CN103288035A - Silicon micro plane flexible connecting rod mechanism manufactured on semiconductor chip - Google Patents
Silicon micro plane flexible connecting rod mechanism manufactured on semiconductor chip Download PDFInfo
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- CN103288035A CN103288035A CN2013102199886A CN201310219988A CN103288035A CN 103288035 A CN103288035 A CN 103288035A CN 2013102199886 A CN2013102199886 A CN 2013102199886A CN 201310219988 A CN201310219988 A CN 201310219988A CN 103288035 A CN103288035 A CN 103288035A
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- connecting rod
- actuator
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 47
- 239000010703 silicon Substances 0.000 title claims abstract description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000005485 electric heating Methods 0.000 claims abstract description 10
- 238000006073 displacement reaction Methods 0.000 claims abstract description 6
- 239000000725 suspension Substances 0.000 claims description 2
- 230000033001 locomotion Effects 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000004035 construction material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
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Abstract
The invention relates to a silicon micro plane flexible connecting rod mechanism manufactured on a semiconductor chip. The plane flexible connecting rod mechanism is composed of an electric heating silicon micro actuator (1) also serving as a driving component, a silicon micro connecting rod (2), a driven component (3) and flexible hinges (4). Reading scales (5) are used for observing and scaling micrometric displacement, anchor points (6) are used for controlling the input of voltage by the outside and supporting all movable components. For the purpose that the silicon micro plane flexible connecting rod mechanism is self-driven, the driving component (1) is composed of the electric heating silicon micro actuator, the output end and the input end of the driving component (1) are connected with the connecting rod (2) and the anchor points (6) respectively through the flexible hinges (4) in a flexible mode, and the silicon micro connecting rod (2), the driven component (3) and the anchor points are also connected through the flexible hinges (4) so that the mechanism can have a determinate movement form and is more flexible when transmitting movements.
Description
Technical field
The present invention relates to a kind of little planar flexible linkage of silicon that is produced on the semiconductor chip, its member adopts the single crystal silicon material of polysilicon membrane or high-aspect-ratio to make, physical dimension at micron between the submillimeter.
Background technology
Microelectromechanical systems (Micro-electro-mechanical System, MEMS) along with the semiconductor integrated circuit technical development, be to be structural material with the semiconductor, be means with the micro-processing technology, microcircuits such as micro mechanical actuators, micromechanics actuator and sensing, detection, signal processing are integrated on the chip, its characteristic size generally at micron to the submillimeter scope.The MEMS technology is the emerging technology field of multidisciplinary intersections such as microelectronics, micro mechanics, minute yardstick mechanics, micro-optics, materialogy, physics, chemistry and biology, has a wide range of applications in space technology, national defence, biological medicine, information technology, industrial process control and other technical fields.
By document and patent retrieval, the research for the planar flexible linkage of macro-scale in the prior art is more, and adopts polysilicon membrane or monocrystalline silicon to be produced on the semiconductor chip not report of minute yardstick planar flexible linkage.In addition, at present MEMS micromechanics mechanism have little valve, Micropump, little for actuator, littlely be actuator and various microsensor mechanism, and adopt the little planar flexible linkage of self-driving type silicon of thermal actuator double as mechanism member not occur.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of little planar flexible linkage of silicon that is produced on the semiconductor chip, and construction material can be polysilicon membrane, also can be other semi-conducting materials such as monocrystalline silicon.
For solving the problems of the technologies described above, the little planar flexible linkage of silicon that is produced on the semiconductor chip of the present invention is made up of electric heating silicon micro-actuator, the little connecting rod of silicon, driven member, fixed anchor point and the scale of double as crank, adopts the little flexible hinge of silicon to connect between each member; Crank in this mechanism is cold and hot arm electric heating silicon micro-actuator, when feeding driving voltage between its two anchor point, produces actuation force by semiconductor silicon material at the thermal expansion effects of minute yardstick, thereby realizes the self-driven of crank; Adopt the little flexible hinge of silicon to be connected with the transmission that helps move between each member, by changing the ratio of each member length dimension, can realize different motion modes.
Cold and hot arm electric heating silicon micro-actuator as drive unit also can be other form actuators, and as the power source of crank, change is applied to the frequency of the driving voltage on the thermal actuator and size and the frequency that voltage magnitude then can change output movement.
In order to increase the driving force of mechanism kinematic, also can use electric heating silicon micro-actuator double as driven member, owing to adopt power decentralized to drive, make mechanism transmit motion and have more flexibility, be applied on two thermal actuators by change and control voltage, can control this motion of mechanism.
The diverse location design has the reading scale on this linkage, can quantitatively record the size of the displacement output numerical value of mechanism's diverse location, thereby be convenient to control and detect when mechanism carries out motion.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is the structure chart to first kind of embodiment of the present invention.
Fig. 2 is the structure chart to second kind of embodiment of the present invention.
The specific embodiment
The little planar flexible linkage of silicon that is produced on the semiconductor chip shown in Figure 1, cold and hot arm silicon micro-actuator 1, the little connecting rod 2 of silicon, driven member 3, flexible hinge 4 by the double as driving member are formed the planar flexible linkage, scale 5 is used for the reading of mechanism's micrometric displacement, and anchor point 6 is used for the input of extraneous control voltage and suspension is played a supportive role.In order to realize the self-driven of the little planar flexible linkage of silicon, driving member 1 in the mechanism is to be made of cold and hot arm electric heating silicon micro-actuator, and the output of this actuator flexibly connects by flexible hinge 4 and the little connecting rod 2 of silicon, the input of silicon micro-actuator flexibly connects by flexible hinge 4 and anchor point 6, in addition, the little connecting rod of silicon 2 and driven member 3, and with driven member 3 and anchor point between also be to adopt the form of flexible hinge to be connected.When feeding driving voltage between two anchor points of thermal actuator, owing to the thermal expansion effects of thermal actuator makes crank self-driven, the actuation force that crank produces makes this planar flexible linkage produce motion, adopt the little flexible hinge of silicon to connect between each member, the transmission of being convenient to move, when the length dimension ratio changes between each member in the mechanism, can realize multi-form motion.Reading scale on the little planar flexible linkage of this silicon is to export and design for the ease of the displacement on observation and the measuring mechanism diverse location.
Fig. 2 shows the another kind of specific embodiment that the present invention is produced on the little planar flexible linkage of silicon on the semiconductor chip.Adopt two cold and hot arm electric heating silicon micro-actuators double as crank 1 and driven member 3 respectively in this mechanism simultaneously, wherein the little connecting rod 2 of silicon is set to output link, in its end scale 5 is set, with the displacement output of observation and measuring mechanism.When this mechanism works, input control voltage between the anchor point 6 of two cold and hot arm electric heating silicon micro-actuators simultaneously, change to be applied on two thermal actuators and control voltage, can control this motion of mechanism, because power decentralized drives, it is bigger to make that mechanism transmits the driving force of moving, and has more flexibility.
Claims (5)
1. little planar flexible linkage of silicon that is produced on the semiconductor chip, by driving member (1), connecting rod (2), driven member (3), flexible hinge (4) is formed the planar flexible linkage, scale (5) is used for the reading of micrometric displacement, anchor point (6) is used for the input of extraneous control voltage and the support of suspension, it is characterized in that: in order to realize the self-driven of the little planar flexible linkage of silicon, described driving member (1) is to be made of the silicon micro-actuator, and the output of silicon micro-actuator is connected with connecting rod (2) by flexible hinge (4), and the input of silicon micro-actuator is connected with anchor point (6) by flexible hinge (4).
2. as the right 1 described little planar flexible linkage of silicon that is produced on the semiconductor chip, it is characterized in that: the driving member (1) that is made of the silicon micro-actuator is with connecting rod (2), driven member (3), flexible hinge (4), scale (5) and anchor point (6) is integrated is produced on the same block semiconductor chip.
3. as right 1 or the 2 described little planar flexible linkages of silicon that are produced on the semiconductor chip, it is characterized in that: the silicon micro-actuator that constitutes driving member (1) is cold and hot arm electric heating silicon micro-actuator.
4. as right 1 or the 2 described little planar flexible linkages of silicon that are produced on the semiconductor chip, it is characterized in that: driven member (3) is made of the silicon micro-actuator.
5. as right 1 or the 2 described little planar flexible linkages of silicon that are produced on the semiconductor chip, it is characterized in that: driving member (1) and driven member (3) constitute by the silicon micro-actuator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310219988.6A CN103288035B (en) | 2013-06-05 | 2013-06-05 | Silicon micro plane flexible connecting rod mechanism manufactured on semiconductor chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310219988.6A CN103288035B (en) | 2013-06-05 | 2013-06-05 | Silicon micro plane flexible connecting rod mechanism manufactured on semiconductor chip |
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| Publication Number | Publication Date |
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| CN103288035A true CN103288035A (en) | 2013-09-11 |
| CN103288035B CN103288035B (en) | 2017-02-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111486207A (en) * | 2020-04-26 | 2020-08-04 | 兰州城市学院 | Silicon micro six-rod force increasing mechanism |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6384509B1 (en) * | 1999-02-23 | 2002-05-07 | Matsushita Electric Works, Ltd. | Semiconductor device |
| CN2700064Y (en) * | 2003-12-16 | 2005-05-18 | 广东工业大学 | Two freedom degree moving plane parallel mechanism |
| CN2742572Y (en) * | 2004-09-30 | 2005-11-23 | 广东工业大学 | Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism |
| CN1704329A (en) * | 2004-06-04 | 2005-12-07 | 大连理工大学 | Electrothermal-driven flexile micro-gripper |
| CN101621261A (en) * | 2009-08-06 | 2010-01-06 | 上海交通大学 | Flexible composite beam electric heating microdriver based on U+V shape |
| CN101745915A (en) * | 2008-12-19 | 2010-06-23 | 中国科学院沈阳自动化研究所 | Rectilinear translation planar nine-bar mechanism and method for constructing a rectilinear translation motion mechanism |
| CN203498069U (en) * | 2013-06-05 | 2014-03-26 | 河南工业大学 | Silicon micro planar flexible linkage mechanism manufactured on semiconductor chip |
-
2013
- 2013-06-05 CN CN201310219988.6A patent/CN103288035B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6384509B1 (en) * | 1999-02-23 | 2002-05-07 | Matsushita Electric Works, Ltd. | Semiconductor device |
| CN2700064Y (en) * | 2003-12-16 | 2005-05-18 | 广东工业大学 | Two freedom degree moving plane parallel mechanism |
| CN1704329A (en) * | 2004-06-04 | 2005-12-07 | 大连理工大学 | Electrothermal-driven flexile micro-gripper |
| CN2742572Y (en) * | 2004-09-30 | 2005-11-23 | 广东工业大学 | Two freedom adhesive sheet machine welding head structure of plane double slide block parallel mechanism |
| CN101745915A (en) * | 2008-12-19 | 2010-06-23 | 中国科学院沈阳自动化研究所 | Rectilinear translation planar nine-bar mechanism and method for constructing a rectilinear translation motion mechanism |
| CN101621261A (en) * | 2009-08-06 | 2010-01-06 | 上海交通大学 | Flexible composite beam electric heating microdriver based on U+V shape |
| CN203498069U (en) * | 2013-06-05 | 2014-03-26 | 河南工业大学 | Silicon micro planar flexible linkage mechanism manufactured on semiconductor chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111486207A (en) * | 2020-04-26 | 2020-08-04 | 兰州城市学院 | Silicon micro six-rod force increasing mechanism |
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| CN103288035B (en) | 2017-02-08 |
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Effective date of registration: 20181101 Address after: 450000 7, B District, 7 Dong Qing Street, Zhengzhou high tech Industrial Development Zone, Henan Patentee after: Zhengzhou Zhuchuang incubating Technology Service Co., Ltd. Address before: 450007 Henan University of Technology, 195 Zhongyuan West Road, Zhengzhou, Henan Patentee before: Henan Industry University |
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Effective date of registration: 20181218 Address after: 450001 Dongqing Street, Zhengzhou High-tech Industrial Development Zone, Henan Province Patentee after: Zhengzhou Hezhong Overseas Talents Pioneer Park Development Co., Ltd. Address before: 450000 7, B District, 7 Dong Qing Street, Zhengzhou high tech Industrial Development Zone, Henan Patentee before: Zhengzhou Zhuchuang incubating Technology Service Co., Ltd. |
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Effective date of registration: 20210804 Address after: 201400 floor 1-2, No.7 Lane 1088, Mingcheng Road, Fengxian District, Shanghai Patentee after: Jinhongyu (Shanghai) Technology Co.,Ltd. Address before: 450001 No. 7, Holly Street, hi tech Industrial Development Zone, Henan, Zhengzhou Patentee before: Zhengzhou Hezhong Overseas Talents Pioneer Park Development Co.,Ltd. |
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