CN104902732B - Radiator - Google Patents
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- CN104902732B CN104902732B CN201510338857.9A CN201510338857A CN104902732B CN 104902732 B CN104902732 B CN 104902732B CN 201510338857 A CN201510338857 A CN 201510338857A CN 104902732 B CN104902732 B CN 104902732B
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Abstract
A kind of radiator, it includes：Heat carrier, radiator and heat sink, the heat carrier is used to contact with electronic component, and the radiator is equipped with accommodating cavity, and radiator liquid is filled with the accommodating cavity, the heat carrier is tightly connected with the accommodating cavity, and the heat carrier is at least partly inserted in the accommodating cavity；The heat sink is arranged on the radiator.Above-mentioned radiator, accommodating cavity is equipped with radiator, heat carrier is inserted in accommodating cavity, utilize the mobility of liquid, the heat that electronic component produces is delivered in the accommodating cavity of radiator by heat carrier, and then absorbed by the radiator liquid in accommodating cavity, and it is rapidly dispersed on radiator, heated sink to again by heat sink with radiating modes such as convection current, radiation, conduction in air, be conducive to the quick transmission of heat and disperse, the heat dissipation performance of radiator is effectively guaranteed, improves the heat dissipation performance of radiator.
Description
Technical field
The present invention relates to technical field of heat dissipation, more particularly to a kind of radiator.
Background technology
Flourish with high-tech, electronic product intelligence and complication, the volume of electronic component increasingly tends to be small
Change, the closeness on unit area is also more and more high.And it is electronic product in operational process that such case, which is brought, which directly affects,
The heat of middle generation is increasing.If hot caused by electronics, these excessive temperature are excluded without good radiating mode
Degree will cause electronic component to produce electronics to dissociate and phenomena such as thermal stress, cause overall stability to reduce, and shortening electronics
The service life of element in itself.Therefore, overheat of these heats to avoid electronic component how is excluded, always is that what be can not be ignored asks
Topic.
For example, a kind of LED power type street lamp segmentation luminescence unit is disclosed in Chinese patent CN201410741409.9
Radiator structure, by the saturating module (1) for LED secondary light-distributions, the LED lamp bead (2), the aluminum that are welded in aluminum-based circuit board (3)
Radiator (5) and solid-state silicon heat conducting film (4) are formed；Solid-state silicon heat conducting film (4) substitutes the liquid heat conductive silicon that tradition is continued to use
Fat, the pattern contacted with face, aluminum-based circuit board (3) is connected with aluminium radiator (5), is worked in LED street lamp and is produced high temperature
Under conditions of, the conductive structure of its mutual face contact will not be changed, the LED operation electric heating held in aluminum-based circuit board can be made smoothly
Conduct, be diffused on aluminium radiator；Radiating fin (6) on radiator is coated with heat loss through radiation coating, this heat loss through radiation
Coating is that the solution that cohesion forms occurs for the modified colloidal particulate (being less than 100 nanometers) crossed through high-temperature process, and solution is in curing agent
Under the action of after film-forming, in fish scale-shaped structure, be conducive to radiation of heat, its filler is carbon nanotubes, spinelle metal oxygen
The material of the high thermal conductances such as compound and infrared emission, this construction can greatly increase heat dissipation specific surface area and conductivity,
The radiation coefficient of luminescence unit infra-red radiation is improved, lifts the effect of heat exchange, reduces the light decay probability of luminescence unit.
And for example, a kind of high-heat-dispersion LED wiring board is disclosed in Chinese patent CN201410734343.0, it include by down toward
On be equipped with radiating base layer, thermal insulation layer and line layer successively, the radiating base layer is metallic plate, its upper surface is equipped with multiple cones
Shape convex block；The top of the taper convex block is equipped with the heat transfer bar of two intersections.The taper convex block in thermal insulation layer is stretched into, is increased
The contact area of radiating base layer and thermal insulation layer, and then improve radiating base layer and the heat transfer efficiency of insulating heat-conductive interlayer.And
The topside area of taper convex block is smaller, thermal insulation layer can be avoided to be punctured by high-voltage electricity.
And for example, a kind of radiator and lighting apparatus are disclosed in Chinese patent CN200910085513.6.The heat dissipation fills
Put including：The riser of tabular, when riser is in running order and horizontal plane；The installation being formed on a side surface of riser
Boss, installation base is centrally disposed adjacent to the heat absorption of riser, formed with the installation end face for installing light source on installation base；Pricker
The radiating fin of weldering connection or extrusion forming on another side surface of riser.Lighting apparatus includes the radiator of the present invention, also
Including：Light source on installation end face.In radiator provided by the present invention, vertically disposed riser is as heat transfer
Plate, side set heat source, and opposite side sets the radiating fin for expanding cooling surface area, can be rapidly transferred to the heat of light source
In the plane of riser, then radiate again into space, improve the heat dissipation effect of lighting apparatus.Radiator can be made in itself
For the supporting structure of lighting apparatus, the lighting apparatus formed is simple in structure, compact, beneficial to heat dissipation.
But dissipation from electronic devices of the prior art substantially or by the heat between heat carrier and heat sink passes
Lead to complete, heat dissipation effect is not highly desirable, so it is required to provide a kind of new radiator.
The content of the invention
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of good heat dispersion performance, radiating efficiency higher heat dissipation dress
Put.
A kind of radiator, including：Heat carrier；Radiator, the radiator are equipped with accommodating cavity, are filled in the accommodating cavity
There is radiator liquid, the heat carrier is tightly connected with the accommodating cavity, and the heat carrier is at least partly inserted in described house
Intracavitary；Heat sink, the heat sink are arranged on the radiator.
In one of the embodiments, the inner wall of the accommodating cavity is equipped with protective layer.
In one of the embodiments, the accommodating cavity is cylindrical structure.
In one of the embodiments, the inner wall of the accommodating cavity is equipped with some auxiliary heat conduction columns.
In one of the embodiments, each auxiliary heat conduction column is uniformly distributed in the inner wall of the accommodating cavity.
In one of the embodiments, each auxiliary heat conduction column is continuously distributed.
In one of the embodiments, the size and shape of each auxiliary heat conduction column is identical.
In one of the embodiments, the section of the auxiliary heat conduction column is arc.
In one of the embodiments, the radius of the auxiliary heat conduction column is the 1/20~1/ of the radius of the accommodating cavity
10。
In one of the embodiments, the radian of the auxiliary heat conduction column is less than 180 degree.
Above-mentioned radiator, radiator is interior to be equipped with accommodating cavity, and heat carrier is inserted in accommodating cavity, utilizes the flowing of liquid
Property, the heat that electronic component produces is delivered in the accommodating cavity of radiator by heat carrier, and then by the cooling fluid in accommodating cavity
Body absorbs, and is rapidly dispersed on radiator, then is heated sink to by heat sink with radiating modes such as convection current, radiation, conduction
In air, be conducive to the quick transmission of heat and disperse, be effectively guaranteed the heat dissipation performance of radiator, improve heat dissipation dress
The heat dissipation performance put.It is big to be additionally, since high uniformity, the thermal capacitance of radiator liquid, the heat that electronic component can be made to produce at work
Amount uniformly absorbed by radiator liquid, avoid because the reason for thermal capacitance is small cause amount of heat can not shed in a short time and to electricity
Subcomponent causes to damage.
Brief description of the drawings
Fig. 1 is the decomposition diagram of radiator in an embodiment of the present invention；
Fig. 2 is the partial structural diagram at another visual angle of radiator in another embodiment of the present invention；
Fig. 3 is the partial structural diagram of radiator in another embodiment of the present invention；
Fig. 4 is the partial structural diagram of radiator in another embodiment of the present invention.
Embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is from the limitation of following public specific embodiment.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be based on orientation shown in the drawings or
Position relationship, is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, " multiple " are meant that at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements, unless otherwise restricted clearly.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
The present invention provides a kind of radiator, it includes：Heat carrier, radiator and heat sink, the heat carrier be used for
Electronic component contacts, and the radiator is equipped with accommodating cavity, and the accommodating cavity is interior to be filled with radiator liquid, the heat carrier with it is described
Accommodating cavity is tightly connected, and the heat carrier is at least partly inserted in the accommodating cavity；The heat sink is arranged at described dissipate
On hot body.
Referring to Fig. 1, radiator 100, including：Heat carrier 110, radiator 120, heat sink 130, radiator 120 are set
There is accommodating cavity 121, be filled with radiator liquid in accommodating cavity 121, heat carrier 100 is tightly connected with accommodating cavity 121, and heat carrier
100 at least part are inserted in accommodating cavity 121, and heat sink 130 is arranged on radiator 120.Above-mentioned radiator, in radiator
Equipped with accommodating cavity, heat carrier is inserted in accommodating cavity, and using the mobility of liquid, the heat that electronic component produces passes through heat carrier
It is delivered in the accommodating cavity of radiator, and then is absorbed by the radiator liquid in accommodating cavity, and be rapidly dispersed on radiator, then leads to
Cross heat sink to heat sink in air with radiating modes such as convection current, radiation, conduction, be conducive to the quick transmission of heat and divide
Dissipate, be effectively guaranteed the heat dissipation performance of radiator, improve the heat dissipation performance of radiator.It is additionally, since radiator liquid
High uniformity, thermal capacitance it is big, being absorbed by radiator liquid for the even heat that electronic component produces at work can be made, avoided because of heat
Holding the reason for small causes amount of heat can not in a short time shed and cause to damage to electronic component.
For example, the heat carrier includes the first heat-conducting piece and the second heat-conducting piece being connected with first heat-conducting piece, it is described
First heat-conducting piece is used to contact with chip；Also, the radiator is equipped with accommodating cavity, and cooling fluid is filled with the accommodating cavity
Body, the heat carrier are tightly connected with the accommodating cavity, and second heat-conducting piece is placed in the accommodating cavity, and at least partly
It is inserted in the radiator liquid.
For the ease of the assembling of radiator and heat carrier, for example, passing through screw thread between the accommodating cavity and the heat carrier
It is tightly connected, and for example, the inner wall of the accommodating cavity is equipped with internal thread, and the correspondence position of the heat carrier is equipped with external screw thread, described
Internal thread is connected with the external screw thread, and for example, is tightly connected between the accommodating cavity and the heat carrier by being clamped, this
Sample, can facilitate the assembling of accommodating cavity and heat carrier.
In order to preferably solve the sealing problem between accommodating cavity and heat carrier, prevent radiator liquid from leaking, example
Such as, the interface of the accommodating cavity and the heat carrier is equipped with sealant layer.By setting sealant layer, accommodating cavity can be improved
Leakproofness between heat carrier, prevents the radiator liquid in accommodating cavity from leaking.
In order to increase radiator liquid and the contact area of radiator in accommodating cavity, to improve radiating efficiency, for example, the appearance
It is cylindrical structure to put chamber, since in the case of equal volume, the surface area of cylinder is larger, in this way, can increase cooling fluid
The contact area of body and radiator, improves the radiating efficiency of radiator.
Since contact of the radiator liquid with radiator is only the madial wall of radiator, i.e. radiator liquid and radiator connect
Contacting surface product is the area of the inner surface of the cylinder, in order to further increase the heat dissipation effect of radiator, for example, described dissipate
Hot wall in vivo is additionally provided with some auxiliary heat conduction columns, and and for example, the section of each auxiliary heat conduction column is arc, and for example, each described
Auxiliary heat conduction column is uniformly distributed in the inner wall of the accommodating cavity, and and for example, each auxiliary heat conduction column is continuously distributed, auxiliary by setting
Heat carrier is helped, radiator liquid and the contact area of radiator can be increased, so as to improve heat transference efficiency, improves heat dissipation effect.
Specifically, referring to Fig. 2, the inner wall of accommodating cavity 121 is additionally provided with some auxiliary heat conduction columns 122, each auxiliary heat conduction
The section of column 122 is cylinder, and the size and shape of each auxiliary heat conduction column 122 are identical, are uniformly arranged in the interior of accommodating cavity 121
Wall, and 122 continuous arrangement of auxiliary heat conduction column.Certainly, auxiliary heat dissipation column is not limited to above-mentioned shape, for example, the auxiliary is led
The section of plume is triangle, and for example, the section of the auxiliary heat conduction column be it is trapezoidal, and for example, the shape of the auxiliary heat conduction column
For rectangle.The shape of auxiliary heat conduction column can be not particularly limited, as long as can increase contact area.
In order to further increase the contact area of radiator liquid and radiator, to improve radiating efficiency, for example, the auxiliary
The radius of heating column is the 1/20~1/10 of the accommodating cavity radius, for example, the radius of the auxiliary heat conduction column is described accommodating
The 1/15 of chamber radius, and for example, the radian of the auxiliary heat conduction column are less than 180 degree, for example, the radian of the auxiliary heat conduction column is
125 to 128 degree.In this way, can further increase radiator liquid and the contact area of radiator, radiating efficiency is improved, while
The volume of radiator liquid can be reduced to avoid space larger in accommodating cavity is taken.
Process is manufactured for the ease of radiator, for example, the auxiliary heat conduction column is integrated with the radiator
Molding structure, and for example, the auxiliary heat conduction column form integrated formed structure with the radiator by casting process, in this way, can
Process is manufactured with facilitate radiator.
In the present embodiment, the radiator liquid is the 50%~80% of the accommodating cavity volume, and the radiator liquid exists
Normal atmosphere pressure boiling point >=70 DEG C, thermal capacitance >=3 × 103J/(kg·℃).Preferably, the radiator liquid is distilled water, ammonia
At least one of water, methanol, ethanol, hexanol, acetone, heptane or conduction oil, for example, the radiator liquid is distilled water and second
The mixture of alcohol.And for example, the radiator liquid includes each component of following mass parts：Distilled water：75 parts~78 parts, ethanol：22
Part~25 parts, sodium chloride：0.5 part~1 part, sodium nitrate：0.5 part~1.5 parts, sodium perborate：0.5 part~1.5 parts, three nitrogen of benzo
Azoles：0.2 part~0.5 part, when the temperature of radiator liquid is more than 30 DEG C, the ethanol being diluted in distilled water occurs gasification and makes steaming
Distilled water gradually gasifies, the ethanol and distilled water of gasification be repeatedly evaporated in the accommodating cavity of sealing condensation and with accommodating cavity
Inner wall carries out heat exchange, and the addition of sodium chloride can reduce the boiling point of ethanol and distilled water, therefore can accelerate distilled water
And the cycle period of evaporation and the condensation of ethanol, and can prevent that distilled water solidifies, nitre when temperature is relatively low
The compounding of sour sodium and benzotriazole can be used as corrosion inhibitor or corrosion inhibiter, it can be formed on the surface of the inner wall of accommodating cavity
Uniform passivation layer and organic film, prevent the further generation of corrosion reaction, the addition of sodium perborate can be with freeze proof inhibitor
And the effect of scale removal.
Preferably, in order to avoid radiator liquid be heated repeatedly, the inner wall during evaporative condenser with accommodating cavity
Reaction is learned, for example, the accommodating cavity wall is adapted to heat-conducting liquid, i.e. the material of the inner wall of accommodating cavity is not sent out with radiator liquid
Biochemical reaction.And for example, the inner wall of the accommodating cavity is made of aluminium alloy, and the aluminium alloy includes each component of following mass parts
Composition：Aluminium：80.2 parts~89.5 parts；Magnesium：10.3 parts~15.1 parts；Silicon：0.5 part~1.5 parts；Copper：1.2 parts~3.5 parts；Manganese：
0.2 part~1.0 parts；Nickel：2.3 parts~4.6 parts；Molybdenum：0.1 part~0.5 part；Zirconium：0.2 part~0.5 part；Above-mentioned aluminium alloy mainly by
Aluminium, magnesium are made, and can not only make the lighter weight of the base material of preparation, and thermal conductivity is preferable, and the addition of silicon, copper, manganese, nickel, molybdenum
Can make the inner wall of accommodating cavity there is larger intensity, in addition, the addition of zirconium can improve accommodating cavity wall fatigue-resistance characteristics and
Corrosion resistance, the but when content of zirconium is more than 0.5 part, its corrosion resistance can't improve smaller, and can influence material
Surrender degree and other mechanical mechanics properties.
Further, the inner wall of the accommodating cavity is equipped with protective layer, and for example, the protective layer include graphite, nano carbon material,
The carbon materials such as diamond-like, chemical physical property temperature, thermal conductivity are good.And for example, the protective layer is in the accommodating cavity
Diamond-like (DLC) coating on wall, and for example, the diamond-like coating have been additionally provided with solid attached effect with the accommodating cavity wall
Chrome coating so that diamond-like coating and accommodating cavity wall have stronger combination power.Preferably, the diamond-like coating
Thickness be 1.0~2.0 microns, the thickness of chrome coating is 10~40 nanometers.And for example, the component of the diamond-like coating includes
20%~60% graphite-phase and 80%~40% diamond phase.
For example, the radiator in one embodiment of the invention, it includes each component of following parts by weight：Aluminium：62 parts~78 parts,
Zinc：11 parts~25 parts, copper：9 parts~11 parts, boron：0.3 part~0.7 part, nickel：0.05 part~0.3 part, manganese：0.3 part~1.5 parts,
Chromium：0.01 part~0.2 part.Above-mentioned radiator contains the aluminium that parts by weight are 62 parts~78 parts, it can be made to maintain lighter quality,
Its density is only 2.6kg/m3~2.7kg/m3, it is little with the density difference of fine aluminium, it so can effectively mitigate the weight of radiator
Amount, is conducive to installation manufacture, while also greatly reduces cost；And its thermal conductivity factor can reach more than 320W/mK, far
Much larger than the thermal conductivity factor of fine aluminium, the heat that more quickly can be transmitted to heat carrier disperses and transmits, and then equably
It is dispersed on whole radiators, to prevent heat from being accumulated on the contact position of heat carrier and radiator, causes hot-spot
The generation of phenomenon；In addition, it is zinc that above-mentioned radiator, which contains parts by weight,：11 parts~25 parts, copper：9 parts~11 parts, boron：0.3 part~
0.7 part, nickel：0.05 part~0.3 part, manganese：0.3 part~1.5 parts, chromium：0.01 part~0.2 part, relative to fine aluminium, radiator prolongs
Malleability energy, toughness, intensity and resistance to elevated temperatures are improved significantly.
In order to make the radiator that there is preferably performance, for example, the radiator further include parts by weight for 0.2 part~
1.2 parts of vanadium, in this way, can suppress growing up for aluminium alloy crystal grain in radiator, makes its obtain more uniform tiny grain structure,
To reduce the brittleness of radiator, so as to improve the mechanical property of radiator entirety, its toughness and intensity are improved.And for example, it is described to dissipate
Hot body contains the titanium that parts by weight are 0.1 part~0.3 part, can cause the crystal grain miniaturization of aluminium alloy in radiator, is dissipated with improving
The ductility of hot body；And for example, the radiator further includes the silicon that parts by weight are 1.0 parts~2.5 parts, when the radiator contains
During suitable silicon, can on the premise of the radiator heat conductivility is not influenced, the hardness of effective heat radiation body with it is wear-resisting
Degree.But when the quality of silicon in radiator is too many, such as mass percent is more than more than 15 parts, the appearance of radiator can be made
Black particles are distributed, and ductility reduces, and is unfavorable for the shaping of radiator.
For example, the heat carrier in an embodiment of the present invention, it includes each component of following mass parts：Aluminium：93.4 part~
95.8 parts, silicon：0.05 part~0.15 part, manganese：0.2 part~0.5 part, magnesium：1.0 parts~3.0 parts, nickel：3.0 parts~6.0 parts, titanium：
0.02 part~0.06 part, zirconium：0.05 part~0.15 part, scandium：0.1 part~0.3 part.Due to adding nickel, nickle atom can reduce crystalline substance
Boundary and transgranular potential difference, this improves the stress corrosion resistant ability of heat carrier, meanwhile, also improve heat carrier intensity,
Plasticity and repetition loading drag.Scandium (Sc) forms precipitated phase Al in aluminium alloy3Sc, it is normal with face-centred cubic structure, lattice
Number is approached with α (Al) matrix, and stability is high, not only has strong age-hardening effect, but also have high heat endurance.Cause
This, the addition of scandium so that alloy structure is fined, and provides forming core core for precipitated phase, makes the precipitation of precipitated phase by crystal boundary
α (Al) matrix gradually is expanded to, more disperse is uniform, reduces crystal boundary and transgranular difference in Electrode Potential, forms homogeneous corrosion, from
And improve the corrosion resisting property of alloy.Due to adding zirconium (Zr), and Zr and Al combine to form Al3Zr intermetallic compounds, this
Kind intermetallic compound has two kinds of structures and form：The Al directly separated out from melt3Zr is tetragonal, can significantly refine conjunction
The as-cast grain of gold；Another kind is the spheroidal particle separated out during ingot homogenization, is had in strong inhibition hot procedure
The effect of recrystallization；And the sensitiveness of alloy quenching containing Zr is not strong, the quenching degree of alloy improves, and therefore, the addition of zirconium is effectively
Improve the intensity, fracture toughness and anti-stress corrosion performance of alloy.
Above-mentioned heat carrier, since it includes aluminium, nickel, magnesium, silicon, manganese, titanium, zirconium, scandium, element, the interaction of these elements, makes
The advantages of obtaining it not only has good heat conductivity, and specific surface area is big, while there is anticorrosive, high intensity.
For example, the heat sink in an embodiment of the present invention, it includes each component of following mass parts：Graphene：20 parts
~30 parts, carbon fiber：20 parts~30 parts, polyamide：40 parts~60 parts, water-soluble silicate：10 parts~20 parts, six sides nitridation
Boron：1 part~8 parts, bismaleimide：2 parts~5 parts, silane coupling agent：0.5 part~2 parts, antioxidant：0.25 part~1 part.
And for example, the antioxidant is the one or more in double Lauryl Alcohol esters, bi-myristoleyl or double octadecanol esters.Again
Such as, the water-soluble silicate is lithium metasilicate or sodium metasilicate.
Above-mentioned graphene, carbon fiber are mixed with polyamide, under the high temperature conditions by the copolyreaction of polyamide certain
Ordered arrangement in degree, forms heat dissipation channel, gives heat and forms microchannel absorption cross-ventilation, produces stronger radiant heat transfer
Effect, so as to improve the heat dissipation performance of heat sink, and the more fluffy sky of heat radiating fin structure formed, quality are lighter.Further, since
Carbon fiber is with the addition of, its surface protection performance and mechanical performance are more preferable, for example, it is more anti-oxidant, more resistant to soda acid and more resistant to corrosion.
Preferably, the heat sink includes each component of following mass parts：Graphene：30 parts~35 parts, carbon fiber：25 parts
~30 parts, polyamide：45 parts~50 parts, water-soluble silicate：15 parts~20 parts, hexagonal boron nitride：4 parts~6 parts, span carrys out acyl
Imines：3 parts~4 parts, silane coupling agent：1 part~1.5 parts, antioxidant：0.5 part~1 part.
Preferably, the heat sink includes each component of following mass parts：35 parts of graphene, 28 parts of carbon fiber, polyamide
45 parts, 18 parts of water-soluble silicate, 5 parts of hexagonal boron nitride, 3.5 parts of bismaleimide, 1.8 parts of silane coupling agent is anti-oxidant
0.7 part of agent.
For example, the particle diameter of graphene is 10-50 μm, the particle diameter of carbon fiber is 20-30 μm, and the particle diameter of hexagonal boron nitride is 1-
10μm。
Above-mentioned heat sink can delay or suppress the progress of polymer oxidizing process by adding antioxidant, so as to prevent
The aging of Polyamide Engineering Plastic simultaneously extends its service life, by adding silane coupling agent and double succinimides, Ke Yiti
The compatibility of high other components and polyamide, makes it have preferable mechanical property and mobility, makes polyamide good into obtaining
Surface quality and machinery, heat and electrical property, can improve the thermal conductivity factor of heat sink by adding hexagonal boron nitride, make heat dissipation
Piece has higher heat loss through radiation ability.
Above-mentioned heat sink, by adding graphene film and carbon fiber in polyamide, has using graphene film and carbon fiber
Have that density is small, thermal conductivity and fine heat radiation property, and to have that cost is low, quality is small and machine-shaping property is good etc. excellent for polyamide material
Point, compared with traditional aluminum alloy heat sink, its quality can greatly reduce, and cost is low, machine-shaping is easy, at the same its also have dissipate
Good in thermal property, toughness are larger, high temperature resistant and the performance such as corrosion-resistant.
In order to further increase the contact area of heat sink and radiator, to improve the radiating efficiency of radiator, for example,
Referring to Fig. 3, heat sink 130 is arcuate structure, i.e. the contact surface of heat sink 130 and radiator 120 is arc, and for example, please be joined
Fig. 4 is read, heat sink 130 is S type structures, i.e. the contact surface of heat sink 130 and radiator 120 is S types, in this way, can increase scattered
The contact area of backing and radiator, improves the heat dissipation performance of radiator.
Above-mentioned radiator, radiator is interior to be equipped with accommodating cavity, and heat carrier is inserted in accommodating cavity, utilizes the flowing of liquid
Property, the heat that electronic component produces is delivered in the accommodating cavity of radiator by heat carrier, and then by the cooling fluid in accommodating cavity
Body absorbs, and is rapidly dispersed on radiator, then is heated sink to by heat sink with radiating modes such as convection current, radiation, conduction
In air, be conducive to the quick transmission of heat and disperse, be effectively guaranteed the heat dissipation performance of radiator, improve heat dissipation dress
The heat dissipation performance put.It is big to be additionally, since high uniformity, the thermal capacitance of radiator liquid, the heat that electronic component can be made to produce at work
Amount uniformly absorbed by radiator liquid, avoid because the reason for thermal capacitance is small cause amount of heat can not shed in a short time and to electricity
Subcomponent causes to damage.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. radiator, it is characterised in that including：Heat carrier, the heat carrier include each component of following mass parts：Aluminium：93.4 parts~95.8 parts, silicon：0.05 part~0.15 Part, manganese：0.2 part~0.5 part, magnesium：1.0 parts~3.0 parts, nickel：3.0 parts~6.0 parts, titanium：0.02 part~0.06 part, zirconium：0.05 Part~0.15 part, scandium：0.1 part~0.3 part；Radiator, the radiator include each component of following parts by weight：Aluminium：62 parts~78 parts, zinc：11 parts~25 parts, copper：9 Part~11 parts, boron：0.3 part~0.7 part, nickel：0.05 part~0.3 part, manganese：0.3 part~1.5 parts, chromium：0.01 part~0.2 part, institute State radiator and be equipped with accommodating cavity, the inner wall of the accommodating cavity is made of aluminium alloy, and the aluminium alloy includes each of following mass parts Component forms：Aluminium：80.2 parts~89.5 parts；Magnesium：10.3 parts~15.1 parts；Silicon：0.5 part~1.5 parts；Copper：1.2 parts~3.5 parts； Manganese：0.2 part~1.0 parts；Nickel：2.3 parts~4.6 parts；Molybdenum：0.1 part~0.5 part；Zirconium：0.2 part~0.5 part, the accommodating cavity Inner wall is equipped with protective layer, and the protective layer is the diamond-like coating on the accommodating cavity wall, and the diamond-like applies Layer has been additionally provided with the chrome coating of solid attached effect with the accommodating cavity wall, and radiator liquid is filled with the accommodating cavity, described to lead Connected between hot body and the accommodating cavity by thread seal, and the heat carrier is at least partly inserted in the accommodating cavity, The interface of the accommodating cavity and the heat carrier is equipped with sealant layer, and the radiator inner wall is additionally provided with some auxiliary heat conductions Column；Heat sink, the heat sink are arranged on the radiator, and the heat sink includes each component of following mass parts：Graphite Alkene：20 parts~30 parts, carbon fiber：20 parts~30 parts, polyamide：40 parts~60 parts, water-soluble silicate：10 parts~20 parts, six Square boron nitride：1 part~8 parts, bismaleimide：2 parts~5 parts, silane coupling agent：0.5 part~2 parts, antioxidant：0.25 part ~1 part；The radiator liquid includes each component of following mass parts：Distilled water：75 parts~78 parts, ethanol：22 parts~25 parts, chlorination Sodium：0.5 part~1 part, sodium nitrate：0.5 part~1.5 parts, sodium perborate：0.5 part~1.5 parts, benzotriazole：0.2 part~0.5 Part.
- 2. radiator according to claim 1, it is characterised in that the inner wall of the accommodating cavity is equipped with protective layer.
- 3. radiator according to claim 1, it is characterised in that the accommodating cavity is cylindrical structure.
- 4. radiator according to claim 1, it is characterised in that the inner wall of the accommodating cavity is equipped with some auxiliary heat conductions Column.
- 5. radiator according to claim 4, it is characterised in that each auxiliary heat conduction column is uniformly distributed in the appearance Put the inner wall of chamber.
- 6. radiator according to claim 5, it is characterised in that each auxiliary heat conduction column is continuously distributed.
- 7. radiator according to claim 4, it is characterised in that the size and shape of each auxiliary heat conduction column is identical.
- 8. radiator according to claim 7, it is characterised in that the section of the auxiliary heat conduction column is arc.
- 9. radiator according to claim 8, it is characterised in that the radius of the auxiliary heat conduction column is the accommodating cavity Radius 1/20~1/10.
- 10. radiator according to claim 9, it is characterised in that the radian of the auxiliary heat conduction column is less than 180 degree.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510338857.9A CN104902732B (en) | 2015-06-17 | 2015-06-17 | Radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510338857.9A CN104902732B (en) | 2015-06-17 | 2015-06-17 | Radiator |
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| CN104902732A CN104902732A (en) | 2015-09-09 |
| CN104902732B true CN104902732B (en) | 2018-05-15 |
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| CN106251598B (en) * | 2016-08-02 | 2019-10-29 | 怀化建南电子科技有限公司 | A kind of four tables unification concentrator apparatus |
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| CN203052596U (en) * | 2013-01-07 | 2013-07-10 | 范勇 | Radiator |
| CN103897664A (en) * | 2014-04-22 | 2014-07-02 | 深圳市比速光电科技有限公司 | Mining lamp phase change liquid and heat radiator thereof |
| CN203733776U (en) * | 2013-10-12 | 2014-07-23 | 苏州嘉德鲁机电科技有限公司 | Totally-enclosed phase-change type radiator and LED lamp therewith |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2705893Y (en) * | 2004-05-26 | 2005-06-22 | 鸿富锦精密工业（深圳）有限公司 | Phase changing heat radiator |
| CN102367373A (en) * | 2011-06-28 | 2012-03-07 | 苏州方暨圆节能科技有限公司 | Heat-transfer medium specially used for solar energy heat pump |
| CN102367376A (en) * | 2011-06-28 | 2012-03-07 | 苏州方暨圆节能科技有限公司 | Heat transfer medium for radiator |
| CN102399535A (en) * | 2011-06-28 | 2012-04-04 | 苏州方暨圆节能科技有限公司 | Heat-conduction fluid |
| CN104197219B (en) * | 2014-09-05 | 2016-01-27 | 关德威 | A kind of LED bulb |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203052596U (en) * | 2013-01-07 | 2013-07-10 | 范勇 | Radiator |
| CN203733776U (en) * | 2013-10-12 | 2014-07-23 | 苏州嘉德鲁机电科技有限公司 | Totally-enclosed phase-change type radiator and LED lamp therewith |
| CN103897664A (en) * | 2014-04-22 | 2014-07-02 | 深圳市比速光电科技有限公司 | Mining lamp phase change liquid and heat radiator thereof |
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