CN2705893Y - Phase changing heat radiator - Google Patents
Phase changing heat radiator Download PDFInfo
- Publication number
- CN2705893Y CN2705893Y CN200420046450.6U CN200420046450U CN2705893Y CN 2705893 Y CN2705893 Y CN 2705893Y CN 200420046450 U CN200420046450 U CN 200420046450U CN 2705893 Y CN2705893 Y CN 2705893Y
- Authority
- CN
- China
- Prior art keywords
- cylinder
- phase
- cavity
- radiator
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of phase-varying radiator, comprise a hollow cylinder, these cylinder two ends are provided with two lids, thereby form the cavity of a sealing, be equipped with in this cavity and can vary with temperature the hydraulic fluid of making gas, liquid two phase change, the cylinder outer peripheral face is one-body molded to be had along the axially extended some radiating fins of cylinder.Because this radiating fin extends vertically at the cylinder outer peripheral face, have bigger cooling surface area, and this radiating fin is one-body molded with cylinder, its cost is low, processing simply.
Description
[technical field]
The utility model is the phase-varying radiator that is used for distributing the electronic component heat about a kind of.
[background technology]
In the modern industry, computer application is almost omnipresent, along with the raising that the production real-time is required and the increase of data processing amount, need constantly have high performance computer to release and satisfy industrial application.The performance of computer depends on its core parts-central processing unit to a great extent, and therefore, the high-frequency high-speed processor is brought in constant renewal in and regenerated, and its speed of service is more and more faster, and still, the central processing unit speed of service is fast more, and then the heat of its unit interval generation is many more.For effectively distribute the heat that central processing unit produces in running, industry installs auxiliary its heat radiation of a radiator usually additional on the central processing unit surface, thereby makes central processing unit self temperature maintenance in normal range of operation.
What early stage application was more is the aluminium extruded type radiator, it is at high temperature with half molten metal aluminium one extrusion molding, and make it have a flat base and by the convex some radiating fins that stretch out of this pedestal, passing to radiating fin by pedestal absorption heat further distributes again, but because the difficulty of making, radiating fin density, depth-width ratio are limited, and the efficiently radiates heat area also is restricted, therefore, radiating effect can't obtain breakthrough raising.
Afterwards, the radiating mode that heat pipe combines with radiator appearred again in industry.Heat pipe is that temperature remains unchanged and can absorb or emit the principle work of big calorimetric when utilizing liquid to change between gas, liquid binary states, changes the traditional heat-dissipating device not high situation of efficient with the heat radiation of metal fever conduction pattern merely.The dealer connects a heat conducting base with heat pipe one end, the other end is in conjunction with some radiating fins, thereby composition radiator, absorb heat by pedestal, passing to radiating fin by heat pipe further distributes again, because liquid circulation velocity is fast, and the radiator integral radiating efficiency is increased substantially, heat-pipe radiating apparatus obtains extensive and a large amount of application at present.
Though heat-pipe radiating apparatus has above-mentioned advantage, because of combining need with radiating fin, welds heat pipe, and not only cost is higher and the weld thermal resistance is bigger.The TaiWan, China patent announcement discloses the heat abstractor of the one-body molded radiating fin of a kind of tool for No. 329341, the pedestal that this device has hollow and sealing reaches and the integrated radiating fin of pedestal upper surface, be equipped with in the pedestal and can vary with temperature the working fluid of making gas, liquid two phase change, and on base internal wall, be provided with groove structure.Radiating fin and pedestal are one-body molded in this device, and processing is simple, cost is lower and weld is few.But because the combination of this heat abstractor and electronic component determines and can only go out some radiating fins in that its pedestal upper surface is one-body molded that area of dissipation is restricted; In addition, pedestal length is subjected to spatial limitation bigger, processes oversize easy and electronic component other elements formation interference on every side, and this also causes certain influence to heat dispersion.
[summary of the invention]
The purpose of this utility model is to provide a kind of can not only effectively increase radiating fin area and the low phase-varying radiator of cost.
The purpose of this utility model realizes by following technical proposal:
The utility model phase-varying radiator comprises a hollow cylinder, these cylinder two ends are provided with two lids, thereby form the cavity of a sealing, be equipped with in this cavity and can vary with temperature the working fluid of making gas, liquid two phase change, the cylinder outer peripheral face is one-body molded to be had along the axially extended some radiating fins of cylinder.
In the utility model on the one hand since this radiating fin extend vertically at the cylinder outer peripheral face, than only big in the known technology at the one-body molded cooling surface area that goes out some radiating fins of pedestal upper surface; On the other hand, this radiating fin and cylinder are one-body molded, and its cost is low, processing is simple.
With reference to the accompanying drawings, the utility model will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is the perspective exploded view of the utility model phase-varying radiator.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the generalized section along III-III line among Fig. 2.
[embodiment]
Please consult Fig. 1 simultaneously to Fig. 3, the utility model phase-varying radiator comprises a cylinder 10, be positioned on cylinder 10 outer peripheral faces and along cylinder 10 axially extended some radiating fins 20 and be positioned at two lids 30 at cylinder 10 two ends, lid 30 sealing cylinders 10 two ends, thereby form the cavity 40 of a sealing in cylinder 10 central authorities, cavity 40 is pumped into the near vacuum state, dress can vary with temperature the working fluid of making gas, liquid two phase change in it, and is provided with capillary structure 50 on cavity 40 inwalls.Radiating fin 20 radially radially distributes along cylinder 10 at the outer peripheral face of cylinder 10, and one-body molded with cylinder 10.
Wherein a lid 30 directly contacts with a heater element 60, absorb the heat that heater elements 60 produce and be sent in the cavity 40 by lid 30, working fluid in the cavity 40 is subjected to thermal evaporation to be converted into gas, gas rises heat is sent on the lower radiating fin of temperature 40, and the gas of rising is condensed into liquid is back to the lid 30 that contacts with heater element 60 again by 50 effects of the capillary structure on cavity 40 inwalls a end in the end cooling of another lid 30.Circulation so repeatedly utilizes the working fluid in the cylinder 10 to finish the heat radiation to heater element 60 in gas, liquid two alternate transformations.
In the utility model on the one hand since this radiating fin 20 extend vertically at cylinder 10 outer peripheral faces, than only big in the known technology at the one-body molded cooling surface area that goes out some radiating fins of pedestal upper surface; On the other hand, this radiating fin 20 is one-body molded with cylinder 10, and its cost is low, processing is simple.
Understandable, the utility model cylinder 10 cross section radially is circular, square or other shapes; In addition, the shape of radiating fin 20 also can change according to real space size in the system.
Claims (5)
1. phase-varying radiator, comprise a hollow cylinder, these cylinder two ends are provided with two lids, thereby form the cavity of a sealing, be equipped with in this cavity and can vary with temperature the working fluid of making gas, liquid two phase change, it is characterized in that: the cylinder outer peripheral face is one-body molded to be had along the axially extended some radiating fins of cylinder.
2. phase-varying radiator as claimed in claim 1 is characterized in that: wherein a lid directly contacts with heater element.
3. phase-varying radiator as claimed in claim 1 is characterized in that: described cavity inner wall is provided with capillary structure.
4. phase-varying radiator as claimed in claim 1 is characterized in that: described cylinder cross section radially is for circular or square.
5. phase-varying radiator as claimed in claim 1 is characterized in that: described radiating fin radially radially distributes along cylinder.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200420046450.6U CN2705893Y (en) | 2004-05-26 | 2004-05-26 | Phase changing heat radiator |
| US10/952,691 US20050263267A1 (en) | 2004-05-26 | 2004-09-29 | Cooling apparatus and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200420046450.6U CN2705893Y (en) | 2004-05-26 | 2004-05-26 | Phase changing heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2705893Y true CN2705893Y (en) | 2005-06-22 |
Family
ID=34851173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200420046450.6U Expired - Fee Related CN2705893Y (en) | 2004-05-26 | 2004-05-26 | Phase changing heat radiator |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20050263267A1 (en) |
| CN (1) | CN2705893Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100413059C (en) * | 2006-03-23 | 2008-08-20 | 胡凯 | Integratively formed chip superconducting radiator |
| CN103149994A (en) * | 2012-01-23 | 2013-06-12 | 微软公司 | Heat transfer device with phase change material |
| CN104422318A (en) * | 2013-09-05 | 2015-03-18 | 中央大学 | Solid-liquid phase change cooler |
| CN107041102A (en) * | 2016-12-09 | 2017-08-11 | 淳铭散热科技股份有限公司 | The heat abstractor of a kind of electronic equipment and device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902732B (en) * | 2015-06-17 | 2018-05-15 | 东莞市闻誉实业有限公司 | Radiator |
| CN111788876B (en) * | 2017-12-08 | 2023-07-07 | 株式会社Kmw | Heat sink for electronic element |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2883591A (en) * | 1954-10-04 | 1959-04-21 | Westinghouse Electric Corp | Semiconductor rectifier device |
| US5629840A (en) * | 1992-05-15 | 1997-05-13 | Digital Equipment Corporation | High powered die with bus bars |
| US5412535A (en) * | 1993-08-24 | 1995-05-02 | Convex Computer Corporation | Apparatus and method for cooling electronic devices |
| US6199625B1 (en) * | 1999-06-11 | 2001-03-13 | Psc Computer Products, Inc. | Stackable heat sink for electronic components |
| US20010050164A1 (en) * | 1999-08-18 | 2001-12-13 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
| US20020033249A1 (en) * | 2000-09-21 | 2002-03-21 | Chia-Chin Chuang | Heat dissipation apparatus |
| US20020080582A1 (en) * | 2000-12-27 | 2002-06-27 | Kai-Cheng Chang | Heat pipe heat dissipating device |
| US7152667B2 (en) * | 2001-10-10 | 2006-12-26 | Fujikura Ltd. | Tower type finned heat pipe type heat sink |
| US20030070791A1 (en) * | 2001-10-12 | 2003-04-17 | Yu-Shen Lin | Heat sink module |
| JP3680040B2 (en) * | 2002-04-22 | 2005-08-10 | 三菱電機株式会社 | heat pipe |
| US6827136B2 (en) * | 2002-10-18 | 2004-12-07 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipating apparatus and method for producing same |
| TW575156U (en) * | 2003-05-08 | 2004-02-01 | Jiun-Guang Luo | Heat pipe |
| TW577683U (en) * | 2003-06-02 | 2004-02-21 | Jiun-Guang Luo | Heat sink |
| US20050155746A1 (en) * | 2004-01-15 | 2005-07-21 | Glacialtech, Inc. | Heat-pipe type heat-sink structure and its sealing method |
| US6986383B2 (en) * | 2004-03-30 | 2006-01-17 | Hul-Chun Hsu | End surface structure of a heat pipe for contact with a heat source |
-
2004
- 2004-05-26 CN CN200420046450.6U patent/CN2705893Y/en not_active Expired - Fee Related
- 2004-09-29 US US10/952,691 patent/US20050263267A1/en not_active Abandoned
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100413059C (en) * | 2006-03-23 | 2008-08-20 | 胡凯 | Integratively formed chip superconducting radiator |
| CN103149994A (en) * | 2012-01-23 | 2013-06-12 | 微软公司 | Heat transfer device with phase change material |
| CN104422318A (en) * | 2013-09-05 | 2015-03-18 | 中央大学 | Solid-liquid phase change cooler |
| CN107041102A (en) * | 2016-12-09 | 2017-08-11 | 淳铭散热科技股份有限公司 | The heat abstractor of a kind of electronic equipment and device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20050263267A1 (en) | 2005-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050622 Termination date: 20100526 |