CN104896350B - Illuminating device - Google Patents
Illuminating device Download PDFInfo
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- CN104896350B CN104896350B CN201510320951.1A CN201510320951A CN104896350B CN 104896350 B CN104896350 B CN 104896350B CN 201510320951 A CN201510320951 A CN 201510320951A CN 104896350 B CN104896350 B CN 104896350B
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Abstract
The present invention relates to a kind of illuminating device, including：Lamp holder, enclosing cover, lampshade, heat-dissipating cylinder and some LEDs.Lamp holder has two contact pins.Lampshade is columnar structured, and the two ends of lampshade are connected with lamp holder and enclosing cover respectively, and lampshade offers some air vents being in communication with the outside, and some air vents are uniformly distributed in lampshade.Heat-dissipating cylinder is hollow-core construction, and the two ends of heat-dissipating cylinder are connected with lamp holder and enclosing cover respectively, and heat-dissipating cylinder is placed in lampshade.Some LEDs are arranged at heat-dissipating cylinder.Above-mentioned illuminating device by some LEDs by being arranged at heat-dissipating cylinder, and heat-dissipating cylinder can effectively improve cooling surface area, so as to be greatly enhanced illuminating device heat dispersion.
Description
Technical field
The present invention relates to lighting technical field, more particularly to a kind of illuminating device.
Background technology
LED (Light Emitting Diode, light emitting diode) can directly and efficiently convert electrical energy into visible ray, and
And possess service life up to tens thousand of hours~100,000 hour.LED is used to be referred to as LED lamp for the light fixture of light source, it is with matter
It is excellent, durable, energy-conservation the advantages of and be referred to as the most frequently used illuminator.As LED lamp technology is developed rapidly in recent years, LED
Tool product replaces original fluorescent lighting fixture substantially.
LED basic structure is P-N knots of a semiconductor, when electric current flows through LED element, and the temperature of P-N knots will
Rise, and the temperature in P-N interfaces is referred to as LED junction temperature, is typically due to the size that element chip is respectively provided with very little, therefore, also
The temperature of LED chip is referred to as the junction temperature of LED chip.
At present, the drawback that LED illumination device itself is present is that LED illumination device light efficiency is tied by LED illumination device
The influence of temperature is larger, and higher junction temperature of chip will cause light efficiency to be decreased obviously, and influence whether the use of LED illumination device
Life-span.Because LED is when luminous, the temperature of its own can be raised constantly, in lasting illumination work, if LED is produced
Raw heat can not be exhaled in time, it will cause the damage of LED, influence the service life of LED.Therefore, LED is solved
The heat dissipation problem of lamp is most important for the performance for lifting LED.
However, still there is the problem of heat dispersion is poor in existing LED illumination device, in particular by relatively high power
When LED is as light source, its heating problem is obvious all the more.
The content of the invention
It is necessary to provide the utilization rate of a kind of good heat dispersion performance and light higher illuminating device.
A kind of illuminating device, including：
Lamp holder, the lamp holder has two contact pins；
Enclosing cover,
Lampshade, the lampshade is columnar structured, and the two ends of the lampshade are connected with the lamp holder and the enclosing cover respectively,
The lampshade offers some air vents being in communication with the outside, and some air vents are uniformly distributed in the lampshade；
Heat-dissipating cylinder, the heat-dissipating cylinder is hollow-core construction, the two ends of the heat-dissipating cylinder respectively with the lamp holder and the enclosing cover
Connect, and the heat-dissipating cylinder is placed in the lampshade；
Some LEDs, some LEDs are arranged at the heat-dissipating cylinder.
In one of the embodiments, the air vent is circular port.
In one of the embodiments, a diameter of 5mm~10mm of the air vent.
In one of the embodiments, a diameter of 6mm~8mm of the air vent.
In one of the embodiments, a diameter of 7.5mm of the air vent.
In one of the embodiments, some air vents are distributed in the lampshade in annular concentric.
In one of the embodiments, between two adjacent LEDs at intervals of 2mm~5mm.
In one of the embodiments, between two adjacent LEDs at intervals of 3mm~4mm.
In one of the embodiments, between two adjacent LEDs at intervals of 3.5mm.
Above-mentioned illuminating device by some LEDs by being arranged at heat-dissipating cylinder, and heat-dissipating cylinder can effectively improve heat-delivery surface
Product, so as to be greatly enhanced illuminating device heat dispersion.
Brief description of the drawings
Fig. 1 is the structural representation of the illuminating device of an embodiment of the present invention；
Fig. 2 is the cut-away view of the illuminating device shown in Fig. 1；
Fig. 3 is the fragmentary sectional view of the illuminating device shown in Fig. 1；
Fig. 4 is the structural representation of the illuminating device of another embodiment of the invention；
Fig. 5 is the structural representation of the illuminating device of another embodiment of the invention；
Fig. 6 is the structural representation of the illuminating device of another embodiment of the invention；
Fig. 7 is the structural representation of the illuminating device of another embodiment of the invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the better embodiment of the present invention.But, the present invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make to understand more the disclosure
Plus it is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " including one or more
The arbitrary and all combination of related Listed Items.
Fig. 1 and Fig. 2 is referred to, illuminating device 10 includes：Lamp holder 100, enclosing cover 200, lampshade 300, heat-dissipating cylinder 400 and some
LED 500, lamp holder 100, enclosing cover 200 are arranged at the two ends of lampshade 300, and heat-dissipating cylinder 400 and some LEDs 500 are placed in lamp
In cover 300.
Referring to Fig. 1, the two ends of lampshade 300 are connected with lamp holder 100 and enclosing cover 200 respectively.Also referring to Fig. 4, lampshade
300 be columnar structured, for example, the lamp holder is used for lamp socket mounted externally；And for example, the lamp holder is provided with contact pin,
The contact pin is used to electrically connect with outside lamp socket, to provide power supply to the normal work of the LED.
Referring to Fig. 4, heat-dissipating cylinder 400 is hollow-core construction, the two ends of heat-dissipating cylinder 400 are connected with lamp holder 100 and enclosing cover respectively
200, and heat-dissipating cylinder 400 is placed in lampshade 300.For example, the heat-dissipating cylinder is hollow cylindrical structure.
Referring to Fig. 4, some LEDs 500 are arranged at the outer surface of heat-dissipating cylinder 400, heat-dissipating cylinder 400 is used for LED 500
The heat produced that lighted during work carries out thermolysis.
In order to further improve the heat dispersion of the illuminating device, for example, referring to Fig. 3, lampshade 300 offer it is some
The air vent 310 being in communication with the outside, some air vents 310 are uniformly distributed in lampshade 300；And for example, some air vents
The lampshade is distributed in annular concentric.For example, the air vent is rectangular opening or parallelogram hole.And for example, it is described logical
Air holes is circular port；And for example, a diameter of 5mm~10mm of the air vent；And for example, a diameter of 6mm of the air vent~
8mm；And for example, a diameter of 7.5mm of the air vent；And for example, some air vent circular arrays are distributed in the lampshade,
In this way, the cooler air outside relatively warm air and the lampshade in the lampshade can carry out heat exchange by the air vent,
So as to further improve the heat dispersion of the illuminating device.
In order to further improve the brightness of the illuminating device and the uniformity of illuminating effect, if for example, referring to Fig. 4,
The interval that the dry circular array of LED 500 is arranged between heat-dissipating cylinder 400, two adjacent circle LEDs 500 is equal；And for example, phase
Between the two adjacent circle LEDs at intervals of 2mm~5mm；And for example, between the adjacent two circle LEDs at intervals of 3mm
~4mm；And for example, between the adjacent two circle LEDs at intervals of 3.5mm；And for example, the LED is LED spotlight；And for example,
Between two adjacent LEDs at intervals of 2mm~5mm；And for example, between two adjacent LEDs at intervals of
3mm~4mm；And for example, between two adjacent LEDs at intervals of 3.5mm, in this way, the photograph can be improved further
The brightness of funerary objects part and the uniformity of illuminating effect.
In order to further improve the heat dispersion of the illuminating device, for example, referring to Fig. 5, the madial wall of heat-dissipating cylinder 400
Some thermal columns 410 are set to inner side protrusion, some thermal columns 410 radially distribute in the madial wall of heat-dissipating cylinder 400；Example
Such as, as shown in figure 5, thermal column 410 is coarser than its end away from heat-dissipating cylinder 400 close to the end of heat-dissipating cylinder 400；And for example, it is described
Thermal column is hollow-core construction；And for example, the thermal column is cylindrical structure；And for example, some thermal columns are away from the LED
One end of lamp is connected with each other；And for example, some through holes are offered on the thermal column；And for example, a diameter of 1mm of the through hole~
1.5mm, in this way, the thermal column can increase cooling surface area, so as to further improve the radiating of the illuminating device
Performance.
In order to further improve the heat dispersion of the illuminating device, for example, referring to Fig. 6, heat-dissipating cylinder 400 is positioned at adjacent
Two LEDs 500 between position at offer heat emission hole 420；And for example, the heat emission hole is circular configuration；And for example, it is described
A diameter of 3mm~6mm of heat emission hole；And for example, a diameter of 4mm~5mm of the heat emission hole；And for example, the diameter of the heat emission hole
For 4.5mm；And for example, the hole wall of the heat emission hole is additionally provided with radiating wire, in this way, relatively warm air in the heat-dissipating cylinder and described dissipating
Cooler air outside hot cylinder can carry out heat exchange by the heat emission hole, so as to further improve the illuminating device
Heat dispersion.
For the utilization rate of the light that further improves the LED, for example, referring to Fig. 7, also include reflecting layer 600,
Reflecting layer 600 fits in the lateral wall of heat-dissipating cylinder 400, and some LEDs 500 are arranged at one of reflecting layer 600 away from heat-dissipating cylinder 400
Sideways；And for example, the material in the reflecting layer is polyethylene terephthalate；And for example, the material in the reflecting layer is ethene
Vinylacetate；And for example, the material in the reflecting layer is PLA；And for example, the thickness in the reflecting layer is 6mm~10mm；Again
Such as, the thickness in the reflecting layer is 8mm~9mm, in this way, can be to the light sent of the LED by the reflecting layer
Reflected and/or reflected, so as to the utilization rate for the light for further improving the LED.In addition, the reflecting layer
Mechanical performance is also preferable, e.g., and resistant to bending and cutting resistance is preferable.
Above-mentioned illuminating device 10 by some LEDs 500 by being arranged at heat-dissipating cylinder 400, and heat-dissipating cylinder 400 can be carried effectively
High cooling surface area, so as to be greatly enhanced the heat dispersion of illuminating device 10.
In order to further improve the heat dispersion of the illuminating device, for example, the heat-dissipating cylinder is prepared using radiating alloy
Obtain, the radiating alloy includes the heat-sink shell, heat-conducting layer and heat dissipating layer for being sequentially overlapped setting；And for example, the heat-sink shell, described
Heat-conducting layer it is identical with the material of the heat dissipating layer or it is different set；And for example, the LED is arranged at the heat-sink shell；And for example,
The heat-conductive characteristic of the heat-sink shell, the heat-conducting layer and the heat dissipating layer successively decreases successively, forms heat-conductive characteristic gradient, from
And the heat dissipation path of the radiating alloy is further optimized, the heat dispersion of heat-dissipating cylinder is drastically increased, and then improve
The heat dispersion of the illuminating device, so, it is possible to meet the radiating requirements of the big illuminating device of caloric value.
For example, the illuminating device of an embodiment of the present invention, wherein, the heat-sink shell of the radiating alloy, it includes
The each component of following mass parts：
90 parts~92 parts of copper, 2 parts~4.5 parts of aluminium, 1 part~2.5 parts of magnesium, 0.5 part~0.8 part of nickel, 0.1 part~0.3 part of iron,
1.5 parts~4.5 parts of vanadium, 0.1 part~0.4 part of manganese, 0.5 part~0.8 part of titanium, 0.5 part~0.8 part of chromium, 0.5 part~0.8 part of vanadium, silicon
0.8 part~15 parts and 0.5 part~2 parts graphenes.
First, the copper (Cu) that above-mentioned heat-sink shell contains 90 parts~92 parts can make heat-sink shell have preferably heat absorption energy.
When copper mass parts be 90 parts~92 parts when, the coefficient of heat conduction of heat-sink shell can reach more than 365W/mK, can rapidly by
The heat that LED is produced is siphoned away, and then is dispersed in making even heat in the overall structure of heat-sink shell, to prevent heat in LED
Accumulated on contact position between lamp and heat-sink shell, cause the generation of hot-spot phenomenon.Moreover, the density of heat-sink shell is less than pure
The density of copper, so can effectively mitigate the weight of heat-sink shell, manufacture more conducively be installed, while also greatly reducing into
This.Wherein, the definition of the coefficient of heat conduction is：Per unit length, every K, can transmit how many W energy, unit is W/mK, its
In " W " refer to thermal power unit, " m " represent long measure rice, and " K " be absolute temperature units, the bigger explanation heat absorptivity of the numerical value
Can be better.In addition, by adding 0.5 part~2 parts of graphene, its coefficient of heat conduction can be effectively improved, and then improve institute
State the heat absorption capacity of heat-sink shell.
Secondly, heat-sink shell contain mass parts be 2 parts~4.5 parts aluminium, 1 part~2.5 parts of magnesium, 0.5 part~0.8 part of nickel,
0.1 part~0.3 part of iron, 1.5 parts~4.5 parts of vanadium, 0.1 part~0.4 part of manganese, 0.5 part~0.8 part of titanium, 0.5 part~
0.8 part of chromium and 0.5 part~0.8 part of vanadium vanadium.Relative to fine copper material, the ductility of heat-sink shell, toughness, intensity with
And resistance to elevated temperatures is improved significantly, and not easy-sintering；So, when LED is installed on heat-sink shell, so that it may to prevent
The high temperature that only LED is produced causes to damage to heat-sink shell, also, can also with preferable ductility, toughness and intensity
Prevent heat-sink shell from being caused deformation by excessive stresses when installing the LED.Wherein, it is 0.5 that heat-sink shell, which contains mass parts,
Part~0.8 part of nickel (Ni), the resistance to elevated temperatures of heat-sink shell can be improved.And for example, heat-sink shell contain mass parts for 1.5 parts~
4.5 parts of vanadium (V) can suppress heat-sink shell crystal grain and grow up, and more uniform tiny grain structure be obtained, to reduce the crisp of heat-sink shell
Property, improve the overall mechanical property of heat-sink shell, to improve toughness and intensity.And for example, heat-sink shell contain mass parts for 0.5 part~
0.8 part of titanium (Ti), can cause the crystal grain miniaturization of heat-sink shell, to improve the ductility of heat-sink shell.
Finally, heat-sink shell also includes the silicon (Si) that mass parts are 0.8 part~15 parts, when heat-sink shell contains appropriate silicon,
On the premise of heat-sink shell heat absorption capacity is not influenceed, the hardness and abrasion resistance of heat-sink shell can be effectively lifted.But, through repeatedly reason
Find, when the quality of silicon in heat-sink shell is too many, such as when mass percent is more than more than 15 parts, can make by analysis and experiment evidence
The appearance distribution black particles of heat-sink shell, and ductility reduction, are unfavorable for the production shaping of heat-sink shell.
For example, the lighting apparatus of an embodiment of the present invention, wherein, the heat-sink shell of the radiating alloy, it includes
The each component of following mass parts：
91 parts~91.5 parts of copper, 3 parts~4.5 parts of aluminium, 2 parts~2.5 parts of magnesium, 0.5 part~0.8 part of nickel, iron 0.1 part~0.3
Part, 1.5 parts~4.5 parts of vanadium, 0.1 part~0.4 part of manganese, 0.5 part~0.8 part of titanium, 0.5 part~0.8 part of chromium, vanadium 0.5 part~0.8
Part, 0.8 part~15 parts and 1.5 parts~2 parts graphenes of silicon.
For example, the lighting apparatus of an embodiment of the present invention, wherein, the heat-sink shell of the radiating alloy, it includes
The each component of following mass parts：
91 parts~91.5 parts of copper, 3 parts~4.5 parts of aluminium, 2 parts~2.5 parts of magnesium, 0.5 part~0.7 part of nickel, iron 0.1 part~0.2
Part, 3.5 parts~4.5 parts of vanadium, 0.1 part~0.3 part of manganese, 0.5 part~0.6 part of titanium, 0.5 part~0.6 part of chromium, vanadium 0.5 part~0.6
Part, 10 parts~15 parts and 1.5 parts~2 parts graphenes of silicon.
For example, the lighting apparatus of an embodiment of the present invention, wherein, the heat-sink shell of the radiating alloy, it includes
The each component of following mass parts：
91.5 parts of copper, 4.5 parts of aluminium, 2 parts of magnesium, 0.6 part of nickel, 0.2 part of iron, 3.5 parts of vanadium, 0.3 part of manganese, 0.5 part of titanium, chromium 0.5
Part, 0.5 part of vanadium, 10 parts and 2 parts graphenes of silicon.
For example, the illuminating device of an embodiment of the present invention, wherein, the heat-conducting layer of the radiating alloy, it includes
The each component of following mass parts：
60 parts~65 parts of copper, 55 parts~60 parts of aluminium, 0.8 part~1.2 parts of magnesium, 0.2 part~0.5 part of manganese, titanium 0.05 part~0.3
Part, 0.05 part~0.1 part of chromium, 0.05 part~0.3 part of vanadium, 0.3 part~0.5 part and 0.1 part~0.3 part graphene of silicon.
First, above-mentioned heat-conducting layer contains the copper and 55 parts~60 parts of aluminium that mass parts are 60 parts~65 parts, can cause
The coefficient of heat conduction of heat-conducting layer is maintained at 320W/mK~345W/mK, described in ensureing that heat-conducting layer will can absorb as heat-sink shell
The heat that LED is produced is quickly transmitted to heat dissipating layer, and then prevents heat from being accumulated on heat-conducting layer, causes hot-spot phenomenon
Produce.Relative to prior art, merely using price costly and the larger copper of quality, above-mentioned heat-conducting layer can both ensure soon
The heat transfer of heat-sink shell to heat dissipating layer, is had the advantages that lighter weight, to be easily installed casting, price less expensive by speed again.Together
When, relative to prior art, merely using the poor aluminium alloy of radiating effect, above-mentioned heat-conducting layer has more preferably conductivity of heat
Energy.
Secondly, by adding 0.1 part~0.3 part of graphene, the heat conductivility of the heat-conducting layer can be greatly enhanced,
Preferably by the heat transfer passed over from heat-sink shell to heat dissipating layer.
Finally, heat-conducting layer contains the magnesium, 0.2 part~0.5 part of manganese, 0.05 part~0.3 that mass parts are 0.8 part~1.2 parts
The titanium, 0.05 part~0.1 part of chromium, 0.05 part~0.3 part of vanadium and 0.3 part~0.5 part of silicon of part, so as to improve heat-conducting layer
Mechanical performance and resistance to elevated temperatures, e.g., mechanical performance includes but is not limited to yield strength, tensile strength.For example, heat-conducting layer
Containing the magnesium that mass parts are 0.8 part~1.2 parts, heat-conducting layer yield strength and tensile strength can be assigned to a certain extent, by
In radiating alloy in the fabrication process, it is necessary to the overall punching press of heat-sink shell, heat-conducting layer and heat dissipating layer is integrally formed, this is accomplished by
Heat dissipating layer has stronger yield strength, to prevent heat dissipating layer from producing irreversible shape by favourable opposition compression in process
Become, and then ensure the proper heat reduction performance of radiating alloy.When the relative mass of magnesium is too low, e.g., when mass parts are less than 0.8 part,
It can not substantially ensure that the yield strength of heat-conducting layer is met to require, however, when the relative mass of magnesium is too high, such as mass parts are more than
At 1.2 parts, the ductility and heat conductivility dramatic decrease of heat-conducting layer can be caused again.For example, it is 0.2 that heat-conducting layer, which contains mass parts,
Part~0.8 part of iron, the higher resistance to elevated temperatures of heat-conducting layer and high temperature resistant mechanical performance can be assigned, beneficial to the processing of heat-conducting layer
Casting.
For example, the illuminating device of an embodiment of the present invention, wherein, the heat dissipating layer of the radiating alloy, it includes
The each component of following mass parts：
88 parts~93 parts of aluminium, 5.5 parts~10.5 parts of silicon, 0.3 part~0.7 part of magnesium, 0.05 part~0.3 part of copper, 0.2 part of iron~
0.8 part, 0.2 part~0.5 part of manganese, 0.05 part~0.3 part of titanium, 0.05 part~0.1 part of chromium, 0.05 part~0.3 part of vanadium and 5 parts~15
Part graphene.
First, above-mentioned heat dissipating layer contains the aluminium that mass parts are 88 parts~93 parts, can cause the coefficient of heat conduction of heat dissipating layer
200W/mK~220W/mK is maintained at, it is remaining when the heat that LED is produced is after heat-sink shell and the radiating of heat conduction layer segment
When heat passes to heat dissipating layer by heat-conducting layer again, heat dissipating layer may insure to be dissipated these remaining heats by consistent
Walk, and then prevent heat from being accumulated on heat dissipating layer, cause hot-spot phenomenon.
Secondly, by adding 5 parts~15 parts of graphene, the heat dispersion of the heat dissipating layer can be effectively improved, is entered
And during the heat being transmitted to from the heat-conducting layer can be rapidly lost to the air dielectric in the external world.
Finally, heat dissipating layer contains the silicon, 0.3 part~0.7 part of magnesium, 0.05 part~0.3 that mass parts are 5.5 parts~10.5 parts
The copper, 0.2 part~0.8 part of iron, 0.2 part~0.5 part of manganese, 0.05 part~0.3 part of titanium, 0.05 part~0.1 part of chromium of part
And 0.05 part~0.3 part of vanadium, the heat dispersion of heat dissipating layer can be significantly improved.For example, heat dissipating layer contains mass parts is
5.5 parts~10.5 parts of silicon and 0.05 part~0.3 part of copper, it can be ensured that heat dissipating layer has good mechanical properties and lighter weight
Advantage, at the same time it can also further improve heat dissipating layer heat-conductive characteristic, further ensure that heat dissipating layer can be by via heat absorption
Scatter away after-heat consistent after layer and heat-conducting layer transmission, and then prevent heat from being accumulated on heat dissipating layer, cause office
Portion's superheating phenomenon.
In order to further improve the tensile strength of the heat dissipating layer, for example, it is 0.8 part that the heat dissipating layer, which also includes mass parts,
~1.2 parts of lead (Pb), so, can when the lead that heat dissipating layer contains 0.8 part~1.2 parts can improve the tensile strength of heat dissipating layer
When striking out radiating fin, i.e. laminated structure to prevent that heat dissipating layer ought be cast, due to being pullled stress by excessive punching press
And be broken.
In order to further improve the high temperature oxidation resistance of the heat dissipating layer, for example, the heat dissipating layer also includes mass parts
For 0.05 part~0.08 part of niobium (Nb), found through many experiments evidence and theory analysis, when the mass parts of niobium are more than 0.05 part
When, the antioxygenic property of heat dissipating layer can be greatly enhanced, it will be understood that heat dissipating layer as in LED street lamp radiator with the external world
The maximum part of air contact area, it requires higher to high temperature oxidation resistance.However, when the mass parts of niobium are more than 0.08 part
When, the magnetic of heat dissipating layer can be caused to sharply increase, influence can be produced on the miscellaneous part in illuminating device.
In order to further improve the heat dispersion of the heat dissipating layer, for example, heat dissipating layer also include mass parts be 0.05 part~
0.2 part of germanium (Ge), when the mass parts of germanium are more than 0.05 part, can play preferable effect to the raising of the heat dispersion of heat dissipating layer
Really, however, when the quality accounting of germanium is excessive, such as when the mass parts of germanium are more than 0.2 part, the brittleness of heat dissipating layer can be made again to be increased.
Above-mentioned radiating alloy sets the heat-sink shell, the heat-conducting layer and the heat dissipating layer by being sequentially overlapped, and described
The heat-conductive characteristic of heat-sink shell, the heat-conducting layer and the heat dissipating layer successively decreases successively, forms heat-conductive characteristic gradient, compared to
For fine copper material, on the premise of heat dispersion is ensured, weight is greatly lowered；The aluminium alloy largely existed compared in the market
For, heat dispersion is greatly enhanced.
It should be noted that the other embodiment of the present invention also includes, the technical characteristic in the various embodiments described above is mutually tied
Close what is formed, the illuminating device that can implement.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of illuminating device, it is characterised in that including：
Lamp holder, the lamp holder has two contact pins；
Enclosing cover,
Lampshade, the lampshade is columnar structured, and the two ends of the lampshade are connected with the lamp holder and the enclosing cover respectively, described
Lampshade offers some air vents being in communication with the outside, and some air vents are uniformly distributed in the lampshade；
Heat-dissipating cylinder, the heat-dissipating cylinder is hollow-core construction, and the two ends of the heat-dissipating cylinder are connected with the lamp holder and the enclosing cover respectively,
And the heat-dissipating cylinder is placed in the lampshade, wherein, the heat-dissipating cylinder is prepared using radiating alloy, the radiating alloy
Heat-sink shell, heat-conducting layer and heat dissipating layer including being sequentially overlapped setting；The heat-sink shell of the radiating alloy, it includes following matter
Measure each component of part：90 parts~92 parts of copper, 2 parts~4.5 parts of aluminium, 1 part~2.5 parts of magnesium, 0.5 part~0.8 part of nickel, 0.1 part of iron~
0.3 part, 1.5 parts~4.5 parts of vanadium, 0.1 part~0.4 part of manganese, 0.5 part~0.8 part of titanium, 0.5 part~0.8 part of chromium, 0.5 part of vanadium~
0.8 part, 0.8 part~15 parts and 0.5 part~2 parts graphenes of silicon；The heat-conducting layer of the radiating alloy, it includes following quality
The each component of part：60 parts~65 parts of copper, 55 parts~60 parts of aluminium, 0.8 part~1.2 parts of magnesium, 0.2 part~0.5 part of manganese, 0.05 part of titanium~
0.3 part, 0.05 part~0.1 part of chromium, 0.05 part~0.3 part of vanadium, 0.3 part~0.5 part and 0.1 part~0.3 part graphene of silicon；It is described
The heat dissipating layer of radiating alloy, it includes each component of following mass parts：88 parts~93 parts of aluminium, 5.5 parts~10.5 parts of silicon, magnesium
0.3 part~0.7 part, 0.05 part~0.3 part of copper, 0.2 part~0.8 part of iron, 0.2 part~0.5 part of manganese, 0.05 part~0.3 part of titanium, chromium
0.05 part~0.1 part, 0.05 part~0.3 part and 5 parts~15 parts graphenes of vanadium；
Some LEDs, some LEDs are arranged at the heat-dissipating cylinder.
2. illuminating device according to claim 1, it is characterised in that the air vent is circular port.
3. illuminating device according to claim 2, it is characterised in that a diameter of 5mm~10mm of the air vent.
4. illuminating device according to claim 3, it is characterised in that a diameter of 6mm~8mm of the air vent.
5. illuminating device according to claim 4, it is characterised in that a diameter of 7.5mm of the air vent.
6. illuminating device according to claim 5, it is characterised in that some air vents are distributed in institute in annular concentric
State lampshade.
7. illuminating device according to claim 1, it is characterised in that between two adjacent LEDs at intervals of
2mm~5mm.
8. illuminating device according to claim 7, it is characterised in that between two adjacent LEDs at intervals of
3mm~4mm.
9. illuminating device according to claim 8, it is characterised in that between two adjacent LEDs at intervals of
3.5mm。
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510320951.1A CN104896350B (en) | 2015-06-11 | 2015-06-11 | Illuminating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510320951.1A CN104896350B (en) | 2015-06-11 | 2015-06-11 | Illuminating device |
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| Publication Number | Publication Date |
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| CN104896350A CN104896350A (en) | 2015-09-09 |
| CN104896350B true CN104896350B (en) | 2017-09-01 |
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| CN202361128U (en) * | 2011-11-16 | 2012-08-01 | 沈李豪 | LED (light-emitting diode) tube capable of emitting light at full angle of 360 degrees |
| US20130155646A1 (en) * | 2011-12-15 | 2013-06-20 | Ningbo Baishi Electric Co., Ltd. | Led tubular lamp |
| CN202432303U (en) * | 2011-12-28 | 2012-09-12 | 鹤山市银雨照明有限公司 | Plastic shell type LED (Light-Emitting Diode) fluorescent lamp tube |
| SE536603C2 (en) * | 2012-03-15 | 2014-03-25 | Auralight Int Ab | LED tubes |
| CN103939769B (en) * | 2014-03-27 | 2016-01-20 | 西安精密印刷机械研究院有限公司 | Ultraviolet light polymerization lamp box |
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