CN2587063Y - Outer heat abstractor for high power light-emitting diode - Google Patents

Outer heat abstractor for high power light-emitting diode Download PDF

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Publication number
CN2587063Y
CN2587063Y CN02282418U CN02282418U CN2587063Y CN 2587063 Y CN2587063 Y CN 2587063Y CN 02282418 U CN02282418 U CN 02282418U CN 02282418 U CN02282418 U CN 02282418U CN 2587063 Y CN2587063 Y CN 2587063Y
Authority
CN
China
Prior art keywords
high power
heat abstractor
circuit board
power led
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN02282418U
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Chinese (zh)
Inventor
林明耀
林明德
江湘湄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGDING ELECTRONIC CO Ltd
Original Assignee
GUANGDING ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GUANGDING ELECTRONIC CO Ltd filed Critical GUANGDING ELECTRONIC CO Ltd
Priority to CN02282418U priority Critical patent/CN2587063Y/en
Application granted granted Critical
Publication of CN2587063Y publication Critical patent/CN2587063Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to an additional radiator of a high power luminous diode, which is assembled with a circuit board which is provided with a plurality of high power luminous diodes. The additional radiator of a high power luminous diode is a main body which is provided with a concave groove; the bottom of the concave groove is convexly provided with a contact part; positions of both side walls of the concave groove, which are adjacent to the contact part, are respectively provided with a slide groove; the bottom edge of the main body is extended with a plurality of radiating fins; both sides of the circuit board can be glidingly arranged in the main body of the additional radiator of a high power luminous diode by the slide grooves. The utility model can achieve the efficiency of convenient assembly and disassembly, and can effectively enhance the heat rejection efficiency and the running power of the high power luminous diodes.

Description

High Power LED adds heat abstractor
Technical field
The utility model relates to heat abstractor, refers to that especially a kind of circuit board that makes directly is slidedly arranged in the heat abstractor, is convenient to assembling, dismounting, efficiently radiates heat, and the High Power LED that improves its operand power adds heat abstractor.
Background technology
Existing High Power LED is to improve its luminous efficiency in the mode that increases electric current, so face with electric current and improve the problem of following amount of localized heat excessively to raise, though this High Power LED can be by the both ends of the surface heat radiation of circuit board, but because circuit board is by metal mostly, the single plate body that PCB or ceramic material are made, therefore only having both ends of the surface can be for heat radiation, and its coefficient of heat conduction is lower, conduction is distributed to the external world to make heat be not easy fast, therefore, can not satisfy the required of High Power LED heat radiation, the brightness and the operand power of this High Power LED can't be improved, though above-mentioned High Power LED has increased the area of plate body as its heat radiation, but its plate body is to be dispelled the heat by circuit board equally, therefore, has the above-mentioned problem of commonly using equally.
At present, after also having the dealer that High Power LED is assembled in circuit board, again this circuit board is fixed on the fin with bolting element and heat conduction viscose glue, to reach the purpose of heat radiation, but, with bolting element and heat conduction viscose glue circuit board to be fixed on the fin, technology is loaded down with trivial details when not only causing assembling, and when this light-emitting diode damages the replacing of desire do, also can make dismounting become difficult because of the fixed of heat conduction viscose glue.
The utility model content
Main purpose of the present utility model is to provide a kind of High Power LED to add heat abstractor, and circuit board directly is slidedly arranged in the heat abstractor, has to be convenient to the effect assembling, dismantle.
Another purpose of the present utility model is to provide a kind of High Power LED to add heat abstractor, and it can improve the radiating efficiency and the operate power of High Power LED.
For reaching above-mentioned purpose, a kind of High Power LED of the present utility model adds heat abstractor, group is provided with a circuit board on this heat abstractor, and group is provided with several High Power LEDs on this circuit board, it is characterized in that: this heat abstractor is a body, offer a recessed groove on this body, the bottom of this recessed groove convexes with a contact site, and be respectively equipped with a chute in the position of the contiguous contact site of this recessed groove two sidewalls, extended some radiating fins in this body root edge again, these circuit board both sides can be slidedly arranged in this heat abstractor by chute.Wherein,
The biend of described body is respectively equipped with fixing hole.
The body of described heat abstractor is with the moulding of aluminium extrusion mode.
Described some radiating fins are radial.
Because the structural design of heat abstractor body and circuit board, make circuit board extremely easily dismounting in two chutes of heat abstractor body, and can effectively improve the radiating efficiency and the operate power of High Power LED.
Description of drawings
Fig. 1, be stereo appearance figure of the present utility model.
Fig. 2, be end view of the present utility model.
Fig. 3, be the assembled state schematic diagram of the utility model and circuit board.
Fig. 4, be the stereo appearance figure after the assembling of the utility model and circuit board.
Fig. 5, be the end view after the assembling of the utility model and circuit board.
Fig. 6, be application schematic diagram of the present utility model.
Embodiment
For to the purpose of this utility model, technical characterictic and benefit thereof, can have and further understand and be familiar with, lift a preferred embodiment now, and conjunction with figs. is described in detail as follows, certainly, the utility model is on some other part, or permission is different in the arrangement of other part:
Referring to Fig. 1,2, a kind of High Power LED adds heat abstractor, its heat abstractor is a body 1, this body 1 is with the moulding of aluminium extrusion mode, and this body 1 offers a recessed groove 11, and these recessed groove 11 bottoms are convexly equipped with a contact site 12, and be respectively equipped with a chute 13 in the position of the contiguous contact site 12 of this recessed groove 11 2 sidewalls, extended some radiating fins 14 in this body 1 root edge again, and these some radiating fins 14 are radial, and this body 1 biend is respectively equipped with fixing hole 15; Form the heat abstractor that adds of a brand-new High Power LED thus.
Referring to Fig. 3-5, during assembling, several High Power LEDs 2 are mounted on the circuit board 3, dual-side 31 with circuit board 3 is slidedly arranged in the body 1 of this heat abstractor along the set chute 13 of recessed groove 11 2 sidewalls again, and the bottom 21 of High Power LED 2 is contacted with contact site 12, so can finish assembling; And when circuit board 3 is slidedly arranged on the chute 13 of this body 1, can be between the bottom 21 of this High Power LED 2 and contact site 12 coating thermal conducting agent 4 (inviscid heat-conducting glue), High Power LED 2 can more effectively be passed to the bottom 21 of heat by High Power LED 2 on the contact site 12, and by contact site 12 heat is conducted to body 1 root edge and extended on some radial radiating fins 14, and heat is in time distributed; So, circuit board 3 dual-sides 31 are slidedly arranged in this body 1 along chute 13, realize being convenient to the purpose assembling, dismantle, can effectively improve the radiating efficiency of High Power LED 2 again, and can effectively improve its operate power.
Referring to Fig. 6, heat abstractor body 1 of the present utility model, can need make different size according to actual installation, and available retaining element 151, fixing hole 15 by heat abstractor body 1 two ends, several heat abstractor bodies 1 that are assembled with High Power LED 2 are fixedly arranged on the support body 5, to satisfy user's needs.
The above only is the utility model one preferred embodiment; allly be familiar with this skill person; according to spirit of the present utility model and principle, various changes and the modification done, all should be covered by within the patent protection category that the utility model claims are defined.

Claims (4)

1. a High Power LED adds heat abstractor, and group is provided with a circuit board on this heat abstractor, and group is provided with several High Power LEDs on this circuit board, it is characterized in that:
This heat abstractor is a body, offer a recessed groove on this body, the bottom of this recessed groove convexes with a contact site, and be respectively equipped with a chute in the position of the contiguous contact site of this recessed groove two sidewalls, extended some radiating fins in this body root edge again, these circuit board both sides can be slidedly arranged in this heat abstractor by chute.
2. High Power LED according to claim 1 adds heat abstractor, it is characterized in that: the biend of described body is respectively equipped with fixing hole.
3. High Power LED according to claim 1 adds heat abstractor, it is characterized in that: the body of described heat abstractor is with the moulding of aluminium extrusion mode.
4. High Power LED according to claim 1 adds heat abstractor, it is characterized in that: described some radiating fins are radial.
CN02282418U 2002-10-25 2002-10-25 Outer heat abstractor for high power light-emitting diode Expired - Fee Related CN2587063Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN02282418U CN2587063Y (en) 2002-10-25 2002-10-25 Outer heat abstractor for high power light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN02282418U CN2587063Y (en) 2002-10-25 2002-10-25 Outer heat abstractor for high power light-emitting diode

Publications (1)

Publication Number Publication Date
CN2587063Y true CN2587063Y (en) 2003-11-19

Family

ID=33744507

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02282418U Expired - Fee Related CN2587063Y (en) 2002-10-25 2002-10-25 Outer heat abstractor for high power light-emitting diode

Country Status (1)

Country Link
CN (1) CN2587063Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006105731A1 (en) * 2005-04-07 2006-10-12 Lighthouse Technologies Ltd. Light emitting array apparatus and method of manufacture
CN100384584C (en) * 2004-12-20 2008-04-30 洪明山 Method for fabricating structure of heat elimination of light emitting diode,
CN100573936C (en) * 2006-12-29 2009-12-23 富准精密工业(深圳)有限公司 The combination of light-emitting diode and heat abstractor
WO2012116523A1 (en) * 2011-03-01 2012-09-07 深圳市华星光电技术有限公司 Light source fixing device, light source assembly and a method for assembling the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100384584C (en) * 2004-12-20 2008-04-30 洪明山 Method for fabricating structure of heat elimination of light emitting diode,
WO2006105731A1 (en) * 2005-04-07 2006-10-12 Lighthouse Technologies Ltd. Light emitting array apparatus and method of manufacture
CN100573936C (en) * 2006-12-29 2009-12-23 富准精密工业(深圳)有限公司 The combination of light-emitting diode and heat abstractor
WO2012116523A1 (en) * 2011-03-01 2012-09-07 深圳市华星光电技术有限公司 Light source fixing device, light source assembly and a method for assembling the same
US8899788B2 (en) 2011-03-01 2014-12-02 Shenzhen China Star Optoelectronics Technology Co., Ltd. Light source fixing device, light source assembly and assembling method thereof

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GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee