CN105066077B - Heat-transfer device - Google Patents
Heat-transfer device Download PDFInfo
- Publication number
- CN105066077B CN105066077B CN201510420921.8A CN201510420921A CN105066077B CN 105066077 B CN105066077 B CN 105066077B CN 201510420921 A CN201510420921 A CN 201510420921A CN 105066077 B CN105066077 B CN 105066077B
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting plate
- conducting layer
- parts
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 44
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 238000009423 ventilation Methods 0.000 claims abstract description 18
- 238000005452 bending Methods 0.000 claims description 14
- 241001092459 Rubus Species 0.000 claims description 6
- 239000002826 coolant Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 239000010949 copper Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- FYYHWMGAXLPEAU-UHFFFAOYSA-N magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 10
- 229910052749 magnesium Inorganic materials 0.000 description 10
- 239000011777 magnesium Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000010936 titanium Substances 0.000 description 9
- 229910052720 vanadium Inorganic materials 0.000 description 9
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium(0) Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 9
- 239000004411 aluminium Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000000741 silica gel Substances 0.000 description 8
- 229910002027 silica gel Inorganic materials 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 8
- 229910052719 titanium Inorganic materials 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 7
- 229910021389 graphene Inorganic materials 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 7
- 239000011572 manganese Substances 0.000 description 7
- 229910052748 manganese Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 229920002456 HOTAIR Polymers 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000011324 bead Substances 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000003026 anti-oxygenic Effects 0.000 description 1
- 230000002457 bidirectional Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002708 enhancing Effects 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 125000005909 ethyl alcohol group Chemical group 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001681 protective Effects 0.000 description 1
- 230000002441 reversible Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- DIMMBYOINZRKMD-UHFFFAOYSA-N vanadium(5+) Chemical compound [V+5] DIMMBYOINZRKMD-UHFFFAOYSA-N 0.000 description 1
Abstract
The present invention relates to a kind of heat-transfer device, including：Pedestal, the pedestal include integrally formed mounting surface, supporting walls and bottom plate, and the supporting walls are connected respectively with the mounting surface, the bottom plate, form a heat dissipation cavity, and the supporting walls offer several ventilation openings；And heat-conducting plate and cooling fin in heat dissipation cavity are arranged at, the heat-conducting plate is connected to the mounting surface, if the heat-conducting plate has dry passage, each passage aligns respectively with a ventilation opening of the supporting walls, and the cooling fin is connected to the heat-conducting plate.The present invention has good heat conductivility, can have good heat dissipation performance rapidly by the heat derives of pedestal and the mounting surface of pedestal by the passage of heat-conducting plate.
Description
Technical field
The present invention relates to technical field of heat dissipation, more particularly to heat-transfer device.
Background technology
LED technology it is just with rapid changepl. never-ending changes and improvements in progress, its luminous efficiency is obtaining surprising breakthrough, and price is also continuous
Reduction, with the large-scale promotion of LED technology, LED light gradually substitutes traditional fluorescent lamp and white heat in routine use
Lamp, LED light have the advantages that low energy consumption, long lifespan, environmentally protective, but LED light also has the defects of very important, during work
Substantial amounts of heat can be sent, if heat dissipation effect is bad, then will significantly reduce the service life, therefore, in order to further extend the use of LED light
Service life reduces the use cost of LED light, it is desirable that LED light must possess splendid heat dissipation performance.
The content of the invention
Based on this, it is necessary to for existing radiator heat dissipation effect it is bad the defects of, a kind of excellent in heat dissipation effect is provided
Heat-transfer device.
A kind of heat-transfer device, including：
Pedestal, the pedestal include integrally formed mounting surface, supporting walls and bottom plate, the supporting walls respectively with the peace
Dress face, bottom plate connection, form a heat dissipation cavity, the supporting walls offer several ventilation openings；And
The heat-conducting plate and cooling fin being arranged in heat dissipation cavity, the heat-conducting plate are connected to the mounting surface, the heat-conducting plate
If with dry passage, each passage aligns respectively with a ventilation opening of the supporting walls, and the cooling fin is connected to
The heat-conducting plate, the heat-conducting plate are provided with multiple Rubus Tosaefulins, coolant are equiped in the Rubus Tosaefulins；
The passage is horizontally disposed with, and the passage has bending part, and the passage has arc-shaped bending part.
In one embodiment, there is thermal conductive cavity inside the heat-conducting plate, the thermal conductive cavity is connected with the passage.
In one embodiment, the heat-conducting plate has first surface and second surface, and the first surface is connected to institute
Mounting surface is stated, the cooling fin is connected to the second surface.
Above-mentioned heat-transfer device has good heat conductivility, can be rapidly by pedestal and pedestal by the passage of heat-conducting plate
The heat derives of mounting surface have good heat dissipation performance.
Description of the drawings
Fig. 1 is the cross-sectional view of the heat-transfer device of one embodiment of the invention；
Fig. 2 is the perspective exploded view of the heat-transfer device of another embodiment of the present invention；
Fig. 3 is the cross-sectional view of the pedestal of one embodiment of the invention；
Fig. 4 is the cross-sectional view of the other direction of the pedestal of one embodiment of the invention；
Fig. 5 is the cross-sectional view of the pedestal of another embodiment of the present invention.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In attached drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that make to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more
The arbitrary and all combination of relevant Listed Items.
For example, a kind of heat-transfer device, including：Pedestal, the pedestal include integrally formed mounting surface, supporting walls and bottom
Plate, the supporting walls are connected respectively with the mounting surface, the bottom plate, form a heat dissipation cavity, the supporting walls offer several
Ventilation opening；And heat-conducting plate and cooling fin in heat dissipation cavity are arranged at, the heat-conducting plate is connected to the mounting surface, the heat-conducting plate
If with dry passage, each passage aligns respectively with a ventilation opening of the supporting walls, and the cooling fin is connected to
The heat-conducting plate.
As shown in Figure 1, the heat-transfer device 20 of a preferred embodiment of the present invention, including：
Pedestal 100, the pedestal 100 include integrally formed mounting surface 110, supporting walls 120 and bottom plate 130, the peace
Dress face 110, supporting walls 120 and bottom plate 130 connect, and please refer to Fig.2 and Fig. 3, the mounting surface 110, supporting walls 120 and bottom plate
130 connections, and internal formation heat dissipation cavity 190, the supporting walls 120 offer several ventilation openings 121.
As shown in Figure 1, being provided with heat-conducting plate 410 and cooling fin 420 in the heat dissipation cavity 190, the heat-conducting plate 410 abuts
In the mounting surface 110, if the heat-conducting plate 410 has a dry passage 430, each passage 430 respectively with the supporting walls
120 ventilation opening 121 aligns, i.e., each passage corresponds to a ventilation opening, and the cooling fin 420 is connected to the heat conduction
Plate 410.There can be good heat dissipation to imitate rapidly by the heat derives on mounting surface 110 by heat-conducting plate 410 and cooling fin 420
Fruit.
The heat-transfer device 20 of the present invention is suitable for various heat-producing devices, carries out heat conduction to heat-producing device, improves the fever and set
Standby radiating efficiency extends its service life, for example, installing heat-producing device on mounting surface 110, heat-transfer device 20 is to heat-producing device
It carries out heat conduction and radiates, be applied to below with heat-transfer device 20 in LED light and the present invention is further elaborated, it should be appreciated that all
It is that heat-transfer device of the invention should not only be defined in and be used in LED light.
Another example of the heat-transfer device of the present invention, as shown in Fig. 2, a kind of heat-transfer device 10, including：
Pedestal 100, the pedestal 100 include integrally formed mounting surface 110, supporting walls 120 and bottom plate 130, the peace
Dress face 110, supporting walls 120 and bottom plate 130 connect, and please refer to Fig.3, and inside forms heat dissipation cavity 190, and the supporting walls 120 open up
There are several ventilation openings 121, the mounting surface 110 extends to form buckling parts 111 along the radial outside of the mounting surface 110.
Lampshade 200, as shown in figure 3, the lampshade 200 is fastened on the buckling parts 111 of the pedestal 100.
Lamp body 300, the lamp body 300 include substrate 310, LED lamp bead 320 and connector 330, and the substrate 310 is installed
In on the mounting surface 110, the LED lamp bead 320 is sequentially connected by connector 330.At this time due to the design of lamp body 300,
The heat-transfer device 10 can also realize luminous effect.
As shown in Fig. 3, Fig. 5, heat-conducting plate 410 and cooling fin 420, the heat-conducting plate 410 are provided in the heat dissipation cavity 190
The mounting surface 110 is connected to, if the heat-conducting plate 410 has dry passage 430, each passage 430 and the supporting walls
120 ventilation opening 121 aligns, and the cooling fin 420 is connected to the heat-conducting plate 410.
Radiating piece 500, the radiating piece 500 is arranged in the bottom plate 130, and is at least partially arranged at the heat dissipation cavity
In 190, in concrete application, for example, one end of the radiating piece 500 is arranged on through the bottom plate 130 in heat dissipation cavity 190, separately
One end exposes to the bottom plate 130 and in wall, is discharged the heat in heat dissipation cavity 190 by wall；For another example, it is described
500 one end of radiating piece is arranged on through the bottom plate 130 in heat dissipation cavity 190, and it is empty with outside that the other end exposes to the bottom plate 130
Gas contacts, and radiating piece 500 is by air by the heat derives in heat dissipation cavity 190.
Heat-conducting plate 410 can effectively absorb the heat of lamp body 300, and heat-conducting plate 410 concentrates the heat of absorption, and passes through logical
Heat is discharged in road 430, and on the other hand, the cooling fin 420 being connected with heat-conducting plate 410 increases heat dissipation area, with cooling fin 420
The radiating piece 500 of connection further improves the radiating efficiency of cooling fin 420, when installing and using, can radiating piece 500 be installed on wall
In wall, radiating piece 500 can transfer heat to wall so that the heat of LED light 10 is further distributed, and improves heat dissipation effect
Rate so that better heat-radiation effect.
For example, the radiating piece 500 is heat-dissipating pipe, heat-dissipating pipe respectively with inside heat dissipation cavity 190, the outside of heat dissipation cavity 190 it is empty
Gas connects, and heat-dissipating pipe can make the hot-air in heat dissipation cavity 190 be circulated, exchanged with the air outside heat dissipation cavity 190, meanwhile,
Heat-dissipating pipe can be by the heat transfer of heat dissipation cavity 190 to outside, for example, the heat-dissipating pipe is heat dissipation copper pipe, heat dissipation copper pipe has good
Good heat conductivility, can be quickly by the heat derives in heat dissipation cavity 190.
In order to which the heat for making heat-conducting plate 410 is more concentrated, more orderly discharge, as shown in Figure 3, Figure 4, the heat-conducting plate 410
Inside has thermal conductive cavity 419, and the thermal conductive cavity 419 connects with the passage 430, thermal conductive cavity 419 may be such that heat can rapidly from
Thermal conductive cavity 419 is focused on heat-conducting plate 410, the hot-air of concentration is discharged to ventilation opening by thermal conductive cavity 419 via passage 430
Outside 121, for example, the thermal conductive cavity 419 is arranged at the middle part of the heat-conducting plate 410 so that the concentration that hot-air can be more uniformly distributed
In thermal conductive cavity 419, for example, 419 shape of the thermal conductive cavity is circle, the concentration of heat is more advantageous to, multiple passages 430 are in radiation
Shape around the thermal conductive cavity 419 circle distribution, in this way, hot-air can be discharged from multiple directions, so as to which hot-air be avoided to block,
And cause discharge not in time.
For example, the ventilation opening 121 is arranged to square, then passage 430 is arranged to matched square with ventilation opening 121, again
Such as, the ventilation opening 121 is provided in round, then passage 430 is arranged to and 121 matched circle of ventilation opening.
In one embodiment, the heat-conducting plate 410 has first surface and second surface, and the first surface is connected to
The mounting surface 110, the cooling fin 420 are connected to the second surface, in this way, heat-conducting plate 410 can be by lamp on mounting surface 110
The heat of body 300 is transferred to rapidly on cooling fin 420 so that heat can be discharged quickly.
Specifically, the substrate 310 is fixedly connected by screw with the mounting surface 110.
In order to further strengthen heat dissipation effect, quickly by the heat derives of lamp body 300, the substrate 310 and the installation
Layer of silica gel is provided between face 110, the layer of silica gel has good heat conductivility, can be rapidly by LED lamp bead on substrate 310
320 heats sent are transferred to mounting surface 110 by layer of silica gel, and then absorb heat by heat-conducting plate 410, and heat is distributed,
The silica gel layer thickness is arranged to 1.2mm~1.8mm, and specifically, silica gel layer thickness is too thick to be easy to cause heat transference efficiency drop
Low, silica gel layer thickness is too thin can not fully to fill up the gap between substrate 310 and the mounting surface 110, again result in heat transfer
It is inefficient, it is preferred that the silica gel layer thickness is 1.5mm.In this way, can either conduct heat rapidly, and it is unlikely to due to layer of silica gel
It is too thick to be easy to cause heat transference efficiency reduction.
To further improve the heat exchanger effectiveness of the heat-conducting plate 410 and the cooling fin 420, radiating efficiency, institute are improved
It states cooling fin 420 and is inserted in the heat-conducting plate 410, such cooling fin 420 can be contacted fully with heat-conducting plate 410, led described in absorption
The heat of hot plate 410, cooling fin 420 distribute heat after absorbing the heat of heat-conducting plate 410, so that the heat of lamp body 300
It can discharge rapidly, for example, the part that the cooling fin 420 is inserted in the heat-conducting plate 410 is arranged on the cooling fin 420 and leads
The ratio of part outside hot plate 410 is 1：2, i.e. the ratio between 420 heating surface area of cooling fin and heat dissipation area is 1：2, it may be such that scattered
Thermal efficiency higher, while ensure the heat exchanger effectiveness of heat-conducting plate 410 and cooling fin 420.
Specifically, the cooling fin 420 is inserted in the heat-conducting plate 410 vertically, is arranged in parallel between cooling fin 420,
In order to increase the contact area of the cooling fin 420 and the heat-conducting plate 410, heat exchanger effectiveness is improved, the cooling fin 420 inclines
Oblique cutting is arranged on the heat-conducting plate 410, for example, inclination angle between the cooling fin 420 and the heat-conducting plate 410 for 20 °~
60 °, it is preferred that the inclination angle between the cooling fin 420 and the heat-conducting plate 410 is 40 °.
In one embodiment, as shown in figure 3, the passage 430 is horizontally disposed, for example, the passage 430 is around described
Thermal conductive cavity 419 is horizontally disposed, runs through passage 430 convenient for hot-air and discharges, very fast airflow speed, improves heat exchange effect
Rate；For another example, in order to increase the contact area of heat-conducting plate 410 and air so that heat exchange more comprehensively, as shown in figure 5, described logical
Road 430 has bending part 431, for example, the passage 430 has bending part 431 in the horizontal direction, alternatively, the passage 430
There is bending part 431 in the vertical direction, the bending part 431 of passage 430 causes passage 430 in the horizontal direction and vertical direction
Upper bending, the passage 430 with bending part 431 add the length of passage 430, add 410 inside of heat-conducting plate and air
Contact area adds the total amount of heat exchange so that better heat-radiation effect.
Specifically, the bending part 431 of passage 430 can increase the contact area of heat-conducting plate 410 and air, but bending part
431 but so that air passage rates decline so that heat dissipation effect improves unobvious, please further to strengthen air passage rates
Referring again to Fig. 5, the passage 430 has arc-shaped bending part 431, and arc-shaped bending part 431 causes air circulation more
For smoothness, air passage rates are accelerated, you can increase the contact area of heat-conducting plate 410 and air, but also air circulation is fast
Arriving for degree is promoted, and further improves heat exchanger effectiveness；For example, in order to further increase contact of the heat-conducting plate 410 with air
Area, 430 inside of passage have curved surface ripple, and the curved surface ripple adds the area of 430 inner wall of passage so that heat conduction
Plate 410 and the contact area of air increase, and further enhance the heat exchange effect of heat-conducting plate 410 and air.In order to accelerate air
Circulation, for another example, 430 inside of passage set mini-fan.
As shown in Fig. 3, Fig. 5, the heat-conducting plate 410 includes sequentially connected first heat-conducting layer 411, the second heat-conducting layer 412
With the 3rd heat-conducting layer 413, first heat-conducting layer 411 is connected to the mounting surface 110, and the cooling fin 420 is connected to described
3rd heat-conducting layer 413, first heat-conducting layer 411 are connected with mounting surface 110, and the 3rd heat-conducting layer 413 connects with cooling fin 420
It connects, for example, the first heat-conducting layer 411, the second heat-conducting layer 412 and the 3rd heat-conducting layer 413 are connected by one forging, for example, first
Heat-conducting layer 411, the second heat-conducting layer 412 and the 3rd heat-conducting layer 413 are by being welded to connect.
For example, first heat-conducting layer 411 includes each component of following mass parts：
85 parts~90 parts of copper, 3 parts~3.5 parts of aluminium, 2 parts~2.5 parts of magnesium, 0.5 part~0.8 part of nickel, 0.3 part~0.5 part of iron,
2.5 parts~4.5 parts of vanadium, 0.2 part~0.4 part of manganese, 0.6 part~0.8 part of titanium, 0.7 part~0.8 part of chromium, 0.6 part~0.8 part of vanadium, silicon
1.2 parts~15 parts and 0.5 part~2 parts of graphene.
First, above-mentioned first heat-conducting layer 411 can make having for the first heat-conducting layer 411 containing 85 parts~90 parts of copper (Cu)
Preferable heat absorption energy.When the mass parts of copper are 85 parts~90 parts, the coefficient of heat conduction of the first heat-conducting layer 411 can reach
The heat that LED light 10 generates can be siphoned away rapidly, and then be dispersed in the first heat conduction with making even heat by more than 355W/mK
In the whole structure of layer 411, to prevent heat from being accumulated on the contact position between 300 and first heat-conducting layer 411 of lamp body, cause
The generation of hot-spot phenomenon.Moreover, the density of the first heat-conducting layer 411 is less than the density of fine copper, so can effectively mitigate
The weight of first heat-conducting layer 411, more conducively installation manufacture, while also greatly reduce cost.Wherein, the coefficient of heat conduction is determined
Justice is：Per unit length, every K can transmit the energy of how many W, unit W/mK, wherein " W " refers to thermal power unit, " m " generation
Table length unit rice, and " K " is absolute temperature units, the numerical value is bigger to illustrate that heat absorption capacity is better.In addition, pass through addition 0.5
Part~2 parts of graphene, its coefficient of heat conduction can be effectively improved, and then improves the heat absorptivity of first heat-conducting layer 411
Energy.
Secondly, the first heat-conducting layer 411 containing mass parts be 3 parts~3.5 parts aluminium, 2 parts~2.5 parts of magnesium, 0.5 part~
0.8 part of nickel, the iron of 0.3 part~0.5 part of iron, 2.5 parts~4.5 parts of vanadium, 0.2 part~0.4 part of manganese, 0.6 part~0.8 part
Titanium, 0.7 part~0.8 part of chromium and 0.6 part~0.8 part of vanadium.Compared with fine copper material, the ductility of the first heat-conducting layer 411
Energy, toughness, intensity and high temperature resistance are improved significantly, and not easy-sintering；In this manner it is possible to prevent LED light 10 from producing
Raw high temperature damages the first heat-conducting layer 411, also, can also prevent with preferable ductility, toughness and intensity
Only the first heat-conducting layer 411 is subject to excessive stresses when installing the lamp body 300 and causes to deform.Wherein, the first heat-conducting layer 411 contains
The nickel (Ni) for having mass parts to be 0.5 part~0.8 part can improve the high temperature resistance of the first heat-conducting layer 411.For another example, first lead
Thermosphere 411 can inhibit 411 crystal grain of the first heat-conducting layer containing the vanadium (V) that mass parts are 1.5 parts~4.5 parts and grow up, and obtain more equal
Even and fine small grain structure to reduce the brittleness of the first heat-conducting layer 411, improves the whole mechanical property of the first heat-conducting layer 411, with
Improve toughness and intensity.For another example, the first heat-conducting layer 411 is 0.6 part~0.8 part of titanium (Ti) containing mass parts, can cause the
The crystal grain miniaturization of one heat-conducting layer 411, to improve the ductility of the first heat-conducting layer 411.
Finally, the first heat-conducting layer 411 further includes the silicon (Si) that mass parts are 1.2 parts~15 parts, when the first heat-conducting layer 411 contains
When having suitable silicon, the first heat-conducting layer 411 can be effectively promoted on the premise of 411 heat absorption capacity of the first heat-conducting layer is not influenced
Hardness and abrasion resistance.But through multiple theory analysis and experiment evidence find, when silicon in the first heat-conducting layer 411 quality too
It is more, such as when mass percent is more than 15 parts or more, the appearance of the first heat-conducting layer 411 can be made to be distributed black particles, and ductility
It can reduce, be unfavorable for the production shaping of the first heat-conducting layer 411.
For example, heat-conducting plate 410 is provided with multiple Rubus Tosaefulins, for example, first heat-conducting layer 411 be provided with it is multiple hollow
It steeps, coolant is equiped in the Rubus Tosaefulins, for example, the coolant is water, water has larger specific heat capacity, is natural good
Conduction material, the radiating efficiency of heat-conducting plate 410 can be improved, for another example, the coolant is ethyl alcohol, and ethyl alcohol has good heat absorption
Performance so that heat-conducting plate 410 can fast endothermic, by the heat derives of lamp body 300.
For example, second heat-conducting layer 412 includes each component of following mass parts：
70 parts~75 parts of copper, 25 parts~35 parts of aluminium, 0.6 part~0.9 part of magnesium, 0.1 part~0.4 part of manganese, titanium 0.1 part~0.4
Part, 0.1 part~0.2 part of chromium, 0.1 part~0.2 part of vanadium, 0.5 part~0.7 part of silicon and 0.2 part~0.3 part of graphene.
First, above-mentioned second heat-conducting layer 412, can containing copper and 25 parts~35 parts of aluminium that mass parts are 70 parts~75 parts
So that the coefficient of heat conduction of the second heat-conducting layer 412 is maintained at 310W/mK~340W/mK, to ensure that the second heat-conducting layer 412 can be with
The heat that the LED light 10 absorbed by the first heat-conducting layer 411 generates is quickly transmitted to the 3rd heat-conducting layer 413, Jin Erfang
Only heat is accumulated on the second heat-conducting layer 412, and hot-spot phenomenon is caused to generate.Compared with the prior art, merely using valency
Costly and the larger copper of quality, above-mentioned second heat-conducting layer 412 can both ensure quickly by the heat transfer of heat-sink shell to the lattice
Three heat-conducting layers 413, but there is lighter weight, to be easily installed casting, price less expensive.Meanwhile compared with the prior art,
Merely using the poor aluminium alloy of heat dissipation effect, above-mentioned second heat-conducting layer 412 has more preferably heat transfer property.
Secondly, by adding in 0.2 part~0.3 part of graphene, leading for second heat-conducting layer 412 can be greatlyd improve
Hot property preferably gives the heat transfer passed over from the first heat-conducting layer 411 to the 3rd heat-conducting layer 413.
Finally, the second heat-conducting layer 412 containing mass parts be 0.6 part~0.9 part magnesium, 0.1 part~0.4 part of manganese, 0.1 part
~0.4 part of titanium, 0.1 part~0.2 part of chromium, 0.1 part~0.2 part of vanadium and 0.5 part~0.7 part of silicon, so as to improve
The mechanical performance and high temperature resistance of two heat-conducting layers 412, e.g., mechanical performance includes but is not limited to yield strength, tensile strength.
For example, the second heat-conducting layer 412 can assign the second heat-conducting layer to a certain extent containing the magnesium that mass parts are 0.6 part~0.9 part
412 yield strengths and tensile strength, due in the fabrication process, it is necessary to the whole punching press of the second heat-conducting layer 412 is integrally formed, this
With regard to needing the second heat-conducting layer 412 that there is stronger yield strength, to prevent that it is excessive that the second heat-conducting layer 412 is subject in process
Punching press stress generates non-reversible deformation, and then ensures the proper heat reduction performance of heat sink, for example, the passage 430 is through setting
In the second heat-conducting layer 412, the second heat-conducting layer 412 is may be such that when carrying out drilling through 430, stronger yield strength and tensile strength
So that the second heat-conducting layer 412 is not likely to produce irregular deformation and fracture so that processing cost is controlled.When the relative mass of magnesium
When too low, e.g., when mass parts are less than 0.8 part, it is impossible to substantially ensure that the yield strength of the second heat-conducting layer 412 is met the requirements, however,
When the relative mass of magnesium is excessively high, for example, mass parts be more than 1.2 parts when, and can cause the second heat-conducting layer 412 ductility and
Heat conductivility dramatic decrease.For example, the second heat-conducting layer 412 can assign second containing the iron that mass parts are 0.2 part~0.8 part
The higher high temperature resistance of heat-conducting layer 412 and high temperature resistant mechanical performance, the processing beneficial to the second heat-conducting layer 412 are cast.
For example, the 3rd heat-conducting layer 413 includes each component of following mass parts：
90 parts~96 parts of aluminium, 8.5 parts~10.5 parts of silicon, 0.5 part~0.7 part of magnesium, 1.0 parts~1.5 parts of copper, 0.4 part of iron~
12 parts of 0.7 part, 0.3 part~0.6 part of manganese, 0.1 part~0.2 part of titanium, 0.1 part~0.2 part of chromium, 0.1 part~0.2 part of vanadium and graphene
~15 parts.
First, above-mentioned 3rd heat-conducting layer 413 can cause the 3rd heat-conducting layer containing the aluminium that mass parts are 90 parts~96 parts
413 coefficient of heat conduction is maintained at 230W/mK~250W/mK, when LED light 10 generate heat by the first heat-conducting layer 411 with
And after the heat dissipation of 412 part of the second heat-conducting layer, when remaining heat transfer gives three heat-conducting layers 413, the 3rd heat-conducting layer 413 can be true
It protects and these remaining heats is evenly transferred to cooling fin 420, and then prevent heat from being accumulated on the 3rd heat-conducting layer 413,
Cause hot-spot phenomenon.
Secondly, by adding in 12 parts~15 graphene, the thermal diffusivity of the 3rd heat-conducting layer 413 can be effectively improved
Can, and then the heat being transmitted to from second heat-conducting layer 412 can be rapidly transferred on cooling fin 420.
Finally, the 3rd heat-conducting layer 413 is 8.5 parts~10.5 parts of silicon, 0.5 part~0.7 part of magnesium, 1.0 containing mass parts
Part~1.5 parts of copper, 0.4 part~0.7 part of iron, 0.3 part~0.6 part of manganese, 0.1 part~0.2 part of titanium, 0.1 part~0.2 part
Chromium and 0.1 part~0.2 part of vanadium, the heat dissipation performance of the 3rd heat-conducting layer 413 can be significantly improved.For example, the 3rd heat-conducting layer
413 contain the silicon and 1.0 parts~1.5 parts of copper that mass parts are 8.5 parts~10.5 parts, it can be ensured that the 3rd heat-conducting layer 413 has
The advantages of good mechanical properties and lighter weight, at the same time it can also further improve the heat-conductive characteristic of the 3rd heat-conducting layer 413,
Further ensure that the 3rd heat-conducting layer 413 can dissipate the after-heat consistent after being transferred via heat-sink shell and heat-conducting layer
It walks, and then prevents heat from being accumulated on the 3rd heat-conducting layer 413, cause hot-spot phenomenon.
In order to further improve the tensile strength of the 3rd heat-conducting layer 413, for example, the 3rd heat-conducting layer 413 also wraps
It is 1.0 parts~1.1 parts of lead (Pb) to include mass parts, when the 3rd heat-conducting layer 413 can improve the containing 1.0 parts~1.1 parts of lead
The tensile strength of three heat-conducting layers 413 strikes out radiating fin, i.e. piece in this way, can prevent that the 3rd heat-conducting layer 413 ought be cast
During shape structure, it is broken since excessive punching press being subject to pull stress.
In order to further improve the high temperature oxidation resistance of the 3rd heat-conducting layer 413, for example, the 3rd heat-conducting layer
413 further include the niobium (Nb) that mass parts are 0.05 part~0.08 part, when the mass parts of niobium are more than 0.05 part, can greatly carry
The antioxygenic property of high 3rd heat-conducting layer 413, it will be understood that the 3rd heat-conducting layer 413 is more demanding to high temperature oxidation resistance.So
And when the mass parts of niobium are more than 0.08 part, the magnetism of the 3rd heat-conducting layer 413 can be caused to sharply increase, it can be in LED light 10
Other component has an impact.
In order to further improve the heat dissipation performance of the 3rd heat-conducting layer 413, for example, the 3rd heat-conducting layer 413 further includes matter
The germanium (Ge) that part is 0.05 part~0.2 part is measured, it, can be to the heat dissipation of the 3rd heat-conducting layer 413 when the mass parts of germanium are more than 0.05 part
Preferable effect is played in the raising of performance, however, when the quality accounting of germanium is excessive, such as when the mass parts of germanium are more than 0.2 part, again
It can make the brittleness of the 3rd heat-conducting layer 413 increase.
In order to further improve radiating efficiency, the surface of the substrate 310 has heat dissipating layer, the heat dissipation on 310 surface of substrate
Layer is conducive to the heat that LED lamp bead 320 is sent and is distributed from other direction, is conducive to improve heat emission efficiency, avoids heat heap
Product.
For example, the heat dissipating layer includes each component of following mass parts：
65 parts~75 parts of copper, 30 parts~35 parts of aluminium, 10.5 parts~11.5 parts of silicon, 0.5 part~0.7 part of magnesium, 1.0 parts of copper~
1.5 parts, 0.4 part~0.7 part of iron, 0.3 part~0.6 part of manganese, 0.1 part~0.2 part of titanium, 0.1 part~0.2 part of chromium, 0.2 part of vanadium~
0.3 part and 10 parts~12 parts of graphene.
Above-mentioned heat dissipating layer contains the aluminium that mass parts are 65 parts~75 parts, and the coefficient of heat conduction of heat dissipating layer can be caused to be maintained at
300W/mK~320W/mK so that the heat that LED lamp bead 320 is sent can be distributed by heat dissipating layer, make heat can be simultaneously to heat conduction
The heat dissipating layer of plate 410 and substrate 310 transfers, with avoiding excess calories unidirectional delivery, is reduced so as to cause heat transfer efficiency.It is logical
The heat dissipating layer bidirectional cooling of heat-conducting plate 410 and substrate 310 is crossed, can further improve radiating efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (3)
1. a kind of heat-transfer device, which is characterized in that including：
Pedestal, the pedestal include integrally formed mounting surface, supporting walls and bottom plate, the supporting walls respectively with the installation
Face, bottom plate connection, form a heat dissipation cavity, the supporting walls offer several ventilation openings；And
The heat-conducting plate and cooling fin being arranged in heat dissipation cavity, the heat-conducting plate are connected to the mounting surface, and the heat-conducting plate has
If dry passage, each passage aligns respectively with a ventilation opening of the supporting walls, and the cooling fin is connected to described
Heat-conducting plate, the heat-conducting plate are provided with multiple Rubus Tosaefulins, coolant are equiped in the Rubus Tosaefulins；
The passage is horizontally disposed with, and the passage has bending part, and the passage has arc-shaped bending part.
2. heat-transfer device according to claim 1, which is characterized in that there is thermal conductive cavity inside the heat-conducting plate, it is described to lead
Hot chamber is connected with the passage.
3. heat-transfer device according to claim 1, which is characterized in that the heat-conducting plate has first surface and the second table
Face, the first surface are connected to the mounting surface, and the cooling fin is connected to the second surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420921.8A CN105066077B (en) | 2015-07-16 | 2015-07-16 | Heat-transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420921.8A CN105066077B (en) | 2015-07-16 | 2015-07-16 | Heat-transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105066077A CN105066077A (en) | 2015-11-18 |
| CN105066077B true CN105066077B (en) | 2018-05-25 |
Family
ID=54495514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510420921.8A Active CN105066077B (en) | 2015-07-16 | 2015-07-16 | Heat-transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105066077B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105605540B (en) * | 2016-03-25 | 2019-12-27 | 和鸿电气股份有限公司 | Heat dissipation device for LED energy-saving lamp |
| CN113218119A (en) * | 2017-12-27 | 2021-08-06 | 博西华电器（江苏）有限公司 | Refrigerator with a door |
| CN108730839A (en) * | 2018-06-08 | 2018-11-02 | 东莞市闻誉实业有限公司 | Horizontal projection lamp fitting |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101986001A (en) * | 2009-07-28 | 2011-03-16 | 富准精密工业(深圳)有限公司 | Light-emitting diode (LED) lamp |
| CN202216082U (en) * | 2011-08-03 | 2012-05-09 | 邵武市兴融科技光电制造有限公司 | Light-emitting diode (LED) road lamp |
| CN203656675U (en) * | 2014-01-26 | 2014-06-18 | 上虞市友友照明电器有限公司 | Light emitting diode (LED) lamp with radiator |
| CN104763954A (en) * | 2015-04-15 | 2015-07-08 | 东莞市闻誉实业有限公司 | Indoor ceiling lamp |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101936465B (en) * | 2009-07-01 | 2013-07-03 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
-
2015
- 2015-07-16 CN CN201510420921.8A patent/CN105066077B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101986001A (en) * | 2009-07-28 | 2011-03-16 | 富准精密工业(深圳)有限公司 | Light-emitting diode (LED) lamp |
| CN202216082U (en) * | 2011-08-03 | 2012-05-09 | 邵武市兴融科技光电制造有限公司 | Light-emitting diode (LED) road lamp |
| CN203656675U (en) * | 2014-01-26 | 2014-06-18 | 上虞市友友照明电器有限公司 | Light emitting diode (LED) lamp with radiator |
| CN104763954A (en) * | 2015-04-15 | 2015-07-08 | 东莞市闻誉实业有限公司 | Indoor ceiling lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105066077A (en) | 2015-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104896351B (en) | Tubular radiating lamp | |
| CN105066077B (en) | Heat-transfer device | |
| CN104696759B (en) | Led lamp | |
| CN104964259B (en) | Radiator | |
| CN105066075B (en) | Radiator | |
| CN207488926U (en) | Computer radiator structure | |
| CN104696763A (en) | LED lighting lamp | |
| CN105003851A (en) | Led lamp | |
| CN104990009B (en) | Ceiling lamp | |
| CN207352551U (en) | The computer radiator of high-cooling property | |
| CN105066016B (en) | Ceiling lamp | |
| CN104696761B (en) | LED radiating lamp | |
| CN104896350B (en) | Illuminating device | |
| JP2006245560A (en) | Structure of heat dissipation fin and its manufacturing process | |
| CN104329650B (en) | Using the radiator structure of the heat pipe combined LED desk lamp of metal-containing polymer | |
| CN104696762A (en) | Led lamp | |
| CN105065958B (en) | Fluorescent tube | |
| CN104696760B (en) | Light fixture | |
| CN104180351B (en) | LED lamp with plate type radiator | |
| CN209710564U (en) | A kind of new radiator | |
| CN104879688B (en) | Domestic lighting light fixture | |
| CN107390833A (en) | A kind of industrial computer for carrying radiating | |
| CN206904927U (en) | A kind of ring-type fan cooling LED radiator | |
| CN104896338B (en) | Lighting | |
| CN206947071U (en) | A kind of radiator structure of aluminum casing resistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |