CN104697383A - Radiating plate - Google Patents
Radiating plate Download PDFInfo
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- CN104697383A CN104697383A CN201510153283.8A CN201510153283A CN104697383A CN 104697383 A CN104697383 A CN 104697383A CN 201510153283 A CN201510153283 A CN 201510153283A CN 104697383 A CN104697383 A CN 104697383A
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Abstract
A radiating plate comprises a substrate. The substrate comprises a main plate made of aluminum alloy materials and a coating disposed on the main plate. The coating is formed by curing graphene solution. The aluminum alloy materials comprise, by weight, 62-78 parts of aluminum, 11-25 parts of zinc, 9-11 parts of copper, 0.1-0.8 part of boron, 0.01-0.4 part of nickel, 0.3-1.5 parts of manganese, and 0.01-0.2 part of chromium. The radiating plate has the advantages that the components of the aluminum alloy materials of the substrate are changed, the graphene coating coats the surface of the radiating substrate, the radiating plate can have large tensile strength and high corrosion resistance, the heat resistance of the radiating plate can be lowered effectively, and the radiating capability of the radiating plate is increased to a large degree.
Description
Technical field
The present invention relates to Heat Conduction Material technical field, particularly relate to a kind of heat sink.
Background technology
Along with high-tech flourish, electronic product is increasingly intelligent and complicated, and the volume of electronic component is tending towards microminiaturization, and the closeness in unit are is also more and more high.And the direct impact that this situation is brought is that the heat that electronic product produces in running is increasing.If there is no the heat that good radiating mode produces to get rid of electron institute, these too high temperature will cause electronic component produce electronics free with thermal stress etc. phenomenon, cause overall stability to reduce, and the life-span of shortening electronic component itself.Therefore, how to get rid of these heats to avoid the overheated of electronic component, always be the problem that can not be ignored.
At present, the material of conventional heat sink is copper and aluminium alloy, and the two respectively has its pluses and minuses.The thermal conductivity of copper is good (the thermal conductivity factor 401W/mK of copper), but price is more expensive, and difficulty of processing is higher, and weight excessive (a lot of fine copper radiator has all exceeded the quantitative limitation of CPU counterweight), thermal capacity is less, and is easily oxidized.In addition when copper once be oxidized, its heat dispersion and life-span will decline greatly.And fine aluminium is too soft, can not directly use, be all that the aluminium alloy used just can provide enough hardness, the advantage of aluminium alloy is cheap, lightweight, but its thermal conductivity (the thermal conductivity factor 237W/mK of aluminium) will be far short of what is expected than copper.
Such as, Chinese patent 201310348357.4 discloses a kind of LED radiator aluminum alloy and preparation method thereof, and each element of this aluminium alloy consists of by mass percentage: Si2.2-2.8, Cu1.5-2.5, Mg1.1-1.6, Zn3.7-4.4, Mn0.6-1.2, Fe0.5-1, Ni0.4-0.8, Cr0.2-0.3, Ti0.15-0.25, Ge0.08-0.12, Th0.04-0.07, Y0.03-0.05, Sm0.02-0.03, Tb0.02-0.03, surplus are aluminium.Aluminium alloy of the present invention has excellent heat conductivility while ensureing higher mechanical strength, and thermal conductivity is at 225-250Wm
-1k
-1, perfect heat-dissipating, effectively can solve the heat dissipation problem existing for current high-powered LED lamp, improve its functional reliability and service life.
And for example; Chinese patent 201210201805.3 provides a kind of fin material for aluminum alloy heat radiator; the intensity that its fin material for aluminum alloy heat radiator that effectively can solve the traditional 3003 aluminium alloy processing of existing employing exists is low, the problem of resist collapse poor performance; simultaneously; it can reduce material thickness greatly; reduce the cost of raw material, and radiator tube can be protected not to be corroded, improve the service life of whole radiator.It is characterized in that: it comprises the following material that gross weight number is 100 parts: silicon (Si) 0.5 part ~ 0.8 part, iron (Fe)≤0.6 part, copper (Cu)≤0.1 part, 1.4 parts ~ 1.8 parts, manganese (Mn), magnesium (Mg)≤0.03 part, 2.3 parts ~ 2.7 parts, zinc (Zn), zirconium (Zr) 0.05 part ~ 0.2 part, all the other are aluminium (Al) and other inevitable impurity trace element.
And for example, Chinese patent 03126663.0 discloses a kind of modified 6063 aluminum alloy materials, this material is in former 6063 aluminium alloys, be added with mixed rare-earth elements La and Ce that weight percentage is 0.11 ~ 0.2%, and wherein the addition of rare-earth elements La is 0.036 ~ 0.14%.The application result of rare earth element in aluminium alloy shows, in aluminium alloy, add appropriate rare earth can improve machinery, physics and processing performance, show as purification, strengthening and refinement, at the radiator that semiconductor and air conditioner and condenser/evaporator device use material of the present invention to make, there are good extrudability and electrical and thermal conductivity performance.
But still there is the defects such as heat conductivility is poor, radiating effect is not good in above-mentioned disclosed patent.
Summary of the invention
Based on this, be necessary for the problems referred to above, provide a kind of heat sink, its radiating effect is better and intensity is larger, high temperature resistant and corrosion-resistant.
A kind of heat sink, comprising:
Substrate, described substrate comprises the mainboard be made up of aluminum alloy materials, and
Coating, described coating is located on described mainboard, and described coating is made after being solidified by graphene solution;
Wherein, described aluminum alloy materials comprises the composition of following mass parts:
Aluminium: 62 parts ~ 78 parts;
Zinc: 11 parts ~ 25 parts;
Copper: 9 parts ~ 11 parts;
Boron: 0.1 part ~ 0.8 part;
Nickel: 0.01 part ~ 0.4 part;
Manganese: 0.3 part ~ 1.5 parts;
Chromium: 0.01 part ~ 0.2 part.
Wherein in an embodiment, the mass parts of boron is 0.3 part ~ 0.7 part.
Wherein in an embodiment, the mass parts of nickel is 0.05 part ~ 0.3 part.
Wherein in an embodiment, the mass parts of manganese is 0.5 part ~ 1.2 parts.
Wherein in an embodiment, the mass parts of chromium is 0.05 part ~ 0.15 part.
Wherein in an embodiment, the mass parts of zinc is 12 parts ~ 19 parts.
Wherein in an embodiment, the mass parts of copper is 9.5 parts ~ 10.5 parts.
Wherein in an embodiment, the thickness of described coating is 5 ~ 50 microns.
Wherein in an embodiment, the thickness of described coating is 10 ~ 20 microns.
Above-mentioned heat sink is by changing the composition of substrate aluminum alloy materials, and in the graphene coated coating in heat-radiating substrate surface, heat sink not only can be made to have larger stretching energy degree, corrosion-resistant, effectively can also reduce the thermal resistance of heat sink simultaneously, thus improve the heat-sinking capability of heat sink largely.
Accompanying drawing explanation
Fig. 1 is the structural representation of heat sink in one embodiment of the invention;
Fig. 2 is the preparation method flow chart of heat sink in one embodiment of the invention.
Detailed description of the invention
For feature of the present invention, technological means and the specific purposes reached, function can be understood further, below in conjunction with detailed description of the invention, the present invention is described in further detail.
Refer to Fig. 1, heat sink 100 comprises substrate 110 and coating 120, and coating 120 is located on substrate 110, and substrate 110 is made up of aluminum alloy materials, and coating 120 is made after being solidified by graphene solution.
And for example, a kind of heat sink, comprises substrate, and described substrate is made up of aluminum alloy materials, and described aluminum alloy materials comprises the composition of following weight portion: aluminium: 62 parts ~ 78 parts; Zinc: 11 parts ~ 25 parts; Copper: 9 parts ~ 11 parts; Boron: 0.1 part ~ 0.8 part; Nickel: 0.01 part ~ 0.4 part; Manganese: 0.3 part ~ 1.5 parts; Chromium: 0.01 part ~ 0.2 part; Coating, described coating is located on described substrate, and described coating is made up of graphene solution.Such as, the weight portion of boron is 0.3 part ~ 0.7 part.Adding of boron can put forward heavy alloyed intensity, puies forward heavy alloyed wetability, is conducive to carrying heavy alloyed cold-forming property.But when the content of boron is less, the effect that intensity increases is less, and when the content of boron is larger, then has a negative impact to the corrosion resistance of aluminium alloy.And for example, the weight portion of nickel is 0.05 part ~ 0.3 part.Adding of nickel can put forward heavy alloyed intensity, and can carry heavy alloyed natural potential, puies forward heavy alloyed corrosion resistance to a certain extent, particularly reduce the corrosion rate under hot conditions, but when nickel content is excessive, then can affect the extrusion performance of alloy, fall low-alloyed mobility.And for example, the weight portion of manganese is 0.5 part ~ 1.2 parts.Adding of manganese can refining alloy particle, puies forward heavy alloyed intensity, but when the content of manganese is larger, when exceeding its solubility in the alloy, then can affect the extrusion performance of alloy, affect the processing characteristics of alloy.And for example, the weight portion of chromium is 0.05 part ~ 0.15 part, and adding of chromium can put forward heavy alloyed intensity, particularly improves the intensity after artificial aging, but when chromium content is excessive, can affect the color and luster of alloy, alloy coloring effect is deteriorated.And for example, the weight portion of zinc is 12 parts ~ 19 parts, zinc add the mobility that can increase alloy, put forward heavy alloyed machinability.And for example, the weight portion of copper is 9.5 parts ~ 10.5 parts, copper add the intensity that can increase alloy, put forward heavy alloyed heat-sinking capability, carry heavy alloyed ductility simultaneously, but when copper content is excessive, then can the corrosivity of alloy have a negative impact.
Such as, described coating is located on described substrate, and described coating is made up of graphene solution, and wherein, described graphene solution comprises the composition of following weight portion: Graphene: 5 parts ~ 15 parts; Adhesive: 20 parts ~ 70 parts; Dispersant: 0.25 part ~ 0.6 part; Surfactant: 0.05 part ~ 0.3 part; Defoamer: 0.5 part ~ 5 parts; Solvent: surplus.And for example, described coating is located on described substrate, and described coating comprises the composition of following weight portion: Graphene: 5 parts ~ 15 parts; Adhesive: 20 parts ~ 70 parts; Dispersant: 0.25 part ~ 0.6 part; Surfactant: 0.05 part ~ 0.3 part; Defoamer: 0.5 part ~ 5 parts; Solvent: surplus.And for example, described coating is located on described substrate, and described coating comprises graphene solution, and wherein, described graphene solution comprises the composition of following weight portion: Graphene: 5 parts ~ 15 parts; Adhesive: 20 parts ~ 70 parts; Dispersant: 0.25 part ~ 0.6 part; Surfactant: 0.05 part ~ 0.3 part; Defoamer: 0.5 part ~ 5 parts; Solvent: 15 parts ~ 40 parts.And for example, described solvent is at least one of water, dimethylbenzene, butanone, isopropyl alcohol.
Such as, described substrate also comprises the intermediate plate be arranged between described mainboard and described coating, and described intermediate plate comprises each component of following mass parts: copper 89.7-92.3 part, aluminium 1.5-3.3 part, zinc 1.7-4.3 part, vanadium 0.6 part ~ 1.3 parts and titanium 0.1 part ~ 0.4 part.Above-mentioned intermediate plate, by adopting copper to be primary raw material, has higher thermal conductivity, can improve the heat dispersion of heat sink further, and because intermediate plate is between mainboard and coating, block with air, can effectively prevent copper oxidized.
And for example, the thickness proportion of described mainboard and described intermediate plate is 10-6:1-0.5.Preferably, the thickness proportion of described mainboard and intermediate plate is 9:1-0.8.If the thickness of intermediate plate is comparatively large, the quality of heat sink can be made excessive, and the thickness of intermediate plate is less, then the effect of its heat conductivility increase is less.
And for example, coating contacts with heat dissipation element, because coating is made up of graphene solution, utilize the thermal conductivity that Graphene is high, heat dissipation element produces heat can carry out face transmission along graphene film rapidly, and be delivered to rapidly heat sink inside, shorten heat-conducting interface material or heater members to the time needed for heat sink heat transfer, improve the radiating rate of heat sink.
In order to increase the contact area of heat sink and air, and for example, mainboard is provided with heat radiation wing plate away from the side of intermediate plate, and and for example, heat radiation wing plate is several, and several heat radiation wing plates be arranged in parallel, and are uniformly distributed on mainboard.Like this, the contact area of heat sink and air can be increased, heat is delivered in outside air in time.And for example, the material of heat radiation wing plate is identical with substrate, and dispel the heat wing plate and substrate is one-body molded obtains.And for example, heat radiation wing plate and substrate are processed through aluminium extruded and are obtained, and like this, are conducive to the intensity increasing heat radiation wing plate and substrate.
And for example, heat radiation wing plate comprises each component of following mass parts: silicon 0.2 part ~ 1.5 parts, copper 0.05 part ~ 1.2 parts, 0.3 part ~ 1.8 parts, manganese, titanium 0.03 part ~ 0.3 part, iron 0 ~ 1.0 part, chromium 0.03 part ~ 0.3 part, 0.2 part ~ 1.0 parts, zinc, zirconium 0.03 part ~ 0.3 part, surplus is aluminium and inevitable impurity.Above-mentioned heat radiation wing plate is made primarily of aluminium, not only can make heat radiation wing plate lighter weight, and silicon, copper, manganese, titanium, adding of iron can make heat radiation wing plate have larger intensity, in addition, the fatigue-resistance characteristics of heat radiation wing plate can be improved the adding of chromium, zinc, zirconium, make heat radiation wing plate have good mechanical property.
And for example, dispel the heat described in each wing plate also extended some radiating fins, and such as, in this heat radiation wing plate, the area of described radiating fin is the 0.2%-0.8% of the area of described heat radiation wing plate; Such as, the area of described radiating fin is the 0.5%-0.6% of the area of described heat radiation wing plate.And for example, the gross area of each described radiating fin is the 60%-95% of the area of described heat radiation wing plate.
And for example, radiating fin comprises: superpose the first rete of setting, the second rete, third membrane layer, the 4th rete and the 5th rete successively, namely the first rete, the second rete, third membrane layer, the 4th rete and the 5th rete superpose attaching successively, that is, second rete is attached on the first rete, third membrane layer is attached on the second rete, and the 4th rete is attached in third membrane layer, and the 5th rete is attached on the 4th rete.
Such as, first rete of an embodiment of the present invention, it comprises each component of following mass parts: 40 parts ~ 70 parts, carborundum, alundum (Al2O3) 13 parts ~ 55 parts, silica 2 parts ~ 15 parts, binding agent 3 parts ~ 25 parts, kaolin 2 parts ~ 20 parts, 0.5 part ~ 2 parts, magnesia, 0.5 part ~ 2 parts, Dongyang soil, light weight calcium 0.5 part ~ 2 parts and rare earth oxide 0.2 part ~ 0.5% part.
Above-mentioned first rete utilizes carborundum as primary raw material, and mix the raw material that remaining may be used for preparing pottery, thus thermal conductivity factor is high, good insulation preformance, thermal coefficient of expansion are low and the good advantage of heat resistance to make above-mentioned first rete possess simultaneously, in addition, above-mentioned first rete also has the advantage being easy to the manufacturing and low cost of manufacture.
Preferably, first rete of an embodiment of the present invention comprises each component of following mass parts: 50 parts ~ 60 parts, carborundum, alundum (Al2O3) 30 parts ~ 50 parts, silica 10 part ~ 15 parts, binding agent 10 parts ~ 20 parts, kaolin 15 parts ~ 20 parts, 1 part ~ 1.5 parts, magnesia, 1 part ~ 1.5 parts, Dongyang soil, light weight calcium 1 part ~ 1.5 parts and rare earth oxide 0.3 part ~ 0.4% part.
Preferably, first rete of an embodiment of the present invention comprises each component of following mass parts: 55 parts, carborundum, alundum (Al2O3) 40 parts, silica 13 parts, binding agent 15 parts, kaolin 18 parts, 1.5 parts, magnesia, 1.5 parts, Dongyang soil, light weight calcium 1.5 parts and rare earth oxide 0.3 part.
Such as, the invention provides a kind of second rete, it is high that it has thermal conductivity factor, the advantage of perfect heat-dissipating and good mechanical property, so, when the heat absorbed is directly passed to described second rete by described first rete, the heat that so described first rete absorbs just can be delivered to rapidly on described second rete, and in the process of heat conduction, based on the heat dispersion that described second rete is excellent, can also by the heat loss on described second rete in the air in the external world.Secondly, because described second rete is also in the distance relatively near with LED, the temperature of itself also can be higher, but, based on the thermal coefficient of expansion that described second rete is lower, just can avoid producing gap between described second rete and described third membrane layer, ensure that the compactness of both laminatings.
Such as, second rete of an embodiment of the present invention, it comprises each component of following mass parts: Graphene 80 parts ~ 95 parts, CNT 0.1 part ~ 20 parts and carbon nano-fiber 0.1 part ~ 20 parts.
Above-mentioned second rete is by adopting Graphene to be primary raw material, and its thermal conductivity factor is greatly improved, and heat-conducting effect is better.In addition, then pass through to add CNT and carbon fiber, can form heat dissipation channel, heat dispersion is also better.
Preferably, the second rete comprises each component of following mass parts: Graphene 85 parts ~ 90 parts, CNT 5 parts ~ 15 parts and carbon nano-fiber 5 parts ~ 15 parts.
Preferably, Graphene 90 parts, CNT 10 parts and carbon nano-fiber 10 parts.
Such as, the invention provides a kind of third membrane layer, it is high that it has thermal conductivity factor, perfect heat-dissipating, good mechanical property and lower-cost advantage, so, when the heat of described second rete passes to described third membrane layer, the heat that so described second rete absorbs just can more promptly be delivered in described third membrane layer, and in the process of heat transfer, the heat of part also can be directly delivered in extraneous air by described third membrane layer.
Such as, the third membrane layer of an embodiment of the present invention, it comprises each component of following mass parts: copper 93 parts ~ 97 parts, 2 parts ~ 4.5 parts, aluminium, 0.1 part ~ 0.3 part, nickel, 0.1 part ~ 0.4 part, manganese, titanium 0.1 part ~ 0.3 part, chromium 0.1 part ~ 0.3 part and vanadium 0.1 part ~ 0.3 part.
Above-mentioned third membrane layer contains copper (Cu) can make the heat conductivility of third membrane layer remain on a higher level.When the mass parts of copper is 93 parts ~ 97 parts, the coefficient of heat conduction of described third membrane layer can reach more than 380W/mK, the heat that can come described second rete transmits more quickly passes, and then be evenly dispersed in the structure of described third membrane layer entirety, to prevent from the contact position of heat between described second rete and described third membrane layer accumulates, cause the generation of hot-spot phenomenon.And the density of described third membrane layer but only has 8.0kg/m
3~ 8.1kg/m
3, be far smaller than the density of fine copper, effectively can alleviate the weight of described third membrane layer like this, be more conducive to manufacture is installed, also greatly reduce cost simultaneously.In addition, described third membrane layer contains the vanadium that mass parts is the aluminium of 2 parts ~ 4.5 parts, the nickel of 0.1 part ~ 0.3 part, the manganese of 0.1 part ~ 0.4 part, the titanium of 0.1 part ~ 0.3 part, the chromium of 0.1 part ~ 0.3 part and 0.1 part ~ 0.3 part.Relative to fine copper, the ductility of third membrane layer, toughness, intensity and resistance to elevated temperatures improve all greatly, and not easy-sintering.
In order to make described third membrane layer have performance better, such as, described third membrane layer contains the nickel that mass parts is 0.1 part ~ 0.3 part, can improve the resistance to elevated temperatures of third membrane layer.And for example, it is that the vanadium of 0.2 part ~ 1.2 parts can suppress third membrane layer grain growth that third membrane layer contains mass parts, obtains more tiny grain structure, to reduce the fragility of described third membrane layer, improve the mechanical property of described third membrane layer entirety, to improve toughness and intensity.And for example, described third membrane layer contains the titanium that mass parts is 0.1 part ~ 0.3 part, can make the crystal grain miniaturization of described third membrane layer, to improve the ductility of described third membrane layer; And for example, described third membrane layer also comprises the silicon (Si) that mass parts is 1 part ~ 2.5 parts, when described third membrane layer contains appropriate silicon, under the prerequisite not affecting described third membrane layer heat conductivility, can effectively promote hardness and the abrasion resistance of described third membrane layer.But, through repeatedly theory analysis and experiment evidence find, when in third membrane layer, the quality of silicon is too many, such as, when mass percent is more than more than 15 parts, can make the appearance distribution black particles of third membrane layer, and ductility reduces, and is unfavorable for the producing shaped of described third membrane layer.
Preferably, described third membrane layer comprises each component of following mass parts: copper 94 parts ~ 96 parts, 3 parts ~ 4 parts, aluminium, 0.2 part ~ 0.3 part, nickel, 0.2 part ~ 0.3 part, manganese, titanium 0.2 part ~ 0.3 part, chromium 0.2 part ~ 0.3 part and vanadium 0.2 part ~ 0.3 part.
Preferably, described third membrane layer comprises each component of following mass parts: copper 95 parts, 3.5 parts, aluminium, 0.3 part, nickel, 0.2 part ~ 0.3 part, manganese, titanium 0.2 part ~ 0.3 part, chromium 0.2 part ~ 0.3 part and vanadium 0.2 part ~ 0.3 part.
It should be noted that, heat is through three first layers, namely described first rete is respectively, after described second rete and described third membrane layer, have relatively large a part of heat to be dissipated in transmission in air dielectric, in addition, primary raw material due to described third membrane layer is copper, its heavier mass, therefore, when relatively little based on described 4th convection burden, described 4th rete can use radiating effect better, lighter in weight, lower-cost material, reduce costs and weight to reach, and obtain the effect of better heat dispersion.
Such as, the invention provides a kind of 4th rete, it is better that it has radiating effect, lighter in weight and lower-cost advantage, so, when the heat of described third membrane layer transmits described 4th rete, so described 4th rete can by the heat loss of the overwhelming majority in air dielectric, to coordinate described first rete, described second rete and described third membrane layer complete the effect of gradient heat transfer, like this, can for different heat regions, realize the gradient transmission of heat and lost effect, solve traditional heat sinks insulated with material poor, cost is high, quality weight, the problem of heat conduction and radiating effect difference.
Such as, 4th rete of an embodiment of the present invention, it comprises each component of following mass parts: copper 47 parts ~ 50 parts, 49 parts ~ 52 parts, aluminium, 0.2 part ~ 0.7 part, magnesium, iron 0.2 part ~ 0.7 part, 0.2 part ~ 0.5 part, manganese, titanium 0.1 part ~ 0.3 part, chromium 0.05 part ~ 0.1 part and vanadium 0.1 part ~ 0.3 part.
It is the copper of 47 parts ~ 50 parts and the aluminium of 49 parts ~ 52 parts that above-mentioned 4th rete contains mass parts, the coefficient of heat conduction of described 4th rete can be made to remain on 300W/mK ~ 350W/mK, to ensure that the heat passed over by described third membrane layer can be dissipated in air dielectric by described 4th rete rapidly, and then prevent heat from piling up on described 4th rete, cause hot-spot phenomenon to produce.Relative to prior art, merely adopt price costly and the larger copper of quality, above-mentioned 4th rete both had good heat dissipation effect, can rapidly by heat loss in air, there is again lighter weight, be convenient to install casting, advantage that price is cheaper.Meanwhile, relative to prior art, merely adopt the aluminium alloy that radiating effect is poor, above-mentioned 4th rete has better heat transfer property.In addition, it is the magnesium of 0.2 part ~ 0.7 part, the iron of 0.2 part ~ 0.7 part, the manganese of 0.2 part ~ 0.5 part, the titanium of 0.1 part ~ 0.3 part, the chromium of 0.05 part ~ 0.1 part and the vanadium of 0.1 part ~ 0.3 that 4th rete contains mass parts, improves the yield strength of the 4th rete, tensile strength and resistance to elevated temperatures.Such as, find through many experiments evidence and theory analysis, the 4th rete contains the magnesium that mass parts is 0.2 part ~ 0.7 part, can give the 4th rete yield strength and tensile strength to a certain extent.
Preferably, described 4th rete comprises each component of following mass parts: copper 48 parts ~ 49 parts, 50 parts ~ 52 parts, aluminium, 0.2 part ~ 0.5 part, magnesium, iron 0.2 part ~ 0.5 part, 0.3 part ~ 0.5 part, manganese, titanium 0.2 part ~ 0.3 part, chromium 0.05 part ~ 0.08 part and vanadium 0.2 part ~ 0.3 part.
Preferably, described 4th rete comprises each component of following mass parts: copper 48 parts, 51 parts, aluminium, 0.3 part, magnesium, iron 0.3 part, 0.4 part, manganese, titanium 0.4 part, chromium 0.08 part and vanadium 0.3 part.
In order to alleviate the weight of described 4th rete further, and obtain good radiating effect, such as, the present invention also provides auxiliary 4th rete, and described auxiliary 4th rete is arranged at described 4th rete away from described third membrane layer one side.
Such as, auxiliary 4th rete of an embodiment of the present invention, it comprises each component of following mass parts: 88 parts ~ 93 parts, aluminium, silicon 5.5 parts ~ 10.5 parts, 0.3 part ~ 0.7 part, magnesium, copper 0.05 part ~ 0.3 part, iron 0.2 part ~ 0.8 part, 0.2 part ~ 0.5 part, manganese, titanium 0.05 part ~ 0.3 part, chromium 0.05 part ~ 0.1 part and vanadium 0.05 part ~ 0.3 part.
Above-mentioned auxiliary 4th rete contains the aluminium that mass parts is 88 parts ~ 93 parts, the coefficient of heat conduction of auxiliary 4th rete can be made to remain on 200W/mK ~ 220W/mK, radiating effect is better, the needs be delivered to by after-heat in air dielectric can be met, simultaneously, its quality is lighter, is more conducive to transport.In addition, auxiliary 4th rete contains the vanadium that mass parts is the silicon of 5.5 parts ~ 10.5 parts, the magnesium of 0.3 part ~ 0.7 part, the copper of 0.05 part ~ 0.3 part, the iron of 0.2 part ~ 0.8 part, the manganese of 0.2 part ~ 0.5 part, the titanium of 0.05 part ~ 0.3 part, the chromium of 0.05 part ~ 0.1 part and 0.05 part ~ 0.3 part, greatly can improve the heat dispersion of auxiliary 4th rete.Such as, it is the silicon of 5.5 parts ~ 10.5 parts and the copper of 0.05 part ~ 0.3 part that auxiliary 4th rete contains mass parts, can guarantee that auxiliary 4th rete has the advantage of good mechanical properties and lighter weight, meanwhile, the heat dispersion of auxiliary 4th rete can also be improved further.And for example, auxiliary 4th rete also comprises the lead that mass parts is 0.3 part ~ 0.6 part, when the lead of assisting the 4th rete to contain 0.3 part ~ 0.6 part can improve the tensile strength of auxiliary 4th rete, like this, can prevent when auxiliary 4th rete is cast strike out sheet or membranaceous structure time, be subject to excessive punching press and pull stress and rupture.And for example, auxiliary 4th rete also comprises the niobium that mass parts is 0.02 part ~ 0.04 part, when the mass parts of niobium is greater than 0.02 part, greatly can improve the antioxygenic property of auxiliary 4th rete, but, when the mass parts of niobium is greater than 0.04 part, the magnetic of auxiliary 4th rete can be caused sharply to increase, can have an impact to miscellaneous part.And for example, auxiliary 4th rete also comprises the germanium that mass parts is 0.02 part ~ 0.03 part, when the mass parts of germanium is greater than 0.02 part, beyond thought effect can be played to the raising of the heat dispersion of auxiliary 4th rete, but, when the quality accounting of germanium is too much, such as, when the mass parts of germanium is greater than 2 parts, the brittleness of auxiliary 4th rete can be made again to increase.
It should be noted that, because heat is through first four layers, namely after described first rete, described second rete, described third membrane layer and described 4th rete, greatly the heat of a part has been lost in extraneous air.Therefore; heat radiation burden based on described 5th rete is relatively little; and self-temperature lower when; when the impact of the larger generation of thermal coefficient of expansion is minimum; the plastic material that described third membrane layer can use current market the most frequently used; reduce costs and weight to reach, and obtain better surface protection performance.
Such as; the invention provides a kind of 5th rete; it is good that it has surface protection performance; the lower advantage of lighter in weight, cost; so, when described 5th rete is positioned at the outermost layer of described radiating fin, good heat dispersion can be had; good surface protection performance, lighter weight and lower cost.
Such as, 5th rete of an embodiment of the present invention, it comprises each component of following mass parts: described 5th rete comprises each component of following mass parts: 20 parts ~ 40 parts, graphite, 20 parts ~ 30 parts, carbon fiber, polyamide 40 parts ~ 60 parts, water-soluble silicate 10 parts ~ 20 parts, hexagonal boron nitride 1 part ~ 8 parts, BMI 2 parts ~ 5 parts, silane coupler 0.5 part ~ 2 parts, 0.25 part ~ 1 part, antioxidant.
When above-mentioned water-soluble silicate mixes with graphite and carbon fiber, under the high temperature conditions can with the generation copolyreaction of polyamide, form heat dissipation channel, thus improve heat dispersion, and the structure of more fluffy sky, quality is lighter.In addition, owing to the addition of carbon fiber, its surface protection performance and mechanical performance are better, such as, more anti-oxidant, and more acid and alkali-resistance is more corrosion-resistant.
Preferably, described 5th rete comprises each component of following mass parts: 30 parts ~ 35 parts, graphite, 25 parts ~ 30 parts, carbon fiber, polyamide 45 parts ~ 50 parts, water-soluble silicate 15 parts ~ 20 parts, hexagonal boron nitride 4 parts ~ 6 parts, BMI 3 parts ~ 4 parts, silane coupler 1 part ~ 1.5 parts, 0.5 part ~ 1 part, antioxidant.
Preferably, described 5th rete comprises each component of following mass parts: 35 parts, graphite, 28 parts, carbon fiber, polyamide 45 parts, water-soluble silicate 18 parts, hexagonal boron nitride 5 parts, BMI 3.5 parts, silane coupler 1.8 parts, 0.7 part, antioxidant.
In order to make described first rete better, described second rete, described third membrane layer, heat conduction and the sinking path of described 4th rete and described 5th rete are optimized more, therefore, considering cost, weight, heat conduction and radiating effect, and when surface protection performance, described second rete of an embodiment of the present invention, described third membrane layer, described 4th rete and described 5th thicknesses of layers ratio are 1 ~ 1.5:8 ~ 12:5 ~ 7:6 ~ 10:2 ~ 2.5, so, described first rete can be made, described second rete, described third membrane layer, heat conduction and the sinking path of described 4th rete and described 5th rete are optimized more.
In order to make each Rotating fields of described radiating fin, i.e. described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete are fixed together better, to improve Stability Analysis of Structures performance, such as, described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete be provided with inserted tooth and caulking groove between adjacent interfaces between two, when adjacent two layers structure is fitted, inserted tooth is embedded in caulking groove, each Rotating fields of described radiating fin can be made like this, i.e. described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete are fixed together better, to improve Stability Analysis of Structures performance.And for example, described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete be provided with buckle and draw-in groove between adjacent interfaces between two, when adjacent two layers structure is fitted, buckle is embedded in draw-in groove, each Rotating fields of described radiating fin can be made like this, namely described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete are fixed together, better to improve Stability Analysis of Structures performance further.
In order to make described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete be fixed together further, to improve structural stability further, and reduce the impact on described radiating fin heat conduction and heat transfer property.
Such as, first filling adhesive layer is set between the first rete and the second rete, second filling adhesive layer is set between the second rete and third membrane layer, is provided with the 3rd between third membrane layer and the 4th rete and fills adhesive layer, arrange the 4th between the 4th rete and the 5th rete and fill adhesive layer.Be appreciated that, first rete, the second rete, the second rete, third membrane layer, the 4th rete and the 5th rete there is the small and a fairly large number of gap of structure between two between adjacent interfaces, its reason is mainly, due to the binding face defective tightness of above-mentioned layers of material, and the first filling adhesive layer, second fills adhesive layer by arranging, the 3rd filling adhesive layer and the 4th is filled adhesive layer and can be filled these gaps preferably, also play the effect of bonding simultaneously.
Such as, the invention provides an embodiment described first fills adhesive layer, it comprises each component of following mass parts: nano alumina particles 300 parts ~ 1000 parts, methyl vinyl silicone rubber 5 parts ~ 30 parts, vinyl silicone oil 10 parts ~ 50 parts, dimethicone 10 parts ~ 100 parts and MQ silicones 1 part ~ 20 parts.
Preferably, described first filling adhesive layer comprises each component of following mass parts: nano alumina particles 800 parts ~ 1000 parts, methyl vinyl silicone rubber 20 parts ~ 30 parts, vinyl silicone oil 40 parts ~ 50 parts, dimethicone 80 parts ~ 100 parts and MQ silicones 15 parts ~ 20 parts.
Preferably, described first filling adhesive layer comprises each component of following mass parts: nano alumina particles 900 parts, methyl vinyl silicone rubber 25 parts, vinyl silicone oil 45 parts, dimethicone 85 parts and MQ silicones 20 parts.
Such as, the invention provides an embodiment described second fills adhesive layer, it comprises each component of following mass parts: nano alumina particles 200 parts ~ 800 parts, methyl vinyl silicone rubber 10 parts ~ 40 parts, vinyl silicone oil 10 parts ~ 50 parts, dimethicone 10 parts ~ 100 parts and MQ silicones 1 part ~ 20 parts;
Preferably, described second filling adhesive layer comprises each component of following mass parts: nano alumina particles 500 parts ~ 700 parts, methyl vinyl silicone rubber 20 parts ~ 30 parts, vinyl silicone oil 30 parts ~ 40 parts, dimethicone 50 parts ~ 80 parts and MQ silicones 10 parts ~ 15 parts.
Preferably, described second filling adhesive layer comprises each component of following mass parts: nano alumina particles 600 parts, methyl vinyl silicone rubber 15 parts, vinyl silicone oil 35 parts, dimethicone 65 parts and MQ silicones 15 parts.
Such as, the invention provides an embodiment the described 3rd fills adhesive layer, it comprises each component of following mass parts: nano alumina particles 200 parts ~ 700 parts, methyl vinyl silicone rubber 10 parts ~ 40 parts, vinyl silicone oil 10 parts ~ 50 parts, dimethicone 10 parts ~ 100 parts and MQ silicones 1 part ~ 20 parts.
Preferably, described 3rd filling adhesive layer comprises each component of following mass parts: nano alumina particles 200 parts ~ 600 parts, methyl vinyl silicone rubber 20 parts ~ 40 parts, vinyl silicone oil 20 parts ~ 50 parts, dimethicone 30 parts ~ 100 parts and MQ silicones 5 parts ~ 10 parts.
Preferably, described 3rd filling adhesive layer comprises each component of following mass parts: nano alumina particles 500 parts, methyl vinyl silicone rubber 25 parts, vinyl silicone oil 25 parts, dimethicone 30 parts and MQ silicones 8 parts.
Such as, the invention provides an embodiment the described 4th fills adhesive layer, it comprises each component of following mass parts: nano alumina particles 150 parts ~ 700 parts, methyl vinyl silicone rubber 15 parts ~ 45 parts, vinyl silicone oil 10 parts ~ 50 parts, dimethicone 10 parts ~ 100 parts and MQ silicones 1 part ~ 20 parts.
Preferably, described 4th filling adhesive layer comprises each component of following mass parts: nano alumina particles 150 parts ~ 450 parts, methyl vinyl silicone rubber 15 parts ~ 25 parts, vinyl silicone oil 10 parts ~ 25 parts, dimethicone 80 parts ~ 100 parts and MQ silicones 1 part ~ 10 parts.
Preferably, described 4th filling adhesive layer comprises each component of following mass parts: nano alumina particles 250 parts, methyl vinyl silicone rubber 18 parts, vinyl silicone oil 20 parts, dimethicone 95 parts and MQ silicones 5 parts.
Above-mentioned first fills adhesive layer, the second filling adhesive layer, the 3rd fills adhesive layer and the 4th filling adhesive layer is all matrix material with organic siliconresin, and adds the nano alumina particles with better heat-conducting effect.By adding conduction powder nano aluminium oxide in organic siliconresin matrix, thus it is stronger to prepare bonding force, thermal conductivity factor height fills jointing material, and then described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete can be made better to be fixed together, to improve structural stability further.
Require emphasis time, first fills adhesive layer, the second filling adhesive layer, the 3rd fills adhesive layer and the 4th content of filling nano alumina particles in adhesive layer successively decreases successively, because heat load is also successively decrease successively from the first rete, the second rete, third membrane layer, the 4th rete to described 5th rete, like this, the effect of gradient heat conduction and heat radiation can be got better.
Described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete is held in order to sticky better, avoid increasing excessive thickness simultaneously, and the impact reduced heat conduction and heat dispersion, such as, described first fills adhesive layer, described second filling adhesive layer, the described 3rd fills adhesive layer and the 4th Thickness Ratio of filling adhesive layer is 1 ~ 1.5:2 ~ 2.5:3 ~ 3.5:4 ~ 4.5, and for example, the described first Thickness Ratio of filling adhesive layer and described first rete is 1:50 ~ 80.
Above-mentioned radiating fin arranges the first rete, the second rete, third membrane layer, the 4th rete and the 5th rete by superposition successively, can obtain good insulating, the coefficient of expansion is low, thermal conductivity factor is large, the advantage of good heat dissipation effect and light weight.
And for example, the present invention also provides a kind of preparation method of heat sink, and it comprises the steps: aluminium, zinc, copper, boron, nickel, manganese and chromium to drop into by weight ratio in stove, is heated to 1100 DEG C ~ 1200 DEG C under nitrogen atmosphere;
Fusion change into aluminum alloy melt after in-furnace temperature is reduced to 710 DEG C ~ 750 DEG C, in aluminum alloy melt, add refining agent, refining, after 10 ~ 15 minutes, is skimmed;
In-furnace temperature is controlled at 750 DEG C ~ 770 DEG C, leave standstill 25 ~ 35 minutes, degasification, to skim;
Temperature is controlled at 550 DEG C, Ageing Treatment 10 hours;
Speed cold casting, obtains substrate;
Graphene solution is coated on substrate, obtain heat sink.
Embodiment one
1, the making of substrate:
According to weight portion: aluminium: 77.8 parts; Zinc: 12 parts; Copper: 9 parts; Boron: 0.3 part; Nickel: 0.05 part; Manganese: 0.5 part; Chromium: 0.05 part, adds after preparing burden in stove, is heated to 1100 DEG C ~ 1200 DEG C under nitrogen atmosphere.
Fusion change into aluminum alloy melt after in-furnace temperature is reduced to 710 DEG C ~ 750 DEG C, in aluminum alloy melt, add refining agent, refining, after 15 ~ 25 minutes, is skimmed.
Such as, by powder spraying pot, refining agent is evenly advertised refining to aluminum alloy melt, during refining, nitrogen pressure is 0.2MPa, and nitrogen gas purity is greater than 99 parts.And for example, the scum silica frost on aluminum alloy melt surface, after 15 ~ 25 minutes, is removed by refining.
In-furnace temperature is controlled at 750 DEG C ~ 770 DEG C, leave standstill 25 ~ 35 minutes, degasification, to skim.
Particularly, after having left standstill, immediately online degasification is carried out to aluminum alloy melt.Wherein, online degasification adopts the online off gas system of secondary, namely first adopts argon gas to carry out one-level degasification with chlorine flowrate than the mist for 1:0.02, then adopts argon gas to carry out secondary degasification.After degasification completes, put stove, carry out immediately taking off Slag treatment.
Temperature is controlled at 550 DEG C, Ageing Treatment 10 hours.
Speed cold casting, obtains substrate.
Such as, spraying cooling liquid during extruding, makes material temperature be reduced to room temperature rapidly, like this, can prevent coarse grains from reducing ductility and the processability of material.
2, the configuration of graphene solution:
According to weight portion: Graphene: 15 parts, epoxy acrylic resin: 50 parts, Sodium Polyacrylate: 0.25 part, isopropyl alcohol: 34 parts, mix, be added to mixer, controls rotating speed 1000rpm, mixing time 1 hour;
Continue to add polyvinylpyrrolidone (PVP) in mixer: 0.25 part, benzyl carbinol oleate: 0.5 part, controlling rotating speed is 800 revs/min, stirs 0.5 hour, obtains graphene solution.
3, graphene solution is coated on substrate, obtain heat sink.
Such as, graphene solution is coated on substrate by the mode adopting EFI to be coated with, and after room temperature airing, obtains heat sink.In the present embodiment, the thickness of coating is 10 microns.
Embodiment two
1, the making of substrate:
According to weight portion: aluminium: 69.7 parts; Zinc: 18 parts; Copper: 10.5 parts; Boron: 0.7 part; Nickel: 0.05 part; Manganese: 1.0 parts; Chromium: 0.05 part, adds after preparing burden in stove, is heated to 1100 DEG C ~ 1200 under nitrogen atmosphere.
Fusion change into aluminum alloy melt after in-furnace temperature is reduced to 710 DEG C ~ 750 DEG C, in aluminum alloy melt, add refining agent, refining, after 15 ~ 25 minutes, is skimmed.
Such as, by powder spraying pot, refining agent is evenly advertised refining to aluminum alloy melt, during refining, nitrogen pressure is 0.2MPa, and nitrogen gas purity is greater than 99 parts.And for example, the scum silica frost on aluminum alloy melt surface, after 15 ~ 25 minutes, is removed by refining.
In-furnace temperature is controlled at 750 DEG C ~ 770 DEG C, leave standstill 25 ~ 35 minutes, degasification, to skim.
Such as, after having left standstill, immediately online degasification is carried out to aluminum alloy melt.Wherein, online degasification adopts the online off gas system of secondary, namely adopts argon gas to carry out one-level degasification with chlorine flowrate than the mist for 1:0.02, adopts argon gas to carry out secondary degasification, like this, degassing effect can be made better, reduce Dissolved H in Liquid Al-Si Alloy content.
After degasification completes, put stove, carry out immediately taking off Slag treatment.
Temperature is controlled at 550 DEG C, Ageing Treatment 10 hours.
Speed cold casting, obtains substrate.
Such as, spraying cooling liquid during extruding, makes material temperature be reduced to room temperature rapidly, like this, can prevent coarse grains from reducing ductility and the processability of material.
2, the configuration of graphene solution:
According to weight portion: Graphene: 10 parts, Kynoar (PVDF): 30 parts, neopelex: 0.15 part, water: 57.6 parts, mix, be added to mixer, controls rotating speed 1000rpm, mixing time 1 hour;
Continue to add polyvinyl chloride (PVC) in mixer: 0.45 part, dimethicone: 2 parts, control rotating speed 800rpm, mixing time 0.5 hour, obtains graphene solution.
3, graphene solution is coated on substrate, obtain heat sink.
In the present embodiment, adopt the mode of spin coating to coat on substrate by graphene solution, room temperature airing obtains heat sink.In the present embodiment, the thickness of coating is 50 microns.
Embodiment three
1, the making of substrate:
According to weight portion: aluminium: 72 parts; Zinc: 15 parts; Copper: 11 parts; Boron: 0.35 part; Nickel: 0.3 part; Manganese: 1.2 parts; Chromium: 0.15 part, adds after preparing burden in stove, is heated to 1100 DEG C ~ 1200 under nitrogen atmosphere.
Fusion change into aluminum alloy melt after in-furnace temperature is reduced to 710 DEG C ~ 750 DEG C, in aluminum alloy melt, add refining agent, refining, after 15 ~ 25 minutes, is skimmed.
Such as, by powder spraying pot, refining agent is evenly advertised refining to aluminum alloy melt, during refining, nitrogen pressure is 0.2MPa, and nitrogen gas purity is greater than 99 parts.And for example, the scum silica frost on aluminum alloy melt surface, after 15 ~ 25 minutes, is removed by refining.
In-furnace temperature is controlled at 750 DEG C ~ 770 DEG C, leave standstill 25 ~ 35 minutes, degasification, to skim.
Particularly, after having left standstill, immediately online degasification is carried out to aluminum alloy melt.Wherein, online degasification adopts the online off gas system of secondary, namely first adopts argon gas to carry out one-level degasification with chlorine flowrate than the mist for 1:0.02, then adopts argon gas to carry out secondary degasification.After degasification completes, put stove, carry out immediately taking off Slag treatment.
Temperature is controlled at 550 DEG C, Ageing Treatment 10 hours.
Speed cold casting, obtains substrate.
Such as, spraying cooling liquid during extruding, makes material temperature be reduced to room temperature rapidly, like this, can prevent coarse grains from reducing ductility and the processability of material.
2, the configuration of graphene solution:
According to weight portion: Graphene: 5 parts, polyurethanes (PU): 20 parts, sodium alginate: 0.2 part, butanone: 69 parts, mix, be added to mixer, controls rotating speed 1000rpm, mixing time 1 hour;
Continue to add polyethylene glycol oxide (PEO) in mixer: 0.8 part, GP defoamer: 5 parts, control rotating speed 800rpm, mixing time 0.5 hour, obtains graphene solution.
3, graphene solution is coated on substrate, obtain heat sink.
In the present embodiment, graphene solution is coated on substrate by the mode adopting EFI to be coated with, and room temperature airing obtains heat sink.The thickness of coating is 40 microns.
Embodiment four
1, the making of substrate:
According to weight portion: aluminium: 69.4 parts; Zinc: 19 parts; Copper: 9.5 parts; Boron: 0.5 part; Nickel: 0.3 part; Manganese: 1.2 parts; Chromium: 0.1 part, adds after preparing burden in stove, is heated to 1100 DEG C ~ 1200 under nitrogen atmosphere.
Fusion change into aluminum alloy melt after in-furnace temperature is reduced to 710 DEG C ~ 750 DEG C, in aluminum alloy melt, add refining agent, refining, after 15 ~ 25 minutes, is skimmed.
Such as, by powder spraying pot, refining agent is evenly advertised refining to aluminum alloy melt, during refining, nitrogen pressure is 0.2MPa, and nitrogen gas purity is greater than 99 parts.And for example, the scum silica frost on aluminum alloy melt surface, after 15 ~ 25 minutes, is removed by refining.
In-furnace temperature is controlled at 750 DEG C ~ 770 DEG C, leave standstill 25 ~ 35 minutes, degasification, to skim.
Particularly, after having left standstill, immediately online degasification is carried out to aluminum alloy melt.Wherein, online degasification adopts the online off gas system of secondary, namely first adopts argon gas to carry out one-level degasification with chlorine flowrate than the mist for 1:0.02, then adopts argon gas to carry out secondary degasification.After degasification completes, put stove, carry out immediately taking off Slag treatment.
Temperature is controlled at 550 DEG C, Ageing Treatment 10 hours.
Speed cold casting, obtains substrate.
Such as, spraying cooling liquid during extruding, makes material temperature be reduced to room temperature rapidly, like this, can prevent coarse grains from reducing ductility and the processability of material.
2, the configuration of graphene solution:
According to weight portion: Graphene: 12 parts, Kynoar (PVDF): 40 parts, sodium carboxymethylcellulose: 0.2 part, dimethylbenzene: 42.3 parts, mix, be added to mixer, controls rotating speed 1200rpm, mixing time 1 hour,
Continue to add polyethylene glycol (PEG) to mixer: 0.5 part, dimethyl silicone polymer: 5 parts, control rotating speed 800rpm, mixing time 0.5 hour, obtains graphene solution.
3, graphene solution is coated on substrate, obtain heat sink.
In the present embodiment, graphene solution is coated on substrate by the mode adopting EFI to be coated with, and room temperature airing obtains heat sink.The thickness of coating is 12 microns.
Embodiment five
1, the making of substrate:
According to weight portion: aluminium: 71.2 parts; Zinc: 17 parts; Copper: 10 parts; Boron: 0.45 part; Nickel: 0.2 part; Manganese: 1.0 parts; Chromium: 0.15 part, adds after preparing burden in stove, is heated to 1100 DEG C ~ 1200 under nitrogen atmosphere.
Fusion change into aluminum alloy melt after in-furnace temperature is reduced to 710 DEG C ~ 750 DEG C, in aluminum alloy melt, add refining agent, refining, after 15 ~ 25 minutes, is skimmed.
Such as, by powder spraying pot, refining agent is evenly advertised refining to aluminum alloy melt, during refining, nitrogen pressure is 0.2MPa, and nitrogen gas purity is greater than 99 parts.And for example, the scum silica frost on aluminum alloy melt surface, after 15 ~ 25 minutes, is removed by refining.
In-furnace temperature is controlled at 750 DEG C ~ 770 DEG C, leave standstill 25 ~ 35 minutes, degasification, to skim.
Particularly, after having left standstill, immediately online degasification is carried out to aluminum alloy melt.Wherein, online degasification adopts the online off gas system of secondary, namely first adopts argon gas to carry out one-level degasification with chlorine flowrate than the mist for 1:0.02, then adopts argon gas to carry out secondary degasification.After degasification completes, put stove, carry out immediately taking off Slag treatment.
Temperature is controlled at 550 DEG C, Ageing Treatment 10 hours.
Speed cold casting, obtains substrate.
Such as, spraying cooling liquid during extruding, makes material temperature be reduced to room temperature rapidly, like this, can prevent coarse grains from reducing ductility and the processability of material.
2, the configuration of graphene solution:
According to weight portion: Graphene: 15 parts, butadiene-styrene rubber (SBR): 60 parts, odium stearate: 0.3 part, isopropyl alcohol: 29.1 parts, mix, be added to mixer, controls rotating speed 1000rpm, mixing time 1 hour;
Continue to add Tissuemat E: 0.6 part in mixer, GP defoamer: 5 parts, control rotating speed 800rpm, mixing time 1 hour, obtains graphene solution.
3, graphene solution is coated on substrate, obtain heat sink.
In the present embodiment, graphene solution is coated on substrate by the mode adopting EFI to be coated with, and room temperature airing obtains heat sink.The thickness of coating is 5 microns.
Embodiment six
1, the making of substrate:
According to weight portion: aluminium: 69.3 parts; Zinc: 20 parts; Copper: 10 parts; Boron: 0.8 part; Nickel: 0.3 part; Manganese: 0.5 part; Chromium: 0.1 part, adds after preparing burden in stove, is heated to 1100 DEG C ~ 1200 under nitrogen atmosphere.
Fusion change into aluminum alloy melt after in-furnace temperature is reduced to 710 DEG C ~ 750 DEG C, in aluminum alloy melt, add refining agent, refining, after 15 ~ 25 minutes, is skimmed.
Such as, by powder spraying pot, refining agent is evenly advertised refining to aluminum alloy melt, during refining, nitrogen pressure is 0.2MPa, and nitrogen gas purity is greater than 99 parts.And for example, the scum silica frost on aluminum alloy melt surface, after 15 ~ 25 minutes, is removed by refining.
In-furnace temperature is controlled at 750 DEG C ~ 770 DEG C, leave standstill 25 ~ 35 minutes, degasification, to skim.
Particularly, after having left standstill, immediately online degasification is carried out to aluminum alloy melt.Wherein, online degasification adopts the online off gas system of secondary, namely first adopts argon gas to carry out one-level degasification with chlorine flowrate than the mist for 1:0.02, then adopts argon gas to carry out secondary degasification.After degasification completes, put stove, carry out immediately taking off Slag treatment.
Temperature is controlled at 550 DEG C, Ageing Treatment 10 hours.
Speed cold casting, obtains substrate.
Such as, spraying cooling liquid during extruding, makes material temperature be reduced to room temperature rapidly, like this, can prevent coarse grains from reducing ductility and the processability of material.
2, the configuration of graphene solution:
According to weight portion: Graphene: 5 parts, polyacrylonitrile (PAN): 70 parts, sodium cetanesulfonate: 0.2 part, water: 24.3 parts, mix, be added to mixer, controls rotating speed 1000rpm, mixing time 1 hour;
Continue to add polyethylene glycol oxide (PEO) in mixer: 0.5 part, dimethicone: 5 parts, control rotating speed 800rpm, mixing time 0.5 hour, obtains graphene solution.
3, graphene solution is coated on substrate, obtain heat sink.
In the present embodiment, adopt the mode of spin coating to coat on substrate by graphene solution, room temperature airing obtains heat sink.The thickness of coating is 24 microns.
The strength of materials is tested:
In order to measure hot strength, carry out standard tensile test at normal temperatures, the hot strength of test material is that more than 200MPa person is evaluated as well (zero), will be evaluated as bad (×) lower than 200MPa person.Test result is in table 1.
Material corrosion resistance is tested
Cut out sample by 50 × 50mm size, carry out salt spray test.The corrosion test time is set as 800 hours, and material surface is without the etch pit of the degree of depth more than 0.1mm, and sample is evaluated as well (zero); If there is the etch pit more than 0.1mm, sample is evaluated as bad (×).
Material heat dispersion is tested:
Heat sink in the various embodiments described above is positioned on heating plate with identical stainless steel substrate simultaneously, controlling temperature of heating plate is 100 DEG C, balances 30 minutes, temp.-sensing wire is fixed on the center of stainless steel substrate and substrate, utilize temperature measurer record temperature, the results are shown in Table 2.
Table 1 sample tensile strength test and salt spray test result
| Sample | Tensile strength test | Salt spray test |
| Embodiment one | ○ | ○ |
| Embodiment two | ○ | ○ |
| Embodiment three | ○ | ○ |
| Embodiment four | ○ | ○ |
| Embodiment five | ○ | ○ |
| Embodiment six | ○ | ○ |
Table 2 temperature test result
| Sample | Stainless steel substrate | Heat sink |
| Embodiment one | 98 | 83 |
| Embodiment two | 95 | 81 |
| Embodiment three | 99 | 82 |
| Embodiment four | 97 | 83 |
| Embodiment five | 98 | 85 |
| Embodiment six | 99 | 84 |
Above by the aluminum alloy materials at heat sink substrate, the content increase of zinc can mobile performance under material molten state, improve the machinability of material, the content of copper adds the intensity of material, especially elevated temperature strength, improves the ductility of this material simultaneously, the content of boron, chromium, nickel and manganese can improve the intensity of material, and nickel can also improve the natural potential of material, improve corrosion resistance, reduce the corrosion rate under the condition of high temperature.Shown by tensile strength test and salt spray test, the hot strength of heat sink of the present invention increases significantly compared with common aluminum alloy, and corrosion resistance is also significantly increased.
Graphene is a kind of carbonaceous new material by monolayer carbon atom tightly packed one-tenth bi-dimensional cellular shape lattice structure.Result of study shows, the heat conductivility of Graphene is better than CNT, the thermal conductivity factor of common CNT can reach more than 3000W/mK, what in various metal, thermal conductivity factor was relatively high has silver (429W/mK), copper (401W/mK), gold (317W/mK), aluminium (237W/mK), and the thermal conductivity factor of single-layer graphene can reach 5300W/mK.
Above-mentioned heat sink is by being coated with Graphene coating at substrate surface, utilize the thermal conductivity that Graphene is high, heat can carry out face transmission along graphene film rapidly, and be delivered to rapidly heat sink inside, shorten heat-conducting interface material or heater members to the time needed for heat sink heat transfer, improve the radiating rate of heat sink, thus reduce the temperature of heater members.
Above-mentioned heat sink is by changing the composition of substrate aluminum alloy materials, and in the graphene coated coating in heat-radiating substrate surface, heat sink not only can be made to have larger stretching energy degree, corrosion-resistant, effectively can also reduce the thermal resistance of heat sink simultaneously, thus improve the heat-sinking capability of heat sink largely.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this description is recorded.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. a heat sink, is characterized in that, comprising:
Substrate, described substrate comprises the mainboard be made up of aluminum alloy materials, and
Coating, described coating is located on described mainboard, and described coating is made after being solidified by graphene solution;
Wherein, described aluminum alloy materials comprises the composition of following mass parts:
Aluminium: 62 parts ~ 78 parts;
Zinc: 11 parts ~ 25 parts;
Copper: 9 parts ~ 11 parts;
Boron: 0.1 part ~ 0.8 part;
Nickel: 0.01 part ~ 0.4 part;
Manganese: 0.3 part ~ 1.5 parts;
Chromium: 0.01 part ~ 0.2 part.
2. heat sink according to claim 1, is characterized in that, the mass parts of boron is 0.3 part ~ 0.7 part.
3. heat sink according to claim 1, is characterized in that, the mass parts of nickel is 0.05 part ~ 0.3 part.
4. heat sink according to claim 1, is characterized in that, the mass parts of manganese is 0.5 part ~ 1.2 parts.
5. heat sink according to claim 1, is characterized in that, the mass parts of chromium is 0.05 part ~ 0.15 part.
6. heat sink according to claim 1, is characterized in that, the mass parts of zinc is 12 parts ~ 19 parts.
7. heat sink according to claim 1, is characterized in that, the mass parts of copper is 9.5 parts ~ 10.5 parts.
8. heat sink according to claim 1, is characterized in that, the thickness of described coating is 5 ~ 50 microns.
9. heat sink according to claim 1, is characterized in that, the thickness of described coating is 10 ~ 20 microns.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023892A (en) * | 2015-06-17 | 2015-11-04 | 东莞市闻誉实业有限公司 | Chip heat radiator |
| CN105090910A (en) * | 2015-08-07 | 2015-11-25 | 苏州晶雷光电照明科技有限公司 | Efficient cooling fin for high-power light-emitting diode |
| CN105177365A (en) * | 2015-08-19 | 2015-12-23 | 合肥市田源精铸有限公司 | Novel aluminum alloy material |
| CN106813521A (en) * | 2017-03-20 | 2017-06-09 | 北京化工大学 | Graphene curved surface conducts heat exchanger |
| CN110296620A (en) * | 2019-06-28 | 2019-10-01 | 河海大学常州校区 | A kind of anti-incrustation plate heat exchanger |
| CN110296621A (en) * | 2019-06-28 | 2019-10-01 | 河海大学常州校区 | A kind of anti-incrustation plate heat exchanger |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102329996A (en) * | 2011-06-23 | 2012-01-25 | 苏州方暨圆节能科技有限公司 | Antibiotic corrosion resistant aluminum alloy heat exchange plate |
| CN102330000A (en) * | 2011-06-23 | 2012-01-25 | 苏州方暨圆节能科技有限公司 | Antibiotic corrosion resistant heat exchanger aluminum pipe |
| WO2013080650A1 (en) * | 2011-12-02 | 2013-06-06 | 古河スカイ株式会社 | Aluminum alloy material and aluminum alloy structure and production process therefor |
| CN203353019U (en) * | 2013-05-28 | 2013-12-18 | 东莞劲胜精密组件股份有限公司 | Graphene metal cooling fin and electronic product cooling structure |
-
2015
- 2015-03-31 CN CN201510153283.8A patent/CN104697383B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102329996A (en) * | 2011-06-23 | 2012-01-25 | 苏州方暨圆节能科技有限公司 | Antibiotic corrosion resistant aluminum alloy heat exchange plate |
| CN102330000A (en) * | 2011-06-23 | 2012-01-25 | 苏州方暨圆节能科技有限公司 | Antibiotic corrosion resistant heat exchanger aluminum pipe |
| WO2013080650A1 (en) * | 2011-12-02 | 2013-06-06 | 古河スカイ株式会社 | Aluminum alloy material and aluminum alloy structure and production process therefor |
| CN203353019U (en) * | 2013-05-28 | 2013-12-18 | 东莞劲胜精密组件股份有限公司 | Graphene metal cooling fin and electronic product cooling structure |
Non-Patent Citations (1)
| Title |
|---|
| 常柏春: "《气焊技术》", 30 April 1983, article "《气焊技术》", pages: 10 - 249-253 * |
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| CN105023892A (en) * | 2015-06-17 | 2015-11-04 | 东莞市闻誉实业有限公司 | Chip heat radiator |
| CN105023892B (en) * | 2015-06-17 | 2018-09-18 | 东莞市闻誉实业有限公司 | Chip radiator |
| CN105090910A (en) * | 2015-08-07 | 2015-11-25 | 苏州晶雷光电照明科技有限公司 | Efficient cooling fin for high-power light-emitting diode |
| CN105177365A (en) * | 2015-08-19 | 2015-12-23 | 合肥市田源精铸有限公司 | Novel aluminum alloy material |
| CN106813521A (en) * | 2017-03-20 | 2017-06-09 | 北京化工大学 | Graphene curved surface conducts heat exchanger |
| CN110296620A (en) * | 2019-06-28 | 2019-10-01 | 河海大学常州校区 | A kind of anti-incrustation plate heat exchanger |
| CN110296621A (en) * | 2019-06-28 | 2019-10-01 | 河海大学常州校区 | A kind of anti-incrustation plate heat exchanger |
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