CN105023892A - Chip heat radiator - Google Patents
Chip heat radiator Download PDFInfo
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- CN105023892A CN105023892A CN201510338846.0A CN201510338846A CN105023892A CN 105023892 A CN105023892 A CN 105023892A CN 201510338846 A CN201510338846 A CN 201510338846A CN 105023892 A CN105023892 A CN 105023892A
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Abstract
The invention discloses a chip heat radiator, which comprises a heat conduction body, a heat radiation body and heat radiation sheets, wherein the heat conduction body comprises a first heat conduction body and a second heat conduction body connected with the first heat conduction body, and the first heat conduction body is used for being contacted with a chip; the heat radiation body is provided with an accommodating cavity, the accommodating cavity is filled with heat radiation liquid, the heat conduction body and the accommodating cavity are in sealed connection, the second heat conduction body is accommodated in the accommodating cavity, and at least part of the second heat conduction body is inserted in the heat radiation liquid; and the heat radiation sheets are arranged on the heat radiation body. According to the above chip heat radiator, the heat radiation body is internally provided with the accommodating cavity, at least part of the second heat conduction body is inserted in the heat radiation liquid, mobility of the liquid is used, heat generated by an electronic element is quickly absorbed by the heat radiation liquid via the heat conduction body, the heat is then dispersed on the heat radiation body via the inner wall of the accommodating cavity, heat is then dispersed to the air in heat radiation modes such as convection, radiation and conduction via the heat radiation sheets, the heat can be quickly transmitted and dispersed, and heat radiation performance of the chip heat radiator is improved.
Description
Technical field
The present invention relates to technical field of heat dissipation, particularly relate to a kind of chip radiator.
Background technology
Along with high-tech flourish, electronic product is increasingly intelligent and complicated, and the volume of electronic component is tending towards microminiaturization, and the closeness in unit are is also more and more high.And the direct impact that this situation is brought is that the heat that electronic product produces in running is increasing.If there is no the heat that good radiating mode produces to get rid of electron institute, these too high temperature will cause electronic component produce electronics free with thermal stress etc. phenomenon, cause overall stability to reduce, and the life-span of shortening electronic component itself.Therefore, how to get rid of these heats to avoid the overheated of electronic component, always be the problem that can not be ignored.
Such as, disclose a kind of radiator structure of LED power-type street lamp segmentation luminescence unit in Chinese patent CN201410741409.9, it formed by for LED secondary light-distribution Tou Mirror module (1), the LED lamp bead (2) be welded in aluminum-based circuit board (3), aluminium radiator (5) and solid state si heat conducting film (4), solid state si heat conducting film (4) substitutes the liquid heat conductive silicone grease that tradition is continued to use, with the pattern of face contact, aluminum-based circuit board (3) is connected with aluminium radiator (5), produce the condition of high temperature in LED street lamp work under, the conductive structure of its mutual face contact can not be changed, the LED work electric heating that aluminum-based circuit board carries can be made to conduct smoothly, be diffused on aluminium radiator, radiating fin (6) on radiator is coated with heat loss through radiation coating, this heat loss through radiation coating is the solution that cohesion occurs the modified colloidal particulate (being less than 100 nanometers) crossed through high-temperature process, solution is under the effect of curing agent after film-forming, in fish scale-shaped structure, be conducive to radiation of heat, its filler is CNT (carbon nano-tube), the material of the high thermal conductance such as spinel metal oxide and infrared emission, this structure can increase heat radiation specific area and conductivity greatly, improve the radiation coefficient of luminescence unit infrared radiation, promote the effect of exchange heat, reduce the light decay probability of luminescence unit.
And for example, disclose a kind of high-heat-dispersion LED wiring board in Chinese patent CN201410734343.0, it comprises and is provided with radiating base layer, thermal insulation layer and line layer successively from the bottom to top, and described radiating base layer is metallic plate, and its upper surface is provided with multiple taper projection; The top of described taper projection is provided with two heat transfer bars intersected.Stretch into the taper projection in thermal insulation layer, add the contact area of radiating base layer and thermal insulation layer, and then improve the heat transfer efficiency of Sa Reji layer and insulating heat-conductive interlayer.And the topside area of taper projection is less, thermal insulation layer can be avoided to be punctured by high-tension electricity.
And for example, a kind of heat abstractor and lighting apparatus is disclosed in Chinese patent CN200910085513.6.This heat abstractor comprises: the riser of tabular, when riser is in running order and horizontal plane; Be formed in the installation base on the surface, side of riser, the heat absorption center of the contiguous riser of installation base is arranged, and installation base is formed with the installation end face for installing light source; Brazing or the radiating fin of extrusion modling on riser opposite side surface.Lighting apparatus comprises heat abstractor of the present invention, also comprises: be arranged on the light source installed on end face.In heat abstractor provided by the present invention, vertically disposed riser is as heat transfer plate, side arranges thermal source, opposite side arranges the radiating fin expanding cooling surface area, the heat of light source can be made to conduct to rapidly in the plane of riser, then dispel the heat in space again, improve the radiating effect of lighting apparatus.Heat abstractor itself namely can as the supporting construction of lighting apparatus, and the lighting apparatus structure formed is simple, compact, is beneficial to heat radiation.
But dissipation from electronic devices of the prior art has still been come by the heat transfer between heat carrier and fin substantially, and radiating effect is not very desirable, so provide a kind of new heat abstractor to be required.
Summary of the invention
Based on this, be necessary for the problems referred to above, the chip radiator that a kind of good heat dispersion performance, radiating efficiency are higher is provided.
A kind of chip radiator, it comprises:
Heat carrier, it the second heat-conducting piece comprising the first heat-conducting piece and be connected with described first heat-conducting piece, described first heat-conducting piece is used for contacting with chip;
Radiator, described radiator is provided with containing cavity, is filled with radiator liquid in described containing cavity, and described heat carrier and described containing cavity are tightly connected, and described second heat-conducting piece is placed in described containing cavity, and is inserted in described radiator liquid at least partly;
Fin, described fin is arranged at described radiator.
Wherein in an embodiment, described heat carrier also comprises the connector be located between described first heat-conducting piece and described second heat-conducting piece.
Wherein in an embodiment, described connector and described containing cavity are tightly connected.
Wherein in an embodiment, described connector is provided with external screw thread, and the correspondence position of the inwall of described containing cavity is provided with internal thread, and described connector and described containing cavity are by described internal thread and described external thread bolt connection.
Wherein in an embodiment, between the inwall of described connector and described containing cavity, be also provided with sealant.
Wherein in an embodiment, described first heat-conducting piece is provided with coating away from the surface of described second connector.
Wherein in an embodiment, described coating is made after being solidified by graphene solution.
Wherein in an embodiment, the thickness of described coating is 5 ~ 30 microns.
Wherein in an embodiment, the sidewall of described second heat-conducting piece is provided with etch resistant layer.
Wherein in an embodiment, the thickness of described etch resistant layer is 10 ~ 20 microns.
Said chip radiator, containing cavity is provided with in radiator, second heat carrier is inserted in radiator liquid at least partly, utilize the mobility of liquid, the heat that electronic component produces is absorbed by radiator liquid rapidly by heat carrier, and be distributed on radiator by the inwall of containing cavity, heat sink in air by fin with radiating modes such as convection current, radiation, conduction again, be conducive to fast transport and the dispersion of heat, effectively ensure that the heat dispersion of chip radiator, improve the heat dispersion of chip radiator.And because the uniformity of radiator liquid is high, thermal capacitance is large, being absorbed by radiator liquid of the even heat that electronic component can be made operationally to produce, avoids because reason that thermal capacitance is little causes amount of heat to shed at short notice and damage is caused to chip.
Accompanying drawing explanation
Fig. 1 is the detonation configuration schematic diagram of an embodiment of the present invention chips radiator;
Fig. 2 is the partial structurtes schematic diagram of another execution mode chips radiator of the present invention;
Fig. 3 is the partial structurtes schematic diagram of another execution mode chips radiator of the present invention;
Fig. 4 is the partial structurtes schematic diagram of another execution mode chips radiator of the present invention.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", " outward ", " clockwise ", " counterclockwise ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise at least one this feature.In describing the invention, the implication of " multiple " is at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
The invention provides a kind of chip radiator, comprising: heat carrier, radiator, fin, the second heat-conducting piece that described heat-conducting piece comprises the first heat-conducting piece and is connected with described first heat-conducting piece, described first heat-conducting piece is used for contacting with chip; Described radiator is provided with containing cavity, is filled with radiator liquid in described containing cavity, and described heat carrier and described containing cavity are tightly connected, and described second heat-conducting piece is placed in described containing cavity, and is inserted in described radiator liquid at least partly; Described fin is arranged at described radiator.
Refer to Fig. 1, chip radiator 100, comprise: heat carrier 110, radiator 120, fin 130, heat carrier 110 comprise the first heat-conducting piece 111, connector 112 and with the second heat-conducting piece 113, as shown in Figure 1, the two ends of connector 112 are connected with the first heat-conducting piece 111 and the second connector 113 respectively, namely, one end of connector 112 is connected with the first heat-conducting piece 111, and the other end is connected with the second connector 113; First heat-conducting piece 111 is for contacting with the chip of outside.Radiator 120 is provided with containing cavity 121, is filled with radiator liquid in containing cavity 121, and connector 112 and containing cavity 121 are tightly connected, and the second heat carrier 112 is inserted in containing cavity 121.Fin 130 is arranged on radiator 120.Said chip radiator, containing cavity is provided with in radiator, second heat carrier is inserted in radiator liquid at least partly, utilize the mobility of liquid, the heat that electronic component produces is absorbed by radiator liquid rapidly by heat carrier, and be distributed on radiator by the inwall of containing cavity, heat sink in air by fin with radiating modes such as convection current, radiation, conduction again, be conducive to fast transport and the dispersion of heat, effectively ensure that the heat dispersion of chip radiator, improve the heat dispersion of chip radiator.And because the uniformity of radiator liquid is high, thermal capacitance is large, being absorbed by radiator liquid of the even heat that electronic component can be made operationally to produce, avoids because reason that thermal capacitance is little causes amount of heat to shed at short notice and damage is caused to chip.
In the present embodiment, be connected by thread seal between described containing cavity with described connector, and for example, described connector is provided with external screw thread, the correspondence position of the inwall of described containing cavity is provided with internal thread, described internal thread and described external screw thread are connected, and for example, and described containing cavity and described connector clamping; And for example, be tightly connected between described containing cavity and described connector by clamping, like this, can facilitate the assembling of containing cavity and heat carrier, installing/dismounting process is simple.
In order to solve the sealing problem between containing cavity and heat carrier better, preventing radiator liquid from leaking, such as, between the inwall of described connector and described containing cavity, being also provided with sealant.By arranging sealant, the sealing between containing cavity and heat carrier can be improved, preventing the radiator liquid in containing cavity from leaking.
In the present embodiment, described radiator liquid is 50% ~ 80% of described containing cavity volume, and described radiator liquid is boiling point>=70 DEG C, thermal capacitance>=3 × 10 at normal atmospheric pressure
3j/ (kg DEG C).Preferably, described radiator liquid is at least one in distilled water, ammoniacal liquor, methyl alcohol, ethanol, hexanol, acetone, heptane or conduction oil, and such as, described radiator liquid is the mixture of distilled water and ethanol.And for example, described radiator liquid comprises each component of following mass parts: distilled water: 75 parts ~ 78 parts, ethanol: 22 parts ~ 25 parts, sodium chloride: 0.5 part ~ 1 part, sodium nitrate: 0.5 part ~ 1.5 parts, sodium perborate: 0.5 part ~ 1.5 parts, BTA: 0.2 part ~ 0.5 part, when the temperature of radiator liquid is more than 30 DEG C, be diluted in the ethanol generating gasification in distilled water and distilled water is gasified gradually, the inwall that the ethanol of gasification and distilled water carry out evaporating cold coalescence and containing cavity repeatedly in the containing cavity of sealing carries out heat exchange, and sodium chloride add the boiling point that can reduce ethanol and distilled water, therefore the evaporation of distilled water and ethanol and the cycle period of condensation can be accelerated, and can prevent when temperature is lower, distilled water solidifies, sodium nitrate and the composite of BTA can be used as corrosion inhibitor or corrosion inhibiter, it can form uniform passivation layer and organic film on the surface of the inwall of containing cavity, stop the further generation of corrosion reaction, sodium perborate add the effect can playing freeze proof inhibitor and scale removal.
Preferably, in order to avoid radiator liquid being repeatedly heated, in evaporative condenser process with the inwall generation chemical reaction of containing cavity, such as, described containing cavity inwall and heat-conducting liquid adaptive, that is, there is not chemical reaction in the material of the inwall of containing cavity and radiator liquid.And for example, the inwall of described containing cavity is made up of aluminium alloy, and described aluminium alloy comprises each component composition of following mass parts: aluminium: 80.2 parts ~ 89.5 parts; Magnesium: 10.3 parts ~ 15.1 parts; Silicon: 0.5 part ~ 1.5 parts; Copper: 1.2 parts ~ 3.5 parts; Manganese: 0.2 part ~ 1.0 parts; Nickel: 2.3 parts ~ 4.6 parts; Molybdenum: 0.1 part ~ 0.5 part; Zirconium: 0.2 part ~ 0.5 part; Above-mentioned aluminium alloy is made primarily of aluminium, magnesium, not only can make the lighter weight of the base material of preparation, thermal conductivity is better, and silicon, copper, manganese, nickel, adding of molybdenum can make the inwall of containing cavity have larger intensity, in addition, zirconium add the fatigue-resistance characteristics and decay resistance that can improve containing cavity inwall, but when the content of zirconium is greater than 0.5 part, its decay resistance can't improve less, and can affect surrender degree and other mechanical mechanics properties of material.
Further, the inwall of described containing cavity is provided with protective layer, and and for example, described protective layer comprises the material with carbon elements such as graphite, nano carbon material, diamond like carbon, and chemical physical property temperature, thermal conductivity is good.And for example; described protective layer is diamond like carbon (DLC) coating be located on described containing cavity inwall; and for example, described diamond-like coating and described containing cavity inwall have also been provided with the chrome coating of solid attached effect, have stronger adhesion to make diamond-like coating and containing cavity inwall.Preferably, the thickness of described diamond-like coating is 1.0 ~ 2.0 microns, and the thickness of chrome coating is 10 ~ 40 nanometers.And for example, the composition of described diamond-like coating comprises the graphite-phase of 20% ~ 60% and the diamond phase of 80% ~ 40%.
In the present embodiment, because the first heat-conducting piece contacts with chip, therefore the first heat-conducting piece needs higher conductive coefficient, such as, in one embodiment of the invention, the first heat-conducting piece comprises each component of following weight portion: copper: 93 parts ~ 97 parts, aluminium: 2 parts ~ 4.5 parts, nickel: 0.1 part ~ 0.3 part, manganese: 0.1 part ~ 0.4 part, titanium: 0.1 part ~ 0.3 part, chromium: 0.1 part ~ 0.3 part, vanadium 0.1 part ~ 0.3 part.
Owing to adding the copper of larger proportion in above-mentioned first heat-conducting piece, the first heat-conducting piece can be made to obtain higher heat conductivility, it can reach more than 380W/mK, more quickly the heat that chip produces can be passed like this, to prevent heat from accumulating at chip perimeter, cause chip local overheating phenomenon and defective chip.And the density of described firstth heat-conducting piece but only has 8.0kg/m
3~ 8.1kg/m
3, be far smaller than the density of fine copper, effectively can alleviate the weight of the first heat-conducting piece like this, be more conducive to manufacture is installed, also greatly reduce cost simultaneously.In addition, above-mentioned first heat-conducting piece contains the vanadium that mass parts is the aluminium of 2 parts ~ 4.5 parts, the nickel of 0.1 part ~ 0.3 part, the manganese of 0.1 part ~ 0.4 part, the titanium of 0.1 part ~ 0.3 part, the chromium of 0.1 part ~ 0.3 part and 0.1 part ~ 0.3 part.Relative to fine copper, the ductility of the first heat-conducting piece, toughness, intensity and resistance to elevated temperatures improve all greatly.Further, size and the shape of the shape of described first heat-conducting piece and size and chip are identical, and like this, the heat that each position of chip produces can pass rapidly by the first heat-conducting piece, avoids the overheated infringement causing chip of the local location of chip.Further, the thickness of the first heat-conducting piece is 50 ~ 200 microns, like this, the first heat-conducting piece both can have been made to keep good mechanical performance, it can be made to keep lighter weight simultaneously, be convenient to its installation process, and reduce its production cost.
In order to improve the heat conductivility of the first heat-conducting piece further, the heat that chip produces can be transmitted fast, such as, described first heat-conducting piece is provided with coating away from the surface of described second connector, that is, the first heat-conducting piece is provided with coating near the surface of chip.And for example, described coating is made after being solidified by graphene solution.And for example, the thickness of described coating is 2 microns ~ 50 microns.Preferably, the thickness of described coating is 5 microns ~ 30 microns.Preferably, the thickness of described coating is 10 microns ~ 20 microns.And for example, described graphene solution comprises each component of following weight portion: Graphene: 5 parts ~ 15 parts, adhesive: 20 parts ~ 70 parts, dispersant: 0.25 part ~ 0.6 part, surfactant: 0.05 part ~ 0.3 part, defoamer: 0.5 part ~ 5 parts, solvent: 10 parts ~ 30 parts.Preferably, described graphene solution comprises the composition of following weight portion: Graphene: 8 parts ~ 12 parts; Adhesive: 30 parts ~ 60 parts; Dispersant: 0.25 part ~ 0.6 part; Surfactant: 0.05 part ~ 0.3 part; Defoamer: 0.5 part ~ 5 parts; Solvent: 10 parts ~ 30 parts.Preferably, described graphene solution comprises the composition of following weight portion: Graphene: 10 parts, adhesive: 50 parts, dispersant: 0.5 part, surfactant: 0.2 part, defoamer: 2 parts, solvent: 20 parts, wherein, described adhesive is epoxy acrylic resin, polyurethane acrylic resin, Kynoar, butadiene-styrene rubber, the at least one of polyacrylonitrile and polyurethanes, described dispersant is polyvinyl chloride, polyethylene glycol oxide, polyethylene glycol, Tissuemat E, the at least one of polyvinyl chloride and polyvinylpyrrolidone, described solvent is water, dimethylbenzene, butanone, the at least one of isopropyl alcohol, described surfactant is Sodium Polyacrylate, neopelex, sodium alginate, sodium carboxymethylcellulose, the at least one of odium stearate and sodium cetanesulfonate, described defoamer is benzyl carbinol oleate, dimethicone, the at least one of GP defoamer and dimethyl silicone polymer.
For the ease of producing, such as, 0.5 part ~ 2.0 parts light triggers are also comprised in described graphene solution, and described adhesive is ultraviolet curable resin, described coating is evenly laid on substrate by described graphene solution, through UV radiation curing formation, such as, described coating layer thickness is 9 nanometers to 220 micron.Like this, its advantage is easy to operation, energy-conserving and environment-protective, but also coating can be made to have higher hardness and higher adhesive ability.And for example, described light trigger is selected from a kind of or wherein multiple combination in 2-hydroxy-2-methyl-1-phenyl-1-acetone (light trigger 1173), 1-hydroxycyclohexyl phenyl ketone (light trigger 184), 2.4.6-trimethyl benzoyl diphenyl base phosphine oxide (light trigger TPO), benzoin dimethylether (light trigger 651), benzophenone (photoinitiator b P), isopropyl thioxanthone (light trigger ITX), 4-morpholinyl benzoyl-1-Ka Ji-1-dimethylamino-propane (light trigger 369).And for example, described adhesive is epoxy acrylic resin or polyurethane acrylic resin.
Be appreciated that, because the second heat-conducting piece is inserted in radiator liquid, therefore the second heat-conducting piece needs to have good resistance to corrosion.Such as, the second heat-conducting piece in an embodiment of the present invention, it comprises each component of following mass parts: aluminium: 93.4 parts ~ 95.8 parts, silicon: 0.05 part ~ 0.15 part, manganese: 0.2 part ~ 0.5 part, magnesium: 1.0 parts ~ 3.0 parts, nickel: 3.0 parts ~ 6.0 parts, titanium: 0.02 part ~ 0.06 part, zirconium: 0.05 part ~ 0.15 part, scandium: 0.1 part ~ 0.3 part.Owing to adding nickel, nickle atom can reduce the potential difference of crystal boundary and intracrystalline, this improves the stress corrosion resistant ability of heat carrier, meanwhile, also improves the intensity of heat carrier, plasticity and repeats to load drag.Scandium (Sc) forms precipitated phase Al in aluminium alloy
3sc, it has face-centred cubic structure, lattice constant and α (Al) matrix close, stability is high, not only has strong age-hardening effect, and has high thermal stability.Therefore, adding of scandium, make alloy structure fined, and provide forming core core for precipitated phase, make the precipitation of precipitated phase expand to α (Al) matrix gradually by crystal boundary, disperse is even more, reduces the difference in Electrode Potential of crystal boundary and intracrystalline, form homogeneous corrosion, thus improve the corrosion resisting property of alloy.Owing to adding zirconium (Zr), and Zr and Al combines formation Al
3zr intermetallic compound, this intermetallic compound has two kinds of Structure and forms: the Al directly separated out from melt
3zr is tetragonal, can the as-cast grain of remarkable refining alloy; Another kind is the spheroidal particle of separating out in ingot homogenization process, has the effect of recrystallization in strong inhibition hot procedure; And strong containing Zr alloy quenching sensitiveness, the quenching degree of alloy improves, therefore, zirconium add the intensity, fracture toughness and the anti-stress corrosion performance that effectively improve alloy.
Above-mentioned second heat-conducting piece, because it comprises aluminium, nickel, magnesium, silicon, manganese, titanium, zirconium, scandium, these elements interact, and make it not only have good heat conductivity, the advantage that specific area is large, have feature that is anticorrosive, high strength simultaneously.
In order to improve the resistance to corrosion of the second heat-conducting piece further, such as, the sidewall of described second heat-conducting piece is provided with etch resistant layer, and for example, etch resistant layer is identical with the composition of described protective layer, and for example, etch resistant layer comprises each component of following mass parts: acroleic acid resin: 25 parts ~ 30 parts, nitrocotton resin: 25 parts-30 parts, butyl acetate: 6 parts ~ 8 parts, n-butanol: 6 parts ~ 8 parts, ethylene glycol ethyl ether: 3 parts ~ 4 parts, levelling agent: 1 part ~ 1.5 parts, defoamer: 1 part ~ 1.5 parts, inorganic filler 20 parts ~ 30 parts, wherein inorganic filler comprises aluminium nitride, boron nitride, aluminium oxide, carborundum or copper powder, preferably, the particle diameter of inorganic filler is 0.5 ~ 3 micron.Adding of nitrocotton resin, not only make it have fast drying, and it is better to have good hardness and brightness smooth weatherability, adding of inorganic filler, can make it have good heat conductivility.Preferably, the thickness of etch resistant layer is 10 ~ 20 microns, like this, can make it have good resistance to corrosion, can keep higher conductive coefficient again simultaneously.
In order to increase the contact area of radiator liquid and radiator in containing cavity, to improve radiating efficiency, such as, radiator is column structure, due to when equal volume, cylindrical surface area is comparatively large, like this, the contact area of radiator liquid and radiator can be increased, improve the radiating efficiency of chip radiator.
Contact due to radiator liquid and radiator is only the madial wall of radiator, namely, the contact area of radiator liquid and radiator is the area of this cylindrical inner surface, in order to strengthen the radiating effect of chip radiator further, such as, described radiator inwall is also provided with some auxiliary heat conduction posts, and for example, described in each, the cross section of auxiliary heat conduction post is arc, and for example, if individual described auxiliary heat conduction post is uniformly distributed in the inwall of described containing cavity, and for example, some described auxiliary heat conduction post continuous distribution, by arranging auxiliary heat conduction body, the contact area of radiator liquid and radiator can be increased, thus raising heat transference efficiency, improve radiating effect.
Particularly, refer to Fig. 2, the inwall of containing cavity 210 is also provided with some auxiliary heat conduction posts 211, the cross section of each auxiliary heat conduction post 211 is cylinder, size and the shape of each auxiliary heat conduction post 211 are identical, are evenly arranged in the inwall of containing cavity 210, and auxiliary heat conduction post 211 continuous arrangement.Certainly, auxiliary heat dissipation post is not limited to above-mentioned shape, and such as, the cross section of described auxiliary heat conduction post is triangle, and and for example, the cross section of described auxiliary heat conduction post is trapezoidal.The shape of auxiliary heat conduction post can not make particular restriction, as long as can increase contact area.
In order to increase the contact area of radiator liquid and radiator further, to improve radiating efficiency, such as, the radius of described auxiliary heat conduction post is 1/20 ~ 1/10 of described containing cavity radius, and such as, the radius of described auxiliary heat conduction post is 1/15 of described containing cavity radius, and for example, the radian of described auxiliary heat conduction post is less than 180 degree, and such as, the radian of described auxiliary heat conduction post is 125 to 128 degree.Like this, the contact area of radiator liquid and radiator can be increased further, improve radiating efficiency, simultaneously also can avoid taking space larger in containing cavity and the volume that reduces radiator liquid.
Manufacture process for the ease of chip radiator, such as, described auxiliary heat conduction post and described radiator are formed in one structure, and for example, described auxiliary heat conduction post and described radiator form integrated formed structure by casting process, and like this, what can facilitate chip radiator manufactures process.
Such as, the radiator in one embodiment of the invention, it comprises each component of following weight portion: aluminium: 62 parts ~ 78 parts, zinc: 11 parts ~ 25 parts, copper: 9 parts ~ 11 parts, boron: 0.3 part ~ 0.7 part, nickel: 0.05 part ~ 0.3 part, manganese: 0.3 part ~ 1.5 parts, chromium: 0.01 part ~ 0.2 part.Above-mentioned radiator contains the aluminium that weight portion is 62 parts ~ 78 parts, and it can be made to maintain lighter quality, and its density is only 2.6kg/m
3~ 2.7kg/m
3, little with the density difference of fine aluminium, effectively can alleviate the weight of radiator like this, be conducive to manufacture is installed, also greatly reduce cost simultaneously; And its conductive coefficient can reach more than 320W/mK, be far longer than the conductive coefficient of fine aluminium, the spread heat more quickly heat carrier transmission can come and transmission, and then be evenly dispersed on whole radiators, to prevent heat from accumulating on the contact position of heat carrier and radiator, cause the generation of local overheating phenomenon; In addition, it is zinc that above-mentioned radiator contains weight portion: 11 parts ~ 25 parts, copper: 9 parts ~ 11 parts, boron: 0.3 part ~ 0.7 part, nickel: 0.05 part ~ 0.3 part, manganese: 0.3 part ~ 1.5 parts, chromium: 0.01 part ~ 0.2 part, relative to fine aluminium, the ductility of radiator, toughness, intensity and resistance to elevated temperatures improve all greatly.
In order to make described radiator, there is performance better, such as, described radiator also comprises the vanadium that weight portion is 0.2 part ~ 1.2 parts, like this, growing up of aluminium alloy crystal grain in radiator can be suppressed, make it obtain more tiny grain structure, to reduce the fragility of radiator, thus improve the mechanical property of radiator entirety, improve its toughness and intensity.And for example, described radiator contains the titanium that weight portion is 0.1 part ~ 0.3 part, can make the crystal grain miniaturization of aluminium alloy in radiator, to improve the ductility of radiator; And for example, described radiator also comprises the silicon that weight portion is 1.0 parts ~ 2.5 parts, when described radiator contains appropriate silicon, can under the prerequisite not affecting described radiator heat conductivility, and the hardness of effective heat radiation body and abrasion resistance.But, when the quality of silicon in radiator is too many, such as, when mass percent is more than more than 15 parts, the appearance distribution black particles of radiator can be made, and ductility reduces, and is unfavorable for the shaping of radiator.
Such as, fin in an embodiment of the present invention, it comprises each component of following mass parts: Graphene: 20 parts ~ 30 parts, carbon fiber: 20 parts ~ 30 parts, polyamide: 40 parts ~ 60 parts, water-soluble silicate: 10 parts ~ 20 parts, hexagonal boron nitride: 1 part ~ 8 parts, bismaleimides: 2 parts ~ 5 parts, silane coupler: 0.5 part ~ 2 parts, antioxidant: 0.25 part ~ 1 part.And for example, described antioxidant is one or more in two Lauryl Alcohol ester, two ten four carbon alcohols esters or two octadecanol ester.And for example, described water-soluble silicate is lithium metasilicate or sodium metasilicate.
Above-mentioned Graphene, carbon fiber mix with polyamide, under the high temperature conditions by the copolyreaction ordered arrangement to a certain extent of polyamide, form heat dissipation channel, give heat and form microchannel absorption cross-ventilation, produce stronger radiant heat transfer effect, thus the heat dispersion of fin can be improved, and the more fluffy sky of heat radiating fin structure formed, quality is lighter.In addition, owing to the addition of carbon fiber, its surface protection performance and mechanical performance are better, such as, more anti-oxidant, more acid and alkali-resistance and more corrosion-resistant.
Preferably, described fin comprises each component of following mass parts: Graphene: 30 parts ~ 35 parts, carbon fiber: 25 parts ~ 30 parts, polyamide: 45 parts ~ 50 parts, water-soluble silicate: 15 parts ~ 20 parts, hexagonal boron nitride: 4 parts ~ 6 parts, bismaleimides: 3 parts ~ 4 parts, silane coupler: 1 part ~ 1.5 parts, antioxidant: 0.5 part ~ 1 part.
Preferably, described fin comprises each component of following mass parts: Graphene 35 parts, 28 parts, carbon fiber, polyamide 45 parts, water-soluble silicate 18 parts, hexagonal boron nitride 5 parts, bismaleimides 3.5 parts, silane coupler 1.8 parts, antioxidant 0.7 part.
Such as, the particle diameter of Graphene is 10-50 μm, and the particle diameter of carbon fiber is 20-30 μm, and the particle diameter of hexagonal boron nitride is 1-10 μm.
Above-mentioned fin can delay by adding antioxidant or suppress the carrying out of polymer oxidizing process, thus stop the aging of Polyamide Engineering Plastic and extend its useful life, by adding silane coupler and two succinimide, the compatibility of other components and polyamide can be improved, make it have good mechanical property and mobility, polyamide is made to enter to obtain good surface quality and machinery, heat and electrical property, the conductive coefficient of fin can be improved by adding hexagonal boron nitride, making fin have higher heat loss through radiation ability.
Above-mentioned fin, by adding graphene film and carbon fiber in polyamide, graphene film and carbon fiber is utilized to have density little, thermal conductivity and fine heat radiation property, and polyamide material has that cost is low, quality is little and the advantage such as machine-shaping property is good, compared with traditional aluminum alloy heat sink, its quality can reduce greatly, cost is low, machine-shaping is easy, and simultaneously it also has the performances such as perfect heat-dissipating, toughness are larger, high temperature resistant and corrosion-resistant.
In order to increase the contact area of fin and radiator further, to improve the radiating efficiency of heat abstractor, such as, refer to Fig. 3, fin 130 is arcuate structure, namely, fin 130 is arc with the contact-making surface of radiator 120, and for example, refers to Fig. 4, fin 130 is S type structure, that is, fin 130 is S type with the contact-making surface of radiator 120, like this, the contact area of fin and radiator can be increased, improve the heat dispersion of heat abstractor.
Said chip radiator, containing cavity is provided with in radiator, second heat carrier is inserted in radiator liquid at least partly, utilize the mobility of liquid, the heat that electronic component produces is absorbed by radiator liquid rapidly by heat carrier, and is distributed on radiator by the inwall of containing cavity, then heats sink in air by fin with radiating modes such as convection current, radiation, conduction, be conducive to fast transport and the dispersion of heat, improve the heat dispersion of chip radiator.And because the uniformity of radiator liquid is high, thermal capacitance is large, being absorbed by radiator liquid of the even heat that electronic component can be made operationally to produce, avoids because reason that thermal capacitance is little causes amount of heat to shed at short notice and damage is caused to chip.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a chip radiator, is characterized in that, comprising:
Heat carrier, it the second heat-conducting piece comprising the first heat-conducting piece and be connected with described first heat-conducting piece, described first heat-conducting piece is used for contacting with chip;
Radiator, described radiator is provided with containing cavity, is filled with radiator liquid in described containing cavity, and described heat carrier and described containing cavity are tightly connected, and described second heat-conducting piece is placed in described containing cavity, and is inserted in described radiator liquid at least partly;
Fin, described fin is arranged at described radiator.
2. chip radiator according to claim 1, is characterized in that, described heat carrier also comprises the connector be located between described first heat-conducting piece and described second heat-conducting piece.
3. chip radiator according to claim 2, is characterized in that, described connector and described containing cavity are tightly connected.
4. chip radiator according to claim 3, is characterized in that, described connector is provided with external screw thread, and the correspondence position of the inwall of described containing cavity is provided with internal thread, and described connector and described containing cavity are by described internal thread and described external thread bolt connection.
5. chip radiator according to claim 4, is characterized in that, is also provided with sealant between the inwall of described connector and described containing cavity.
6. chip radiator according to claim 1, is characterized in that, described first heat-conducting piece is provided with coating away from the surface of described second connector.
7. chip radiator according to claim 6, is characterized in that, described coating is made after being solidified by graphene solution.
8. chip radiator according to claim 1, is characterized in that, the thickness of described coating is 5 ~ 30 microns.
9. chip radiator according to claim 1, is characterized in that, the sidewall of described second heat-conducting piece is provided with etch resistant layer.
10. chip radiator according to claim 1, is characterized in that, the thickness of described etch resistant layer is 10 ~ 20 microns.
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| CN105023892B (en) | 2018-09-18 |
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