CN220870712U - Novel semiconductor lighting module - Google Patents
Novel semiconductor lighting module Download PDFInfo
- Publication number
- CN220870712U CN220870712U CN202322750886.9U CN202322750886U CN220870712U CN 220870712 U CN220870712 U CN 220870712U CN 202322750886 U CN202322750886 U CN 202322750886U CN 220870712 U CN220870712 U CN 220870712U
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- fin
- led lamp
- slot
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 55
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000011049 pearl Substances 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims description 2
- 238000004021 metal welding Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 17
- 239000011324 bead Substances 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Abstract
The utility model discloses a novel semiconductor lighting module, and belongs to the technical field of semiconductor lighting. Including metal substrate, LED lamp pearl and fin, metal substrate's fixed surface has a plurality of LED lamp pearls, be fixed with the heat dissipation base between the below of LED lamp pearl and the metal substrate, the both sides fixedly connected with pin of LED lamp pearl, the below of pin is connected with the insulating layer through the copper foil layer, the lower surface of fin is equipped with a plurality of fin, metal substrate's side is equipped with the connection plug-in components, the connection plug-in components is the U type, the upper end of connection plug-in components and the welding of metal substrate's side, the inside at the slot is inserted to the lower extreme, slot and the lower extreme interference fit of connection plug-in components, the slot sets up the inside at the fin. The utility model uses the connecting plug-in to connect the radiating fin and the metal substrate in the semiconductor module structure, and compared with the traditional structure which only uses the heat conducting glue layer to connect the radiating fin and the metal substrate, the structure is more stable, the radiating fin can not be separated from the metal substrate, and the radiating performance of the module is fully ensured.
Description
Technical Field
The utility model relates to the technical field of semiconductor illumination, in particular to a novel semiconductor illumination module.
Background
The semiconductor lighting module is a semiconductor solid light-emitting device, has the remarkable characteristics of high efficiency, energy conservation, environmental protection, easy maintenance and the like, is an effective way for realizing energy conservation and emission reduction, and can be used as a lighting element in a lamp cap of an LED street lamp.
The LED lamp beads in the semiconductor lighting module are arranged on the surface of the metal substrate, the radiating fins are adhered to the lower surface of the metal substrate through the heat-conducting glue, the radiating fins are used for radiating heat generated in the working process of the LED lamp beads, the LED lamp beads are of an indispensable structure, then the LED lamp beads are adhered to the metal substrate only through the heat-conducting glue in the prior art, the heat-conducting adhesiveness is reduced along with the use time, the risk that the radiating fins are separated from the metal substrate exists, and the normal use of the module can be influenced, so that the semiconductor lighting module with stable structural connection is required.
Disclosure of utility model
In order to solve the problems, the utility model provides a novel semiconductor lighting module.
The utility model is realized by the following technical scheme:
The utility model provides a novel semiconductor lighting module, includes metal substrate, LED lamp pearl and fin, the fixed surface of metal substrate has a plurality of LED lamp pearls, be fixed with the heat dissipation base between the below of LED lamp pearl and the metal substrate, the both sides fixedly connected with pin of LED lamp pearl, the below of pin is connected with the insulating layer through the copper foil layer, the upper surface at metal substrate is fixed to the insulating layer, the lower surface at metal substrate is fixed to the fin, be connected with the heat conduction glue film between fin and the metal substrate, the lower surface of fin is equipped with a plurality of radiating fins, the side of metal substrate is equipped with the connection plug-in components, the connection plug-in components is the U type, the upper end of connection plug-in components is welded with the side of metal substrate, and the lower extreme is inserted and is established in the inside of slot, slot and the lower extreme interference fit of connection plug-in components, the slot sets up the inside at the fin.
The heat dissipation base is a trapezoid base.
The side of the metal substrate is fixed with a reflector, and the reflector is an arc-shaped plate and is bent upwards.
And the pins are welded or connected with the copper foil layer by glue.
Compared with the prior art, the utility model has the beneficial effects that:
The utility model uses the connecting plug-in to connect the radiating fin and the metal substrate in the semiconductor module structure, and compared with the traditional structure which only uses the heat conducting glue layer to connect the radiating fin and the metal substrate, the structure is more stable, the radiating fin can not be separated from the metal substrate, and the radiating performance of the module is fully ensured.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is an enlarged schematic view of the structure of fig. 1A according to the present utility model.
In the figure: 1. LED lamp beads; 2. pins; 3. a copper foil layer; 4. an insulating layer; 5. a metal substrate; 6. a heat sink; 6-1, a slot; 7. a heat conducting adhesive layer; 8. a connection plug-in; 9. a heat radiation fin; 10. a heat dissipation base; 11. a reflective sheet.
Detailed Description
The utility model is further described below with reference to the accompanying drawings:
As shown in fig. 1 and 2 of the attached drawings, the novel semiconductor lighting module comprises a metal substrate 5, an LED lamp bead 1 and a radiating fin 6, wherein a plurality of LED lamp beads 1 are fixed on the surface of the metal substrate 5, a radiating base 10 is fixed between the lower part of the LED lamp bead 1 and the metal substrate 5, pins 2 are fixedly connected to the two sides of the LED lamp bead 1, the lower part of each pin 2 is connected with an insulating layer 4 through a copper foil layer 3, the insulating layer 4 is fixed on the upper surface of the metal substrate 5, the radiating fin 6 is fixed on the lower surface of the metal substrate 5, a heat conducting adhesive layer 7 is connected between the radiating fin 6 and the metal substrate 5, a plurality of radiating fins 9 are arranged on the lower surface of the radiating fin 6, a connecting plug-in 8 is arranged on the side surface of the metal substrate 5, the connecting plug-in 8 is U-shaped, the upper end of the connecting plug-in 8 is welded with the side surface of the metal substrate 5, the lower end is inserted into the slot 6-1, the lower end of the slot 6-1 is in interference fit with the lower end of the connecting plug-in 8, and the radiating fin 6-1 is arranged inside the radiating fin 6-1.
The heat dissipation base 10 is a trapezoid base.
The side surface of the metal substrate 5 is fixed with a reflecting sheet 11, and the reflecting sheet 11 is an arc-shaped plate and is bent upwards.
The pins 2 are welded or connected with the copper foil layer 3 by glue.
Example 1
The utility model provides a novel semiconductor lighting module, includes metal substrate 5, LED lamp pearl 1 and fin 6, the fixed surface of metal substrate 5 has a plurality of LED lamp pearls 1, be fixed with heat dissipation base 10 between the below of LED lamp pearl 1 and the metal substrate 5, the both sides fixedly connected with pin 2 of LED lamp pearl 1, the below of pin 2 is connected with insulating layer 4 through copper foil layer 3, welding or with gluing between pin 2 and the copper foil layer 3 are connected.
The insulating layer 4 is fixed on the upper surface of the metal substrate 5, the radiating fins 6 are fixed on the lower surface of the metal substrate 5, a heat conducting glue layer 7 is connected between the radiating fins 6 and the metal substrate 5, a plurality of radiating fins 9 are arranged on the lower surface of the radiating fins 6, a connecting plug-in unit 8 is arranged on the side surface of the metal substrate 5, the connecting plug-in unit 8 is U-shaped, the upper end of the connecting plug-in unit 8 is welded with the side surface of the metal substrate 5, the lower end of the connecting plug-in unit is inserted into the slot 6-1, the slot 6-1 is in interference fit with the lower end of the connecting plug-in unit 8, and the slot 6-1 is arranged in the radiating fins 6.
In the semiconductor module structure, the radiating fin and the metal substrate are reinforced and connected by the connecting plug-in 8, and compared with the traditional structure that the radiating fin and the metal substrate are connected by only using the heat conducting glue layer, the structure is more stable, the radiating fin cannot be separated from the metal substrate, and the radiating performance of the module is fully ensured.
In addition, the heat dissipation base 10 is a trapezoid base in the structure, so that the heat transfer area between the bottom of the LED lamp bead and the metal substrate is increased, and the heat dissipation effect is further improved.
Further, in the structure, the side surface of the metal substrate 5 is fixed with a reflecting sheet 11, the reflecting sheet 11 is an arc-shaped plate and is bent upwards, the reflecting sheet can reflect the light of the LED lamp beads 1, the light is prevented from being scattered towards two ends, and the lighting effect is improved.
The foregoing description is only illustrative of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, but rather the equivalent variations and modifications in shape, construction, characteristics and spirit according to the scope of the claims should be construed to be included in the scope of the claims.
Claims (4)
1. The utility model provides a novel semiconductor lighting module which characterized in that: including metal base plate (5), LED lamp pearl (1) and fin (6), the fixed surface of metal base plate (5) is provided with a plurality of LED lamp pearls (1), be fixed with heat dissipation base (10) between the below of LED lamp pearl (1) and metal base plate (5), the both sides fixedly connected with pin (2) of LED lamp pearl (1), the below of pin (2) is connected with insulating layer (4) through copper foil layer (3), insulating layer (4) are fixed at the upper surface of metal base plate (5), fin (6) are fixed at the lower surface of metal base plate (5), be connected with heat conduction glue film (7) between fin (6) and metal base plate (5), the lower surface of fin (6) is equipped with a plurality of fin (9), the side of metal base plate (5) is equipped with connection plug-in components (8), the side welding of the upper end of connection plug-in components (8) and metal base plate (5), the lower extreme is inserted and is established in the inside of slot (6-1) and is connected with slot (6-1), the inside of slot (6-1) is held in the slot (6-1.
2. The novel semiconductor lighting module of claim 1, wherein: the heat dissipation base (10) is a trapezoid base.
3. The novel semiconductor lighting module of claim 1, wherein: the side face of the metal substrate (5) is fixed with a reflecting sheet (11), and the reflecting sheet (11) is an arc-shaped plate and is bent upwards.
4. The novel semiconductor lighting module of claim 1, wherein: the pins (2) are welded or connected with the copper foil layer (3) through glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322750886.9U CN220870712U (en) | 2023-10-13 | 2023-10-13 | Novel semiconductor lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322750886.9U CN220870712U (en) | 2023-10-13 | 2023-10-13 | Novel semiconductor lighting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220870712U true CN220870712U (en) | 2024-04-30 |
Family
ID=90817091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322750886.9U Active CN220870712U (en) | 2023-10-13 | 2023-10-13 | Novel semiconductor lighting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220870712U (en) |
-
2023
- 2023-10-13 CN CN202322750886.9U patent/CN220870712U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211670217U (en) | High-heat-conduction high-efficiency LED (light emitting diode) insulating packaging device | |
| CN211902545U (en) | LED lamp bead fixing structure | |
| CN212851202U (en) | Novel LED drive circuit board | |
| CN220870712U (en) | Novel semiconductor lighting module | |
| WO2011134121A1 (en) | Led light source module | |
| CN201434352Y (en) | Light-emitting diode encapsulation structure and light bar applying same | |
| CN201043702Y (en) | High-power LED road lamp | |
| CN202580763U (en) | Novel light-emitting diode (LED) fluorescent tube | |
| CN207146118U (en) | A kind of LED electricity-saving lamps for lamp box label | |
| CN200993345Y (en) | Efficient integrated LED lamp | |
| CN208139228U (en) | A kind of large-power LED light bead radiator structure based on COB encapsulation | |
| CN202521431U (en) | Light-emitting diode (LED) street lamp | |
| CN202253053U (en) | Light emitting diode (LED) fluorescent lamp with high radiation efficiency | |
| CN202281102U (en) | Backlight LED (Light Emitting Diode) flat light source | |
| CN218763271U (en) | LED lamp module | |
| CN211265513U (en) | Anti-cold-solder-joint surface-mounted light-emitting diode | |
| CN213026191U (en) | Low-attenuation semiconductor light-emitting diode | |
| CN203162887U (en) | High-efficiency cooling structure of light-emitting diode (LED) lamp | |
| CN218720803U (en) | LED street lamp holder | |
| CN214619100U (en) | LED lamp bead capable of enhancing heat conduction efficiency by increasing contact area | |
| CN217684467U (en) | Energy-saving semiconductor lighting module | |
| CN216532387U (en) | Heat radiation structure and have heat radiation structure's equipment | |
| CN207621716U (en) | A kind of LED light of super low energy consumption specular removal | |
| CN213686328U (en) | Light emitting diode array light source | |
| CN203671332U (en) | LED fluorescent lamp with LED substrate arranged at bottom of PC lamp tube |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |