CN2567786Y - High-power light dipolar body covered by cooling structure - Google Patents
High-power light dipolar body covered by cooling structure Download PDFInfo
- Publication number
- CN2567786Y CN2567786Y CN02247707U CN02247707U CN2567786Y CN 2567786 Y CN2567786 Y CN 2567786Y CN 02247707 U CN02247707 U CN 02247707U CN 02247707 U CN02247707 U CN 02247707U CN 2567786 Y CN2567786 Y CN 2567786Y
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- light emitting
- power light
- emitting diode
- heating panel
- holding part
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Abstract
The utility model relates to a high-power light dipolar body covered by a heat dissipation structure, which provides an electronic component which enhances heat dissipation efficiency, reduces thermal resistance and has high operating power. The utility model comprises a high-power light dipolar body of an encapsulation structure with resin/transparent bag material, and a heat dissipation structure which is coated and arranged on the outer part of the high-power light dipolar body and is used for absorbing and releasing heat energy released by the high-power light dipolar body, wherein, the high-power light dipolar body is composed of a basal body, a light part which is convexly arranged on the basal body, and a plurality of connecting feet which are arranged on both sides of the basal body.
Description
Technical field
The utility model belongs to electronic component, and particularly a kind of have a high-power light emitting diode that adds radiator structure.
Background technology
As shown in figure 13, existing high-power light emitting diode comprises matrix, is convexly set in illuminating part and a plurality of pin of being located at the matrix end face of matrix.
During assembling, be welded on the circuit board by the pin of high-power light emitting diode.
Though, because that light-emittingdiode has is light and handy than the conventional lamp volume, can save plurality of advantages such as a large amount of energy.But how still inferior than conventional lamp its brightness is, and its reason system is relevant with the luminous efficiency of light-emittingdiode own.Therefore, above-mentioned high-power light-emittingdiode just can improve above-mentioned disappearance, but because high-power light emitting two systems improve its luminous efficiency to increase electric current, improve the problem follow amount of localized heat excessively to raise so that face again with electric current, though and high-power light emitting diode system can dispel the heat by the circuit board both ends of the surface, but because circuit board is with metal mostly, the single plate body that PCB or ceramic material are made, therefore, it only has both ends of the surface can be for heat radiation, and its coefficient of heat conduction is also lower, making heat be not easy conduction fast scatters and disappears to extraneous, therefore, and do not meet the needs that the high-power light emitting diode dispels the heat, and then the brightness of high-power light emitting diode and operand power can't be improved.Though above-mentioned high-power light emitting diode has increased plate body as its area of dissipation, the same system of its plate body dispels the heat by circuit board, therefore, and the same problem that brightness and operand power can't be improved that exists.
At present, as shown in figure 14, also there is the dealer that metal shell is used in outside with the reception diode element of resin-encapsulated, but do not dispel the heat owing to receive monomer itself, therefore, receive the metal shell of monomer, its function only for preventing the electromagnetic interference monomer, there is no heat radiation function.
Summary of the invention
The purpose of this utility model provide a kind ofly improve radiating efficiency, reduce thermal resistance, high-power light emitting diode that high the having of operand power adds radiator structure.
The utility model comprises to be with the high-power light emitting diode of resin/transparent packaging material encapsulating structure and to cover to use in high-power light emitting diode outside and absorb and discharge the radiator structure that the high-power light emitting diode discharges heat energy; High-power light emitting diode system is made of matrix, the illuminating part that is convexly set in matrix and a plurality of pin of being located at the matrix both sides.
Wherein:
Radiator structure is a heating panel, it is provided with the holding part that can put high-power light emitting diode matrix in book office, form the opening of the high-power light emitting diode pin that can bridge in the holding part both sides respectively, and be respectively equipped with in the opening both side edges and use the catch that backstop high-power light emitting diode matrix shifts out radiator structure.
Heating panel holding part periphery is provided with and uses the buckling parts that fastens high-power light emitting diode matrix more than one.
Heating panel in the middle of being stacked with on the heating panel; Heating panel holding part central authorities offer slotted eye; The holding part of middle heating panel be slightly less than heating panel holding part and with the corresponding plate body of heating panel holding part central authorities' slotted eye; The holding part periphery of middle heating panel is provided with the perforation of passing for buckling parts more than corresponding to heating panel holding part periphery buckling parts; The holding part of middle heating panel is overlapped in the heating panel holding part slotted eye, and forms the plane of putting for the high-power light emitting diode with the heating panel holding part.
Radiator structure system is made up of first heating panel and second heating panel; The first heating panel book office is provided with the holding part that can put high-power light emitting diode matrix, form the opening of the high-power light emitting diode pin that can bridge in the holding part both sides respectively, and be respectively equipped with in the opening both side edges and use the catch that backstop high-power light emitting diode matrix shifts out radiator structure; The second heating panel book office be provided with just can chimeric high-power light emitting diode illuminating part the hole, extend the stopper section of using backstop high-power light emitting diode matrix corresponding to the first heating panel holding part both-side opening in the two ends, hole.
The periphery in the hole of chimeric high-power light emitting diode illuminating part is provided with the fixed part that bends to first heating panel more than on second heating panel.
The first heating panel holding part periphery is provided with and uses the buckling parts that fastens high-power light emitting diode matrix more than one; Place, the contiguous fixed part of second heating panel position offers corresponding and supplies the ccontaining opening of the first heating panel buckling parts.
The first heating panel buckling parts book office is provided with salient point; The second heating panel fixed part book office is provided with the fixing hole of and chimeric location corresponding with salient point on the first heating panel buckling parts.
Radiator structure is a heating panel, it is provided with the holding part that can put the high-power light emitting diode in book office, book office is offered the hole of passing high-power light emitting diode illuminating part in the holding part bottom surface, form the opening of the high-power light emitting diode pin that bridges in the holding part both sides respectively, and be respectively equipped with catch in the opening both side edges; The holding part periphery is provided with and uses the buckling parts that fastens high-power light emitting diode matrix more than one.
Heating panel/first heating panel holding part is offered the perforation of using the high-power light emitting diode that cooperates different shape more than one.
Because the utility model comprises to be with the high-power light emitting diode of resin/transparent packaging material encapsulating structure and to cover to use in high-power light emitting diode outside and absorb and discharge the radiator structure that the high-power light emitting diode discharges heat energy; High-power light emitting diode system is made of matrix, the illuminating part that is convexly set in matrix and a plurality of pin of being located at the matrix both sides.During assembling, be covered with the pin welding assembly of heating panel high-power light emitting diode on circuit board with the outside; During use, the high-power light emitting diode promptly can discharge heat energy, at this moment, the radiator structure that is overlying on high-power light emitting diode outside outward just begins to absorb the heat energy that the high-power light emitting diode is discharged, and promptly to radiator structure up and down both ends of the surface discharge, and discharge the heat energy of high-power light emitting diode simultaneously together with the upper/lower terminal of circuit board; So, the area of dissipation of high-power light emitting diode can be increased, and the effect of its operand power can be promoted.Not only improve radiating efficiency, reduce thermal resistance, and the operand power height, thereby reach the purpose of this utility model.
Description of drawings
Fig. 1, be the utility model embodiment one structural representation stereogram.
Fig. 2, be the utility model embodiment one decomposition texture schematic isometric.
Fig. 3, be the utility model embodiment one user mode schematic diagram.
Fig. 4, for the utility model embodiment one decomposition texture schematic isometric (holding part is offered perforation).
Fig. 5, be the utility model embodiment one structural representation stereogram (folded establish in the middle of heating panel).
Fig. 6, be the utility model embodiment one decomposition texture schematic isometric (folded establish in the middle of heating panel).
Fig. 7, be the utility model embodiment two structural representation stereograms.
Fig. 8, be the utility model embodiment two decomposition texture schematic isometric.
Fig. 9, be the utility model embodiment two user mode schematic diagrames.
Figure 10, be the utility model embodiment three structural representation stereograms.
Figure 11, be the utility model embodiment three decomposition texture schematic isometric.
Figure 12, be the utility model embodiment three user mode schematic diagrames.
Figure 13, high-power light emitting diode structure schematic isometric for commonly using.
Figure 14, resin-encapsulated component structure schematic isometric for commonly using.
Embodiment
Embodiment one
As Fig. 1, Fig. 2, shown in Figure 3, the utility model comprises high-power light emitting diode 1 and covers in the radiator structure 2 of high-power light emitting diode 1 outside.
High-power light emitting diode 1 is that it is to be made of matrix 11, the illuminating part 12 that is convexly set in matrix 11 and a plurality of pin 13 of being located at matrix 11 both sides with the structure of resin or the encapsulation of transparent packaging material.
Radiator structure is a heating panel 2, it is provided with the holding part 21 that can put high-power light emitting diode 1 matrix 11 in book office, be provided with the buckling parts 22 of using fastening high-power light emitting diode 1 matrix 11 more than one in holding part 21 peripheries, and form the opening 23 of high-power light emitting diode 1 pin 13 that can bridge respectively in holding part 21 both sides, and be respectively equipped with catch 24 in opening 23 both side edges, use backstop high-power light emitting diode 1 matrix 11 and shift out radiator structure.
During assembling, earlier high-power light emitting diode 1 is placed in the holding part 21 of heating panel 2, make its pin 13 be cross-placed on holding part 21 both-side openings 23 places, and make buckling parts 22 be fastened on the matrix 11 of high-power light emitting diode 1, and, make its unlikely holding part 21 that shifts out by catch 24 backstop high-power light emitting diodes 1 matrix 11 of opening 23 both side edges; Pin 13 welding assemblies that cover the high-power light emitting diode 1 of putting heating panel 2 with the outside are promptly finished assembling on circuit board 5.
During use, high-power light emitting diode 1 promptly can discharge heat energy, at this moment, the heating panel 2 that is overlying on high-power light emitting diode 1 outside outward just begins to absorb the heat energy that high-power light emitting diode 1 is discharged, and promptly discharge to heating panel 2 end faces, and discharge the heat energy of high-power light emitting diode 1 simultaneously together with the upper/lower terminal of circuit board 5, so, the area of dissipation of high-power light emitting diode 1 can be increased, and the effect of its operand power can be promoted.
As shown in Figure 4, also can offer more than one and bore a hole 25, to cooperate the high-power light emitting diode 1A of different shape in heating panel 2 holding parts 21.
As Fig. 5, shown in Figure 6, radiator structure system is made up of heating panel 2 and stacked thereon middle heating panel 2A.
The holding part 21A of middle heating panel 2A be slightly less than heating panel 2 holding part 21 and with heating panel 2 holding parts 21 central slotted eye 211 corresponding plate bodys, so that the holding part 21A of middle heating panel 2A is overlapped in heating panel 2 holding parts 21, so that heating panel 2 holding parts 21 form the plane of putting for high-power light emitting diode 1 with middle heating panel 2A holding part 21A.The holding part 21A periphery of middle heating panel 2A is provided with the perforation 22A that passes for buckling parts 22 more than corresponding to heating panel 2 holding parts 21 periphery buckling partss 22.
Embodiment two
As Fig. 7, Fig. 8, shown in Figure 9, the utility model comprises high-power light emitting diode 1 and covers in the radiator structure of high-power light emitting diode 1 outside.
High-power light emitting diode 1 is that it is to be made of matrix 11, the illuminating part 12 that is convexly set in matrix 11 and a plurality of pin 13 of being located at matrix 11 both sides with the structure of resin or the encapsulation of transparent packaging material.
Radiator structure system is made up of first heating panel 31 and second heating panel 32.
Second heating panel, 32 book offices be provided with just can chimeric high-power light emitting diode 1 illuminating part 12 hole 321,321 two ends extend the stopper section 322 of using backstop high-power light emitting diode 1 matrix 11 corresponding to first heating panel, 31 holding parts, 311 both-side openings 314 in the hole, be provided with the fixed part 323 that bends to first heating panel 31 more than in hole 321 peripheries, and be provided with the fixing hole 324 of and chimeric location corresponding in fixed part 323 book offices with salient point 313 on first heating panel, 31 buckling partss 312, offer corresponding in contiguous fixed part 323 positions and for the ccontaining opening 325 of first heating panel, 31 buckling partss 312, so that first, two heating panels 31,32 more firmly are fixed in high-power light emitting diode 1 outside.
During assembling, earlier high-power light emitting diode 1 is placed in the holding part 311 of first heating panel 31, make its pin 13 be cross-placed on holding part 311 both-side openings 314 places, and make buckling parts 312 be fastened on the matrix 11 of high-power light emitting diode 1, and, make its unlikely holding part 311 that shifts out by catch 315 backstop high-power light emitting diodes 1 matrix 11 of opening 314 both side edges; With the hole 321 of second heating panel 32 illuminating part 12 second heating panel 32 is combined on first heating panel 31 then corresponding to high-power light emitting diode 1, and the fixing hole 324 on the fixed part 323 of first heating panel 31 bending and the salient point 313 chimeric location on first heating panel, 31 buckling partss 312 on mat second heating panel 32, and stopper section 322 corresponding matching, first heating panel, 31 openings, 314 both side edges catch, 315 backstop high-power light emitting diodes, 1 matrix 11 of 321 both sides, second heating panel, 32 holes; The buckling parts 312 of first heating panel 31 promptly is placed in the opening 325 of second heating panel, 32 contiguous fixed parts 323, so, just can make first and second heating panel 31,32 more firmly be fixed in the outside of high-power light emitting diode 1; Then, pin 13 welding assemblies that are covered with the radiator structure high-power light emitting diode of being made up of first and second heating panel 31,32 1 with the outside are promptly finished assembling on circuit board 5.
During use, high-power light emitting diode 1 promptly can discharge heat energy, at this moment, first and second heating panel 31,32 that is overlying on high-power light emitting diode 1 outside outward just begins to absorb the heat energy that high-power light emitting diode 1 is discharged, and promptly to the both ends of the surface release about in the of 31,32 of first and second heating panel, and discharge the heat energy of high-power light emitting diode 1 simultaneously, thereby form six area of dissipations that comprise first heating panel, 31 upper and lower end faces, second heating panel, 32 upper and lower end faces and circuit board 5 upper and lower sides together with the upper/lower terminal of circuit board 5.So, the area of dissipation of high-power light emitting diode 1 can be increased, and the effect of its operand power can be promoted.
Embodiment three
As Figure 10, Figure 11, shown in Figure 12, the utility model comprises high-power light emitting diode 1 and covers in the radiator structure of high-power light emitting diode 1 outside.
High-power light emitting diode 1 is that it is to be made of matrix 11, the illuminating part 12 that is convexly set in matrix 11 and a plurality of pin 13 of being located at matrix 11 both sides with the structure of resin or the encapsulation of transparent packaging material.
Radiator structure is a heating panel 4, it is provided with the holding part 41 that can put high-power light emitting diode 1 in book office, offer the hole 42 of passing high-power light emitting diode 1 illuminating part 12 in holding part 41 bottom surface book offices, form the opening 43 of high-power light emitting diode 1 pin 13 that bridges respectively in holding part 41 both sides, and be respectively equipped with catch 44 in opening 43 both side edges, use backstop high-power light emitting diode 1 matrix 11 and shift out radiator structure; Be provided with the buckling parts 45 of using fastening high-power light emitting diode 1 matrix 11 more than one in holding part 41 peripheries.
During assembling, earlier high-power light emitting diode 1 is placed in the holding part 41 of heating panel 4, make its pin 13 be cross-placed on holding part 41 both-side openings 43 places, and the illuminating part 12 that makes high-power light emitting diode 1 passes the hole 42 of holding part 41 bottom surfaces, and be fastened on the matrix 11 of high-power light emitting diode 1 with buckling parts 45, and, make its unlikely holding part 41 that shifts out by catch 44 backstop high-power light emitting diodes 1 matrix 11 of opening 43 both side edges; Then, pin 13 welding assemblies that are covered with heating panel 4 high-power light emitting diodes 1 with the outside are promptly finished assembling on circuit board 5.
During use, high-power light emitting diode 1 promptly can discharge heat energy, at this moment, the heating panel 4 that is overlying on high-power light emitting diode 1 outside outward just begins to absorb the heat energy that high-power light emitting diode 1 is discharged, and promptly to heating panel about in the of 4 both ends of the surface discharge, and discharge the heat energy of high-power light emitting diode 1 simultaneously together with the upper/lower terminal of circuit board 5.So, the area of dissipation of high-power light emitting diode 1 can be increased, and the effect of its operand power can be promoted.
Claims (10)
1, a kind of have a high-power light emitting diode that adds radiator structure, and it comprises being high-power light emitting diode with resin/transparent packaging material encapsulating structure, and it is to be made of matrix, the illuminating part that is convexly set in matrix and a plurality of pin of being located at the matrix both sides; It is characterized in that described high-power light emitting diode outside is covered with the radiator structure of using absorption and discharging high-power light emitting diode release heat energy.
2, according to claim 1 have a high-power light emitting diode that adds radiator structure, it is characterized in that described radiator structure is a heating panel, it is provided with the holding part that can put high-power light emitting diode matrix in book office, form the opening of the high-power light emitting diode pin that can bridge in the holding part both sides respectively, and be respectively equipped with in the opening both side edges and use the catch that backstop high-power light emitting diode matrix shifts out radiator structure.
3, according to claim 1 and 2 have a high-power light emitting diode that adds radiator structure, it is characterized in that described heating panel holding part periphery is provided with to use the buckling parts that fastens high-power light emitting diode matrix more than one.
4, according to claim 1 and 2 have a high-power light emitting diode that adds radiator structure, heating panel in the middle of it is characterized in that being stacked with on the described heating panel; Heating panel holding part central authorities offer slotted eye; The holding part of middle heating panel be slightly less than heating panel holding part and with the corresponding plate body of heating panel holding part central authorities' slotted eye; The holding part periphery of middle heating panel is provided with the perforation of passing for buckling parts more than corresponding to heating panel holding part periphery buckling parts; The holding part of middle heating panel is overlapped in the heating panel holding part slotted eye, and forms the plane of putting for the high-power light emitting diode with the heating panel holding part.
5, according to claim 1 have a high-power light emitting diode that adds radiator structure, it is characterized in that described radiator structure system is made up of first heating panel and second heating panel; The first heating panel book office is provided with the holding part that can put high-power light emitting diode matrix, form the opening of the high-power light emitting diode pin that can bridge in the holding part both sides respectively, and be respectively equipped with in the opening both side edges and use the catch that backstop high-power light emitting diode matrix shifts out radiator structure; The second heating panel book office be provided with just can chimeric high-power light emitting diode illuminating part the hole, extend the stopper section of using backstop high-power light emitting diode matrix corresponding to the first heating panel holding part both-side opening in the two ends, hole.
6, according to claim 5 have a high-power light emitting diode that adds radiator structure, and the periphery that it is characterized in that the hole of chimeric high-power light emitting diode illuminating part on described second heating panel is provided with more than one the fixed part to the bending of first heating panel.
7, describedly have a high-power light emitting diode that adds radiator structure according to claim 5 or 6, it is characterized in that the described first heating panel holding part periphery is provided with to use the buckling parts that fastens high-power light emitting diode matrix more than one; Place, the contiguous fixed part of second heating panel position offers corresponding and supplies the ccontaining opening of the first heating panel buckling parts.
8, according to claim 7 have a high-power light emitting diode that adds radiator structure, it is characterized in that the described first heating panel buckling parts book office is provided with salient point; The second heating panel fixed part book office is provided with the fixing hole of and chimeric location corresponding with salient point on the first heating panel buckling parts.
9, according to claim 1 have a high-power light emitting diode that adds radiator structure, it is characterized in that described radiator structure is a heating panel, it is provided with the holding part that can put the high-power light emitting diode in book office, book office is offered the hole of passing high-power light emitting diode illuminating part in the holding part bottom surface, form the opening of the high-power light emitting diode pin that bridges in the holding part both sides respectively, and be respectively equipped with catch in the opening both side edges; The holding part periphery is provided with and uses the buckling parts that fastens high-power light emitting diode matrix more than one.
10, describedly have a high-power light emitting diode that adds radiator structure according to claim 2 or 5, it is characterized in that described heating panel/first heating panel holding part offers the perforation of using the high-power light emitting diode that cooperates different shape more than one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02247707U CN2567786Y (en) | 2002-08-16 | 2002-08-16 | High-power light dipolar body covered by cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02247707U CN2567786Y (en) | 2002-08-16 | 2002-08-16 | High-power light dipolar body covered by cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2567786Y true CN2567786Y (en) | 2003-08-20 |
Family
ID=33718528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02247707U Expired - Fee Related CN2567786Y (en) | 2002-08-16 | 2002-08-16 | High-power light dipolar body covered by cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2567786Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7982227B2 (en) | 2006-06-27 | 2011-07-19 | Everlight Electronics Co., Ltd. | Light emitting diode package |
-
2002
- 2002-08-16 CN CN02247707U patent/CN2567786Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7982227B2 (en) | 2006-06-27 | 2011-07-19 | Everlight Electronics Co., Ltd. | Light emitting diode package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |