CN105066077B - Heat conduction device - Google Patents

Abstract

The present invention relates to a heat transfer device comprising: the base comprises an integrally formed mounting surface, a supporting wall and a bottom plate, the supporting wall is respectively connected with the mounting surface and the bottom plate to form a heat dissipation cavity, and the supporting wall is provided with a plurality of ventilation openings; and the heat conducting plate and the radiating fins are arranged in the radiating cavity, the heat conducting plate is abutted to the mounting surface and is provided with a plurality of channels, each channel is respectively aligned with one ventilation opening of the supporting wall, and the radiating fins are connected with the heat conducting plate. The invention has good heat-conducting performance, can rapidly lead out the heat of the base and the mounting surface of the base through the channel of the heat-conducting plate, and has good heat-radiating performance.

Description

Heat conduction device

technical field

The invention relates to the technical field of heat dissipation, in particular to a heat conduction device.

Background technique

LED technology is improving with each passing day. Its luminous efficiency is making amazing breakthroughs, and its price is constantly decreasing. With the large-scale promotion of LED technology, LED lights have gradually replaced traditional fluorescent lamps and incandescent lamps in daily use. LED lights have the advantages of low energy consumption, long life, and environmental protection, but LED lights also have defects that cannot be ignored. When they work, they will emit a lot of heat. To prolong the service life of LED lamps and reduce the cost of using LED lamps, LED lamps must have excellent heat dissipation performance.

Contents of the invention

Based on this, it is necessary to provide a heat conduction device with good heat dissipation effect for the defect of poor heat dissipation effect of the existing heat dissipation device.

A heat conduction device, comprising:

The base, the base includes an integrally formed installation surface, a support wall and a bottom plate, the support walls are respectively connected to the installation surface and the bottom plate to form a cooling cavity, and the support wall is provided with a number of ventilation openings; and

The heat conduction plate and the heat sink arranged in the heat dissipation cavity, the heat conduction plate abuts against the installation surface, the heat conduction plate has several channels, and each of the channels is respectively aligned with one of the ventilation openings of the support wall , the heat sink is connected to the heat conduction plate, the heat conduction plate is provided with a plurality of hollow cells, and a cooling liquid is installed in the hollow cells;

The channel is arranged horizontally, the channel has a bent part, and the channel has a circular arc-shaped bent part.

In one embodiment, the heat conduction plate has a heat conduction cavity inside, and the heat conduction cavity communicates with the channel.

In one embodiment, the heat conducting plate has a first surface and a second surface, the first surface abuts against the installation surface, and the heat sink is connected to the second surface.

The above-mentioned heat conduction device has good heat conduction performance, and the heat of the base and the mounting surface of the base can be quickly exported through the channel of the heat conduction plate, and has good heat dissipation performance.

Description of drawings

Fig. 1 is a schematic cross-sectional structure diagram of a heat conduction device according to an embodiment of the present invention;

2 is a three-dimensional exploded schematic diagram of a heat conduction device according to another embodiment of the present invention;

Fig. 3 is a schematic cross-sectional structure diagram of a base according to an embodiment of the present invention;

Fig. 4 is a schematic cross-sectional structure diagram of another direction of a base according to an embodiment of the present invention;

Fig. 5 is a schematic cross-sectional structure diagram of a base according to another embodiment of the present invention.

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

For example, a heat conduction device includes: a base, the base includes an integrally formed installation surface, a support wall and a bottom plate, the support walls are respectively connected with the installation surface and the bottom plate to form a heat dissipation cavity, the The support wall is provided with a number of ventilation openings; and a heat conducting plate and a cooling fin arranged in the heat dissipation cavity, the heat conducting plate abuts against the installation surface, the heat conducting plate has several channels, and each of the channels is respectively connected to the One of the air vents of the supporting wall is aligned, and the heat sink is connected to the heat conducting plate.

As shown in Figure 1, a heat conduction device 20 according to a preferred embodiment of the present invention includes:

The base 100, the base 100 includes an integrally formed installation surface 110, a support wall 120 and a bottom plate 130, the installation surface 110, the support wall 120 and the bottom plate 130 are connected, please refer to Figure 2 and Figure 3, the installation surface 110 , the support wall 120 is connected to the bottom plate 130 , and a cooling chamber 190 is formed inside, and the support wall 120 is provided with a plurality of vents 121 .

As shown in FIG. 1 , a heat conduction plate 410 and a heat sink 420 are arranged in the heat dissipation chamber 190, the heat conduction plate 410 abuts against the installation surface 110, and the heat conduction plate 410 has several channels 430, each of which The channels 430 are respectively aligned with one of the vents 121 of the supporting wall 120 , that is, each channel corresponds to one vent, and the heat sink 420 is connected to the heat conducting plate 410 . The heat on the installation surface 110 can be quickly dissipated through the heat conducting plate 410 and the heat sink 420 , which has a good heat dissipation effect.

The heat conduction device 20 of the present invention is applicable to various heating devices, conducts heat to the heat generating devices, improves the heat dissipation efficiency of the heat generating devices, and prolongs its service life. And dissipate heat, the following will further explain the present invention by applying the heat conduction device 20 to LED lamps. It should be understood that the heat conduction device of the present invention should not be limited to use in LED lamps.

Yet another example of the heat conduction device of the present invention, as shown in FIG. 2, a heat conduction device 10, which includes:

The base 100, the base 100 includes an integrally formed installation surface 110, a support wall 120 and a bottom plate 130, the installation surface 110, the support wall 120 and the bottom plate 130 are connected, please refer to FIG. 3, and a heat dissipation cavity 190 is formed inside, so The supporting wall 120 defines a plurality of ventilation openings 121 , and the mounting surface 110 extends radially outside the mounting surface 110 to form a fastening portion 111 .

The lampshade 200 , as shown in FIG. 3 , the lampshade 200 is fastened to the fastening portion 111 of the base 100 .

The lamp body 300 , the lamp body 300 includes a substrate 310 , LED lamp beads 320 and connectors 330 , the substrate 310 is installed on the installation surface 110 , and the LED lamp beads 320 are sequentially connected through the connectors 330 . At this time, due to the design of the lamp body 300 , the heat conduction device 10 can also achieve the effect of emitting light.

As shown in Fig. 3 and Fig. 5, a heat conduction plate 410 and a heat dissipation fin 420 are arranged in the heat dissipation cavity 190, the heat conduction plate 410 abuts against the installation surface 110, and the heat conduction plate 410 has several channels 430, each A channel 430 is aligned with a vent 121 of the support wall 120 , and the heat sink 420 is connected to the heat conducting plate 410 .

The heat dissipation element 500, the heat dissipation element 500 passes through the bottom plate 130, and is at least partially disposed in the heat dissipation chamber 190. In a specific application, for example, one end of the heat dissipation element 500 passes through the bottom plate 130 and is disposed on the In the heat dissipation cavity 190, the other end is exposed to the bottom plate 130 and installed in the wall, and the heat in the heat dissipation cavity 190 is discharged through the wall; as another example, one end of the heat dissipation element 500 passes through the bottom plate 130 and is installed in the heat dissipation cavity 190 The other end is exposed on the bottom plate 130 and is in contact with the outside air, and the heat dissipation element 500 conducts the heat in the heat dissipation chamber 190 through the air.

The heat conduction plate 410 can effectively absorb the heat of the lamp body 300. The heat conduction plate 410 concentrates the absorbed heat and discharges the heat through the channel 430. On the other hand, the heat sink 420 connected to the heat conduction plate 410 increases the heat dissipation area, and The heat sink 500 connected to the heat sink 420 further improves the heat dissipation efficiency of the heat sink 420. When installed and used, the heat sink 500 can be installed in the wall, and the heat sink 500 can transfer heat to the wall, so that the heat of the LED lamp 10 can be further dissipated. , improve the heat dissipation efficiency, and make the heat dissipation effect better.

For example, the heat dissipation element 500 is a heat dissipation pipe, and the heat dissipation pipe communicates with the inside of the heat dissipation chamber 190 and the air outside the heat dissipation chamber 190, and the heat dissipation pipe can circulate and exchange the hot air in the heat dissipation chamber 190 with the air outside the heat dissipation chamber 190, At the same time, the heat dissipation pipe can transfer the heat of the heat dissipation chamber 190 to the outside, for example, the heat dissipation pipe is a heat dissipation copper pipe, and the heat dissipation copper pipe has good heat conduction performance, and can quickly dissipate the heat in the heat dissipation chamber 190 .

In order to make the heat of the heat conduction plate 410 more concentrated and discharged in a more orderly manner, as shown in Figure 3 and Figure 4, the heat conduction plate 410 has a heat conduction cavity 419 inside, and the heat conduction cavity 419 communicates with the channel 430, and the heat conduction cavity 419 can make the heat can be quickly concentrated from the heat conduction plate 410 to the heat conduction cavity 419, and the concentrated hot air is discharged to the outside of the vent 121 through the heat conduction cavity 419 through the channel 430. For example, the heat conduction cavity 419 is arranged on the heat conduction plate 410 The middle part, so that hot air can be more evenly concentrated in the heat conduction chamber 419, for example, the heat conduction chamber 419 is circular in shape, which is more conducive to the concentration of heat, and a plurality of channels 430 are radially around the circumference of the heat conduction chamber 419 Distributed, so that hot air can be discharged from multiple directions, so as to avoid the blockage of hot air, resulting in untimely discharge.

For example, if the vent 121 is set as a square, then the channel 430 is set as a square matching the vent 121; for another example, if the vent 121 is set as a circle, then the channel 430 is set as a circle matching the vent 121 .

In one embodiment, the heat conduction plate 410 has a first surface and a second surface, the first surface abuts against the installation surface 110, and the heat sink 420 is connected to the second surface, so that heat conduction The plate 410 can quickly transfer the heat of the lamp body 300 on the installation surface 110 to the heat sink 420, so that the heat can be discharged quickly.

Specifically, the substrate 310 is fixedly connected to the installation surface 110 by screws.

In order to further enhance the heat dissipation effect and quickly dissipate the heat of the lamp body 300, a silica gel layer is provided between the substrate 310 and the installation surface 110. The heat emitted by the beads 320 is transferred to the installation surface 110 through the silica gel layer, and then the heat is absorbed by the heat conducting plate 410 to dissipate the heat. The thickness of the silica gel layer is set at 1.2 mm to 1.8 mm. The heat transfer efficiency is reduced, and the thickness of the silica gel layer is too thin to fully fill the gap between the substrate 310 and the installation surface 110 , which also leads to low heat transfer efficiency. Preferably, the thickness of the silica gel layer is 1.5 mm. In this way, heat can be transferred rapidly, and the heat transfer efficiency will not be lowered due to too thick silica gel layer.

In order to further improve the heat exchange efficiency between the heat conduction plate 410 and the heat dissipation fin 420, and improve the heat dissipation efficiency, the heat dissipation fin 420 is inserted into the heat conduction plate 410, so that the heat dissipation fin 420 can fully contact the heat conduction plate 410 and absorb The heat of the heat conduction plate 410, the heat sink 420 absorbs the heat of the heat conduction plate 410 and dissipates the heat, so that the heat of the lamp body 300 can be quickly discharged. For example, the heat sink 420 is inserted in the heat conduction plate 410 The ratio of the heat sink 420 to the portion outside the heat conduction plate 410 is 1:2, that is, the ratio of the heat receiving area of the heat sink 420 to the heat dissipation area is 1:2, which can make the heat dissipation efficiency higher, and at the same time ensure that the heat conduction plate 410 The heat exchange efficiency with the heat sink 420.

Specifically, the heat sink 420 is vertically inserted into the heat conduction plate 410, and the heat sink 420 is arranged in parallel. In order to increase the contact area between the heat sink 420 and the heat conduction plate 410 and improve heat exchange efficiency, The heat sink 420 is obliquely inserted into the heat conduction plate 410, for example, the inclination angle between the heat sink 420 and the heat conduction plate 410 is 20°-60°, preferably, the heat sink 420 and the heat conduction plate 410 The inclination angle between the heat conducting plates 410 is 40°.

In one embodiment, as shown in FIG. 3, the channel 430 is arranged horizontally. For example, the channel 430 is arranged horizontally around the heat conduction cavity 419, so that hot air can be quickly discharged through the channel 430, and the airflow velocity is faster, which improves Heat exchange efficiency; another example, in order to increase the contact area between the heat conducting plate 410 and the air, so that the heat exchange is more comprehensive, as shown in Figure 5, the channel 430 has a bent portion 431, for example, the channel 430 is in the horizontal direction There is a bending part 431, or, the channel 430 has a bending part 431 in the vertical direction, and the bending part 431 of the channel 430 makes the channel 430 bend in the horizontal direction and the vertical direction, and has a bending part 431 The channel 430 increases the length of the channel 430, increases the contact area between the inside of the heat conducting plate 410 and the air, increases the total amount of heat exchange, and makes the heat dissipation effect better.

Specifically, the bent portion 431 of the channel 430 can increase the contact area between the heat conduction plate 410 and the air, but the bent portion 431 reduces the air circulation speed, so that the heat dissipation effect is not significantly improved. In order to further enhance the air circulation speed, please again Referring to FIG. 5 , the channel 430 has an arc-shaped bent portion 431 , the arc-shaped bent portion 431 makes the air circulation smoother, speeds up the air circulation speed, and increases the contact area between the heat conduction plate 410 and the air. , which also increases the air circulation speed and further improves the heat exchange efficiency; The area of the heat conduction plate 410 increases the contact area with the air, further enhancing the heat exchange effect between the heat conduction plate 410 and the air. In order to speed up the air circulation, as another example, a micro fan is arranged inside the channel 430 .

As shown in FIG. 3 and FIG. 5 , the heat conduction plate 410 includes a first heat conduction layer 411 , a second heat conduction layer 412 and a third heat conduction layer 413 sequentially connected, and the first heat conduction layer 411 abuts against the installation surface. 110, the heat sink 420 is connected to the third heat conduction layer 413, the first heat conduction layer 411 is connected to the mounting surface 110, the third heat conduction layer 413 is connected to the heat sink 420, for example, the first heat conduction layer 411 , The second heat conduction layer 412 and the third heat conduction layer 413 are connected by integral forging, for example, the first heat conduction layer 411 , the second heat conduction layer 412 and the third heat conduction layer 413 are connected by welding.

For example, the first heat conducting layer 411 includes the following components in parts by mass:

85-90 parts of copper, 3-3.5 parts of aluminum, 2-2.5 parts of magnesium, 0.5-0.8 parts of nickel, 0.3-0.5 parts of iron, 2.5-4.5 parts of vanadium, 0.2-0.4 parts of manganese, titanium 0.6-0.8 parts, 0.7-0.8 parts of chromium, 0.6-0.8 parts of vanadium, 1.2-15 parts of silicon, and 0.5-2 parts of graphene.

Firstly, the above-mentioned first heat conducting layer 411 contains 85-90 parts of copper (Cu), so that the first heat conducting layer 411 has better heat absorption energy. When the mass part of copper is 85 to 90 parts, the thermal conductivity of the first heat conducting layer 411 can reach more than 355W/mK, which can quickly absorb the heat generated by the LED lamp 10, and then evenly disperse the heat in the first heat conducting layer 411. The overall structure of the heat conduction layer 411 is to prevent heat from accumulating at the contact position between the lamp body 300 and the first heat conduction layer 411 , causing local overheating. Moreover, the density of the first heat conduction layer 411 is lower than that of pure copper, which can effectively reduce the weight of the first heat conduction layer 411 , which is more convenient for installation and manufacture, and also greatly reduces the cost. Among them, the definition of thermal conductivity is: per unit length, per K, how many W of energy can be transmitted, the unit is W/mK, where "W" refers to the thermal power unit, "m" represents the length unit meter, and "K" is The absolute temperature unit, the larger the value, the better the heat absorption performance. In addition, by adding 0.5-2 parts of graphene, the thermal conductivity thereof can be effectively improved, thereby improving the heat absorption performance of the first heat-conducting layer 411 .

Secondly, the first heat conduction layer 411 contains 3-3.5 parts by mass of aluminum, 2-2.5 parts of magnesium, 0.5-0.8 parts of nickel, 0.3-0.5 parts of iron, 2.5-4.5 parts of Vanadium, 0.2-0.4 parts of manganese, 0.6-0.8 parts of titanium, 0.7-0.8 parts of chromium and 0.6-0.8 parts of vanadium. Compared with the pure copper material, the ductility, toughness, strength and high temperature resistance of the first heat conduction layer 411 are greatly improved, and it is not easy to sinter; in this way, the high temperature generated by the LED lamp 10 can prevent the first heat conduction layer 411 from being damaged. , and having better ductility, toughness and strength can also prevent the first heat conducting layer 411 from being deformed due to excessive stress when the lamp body 300 is installed. Wherein, the first heat conduction layer 411 contains nickel (Ni) in an amount of 0.5-0.8 parts by mass, which can improve the high temperature resistance of the first heat conduction layer 411 . As another example, the first heat conduction layer 411 contains 1.5-4.5 parts by mass of vanadium (V), which can inhibit the grain growth of the first heat conduction layer 411 and obtain a relatively uniform and fine grain structure, so as to reduce the size of the first heat conduction layer. The brittleness of 411 improves the overall mechanical properties of the first heat conducting layer 411 to increase toughness and strength. As another example, the first heat conduction layer 411 contains 0.6-0.8 parts by mass of titanium (Ti), which can make the crystal grains of the first heat conduction layer 411 finer, so as to improve the ductility of the first heat conduction layer 411 .

Finally, the first heat conducting layer 411 also includes 1.2-15 parts by mass of silicon (Si). When the first heat conducting layer 411 contains an appropriate amount of silicon, it can , effectively improving the hardness and wear resistance of the first heat conducting layer 411 . However, after many times of theoretical analysis and experimental evidence, it is found that when the mass of silicon in the first heat conduction layer 411 is too much, for example, when the mass percentage exceeds 15 parts, black particles will be distributed on the surface of the first heat conduction layer 411, and the ductility decrease, which is not conducive to the production and molding of the first heat conducting layer 411 .

For example, the heat conduction plate 410 is provided with a plurality of hollow cells, for example, the first heat conduction layer 411 is provided with a plurality of hollow cells, and the hollow cells are equipped with a cooling liquid, for example, the cooling liquid is water, and the water has relatively Large specific heat capacity is a natural and good heat-conducting substance, which can improve the heat dissipation efficiency of the heat-conducting plate 410. For another example, the cooling liquid is ethanol, which has good heat-absorbing performance, so that the heat-conducting plate 410 can quickly absorb heat, and the lamp body 300 heat exports.

For example, the second heat conducting layer 412 includes the following components in parts by mass:

70-75 parts of copper, 25-35 parts of aluminum, 0.6-0.9 parts of magnesium, 0.1-0.4 parts of manganese, 0.1-0.4 parts of titanium, 0.1-0.2 parts of chromium, 0.1-0.2 parts of vanadium, silicon 0.5-0.7 parts and 0.2-0.3 parts of graphene.

First, the second heat conduction layer 412 contains 70-75 parts by mass of copper and 25-35 parts by mass of aluminum, so that the thermal conductivity of the second heat conduction layer 412 can be maintained at 310W/mK-340W/mK to ensure The second heat conduction layer 412 can quickly transfer the heat generated by the LED lamp 10 absorbed by the first heat conduction layer 411 to the third heat conduction layer 413 , thereby preventing heat from accumulating on the second heat conduction layer 412 and causing local overheating. Compared with the prior art, simply using expensive and high-quality copper, the above-mentioned second heat-conducting layer 412 can not only ensure that the heat of the heat-absorbing layer is transferred to the third heat-conducting layer 413 quickly, but also has the advantages of light weight and convenient Advantages of installation casting and lower price. At the same time, compared with the prior art, simply using aluminum alloy with poor heat dissipation effect, the above-mentioned second heat conduction layer 412 has better heat transfer performance.

Secondly, by adding 0.2-0.3 parts of graphene, the thermal conductivity of the second heat conducting layer 412 can be greatly improved, and the heat transferred from the first heat conducting layer 411 can be better transferred to the third heat conducting layer 413 .

Finally, the second heat conducting layer 412 contains 0.6-0.9 parts by mass of magnesium, 0.1-0.4 parts of manganese, 0.1-0.4 parts of titanium, 0.1-0.2 parts of chromium, and 0.1-0.2 parts of vanadium and 0.5-0.7 parts of silicon, so as to improve the mechanical properties and high temperature resistance properties of the second heat conducting layer 412, for example, the mechanical properties include but not limited to yield strength and tensile strength. For example, the second heat conduction layer 412 contains 0.6-0.9 parts by mass of magnesium, which can give the second heat conduction layer 412 yield strength and tensile strength to a certain extent, because in the manufacturing process, the second heat conduction layer 412 needs to be The overall stamping is integrally formed, which requires the second heat conduction layer 412 to have a strong yield strength to prevent the second heat conduction layer 412 from being irreversibly deformed by excessive stamping stress during processing, thereby ensuring the normal heat dissipation performance of the heat sink, for example The passage 430 is arranged through the second heat conduction layer 412, so that when the second heat conduction layer 412 is drilling the passage 430, the stronger yield strength and tensile strength make the second heat conduction layer 412 less prone to irregular deformation and fracture , making the processing cost under control. When the relative mass of magnesium is too low, such as when the mass part is less than 0.8 parts, the yield strength of the second heat conducting layer 412 cannot be fully guaranteed to meet the requirements; however, when the relative mass of magnesium is too high, such as when the mass part is greater than 1.2 parts , and the ductility and thermal conductivity of the second heat-conducting layer 412 will drop sharply. For example, the second heat-conducting layer 412 contains 0.2-0.8 parts by mass of iron, which can endow the second heat-conducting layer 412 with higher high-temperature resistance and high-temperature-resistant mechanical properties, which is beneficial to the processing and casting of the second heat-conducting layer 412 .

For example, the third heat conducting layer 413 includes the following components in parts by mass:

90-96 parts of aluminum, 8.5-10.5 parts of silicon, 0.5-0.7 parts of magnesium, 1.0-1.5 parts of copper, 0.4-0.7 parts of iron, 0.3-0.6 parts of manganese, 0.1-0.2 parts of titanium, chromium 0.1-0.2 parts, 0.1-0.2 parts of vanadium and 12-15 parts of graphene.

Firstly, the above-mentioned third heat conduction layer 413 contains 90-96 parts by mass of aluminum, which can keep the thermal conductivity of the third heat conduction layer 413 at 230W/mK-250W/mK. When the heat generated by the LED lamp 10 passes through the first After the heat conduction layer 411 and the second heat conduction layer 412 partially dissipate heat, when the remaining heat is transferred to the third heat conduction layer 413, the third heat conduction layer 413 can ensure that the remaining heat is evenly transferred to the heat sink 420, thereby preventing the heat from being transferred to the heat sink 420. Accumulation on the third heat conducting layer 413 causes local overheating.

Secondly, by adding 12 parts to 15 parts of graphene, the heat dissipation performance of the third heat conducting layer 413 can be effectively improved, and the heat transferred from the second heat conducting layer 412 can be quickly transferred to the heat sink 420 superior.

Finally, the third heat conducting layer 413 contains 8.5-10.5 parts by mass of silicon, 0.5-0.7 parts of magnesium, 1.0-1.5 parts of copper, 0.4-0.7 parts of iron, and 0.3-0.6 parts of manganese , 0.1-0.2 parts of titanium, 0.1-0.2 parts of chromium and 0.1-0.2 parts of vanadium can greatly improve the heat dissipation performance of the third heat-conducting layer 413 . For example, the third heat conduction layer 413 contains 8.5-10.5 parts by mass of silicon and 1.0-1.5 parts by mass of copper, which can ensure that the third heat conduction layer 413 has the advantages of good mechanical properties and light weight. Improve the heat conduction performance of the third heat conduction layer 413, and further ensure that the third heat conduction layer 413 can evenly and continuously dissipate the remaining heat transferred through the heat absorbing layer and the heat conduction layer, thereby preventing heat from accumulating on the third heat conduction layer 413, causing Local overheating phenomenon.

In order to further improve the tensile strength of the third heat conduction layer 413, for example, the third heat conduction layer 413 further includes 1.0 to 1.1 parts by mass of lead (Pb), when the third heat conduction layer 413 contains 1.0 to 1.1 parts by mass. 1.1 parts of lead can improve the tensile strength of the third heat conduction layer 413, like this, can prevent when the third heat conduction layer 413 is cast and stamped into cooling fins, i.e. a sheet structure, due to being subjected to excessive punching and pulling stress. fracture.

In order to further improve the high-temperature oxidation resistance of the third heat-conducting layer 413, for example, the third heat-conducting layer 413 further includes niobium (Nb) in a mass part of 0.05-0.08 parts, when the mass part of niobium is greater than 0.05 parts , can greatly improve the anti-oxidation performance of the third heat conduction layer 413. It can be understood that the third heat conduction layer 413 has higher requirements on high temperature oxidation resistance. However, when the mass fraction of niobium is greater than 0.08, the magnetic properties of the third heat conducting layer 413 will increase sharply, which will affect other components in the LED lamp 10 .

In order to further improve the heat dissipation performance of the third heat conduction layer 413, for example, the third heat conduction layer 413 further includes germanium (Ge) with a mass part of 0.05-0.2 parts. When the mass part of germanium is greater than 0.05 parts, it will The improvement of the heat dissipation performance of the third heat conduction layer 413 has a better effect, however, when the mass proportion of germanium is too much, for example, when the mass part of germanium is greater than 0.2 parts by mass, the brittleness of the third heat conduction layer 413 will increase.

In order to further improve heat dissipation efficiency, the surface of the substrate 310 has a heat dissipation layer. The heat dissipation layer on the surface of the substrate 310 is conducive to dissipating the heat emitted by the LED lamp beads 320 from other directions, which is conducive to improving the heat dissipation efficiency and avoiding heat accumulation.

For example, the heat dissipation layer includes the following components in parts by mass:

65-75 parts of copper, 30-35 parts of aluminum, 10.5-11.5 parts of silicon, 0.5-0.7 parts of magnesium, 1.0-1.5 parts of copper, 0.4-0.7 parts of iron, 0.3-0.6 parts of manganese, titanium 0.1-0.2 parts, 0.1-0.2 parts of chromium, 0.2-0.3 parts of vanadium, and 10-12 parts of graphene.

The above-mentioned heat dissipation layer contains 65-75 parts by mass of aluminum, which can keep the thermal conductivity of the heat dissipation layer at 300W/mK-320W/mK, so that the heat emitted by the LED lamp bead 320 can be dissipated through the heat dissipation layer, so that the heat can be simultaneously The heat conduction plate 410 and the heat dissipation layer of the base plate 310 are transferred to avoid excessive one-way transfer of heat, thereby reducing heat transfer efficiency. The heat dissipation efficiency can be further improved through the bidirectional heat dissipation of the heat conduction plate 410 and the heat dissipation layer of the substrate 310 .

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (3)

1. a kind of heat-transfer device, which is characterized in that including：

Pedestal, the pedestal include integrally formed mounting surface, supporting walls and bottom plate, the supporting walls respectively with the installation Face, bottom plate connection, form a heat dissipation cavity, the supporting walls offer several ventilation openings；And

The heat-conducting plate and cooling fin being arranged in heat dissipation cavity, the heat-conducting plate are connected to the mounting surface, and the heat-conducting plate has If dry passage, each passage aligns respectively with a ventilation opening of the supporting walls, and the cooling fin is connected to described Heat-conducting plate, the heat-conducting plate are provided with multiple Rubus Tosaefulins, coolant are equiped in the Rubus Tosaefulins；

The passage is horizontally disposed with, and the passage has bending part, and the passage has arc-shaped bending part.

2. heat-transfer device according to claim 1, which is characterized in that there is thermal conductive cavity inside the heat-conducting plate, it is described to lead Hot chamber is connected with the passage.

3. heat-transfer device according to claim 1, which is characterized in that the heat-conducting plate has first surface and the second table Face, the first surface are connected to the mounting surface, and the cooling fin is connected to the second surface.