CN2672859Y - 一种大功率的微电子产品 - Google Patents

一种大功率的微电子产品 Download PDF

Info

Publication number
CN2672859Y
CN2672859Y CNU2003201227698U CN200320122769U CN2672859Y CN 2672859 Y CN2672859 Y CN 2672859Y CN U2003201227698 U CNU2003201227698 U CN U2003201227698U CN 200320122769 U CN200320122769 U CN 200320122769U CN 2672859 Y CN2672859 Y CN 2672859Y
Authority
CN
China
Prior art keywords
chip
frame
microelectronic product
pins
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2003201227698U
Other languages
English (en)
Inventor
谭小春
石景平
朱坤恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai KaiHong Technology Co Ltd
Original Assignee
Shanghai KaiHong Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai KaiHong Technology Co Ltd filed Critical Shanghai KaiHong Technology Co Ltd
Priority to CNU2003201227698U priority Critical patent/CN2672859Y/zh
Application granted granted Critical
Publication of CN2672859Y publication Critical patent/CN2672859Y/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种涉及微电子产品的装置，尤指一种放置芯片为平台结构框架的一种大功率的微电子产品。该装置由框架、引脚、芯片、焊料、桥架及本体等组成，去除原PowemiteIII器件框架两侧面的两个对称翼，通过让本体渗入框架底部台阶的新型结构，达到使引脚和本体连在一起的目的，框架内是放置芯片的平台结构，框架的另一侧面的两个引脚采用了平脚结构。本实用新型的优点：能消除塑封体内的内应力，从而达到消除芯片碎裂的缺陷，使引脚和本体连在一起，使得器件做好后，不需要引脚的成型工序，避免了在引脚成型过程中器件的损坏，本实用新型结构简单，易于实施，并降低了制造成本。

Description

一种大功率的微电子产品
技术领域
本实用新型涉及一种大功率的表面贴装器件，尤指一种安装芯片的平台能消除内部应力，加工简单的一种大功率的微电子产品。
背景技术
美国专利号：6,608,373揭示了一种功率器件，如图1、2所示，在功率器件的侧面有折弯的引脚1。它包括一个导电的平台，平台两侧有两个弯曲的翼，塑封时达到增强和本体连接的目的。封装后这两个翼象贝壳一样包围着芯片，同时，由于翼暴露在外面，增加了器件的散热功能。
请参阅附图3、4所示，在实际生产制造过程中，采用这种设计封装的产品，存在很多芯片裂痕的缺陷。经过很多试验分析，最后得出的结论是：芯片被损坏是发生在塑封的过程中。由于在常温下，在两翼的弯角处，存在着弯曲应力，即有弯角处的内应力位置2，如图3所示。在塑封的高温环境下，受热的框架会发生热胀冷缩的，而弯角处的应力是向外的，所以内翼的膨胀要大于外翼的膨胀，由于翼被型腔限制了，这样框架截面会变成如图4那样的形状，其形状为变形后放置芯片的平台4，等到冷却后，框架截面又会恢复为原来的形状。在这个过程中，框架平台和芯片之间的连接是硬性的连接，所以在受热的时候，框架平台有向上的力作用在芯片的底部，而冷却时，框架平台对芯片有向下拉的力，就在这样的过程中，芯片就产生了裂痕。
发明内容
为了克服上述不足之处，本实用新型的主要目的旨在提供一种能消除塑封体内的内应力，从而消除芯片碎裂缺陷的装置。
本实用新型要解决的技术问题是：要消除器件内部的应力，要使引脚和本体用新的方式连在一起，使得器件做好后，不需要引脚的成型工序，避免了在引脚成型过程中器件损坏的可能等问题。
本实用新型解决其技术问题所采用的技术方案是：该装置由框架、引脚、芯片、焊料、桥架及本体等组成，去除原PowemiteIII器件框架两侧面的两个对称翼，通过让本体渗入框架底部台阶的新型结构，达到使引脚和本体连在一起的目的。
所述的一种大功率的微电子产品的框架内是放置芯片的平台结构，框架的另一侧面的两个引脚为平的引脚结构，即采用了平脚结构。
本实用新型的有益效果是：能消除塑封体内的内应力，从而达到消除芯片碎裂的缺陷，使引脚和本体连在一起，使得器件做好后，不需要引脚的成型工序，避免了在引脚成型过程中器件的损坏，本实用新型结构简单，易于实施，降低了制造成本。
附图说明
下面结合附图和实施例对本实用新型进一步说明。
附图1是现有的PowemiteIII器件示意图；
附图2是现有的PowermiteIII框架立体示意图；
附图3是现有的PowemiteIII器件的截面示意图；
附图4是现有PowemiteIII在高温环境下截面的形状示意图；
附图5本实用新型的PowemiteIII框架立体示意图；
附图6是本实用新型的PowemiteIII框架底面示意图；
附图7是本实用新型结构器件封装步骤示意图；
附图8是本实用新型器件封装后的示意图。
附图中标号说明：
1-折弯的引脚；                  10-框架；
2-内应力位置；                  20-焊料；
3-对称翼；                      30-芯片；
4-变形后放置芯片的平台；        40-桥架；
5-平的引脚；                    50-桥架；
6-平台；
7-台阶；
具体实施方式
请参阅附图5、6、7、8所示，该装置由框架10、引脚、芯片30、焊料20、桥架40及本体50组成，本实用新型去除原PowemiteIII器件框架10两侧面的两个对称翼3，通过让本体50渗入框架10底部台阶7的新型结构，达到使引脚和本体50连在一起的目的。
所述的一种大功率的微电子产品的框架10内是放置芯片30的平台6结构，框架10的另一侧面的两个引脚为平的引脚5结构，即采用了平脚结构，这样使得器件做好后，不需要引脚的成型工序，避免了在引脚成型过程中器件的损坏。
请参阅附图7、8所示，实施步骤如图7，首先，在框架10平台6上点上焊料20，贴芯片30，然后再在芯片30上表面和框架10的另一端点上焊料20，最后就可以把桥架40贴上，进行塑封了。当塑封的时候，本体顺着框架10底面两旁，充满整个台阶7，从而达到把器件的脚和整体连接在一起的目的，封装后如图8所示。

Claims (2)

1、一种大功率的微电子产品，该装置有框架、引脚、芯片、焊料、桥架及本体，其特征在于：去除框架两侧面的两个对称翼，本体渗入框架底部台阶，引脚和本体连在一起。
2、根据权利要求1所述的一种大功率的微电子产品，其特征在于：所述框架内是放置芯片的平台结构，框架的另一侧面的两个引脚为平的引脚结构。
CNU2003201227698U 2003-12-23 2003-12-23 一种大功率的微电子产品 Expired - Lifetime CN2672859Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2003201227698U CN2672859Y (zh) 2003-12-23 2003-12-23 一种大功率的微电子产品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2003201227698U CN2672859Y (zh) 2003-12-23 2003-12-23 一种大功率的微电子产品

Publications (1)

Publication Number Publication Date
CN2672859Y true CN2672859Y (zh) 2005-01-19

Family

ID=34476288

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2003201227698U Expired - Lifetime CN2672859Y (zh) 2003-12-23 2003-12-23 一种大功率的微电子产品

Country Status (1)

Country Link
CN (1) CN2672859Y (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105609478A (zh) * 2014-11-14 2016-05-25 英飞凌科技股份有限公司 电连接组件、半导体模块和用于制造半导体模块的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105609478A (zh) * 2014-11-14 2016-05-25 英飞凌科技股份有限公司 电连接组件、半导体模块和用于制造半导体模块的方法
US9991609B2 (en) 2014-11-14 2018-06-05 Infineon Technologies Ag Electrical connection module, semiconductor module and method for producing a semiconductor module
CN105609478B (zh) * 2014-11-14 2018-11-16 英飞凌科技股份有限公司 电连接组件、半导体模块和用于制造半导体模块的方法

Similar Documents

Publication Publication Date Title
CN107081719A (zh) 一种电容器的维修工作台及其维修方法
CN2672859Y (zh) 一种大功率的微电子产品
CN106298713A (zh) 一种垂直连接的功率模块及其堆叠连接的引脚
CN203339218U (zh) 一种薄膜型led器件
CN208722869U (zh) 一种芯片封装结构
CN116422538A (zh) 一种刮胶与粘胶的定位检测装置及方法
CN105789169A (zh) 一种有引线封装用的引线框架结构
CN109025074A (zh) 一种连接件、瓦组件及瓦组件的制作方法
CN100470772C (zh) 免焊接印刷电路板组合
CN108526318A (zh) 一种建筑预制构件折弯用模具
CN111805650B (zh) 实木弯曲拼板方法
CN200970672Y (zh) 框架式整体架桥焊接装置
CN202678409U (zh) 一种led灯珠封装结构
CN201228817Y (zh) 拼装式立管管夹
CN109342176A (zh) 一种烧结纳米银受压试件制备装置
CN212566898U (zh) 一种mlcc烧成用防脱落高温陶瓷支架
CN215985089U (zh) 一种湿温度振动三综合试验箱振动组件
CN211655287U (zh) 高功率微矩形电连接器类模具
CN219521826U (zh) 一种csop封装的外引线整形夹具
CN205617830U (zh) 组装式输电线路抢修架线杆
CN208544842U (zh) 一种钢化玻璃自动上下料装置
CN216311749U (zh) 一种芯片引脚自动修复治具
CN213107779U (zh) 一种导热硅胶的异型产品热压模具
CN213888057U (zh) 一种金属件精密成型模具
CN219180508U (zh) 半桥驱动产品框架

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20131223

Granted publication date: 20050119