CN104902732A - Heat dissipation apparatus - Google Patents
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- CN104902732A CN104902732A CN201510338857.9A CN201510338857A CN104902732A CN 104902732 A CN104902732 A CN 104902732A CN 201510338857 A CN201510338857 A CN 201510338857A CN 104902732 A CN104902732 A CN 104902732A
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Abstract
Provided is a heat dissipation apparatus, comprising a thermal conductor, a radiator and radiating fins. The thermal conductor is used for contacting with electronic components; the radiator is provided with an accommodating chamber filled with cooling fluid; the thermal conductor is in sealing connection with the accommodating chamber, and is partially inserted in the accommodating chamber; the radiating fins are arranged on the radiator. The heat dissipation apparatus is internally provided with the accommodating chamber; the thermal conductor is inserted in the accommodating chamber; by utilizing liquid fluidity, heat generated by the electronic components is transmitted to the accommodating chamber of the radiator through the thermal conductor, then is absorbed by the cooling fluid in the accommodating chamber, is rapidly dispersed to the radiator, and then is dispersed in the air through the radiating fins in heat dissipation modes such as convection, radiation, transmission, etc. The heat dissipation apparatus is in favor of heat rapid transmission and disperse, and effectively guarantees and improves the heat dissipation performance of the heat dissipation apparatus.
Description
Technical field
The present invention relates to technical field of heat dissipation, particularly relate to a kind of heat abstractor.
Background technology
Along with high-tech flourish, electronic product is increasingly intelligent and complicated, and the volume of electronic component is tending towards microminiaturization, and the closeness in unit are is also more and more high.And the direct impact that this situation is brought is that the heat that electronic product produces in running is increasing.If there is no the heat that good radiating mode produces to get rid of electron institute, these too high temperature will cause electronic component produce electronics free with thermal stress etc. phenomenon, cause overall stability to reduce, and the life-span of shortening electronic component itself.Therefore, how to get rid of these heats to avoid the overheated of electronic component, always be the problem that can not be ignored.
Such as, disclose a kind of radiator structure of LED power-type street lamp segmentation luminescence unit in Chinese patent CN201410741409.9, formed by for LED secondary light-distribution Tou Mirror module (1), the LED lamp bead (2) be welded in aluminum-based circuit board (3), aluminium radiator (5) and solid state si heat conducting film (4), solid state si heat conducting film (4) substitutes the liquid heat conductive silicone grease that tradition is continued to use, with the pattern of face contact, aluminum-based circuit board (3) is connected with aluminium radiator (5), produce the condition of high temperature in LED street lamp work under, the conductive structure of its mutual face contact can not be changed, the LED of Cheng Load in aluminum-based circuit board work electric heating can be made to conduct smoothly, be diffused on aluminium radiator, radiating fin (6) on radiator is coated with heat loss through radiation coating, this heat loss through radiation coating is the solution that cohesion occurs the modified colloidal particulate (being less than 100 nanometers) crossed through high-temperature process, solution is under the effect of curing agent after film-forming, in fish scale-shaped structure, be conducive to radiation of heat, its filler is CNT (carbon nano-tube), the material of the high thermal conductance such as spinel metal oxide and infrared emission, this structure can increase heat radiation specific area and conductivity greatly, improve the radiation coefficient of luminescence unit infrared radiation, promote the effect of exchange heat, reduce the light decay probability of luminescence unit.
And for example, disclose a kind of high-heat-dispersion LED wiring board in Chinese patent CN201410734343.0, it comprises and is provided with radiating base layer, thermal insulation layer and line layer successively from the bottom to top, and described radiating base layer is metallic plate, and its upper surface is provided with multiple taper projection; The top of described taper projection is provided with two heat transfer bars intersected.Stretch into the taper projection in thermal insulation layer, add the contact area of radiating base layer and thermal insulation layer, and then improve the heat transfer efficiency of radiating base layer and insulating heat-conductive interlayer.And the topside area of taper projection is less, thermal insulation layer can be avoided to be punctured by high-tension electricity.
And for example, a kind of heat abstractor and lighting apparatus is disclosed in Chinese patent CN200910085513.6.This heat abstractor comprises: the riser of tabular, when riser is in running order and horizontal plane; Be formed in the installation base on the surface, side of riser, the heat absorption center of the contiguous riser of installation base is arranged, and installation base is formed with the installation end face for installing light source; Brazing or the radiating fin of extrusion modling on riser opposite side surface.Lighting apparatus comprises heat abstractor of the present invention, also comprises: be arranged on the light source installed on end face.In heat abstractor provided by the present invention, vertically disposed riser is as heat transfer plate, side arranges thermal source, opposite side arranges the radiating fin expanding cooling surface area, the heat of light source can be made to conduct to rapidly in the plane of riser, then dispel the heat in space again, improve the radiating effect of lighting apparatus.Heat abstractor itself namely can as the supporting construction of lighting apparatus, and the lighting apparatus structure formed is simple, compact, is beneficial to heat radiation.
But dissipation from electronic devices of the prior art has still been come by the heat transfer between heat carrier and fin substantially, and radiating effect is not very desirable, so provide a kind of new heat abstractor to be required.
Summary of the invention
Based on this, be necessary for the problems referred to above, the heat abstractor that a kind of good heat dispersion performance, radiating efficiency are higher is provided.
A kind of heat abstractor, comprising: heat carrier; Radiator, described radiator is provided with containing cavity, is filled with radiator liquid in described containing cavity, and described heat carrier and described containing cavity are tightly connected, and described heat carrier is inserted in described containing cavity at least partly; Fin, described fin is arranged on described radiator.
Wherein in an embodiment, the inwall of described containing cavity is provided with protective layer.
Wherein in an embodiment, described containing cavity is cylindrical structure.
Wherein in an embodiment, the inwall of described containing cavity is provided with some auxiliary heat conduction posts.
Wherein in an embodiment, each described auxiliary heat conduction post is uniformly distributed in the inwall of described containing cavity.
Wherein in an embodiment, each described auxiliary heat conduction post continuous distribution.
Wherein in an embodiment, the size and shape of each auxiliary heat conduction post is identical.
Wherein in an embodiment, the cross section of described auxiliary heat conduction post is arc.
Wherein in an embodiment, the radius of described auxiliary heat conduction post is 1/20 ~ 1/10 of the radius of described containing cavity.
Wherein in an embodiment, the radian of described auxiliary heat conduction post is less than 180 degree.
Above-mentioned heat abstractor, containing cavity is provided with in radiator, heat carrier is inserted in containing cavity, utilize the mobility of liquid, the heat that electronic component produces is delivered in the containing cavity of radiator by heat carrier, and then absorbed by the radiator liquid in containing cavity, and be rapidly dispersed on radiator, heat sink in air by fin with radiating modes such as convection current, radiation, conduction again, be conducive to fast transport and the dispersion of heat, effectively ensure that the heat dispersion of heat abstractor, improve the heat dispersion of heat abstractor.And because the uniformity of radiator liquid is high, thermal capacitance is large, being absorbed by radiator liquid of the even heat that electronic component can be made operationally to produce, avoids because reason that thermal capacitance is little causes amount of heat to shed at short notice and damage is caused to electronic component.
Accompanying drawing explanation
Fig. 1 is the detonation configuration schematic diagram of heat abstractor in an embodiment of the present invention;
Fig. 2 is the partial structurtes schematic diagram at another visual angle of heat abstractor in another execution mode of the present invention;
Fig. 3 is the partial structurtes schematic diagram of heat abstractor in another execution mode of the present invention;
Fig. 4 is the partial structurtes schematic diagram of heat abstractor in another execution mode of the present invention.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", " outward ", " clockwise ", " counterclockwise ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise at least one this feature.In describing the invention, the implication of " multiple " is at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
The invention provides a kind of heat abstractor, it comprises: heat carrier, radiator and fin, described heat carrier is used for contacting with electronic component, described radiator is provided with containing cavity, radiator liquid is filled with in described containing cavity, described heat carrier and described containing cavity are tightly connected, and described heat carrier is inserted in described containing cavity at least partly; Described fin is arranged on described radiator.
Refer to Fig. 1, heat abstractor 100, comprise: heat carrier 110, radiator 120, fin 130, radiator 120 is provided with containing cavity 121, is filled with radiator liquid in containing cavity 121, and heat carrier 100 and containing cavity 121 are tightly connected, and heat carrier 100 is inserted in containing cavity 121 at least partly, fin 130 is arranged on radiator 120.Above-mentioned heat abstractor, containing cavity is provided with in radiator, heat carrier is inserted in containing cavity, utilize the mobility of liquid, the heat that electronic component produces is delivered in the containing cavity of radiator by heat carrier, and then absorbed by the radiator liquid in containing cavity, and be rapidly dispersed on radiator, heat sink in air by fin with radiating modes such as convection current, radiation, conduction again, be conducive to fast transport and the dispersion of heat, effectively ensure that the heat dispersion of heat abstractor, improve the heat dispersion of heat abstractor.And because the uniformity of radiator liquid is high, thermal capacitance is large, being absorbed by radiator liquid of the even heat that electronic component can be made operationally to produce, avoids because reason that thermal capacitance is little causes amount of heat to shed at short notice and damage is caused to electronic component.
Such as, the second heat-conducting piece that described heat carrier comprises the first heat-conducting piece and is connected with described first heat-conducting piece, described first heat-conducting piece is used for contacting with chip; Further, described radiator is provided with containing cavity, is filled with radiator liquid in described containing cavity, and described heat carrier and described containing cavity are tightly connected, and described second heat-conducting piece is placed in described containing cavity, and is inserted in described radiator liquid at least partly.
For the ease of the assembling of radiator and heat carrier, such as, be connected by thread seal between described containing cavity with described heat carrier, and for example, the inwall of described containing cavity is provided with internal thread, the correspondence position of described heat carrier is provided with external screw thread, described internal thread and described external screw thread are connected, and and for example, are tightly connected between described containing cavity and described heat carrier by clamping, like this, the assembling of containing cavity and heat carrier can be facilitated.
In order to solve the sealing problem between containing cavity and heat carrier better, prevent radiator liquid from leaking, such as, the interface of described containing cavity and described heat carrier is provided with sealant layer.By arranging sealant layer, the sealing between containing cavity and heat carrier can be improved, preventing the radiator liquid in containing cavity from leaking.
In order to increase the contact area of radiator liquid and radiator in containing cavity, to improve radiating efficiency, such as, described containing cavity is column structure, due to when equal volume, cylindrical surface area is comparatively large, like this, the contact area of radiator liquid and radiator can be increased, improve the radiating efficiency of heat abstractor.
Contact due to radiator liquid and radiator is only the madial wall of radiator, namely, the contact area of radiator liquid and radiator is the area of this cylindrical inner surface, in order to strengthen the radiating effect of heat abstractor further, such as, described radiator inwall is also provided with some auxiliary heat conduction posts, and for example, described in each, the cross section of auxiliary heat conduction post is arc, and for example, each described auxiliary heat conduction post is uniformly distributed in the inwall of described containing cavity, and for example, each described auxiliary heat conduction post continuous distribution, by arranging auxiliary heat conduction body, the contact area of radiator liquid and radiator can be increased, thus raising heat transference efficiency, improve radiating effect.
Particularly, refer to Fig. 2, the inwall of containing cavity 121 is also provided with some auxiliary heat conduction posts 122, the cross section of each auxiliary heat conduction post 122 is cylinder, size and the shape of each auxiliary heat conduction post 122 are identical, are evenly arranged in the inwall of containing cavity 121, and auxiliary heat conduction post 122 continuous arrangement.Certainly, auxiliary heat dissipation post is not limited to above-mentioned shape, and such as, the cross section of described auxiliary heat conduction post is triangle, and and for example, the cross section of described auxiliary heat conduction post is trapezoidal, and and for example, the shape of described auxiliary heat conduction post is rectangle.The shape of auxiliary heat conduction post can not make particular restriction, as long as can increase contact area.
In order to increase the contact area of radiator liquid and radiator further, to improve radiating efficiency, such as, the radius of described auxiliary heat conduction post is 1/20 ~ 1/10 of described containing cavity radius, and such as, the radius of described auxiliary heat conduction post is 1/15 of described containing cavity radius, and for example, the radian of described auxiliary heat conduction post is less than 180 degree, and such as, the radian of described auxiliary heat conduction post is 125 to 128 degree.Like this, the contact area of radiator liquid and radiator can be increased further, improve radiating efficiency, simultaneously also can avoid taking space larger in containing cavity and the volume that reduces radiator liquid.
Manufacture process for the ease of heat abstractor, such as, described auxiliary heat conduction post and described radiator are formed in one structure, and for example, described auxiliary heat conduction post and described radiator form integrated formed structure by casting process, and like this, what can facilitate heat abstractor manufactures process.
In the present embodiment, described radiator liquid is 50% ~ 80% of described containing cavity volume, and described radiator liquid is boiling point>=70 DEG C, thermal capacitance>=3 × 10 at normal atmospheric pressure
3j/ (kg DEG C).Preferably, described radiator liquid is at least one in distilled water, ammoniacal liquor, methyl alcohol, ethanol, hexanol, acetone, heptane or conduction oil, and such as, described radiator liquid is the mixture of distilled water and ethanol.And for example, described radiator liquid comprises each component of following mass parts: distilled water: 75 parts ~ 78 parts, ethanol: 22 parts ~ 25 parts, sodium chloride: 0.5 part ~ 1 part, sodium nitrate: 0.5 part ~ 1.5 parts, sodium perborate: 0.5 part ~ 1.5 parts, BTA: 0.2 part ~ 0.5 part, when the temperature of radiator liquid is more than 30 DEG C, be diluted in the ethanol generating gasification in distilled water and distilled water is gasified gradually, the inwall that the ethanol of gasification and distilled water carry out evaporating cold coalescence and containing cavity repeatedly in the containing cavity of sealing carries out heat exchange, and sodium chloride add the boiling point that can reduce ethanol and distilled water, therefore the evaporation of distilled water and ethanol and the cycle period of condensation can be accelerated, and can prevent when temperature is lower, distilled water solidifies, sodium nitrate and the composite of BTA can be used as corrosion inhibitor or corrosion inhibiter, it can form uniform passivation layer and organic film on the surface of the inwall of containing cavity, stop the further generation of corrosion reaction, adding of sodium perborate can the effect of freeze proof inhibitor and scale removal.
Preferably, in order to avoid radiator liquid being repeatedly heated, in evaporative condenser process with the inwall generation chemical reaction of containing cavity, such as, described containing cavity inwall and heat-conducting liquid adaptive, that is, there is not chemical reaction in the material of the inwall of containing cavity and radiator liquid.And for example, the inwall of described containing cavity is made up of aluminium alloy, and described aluminium alloy comprises each component composition of following mass parts: aluminium: 80.2 parts ~ 89.5 parts; Magnesium: 10.3 parts ~ 15.1 parts; Silicon: 0.5 part ~ 1.5 parts; Copper: 1.2 parts ~ 3.5 parts; Manganese: 0.2 part ~ 1.0 parts; Nickel: 2.3 parts ~ 4.6 parts; Molybdenum: 0.1 part ~ 0.5 part; Zirconium: 0.2 part ~ 0.5 part; Above-mentioned aluminium alloy is made primarily of aluminium, magnesium, not only can make the lighter weight of the base material of preparation, thermal conductivity is better, and silicon, copper, manganese, nickel, adding of molybdenum can make the inwall of containing cavity have larger intensity, in addition, zirconium add the fatigue-resistance characteristics and decay resistance that can improve containing cavity inwall, but when the content of zirconium is greater than 0.5 part, its decay resistance can't improve less, and can affect surrender degree and other mechanical mechanics properties of material.
Further, the inwall of described containing cavity is provided with protective layer, and and for example, described protective layer comprises the material with carbon elements such as graphite, nano carbon material, diamond like carbon, and chemical physical property temperature, thermal conductivity is good.And for example; described protective layer is diamond like carbon (DLC) coating be located on described containing cavity inwall; and for example, described diamond-like coating and described containing cavity inwall have also been provided with the chrome coating of solid attached effect, have stronger adhesion to make diamond-like coating and containing cavity inwall.Preferably, the thickness of described diamond-like coating is 1.0 ~ 2.0 microns, and the thickness of chrome coating is 10 ~ 40 nanometers.And for example, the composition of described diamond-like coating comprises the graphite-phase of 20% ~ 60% and the diamond phase of 80% ~ 40%.
Such as, the radiator in one embodiment of the invention, it comprises each component of following weight portion: aluminium: 62 parts ~ 78 parts, zinc: 11 parts ~ 25 parts, copper: 9 parts ~ 11 parts, boron: 0.3 part ~ 0.7 part, nickel: 0.05 part ~ 0.3 part, manganese: 0.3 part ~ 1.5 parts, chromium: 0.01 part ~ 0.2 part.Above-mentioned radiator contains the aluminium that weight portion is 62 parts ~ 78 parts, and it can be made to maintain lighter quality, and its density is only 2.6kg/m
3~ 2.7kg/m
3, little with the density difference of fine aluminium, effectively can alleviate the weight of radiator like this, be conducive to manufacture is installed, also greatly reduce cost simultaneously; And its conductive coefficient can reach more than 320W/mK, be far longer than the conductive coefficient of fine aluminium, the spread heat more quickly heat carrier transmission can come and transmission, and then be evenly dispersed on whole radiators, to prevent heat from accumulating on the contact position of heat carrier and radiator, cause the generation of local overheating phenomenon; In addition, it is zinc that above-mentioned radiator contains weight portion: 11 parts ~ 25 parts, copper: 9 parts ~ 11 parts, boron: 0.3 part ~ 0.7 part, nickel: 0.05 part ~ 0.3 part, manganese: 0.3 part ~ 1.5 parts, chromium: 0.01 part ~ 0.2 part, relative to fine aluminium, the ductility of radiator, toughness, intensity and resistance to elevated temperatures improve all greatly.
In order to make described radiator, there is performance better, such as, described radiator also comprises the vanadium that weight portion is 0.2 part ~ 1.2 parts, like this, growing up of aluminium alloy crystal grain in radiator can be suppressed, make it obtain more tiny grain structure, to reduce the fragility of radiator, thus improve the mechanical property of radiator entirety, improve its toughness and intensity.And for example, described radiator contains the titanium that weight portion is 0.1 part ~ 0.3 part, can make the crystal grain miniaturization of aluminium alloy in radiator, to improve the ductility of radiator; And for example, described radiator also comprises the silicon that weight portion is 1.0 parts ~ 2.5 parts, when described radiator contains appropriate silicon, can under the prerequisite not affecting described radiator heat conductivility, and the hardness of effective heat radiation body and abrasion resistance.But, when the quality of silicon in radiator is too many, such as, when mass percent is more than more than 15 parts, the appearance distribution black particles of radiator can be made, and ductility reduces, and is unfavorable for the shaping of radiator.
Such as, heat carrier in an embodiment of the present invention, it comprises each component of following mass parts: aluminium: 93.4 parts ~ 95.8 parts, silicon: 0.05 part ~ 0.15 part, manganese: 0.2 part ~ 0.5 part, magnesium: 1.0 parts ~ 3.0 parts, nickel: 3.0 parts ~ 6.0 parts, titanium: 0.02 part ~ 0.06 part, zirconium: 0.05 part ~ 0.15 part, scandium: 0.1 part ~ 0.3 part.Owing to adding nickel, nickle atom can reduce the potential difference of crystal boundary and intracrystalline, this improves the stress corrosion resistant ability of heat carrier, meanwhile, also improves the intensity of heat carrier, plasticity and repeats to load drag.Scandium (Sc) forms precipitated phase Al in aluminium alloy
3sc, it has face-centred cubic structure, lattice constant and α (Al) matrix close, stability is high, not only has strong age-hardening effect, and has high thermal stability.Therefore, adding of scandium, make alloy structure fined, and provide forming core core for precipitated phase, make the precipitation of precipitated phase expand to α (Al) matrix gradually by crystal boundary, disperse is even more, reduces the difference in Electrode Potential of crystal boundary and intracrystalline, form homogeneous corrosion, thus improve the corrosion resisting property of alloy.Owing to adding zirconium (Zr), and Zr and Al combines formation Al
3zr intermetallic compound, this intermetallic compound has two kinds of Structure and forms: the Al directly separated out from melt
3zr is tetragonal, can the as-cast grain of remarkable refining alloy; Another kind is the spheroidal particle of separating out in ingot homogenization process, has the effect of recrystallization in strong inhibition hot procedure; And strong containing Zr alloy quenching sensitiveness, the quenching degree of alloy improves, therefore, zirconium add the intensity, fracture toughness and the anti-stress corrosion performance that effectively improve alloy.
Above-mentioned heat carrier, because it comprises aluminium, nickel, magnesium, silicon, manganese, titanium, zirconium, scandium, element, these elements interact, and make it not only have good heat conductivity, the advantage that specific area is large, have feature that is anticorrosive, high strength simultaneously.
Such as, fin in an embodiment of the present invention, it comprises each component of following mass parts: Graphene: 20 parts ~ 30 parts, carbon fiber: 20 parts ~ 30 parts, polyamide: 40 parts ~ 60 parts, water-soluble silicate: 10 parts ~ 20 parts, hexagonal boron nitride: 1 part ~ 8 parts, bismaleimides: 2 parts ~ 5 parts, silane coupler: 0.5 part ~ 2 parts, antioxidant: 0.25 part ~ 1 part.And for example, described antioxidant is one or more in two Lauryl Alcohol ester, two ten four carbon alcohols esters or two octadecanol ester.And for example, described water-soluble silicate is lithium metasilicate or sodium metasilicate.
Above-mentioned Graphene, carbon fiber mix with polyamide, under the high temperature conditions by the copolyreaction ordered arrangement to a certain extent of polyamide, form heat dissipation channel, give heat and form microchannel absorption cross-ventilation, produce stronger radiant heat transfer effect, thus the heat dispersion of fin can be improved, and the more fluffy sky of heat radiating fin structure formed, quality is lighter.In addition, owing to the addition of carbon fiber, its surface protection performance and mechanical performance are better, such as, more anti-oxidant, more acid and alkali-resistance and more corrosion-resistant.
Preferably, described fin comprises each component of following mass parts: Graphene: 30 parts ~ 35 parts, carbon fiber: 25 parts ~ 30 parts, polyamide: 45 parts ~ 50 parts, water-soluble silicate: 15 parts ~ 20 parts, hexagonal boron nitride: 4 parts ~ 6 parts, bismaleimides: 3 parts ~ 4 parts, silane coupler: 1 part ~ 1.5 parts, antioxidant: 0.5 part ~ 1 part.
Preferably, described fin comprises each component of following mass parts: Graphene 35 parts, 28 parts, carbon fiber, polyamide 45 parts, water-soluble silicate 18 parts, hexagonal boron nitride 5 parts, bismaleimides 3.5 parts, silane coupler 1.8 parts, antioxidant 0.7 part.
Such as, the particle diameter of Graphene is 10-50 μm, and the particle diameter of carbon fiber is 20-30 μm, and the particle diameter of hexagonal boron nitride is 1-10 μm.
Above-mentioned fin can delay by adding antioxidant or suppress the carrying out of polymer oxidizing process, thus stop the aging of Polyamide Engineering Plastic and extend its useful life, by adding silane coupler and two succinimide, the compatibility of other components and polyamide can be improved, make it have good mechanical property and mobility, polyamide is made to enter to obtain good surface quality and machinery, heat and electrical property, the conductive coefficient of fin can be improved by adding hexagonal boron nitride, making fin have higher heat loss through radiation ability.
Above-mentioned fin, by adding graphene film and carbon fiber in polyamide, graphene film and carbon fiber is utilized to have density little, thermal conductivity and fine heat radiation property, and polyamide material has that cost is low, quality is little and the advantage such as machine-shaping property is good, compared with traditional aluminum alloy heat sink, its quality can reduce greatly, cost is low, machine-shaping is easy, and simultaneously it also has the performances such as perfect heat-dissipating, toughness are larger, high temperature resistant and corrosion-resistant.
In order to increase the contact area of fin and radiator further, to improve the radiating efficiency of heat abstractor, such as, refer to Fig. 3, fin 130 is arcuate structure, namely, fin 130 is arc with the contact-making surface of radiator 120, and for example, refers to Fig. 4, fin 130 is S type structure, that is, fin 130 is S type with the contact-making surface of radiator 120, like this, the contact area of fin and radiator can be increased, improve the heat dispersion of heat abstractor.
Above-mentioned heat abstractor, containing cavity is provided with in radiator, heat carrier is inserted in containing cavity, utilize the mobility of liquid, the heat that electronic component produces is delivered in the containing cavity of radiator by heat carrier, and then absorbed by the radiator liquid in containing cavity, and be rapidly dispersed on radiator, heat sink in air by fin with radiating modes such as convection current, radiation, conduction again, be conducive to fast transport and the dispersion of heat, effectively ensure that the heat dispersion of heat abstractor, improve the heat dispersion of heat abstractor.And because the uniformity of radiator liquid is high, thermal capacitance is large, being absorbed by radiator liquid of the even heat that electronic component can be made operationally to produce, avoids because reason that thermal capacitance is little causes amount of heat to shed at short notice and damage is caused to electronic component.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a heat abstractor, is characterized in that, comprising:
Heat carrier;
Radiator, described radiator is provided with containing cavity, is filled with radiator liquid in described containing cavity, and described heat carrier and described containing cavity are tightly connected, and described heat carrier is inserted in described containing cavity at least partly;
Fin, described fin is arranged on described radiator.
2. heat abstractor according to claim 1, is characterized in that, the inwall of described containing cavity is provided with protective layer.
3. heat abstractor according to claim 1, is characterized in that, described containing cavity is cylindrical structure.
4. heat abstractor according to claim 1, is characterized in that, the inwall of described containing cavity is provided with some auxiliary heat conduction posts.
5. heat abstractor according to claim 4, is characterized in that, each described auxiliary heat conduction post is uniformly distributed in the inwall of described containing cavity.
6. heat abstractor according to claim 5, is characterized in that, each described auxiliary heat conduction post continuous distribution.
7. heat abstractor according to claim 4, is characterized in that, the size and shape of each auxiliary heat conduction post is identical.
8. heat abstractor according to claim 7, is characterized in that, the cross section of described auxiliary heat conduction post is arc.
9. heat abstractor according to claim 8, is characterized in that, the radius of described auxiliary heat conduction post is 1/20 ~ 1/10 of the radius of described containing cavity.
10. heat abstractor according to claim 9, is characterized in that, the radian of described auxiliary heat conduction post is less than 180 degree.
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| CN201510338857.9A CN104902732B (en) | 2015-06-17 | 2015-06-17 | Radiator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106251598A (en) * | 2016-08-02 | 2016-12-21 | 怀化建南电子科技有限公司 | A kind of four table unification concentrator apparatus |
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| US20050263267A1 (en) * | 2004-05-26 | 2005-12-01 | Hon Hai Precision Industry Co., Ltd. | Cooling apparatus and method for manufacturing the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106251598A (en) * | 2016-08-02 | 2016-12-21 | 怀化建南电子科技有限公司 | A kind of four table unification concentrator apparatus |
| CN106251598B (en) * | 2016-08-02 | 2019-10-29 | 怀化建南电子科技有限公司 | A kind of four tables unification concentrator apparatus |
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| CN104902732B (en) | 2018-05-15 |
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