CN2713635Y - Radiator - Google Patents

Abstract

A heat sink for dissipating heat generated by electronic components, which includes a base and a plurality of cooling fins on the base, the bottom of the base is recessed inwardly to form a groove, the groove has a top wall and surrounding At least one side wall formed by the top wall accommodates the electronic component, and the top wall and at least one side wall are in heat conduction contact with the electronic component. The heat generated by the electronic components is transferred to the heat sink not only from the top wall but also from the side walls. Compared with the prior art, the heat transfer contact area is increased, the heat transfer speed is increased, and thus the heat dissipation effect is improved.

Description

heat sink

【Technical field】

The utility model relates to a heat sink, in particular to a heat sink used to assist electronic components to dissipate heat.

【Background technique】

With the rapid development of the electronics industry, the running speed of electronic components such as microprocessors is getting faster and faster. However, the high-frequency and high-speed operation will inevitably increase the heat generated rapidly. If the heat is not dissipated in time, it will cause The temperature rises sharply, which seriously affects the stability and performance of electronic components. On the other hand, due to the continuous advancement of large-scale integrated circuit technology, the size of electronic heating components such as microprocessors is also getting smaller and smaller, which will make electronic components The heat generated by the high-speed operation of the components is more difficult to dissipate. At present, the heat dissipation problem has become a major obstacle affecting the development of the electronics industry to the high end. Therefore, the heat dissipation device or heat dissipation system has become one of the indispensable equipment in the current electronic devices. Moreover, heat dissipation devices with high heat dissipation efficiency have always been actively researched and developed by the electronic industry.

The heat dissipation method commonly used in the industry is to install a radiator on the top surface of the electronic component. The lower surface is a plane, which is attached to the top surface of the electronic component 3 installed on the circuit board 4. A large amount of heat released by the electronic component 3 is conducted from the top surface to the base 1, and then flows rapidly from the base 1 to the The heat dissipation fins 2 are then dissipated into the environment. This kind of radiator has the advantage of being simple to manufacture, but with the increase of electronic integration, the heat emitted by electronic components per unit time and unit area is increasing, while this kind of radiator only conducts heat from the top surface of electronic components, and the heat transfer The limited contact area is increasingly unable to meet the heat dissipation requirements of high-frequency and high-speed electronic components, so another heat dissipation device with rapid heat transfer and good heat dissipation effect is needed to meet the heat dissipation requirements of electronic components.

【Content of invention】

The purpose of the utility model is to provide a radiator with rapid heat transfer and good heat dissipation effect.

The purpose of this utility model is achieved through the following technical proposals: the utility model radiator dissipates heat generated by electronic components, which includes a base and a number of cooling fins on the base, the bottom surface of the base is sunken inwards A groove is formed, the groove has a top wall and at least one side wall formed around the top wall, which accommodates the electronic component, and the top wall and at least one side wall are in heat conduction contact with the electronic component.

The top wall and at least one side wall of the groove of the radiator base of the utility model are in thermal contact with the electronic components, so that the heat generated by the electronic components is not only transmitted from the top wall but also from the side walls to the radiator, compared with the prior art , the heat transfer contact area is increased, the heat transfer speed is increased, and the heat dissipation effect is improved.

The utility model will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

【Description of drawings】

FIG. 1 is an assembly diagram of a known heat sink and related components.

Fig. 2 is a perspective view of the radiator of the present invention.

Fig. 3 is a schematic diagram of the radiator of the present invention and related components not yet assembled.

Fig. 4 is a schematic diagram of the assembly of the radiator of the present invention and related components.

【Detailed ways】

Please refer to FIGS. 2 to 4 at the same time. The heat sink 10 of the present invention is used to assist in dissipating the heat generated by the electronic components 40 disposed on the circuit board 50 during operation.

The heat sink 10 includes a base 20 and a plurality of cooling fins 30 extending on the upper surface of the base 20. The base 20 is made of a metal material with good thermal conductivity, and its bottom surface is concaved inward, forming a cross section of The square groove 21 has a top wall 22 and four side walls 24 formed around the top wall 22 .

When assembling, place the groove 21 of the heat sink 10 facing the electronic component 40 , buckle it on the electronic component 40 , and make the top wall 22 and the side wall 24 of the groove 21 adhere to the outer surface of the electronic component 40 .

In order to make the base 20 and the electronic component 40 adhere closely, a heat-conducting medium, such as heat-conducting adhesive, can be coated on the top wall 22 and the four side walls 24 of the groove 21 .

It is not difficult to see from the above that the top wall 22 and the side wall 24 of the groove 21 of the radiator 10 are in heat conduction contact with the electronic component 40, and the heat generated by the electronic component 40 is not only transferred from the top wall 22 but also from the side wall 24 to the radiator. 10. Compared with the prior art, the heat transfer contact area is increased, the heat transfer speed is increased, and thus the heat dissipation effect is improved.

It can be understood that the heat dissipation fins 30 of the radiator 10 of the present invention can be arranged on the base 20 in any manner such as welding, bonding, inserting and riveting, or can be integrally formed with the base 20, or can be formed by setting a heat pipe Connect the base 20 with the heat dissipation fins 30; the cross-section of the groove 21 is not limited to a square, and can be adjusted to other polygons such as circles and rhombuses according to actual needs, and when there are multiple side walls, as long as The thermal conduction contact between one side wall and the electronic component 40 can increase the heat transfer contact area compared with the prior art, thereby improving the heat dissipation effect.

Claims (7)

1. A heat sink that dissipates heat generated by electronic components, comprising a base and a plurality of cooling fins on the base, characterized in that: the bottom surface of the base is recessed to form a groove, the groove It has a top wall and at least one side wall formed around the top wall, which accommodates the electronic component, and the top wall and at least one side wall are in heat conduction contact with the electronic component. 2. The heat sink according to claim 1, characterized in that: the cross-section of the groove is polygonal. 3. The heat sink according to claim 2, wherein the cross-section of the groove is square. 4. The heat sink according to claim 2, characterized in that: the cross-section of the groove is rhombus. 5. The heat sink as claimed in claim 1, wherein the cross section of the groove is circular. 6. The heat sink according to claim 1, characterized in that: the top wall is coated with a heat conducting medium. 7. The heat sink according to claim 1 or 6, characterized in that: the side wall is coated with a heat conducting medium.

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