CN2614885Y - Combined mould for plastic chip solidification - Google Patents
Combined mould for plastic chip solidification Download PDFInfo
- Publication number
- CN2614885Y CN2614885Y CN 03213340 CN03213340U CN2614885Y CN 2614885 Y CN2614885 Y CN 2614885Y CN 03213340 CN03213340 CN 03213340 CN 03213340 U CN03213340 U CN 03213340U CN 2614885 Y CN2614885 Y CN 2614885Y
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- annular seal
- plastic
- cushion ring
- negative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A composite die for solidifying plastic chips comprises a negative, a silicon chip, a plastic cushion ring, an annular seal, and four to fifty nut screws. The external diameter of the silicon chip equals to or is slightly bigger than the inner diameter of the plastic cushion ring. The radial profile of the annular seal is of L shape, the inner diameter phi 1 of the annular seal equals to or is slightly bigger than the inner diameter of the plastic cushion ring, and the inner diameter phi 2 of the annular seal equals to or is slightly bigger than the external diameter of the plastic cushion ring. The negative and the periphery of the annular seal are provided with four to fifty through-holes or threaded apertures in the height direction. The negative, the silicon chip, the plastic cushion ring and the annular seal which are superposed from the underside to the top assemble to an integral body via four to fifty nut screws. The utility model has the advantages of that using the elasticity of the plastic cushion ring, the pressure which is produced by the annular seal and the diamond-shaped nut screw effectively prevents the PDMS fore-body compound from leaking to the bottom of the silicon chip and embedding the silicon chip ultimately. Using the diamond-shaped nut screw, the operation is convenient and the time and the labor are saved.
Description
Technical field:
The utility model relates to the micro-fluidic chip manufacturing technology, and a kind of curing mold of making the plastic chip base material that is specifically designed to is provided especially.
Background technology:
Micro-total analysis system (Micro Total Analysis Systems, μ-TAS) is a frontier interdisciplinary, its final purpose is by the microminiaturization of chemical device and integrated, to greatest extent the function of assay laboratory is transferred to (as all kinds of chips) in the portable analytical equipment, realize " microminiaturization " of analytical equipment, therefore micro-total analysis system also generically is called " chip lab " (Lab-on-a-chip), can be divided into two big classes again according to chip structure and working mechanism: micro-array chip (Microarray chip), be called " biochip " again, and micro-fluidic chip (Microfluidic chip), the former development is quite ripe, abroad with degree of depth industrialization; The latter utilizes micro electronmechanical process technology (MEMS), at silicon mainly based on analytical chemistry and biochemistry, glass, quartz, frosting process the microchannel network of 10-100 micron, EOF and electrophoresis are flowed as driving force, by changing driving voltage, flow direction and the speed of control fluid in the network of microchannel, thereby realize to target analytes sampling, dilute, add reagent,, enrichment, extraction, mix, reaction separates, steps such as detection are the emphasis of current research.Chip manufacturing is one of them pith, and chip material and forming technique are a variety of again, and wherein PDMS curing is a kind of method of simple and fast, and manufacturing and designing of PDMS curing mold do not see that bibliographical information is arranged.General way is in the laboratory at present, framework with a negative and an open type constitutes, it has a significant deficiency, and the PDMS precursor mixture can flow into the silicon chip bottom, separate with silicon chip whole silicon chip embedding is extremely difficult thereby cause after the PDMS moulding, thereby can not satisfy the laboratory work needs.
Summary of the invention:
The purpose of this utility model provides a kind of PDMS embedding silicon chip can avoided, and plastic chip solidifies uses assembling die.
The utility model provides a kind of plastic chip to solidify and has used assembling die, and it is characterized in that: this assembling die is constituted by negative (1), silicon chip (2), plastic washer (3), sealing ring (4), a 4-50 nut (5);
The external diameter of silicon chip (2) equals or is slightly larger than the internal diameter of plastic washer (3); The radial section of sealing ring (4) has L type structure, and the internal diameter φ 1 of sealing ring (4) equals or be slightly larger than the internal diameter of plastic washer (3), and the internal diameter φ 2 of sealing ring (4) equals or be slightly larger than the external diameter of plastic washer (3); The periphery of negative (1) and sealing ring (4) has 4-50 through hole or threaded hole on short transverse,
Negative (1), silicon chip (2), plastic washer (3), sealing ring (4) stack from the bottom to top, are combined into an integral body by 4-50 nut (5).
The utility model plastic chip solidifies in the assembling die, and described plastic washer (3) has elasticity.Described nut (5) is preferably rhombus nut (5).
Compare with conventional PDMS curing mold, the advantage that the utlity model has is:
1, utilize the elasticity of plastic washer (3), and sealing ring (4) with rhombus nut (5) thus cooperate the pressure that is produced to prevent that effectively the PDMS precursor mixture is to its embedding the most at last of silicon chip bottom leaky.
2, rhombus nut (5) is easy to operate, saves time.
Description of drawings:
Fig. 1 illustrates for plastic chip solidifies with a kind of assembled state of assembling die.
The specific embodiment:
As shown in Figure 1, a circular negative (1), a circular silicon chip (2), annular plastics packing ring (3), annular sealing ring (4), 6 rhombus nuts (5) are arranged in this assembling die.Have 6 threaded holes on the negative short transverse, have 6 through holes on the short transverse of sealing ring.Circular negative (1) constitutes cavity with circular silicon chip (2), annular plastics packing ring (3) and annular sealing ring (4) and is used to solidify the PDMS chip.Utilize the elasticity of plastic washer (3), and sealing ring (4) cooperates the pressure that is produced to prevent leakage with rhombus nut (5).
Claims (3)
1, assembling die is used in a kind of plastic chip curing, and it is characterized in that: this assembling die is constituted by negative (1), silicon chip (2), plastic washer (3), sealing ring (4), a 4-50 nut (5);
The external diameter of silicon chip (2) equals or is slightly larger than the internal diameter of plastic washer (3); The radial section of sealing ring (4) has L type structure, and the internal diameter φ 1 of sealing ring (4) equals or be slightly larger than the internal diameter of plastic washer (3), and the internal diameter φ 2 of sealing ring (4) equals or be slightly larger than the external diameter of plastic washer (3); The periphery of negative (1) and sealing ring (4) has 4-50 through hole or threaded hole on short transverse,
Negative (1), silicon chip (2), plastic washer (3), sealing ring (4) stack from the bottom to top, are combined into an integral body by 4-50 nut (5).
2, solidify assembling die according to the described plastic chip of claim 1, it is characterized in that: described plastic washer (3) has elasticity.
3, solidify assembling die according to the described plastic chip of claim 1, it is characterized in that: described nut (5) is a rhombus nut (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03213340 CN2614885Y (en) | 2003-05-27 | 2003-05-27 | Combined mould for plastic chip solidification |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03213340 CN2614885Y (en) | 2003-05-27 | 2003-05-27 | Combined mould for plastic chip solidification |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2614885Y true CN2614885Y (en) | 2004-05-12 |
Family
ID=34242321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 03213340 Expired - Fee Related CN2614885Y (en) | 2003-05-27 | 2003-05-27 | Combined mould for plastic chip solidification |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2614885Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101885216A (en) * | 2009-05-14 | 2010-11-17 | 鸿富锦精密工业(深圳)有限公司 | Method for manufacturing flexible mould |
-
2003
- 2003-05-27 CN CN 03213340 patent/CN2614885Y/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101885216A (en) * | 2009-05-14 | 2010-11-17 | 鸿富锦精密工业(深圳)有限公司 | Method for manufacturing flexible mould |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |