme positions are the sheet picking position and the sheet sticking position which are needed by the welding head, a motor of the suction head is fixed on the machine frame, the suction head corresponding to a translation beam moves up and down through a link mechanism of the parallelogram suction head and a spatial cam, and the wafer picking action and the wafer welding and sticking action are completed. The welding head mechanism is without a large-stroke straight-line transmission mechanism, the two motor do not move, and the utility model is especially suitable for being used by a sheet sticking machine of high-speed large-size wafers.
Description
Technical field
The utility model relates to the die Bonder soldering tip mechanism of swinging translational formula in the clinoplain.
Background technology
Soldering tip is the die Bonder core component, its function be with on the brilliant garden the wafer of cutting and separating pick up, transmit and be positioned over that (lead frame, pcb board etc.) carry out paste weld on the carrier.For this reason, soldering tip mechanism belongs to the transmission mechanism of two-freedom, needs to travel to and fro between accurately, reposefully to pick up sheet and two positions of bonding die, finishes and picks up wafer, transmits actions such as wafer, weldbonding wafer.Wherein, pick up with the necessary straight line transmission of weldbonding wafer stroke very little, can be less than 1～3mm, the stroke that transmits wafer is but very big, and along with brilliant garden diameter increase day by day (reached 12 inches, promptly 250mm or more than) and constantly increase.Therefore, in the present megacryst garden die Bonder, brilliant garden is arranged in the below of carrier, so that the megacryst garden can be passed through from the carrier below, reduces the wafer handling distance, but, commonly used in the market multiple soldering tip mechanism all needs big stroke (picking up the required rectilinear path of sheet and bonding die relatively) straight-line transmitting actuation mechanism (as guide rail, screw mandrel, pneumatic bearing etc.), therefore, soldering tip is coming and going at a high speed under the state, and wearing and tearing are big, the life-span is short, manufacturing and maintenance cost height; Simultaneously, because soldering tip is the two-freedom transmission mechanism, general two motors (stepping motor or servomotor) that adopt drive, wherein, have a motor to be installed in another motor-driven mechanism, the ratio that the quality of this mobile motor accounts for whole soldering tip moving-mass is very big, thereby the movement inertia of soldering tip is bigger, the effective way of head it off is: design a kind of soldering tip mechanism, make two drive motors all be installed on the fixed frame, can realize the two-freedom separate transmission again simultaneously.
Summary of the invention
There are big stroke straight-line transmitting actuation mechanism, shortcoming that movement inertia is big in order to overcome megacryst garden soldering tip device, the utility model purpose provides a kind of soldering tip mechanism that does not have above-mentioned shortcoming, this mechanism adopts the swing mechanism and the spatial cam transmission of clinoplain, only need rolling bearing, need not big stroke straight-line transmitting actuation mechanism, and two drive motors all are fixedly mounted on the frame, and moving mass is light.
The utility model main technical schemes is: four ABDE of connecting rod swing arm mechanism of parallelogram are arranged on the clinoplain, drive oscillating arm mechanisms by toggle, the control suction nozzle is picking up parallel moving between sheet position and the bonding die position, realizes the transmission action of wafer; Four connecting rod suction nozzle CDEF of mechanism and space cams of the parallelogram of arranging in four connecting rod swing arm mechanisms are controlled moving of suction nozzle relative translation beam, and picking up with weldbonding of wafer of realization moved.
Two swing extreme position correspondences of four connecting rod swing arm mechanisms of above-mentioned parallelogram are picked up sheet position and bonding die position.
Pivot center A, B, C, D, E, the F of above-mentioned four ABDE of connecting rod swing arm mechanism and the four connecting rod suction nozzle CDEF of mechanism are parallel.
Shared pivot center D, the E of above-mentioned four ABDE of connecting rod swing arm mechanism and the four connecting rod suction nozzle CDEF of mechanism can take apart not shared.
The beneficial effects of the utility model are, oscillating arm mechanisms is swung in clinoplain and realized wafer handling in this programme, does not have big stroke straight-line transmitting actuation mechanism, and it is little to wear and tear, and the life-span is long, and cost is low; Two extreme positions of swing arm are set at ten sheet positions and bonding die position, have improved and have picked up the location static accuracy of putting wafer; The suction nozzle motor is fixed on the frame, finishes wafer by suction nozzle linkage and space cam and picks up and the weldbonding action, has alleviated moving-mass, helps improving the soldering tip shuttle speed and improves dynamic property.
Description of drawings
The utility model is as shown in drawings:
Fig. 1 is a soldering tip motion schematic diagram.
Fig. 2 is that the A of Fig. 1 is to figure.
Among the figure, 1: wafer 2: suction nozzle 3: spring 4: space cam 5: translation beam
6: clinoplain 7: horizontal plane 8: brilliant garden 9: carrier 10: suction nozzle motor
11: frame 12: swing arm motor 13: crank 14: connecting rod
A, B, C, D, E, F: hinge
Embodiment
In the accompanying drawings, solid line represents that soldering tip mechanism is in and picks up sheet (PICK) position that bonding die (BOND) position is represented in double dot dash line.Carrier 9 can be passed through in the brilliant garden 8 of bearing wafer, and both are 60mm at the difference in height Z of vertical direction, and horizontal direction stroke Y is 100mm; The oscillating arm mechanisms ABDE of parallelogram is arranged in the clinoplain, and the swing arm motor promotes the swing arm swing by toggle, and suction nozzle, cam are realized wafer handling along with translation beam translation between PICK and BOND together; The suction nozzle motor drives suction nozzle relative translation beam and moves up and down by suction nozzle linkage CDEF and cam, realizes that wafer picks up and the wafer weldbonding; In this scheme, the suction nozzle motor is fixed on the frame, have only the quadric chain CDEF and the cam of parallelogram to be mounted on the oscillating arm mechanisms ABDE, the swing of oscillating arm mechanisms ABDE can not make suction nozzle relative translation beam produce displacement, when having only the suction nozzle motor to rotate, just can make connecting rod EF drive the cam rotation, drive suction nozzle relative translation beam and move up and down.
The job order of soldering tip mechanism mainly comprises steps such as picking up wafer, transmission wafer, weldbonding wafer.After the first step, swing arm motor-driven oscillating arm mechanisms were come ten sheet positions (PICK), suction nozzle motor-driven connecting rod EF rotated, and rotates by the FC actuating cam, depress suction nozzle, draw wafer, suction nozzle motor counter-rotating then, under spring 3 effects, move on the suction nozzle, finish the wafer picking action; In second step, the swing arm motor promotes ABDE and swings to bonding die position (BOND) by toggle, finish the wafer handling action, in this process, wafer is with translation beam parallel moving in clinoplain, realize horizontal direction displacement Y and vertical direction displacement Z, need not the straight-line transmitting actuation mechanism; In the 3rd step, suction nozzle motor M 2 is rotated, and depresses suction nozzle, and on matrix, suction nozzle motor counter-rotating then moves on the suction nozzle with the wafer weldbonding, finishes the action of wafer weldbonding; In the 4th step, the counter-rotating of swing arm motor is got back to the suction nozzle pendulum and is inhaled the sheet position, for next circulation is prepared.
Claims (4)
1. the die Bonder soldering tip mechanism of swinging translational formula in the clinoplain, it is characterized in that: four connecting rod swing arm mechanisms (ABDE) of parallelogram are arranged on the clinoplain, drive oscillating arm mechanisms by toggle, the control suction nozzle is picking up parallel moving between sheet position and the bonding die position, realizes the transmission action of wafer; Four connecting rod suction nozzle mechanism (CDEF) and space cams of the parallelogram of arranging in four connecting rod swing arm mechanisms are controlled moving of suction nozzle relative translation beam, and picking up with weldbonding of wafer of realization moved.
2. the die Bonder soldering tip mechanism of swinging translational formula in the clinoplain according to claim 1 is characterized in that: two swing extreme position correspondences of four connecting rod swing arm mechanisms of above-mentioned parallelogram are picked up sheet position and bonding die position.
3. the die Bonder soldering tip mechanism of swinging translational formula in the clinoplain according to claim 1, it is characterized in that: pivot center (A), (B), (C), (D), (E), (F) of above-mentioned four connecting rod swing arm mechanisms (ABDE) and four connecting rod suction nozzle mechanisms (CDEF) are parallel.
4. the die Bonder soldering tip mechanism of swinging translational formula in the clinoplain according to claim 1, it is characterized in that: shared pivot center (D), (E) of above-mentioned four connecting rod swing arm mechanisms (ABDE) and four connecting rod suction nozzle mechanisms (CDEF) can take apart not shared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320119229 CN2675356Y (en) | 2003-12-16 | 2003-12-16 | Sticking machine welding head mechanism capable of swinging and translating in inclined plane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320119229 CN2675356Y (en) | 2003-12-16 | 2003-12-16 | Sticking machine welding head mechanism capable of swinging and translating in inclined plane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2675356Y true CN2675356Y (en) | 2005-02-02 |
Family
ID=34475637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320119229 Expired - Fee Related CN2675356Y (en) | 2003-12-16 | 2003-12-16 | Sticking machine welding head mechanism capable of swinging and translating in inclined plane |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2675356Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261581A (en) * | 2015-11-20 | 2016-01-20 | 王敕 | Chip packaging equipment suitable for 12inch wafer |
-
2003
- 2003-12-16 CN CN 200320119229 patent/CN2675356Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261581A (en) * | 2015-11-20 | 2016-01-20 | 王敕 | Chip packaging equipment suitable for 12inch wafer |
| CN105261581B (en) * | 2015-11-20 | 2018-11-02 | 王敕 | Chip encapsulating device suitable for 12 cun of wafers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |