CN2537126Y

CN2537126Y - Power LED

Info

Publication number: CN2537126Y
Application number: CN02208114U
Authority: CN
Inventors: 林明德; 林明耀
Original assignee: GUANGDING ELECTRONIC CO Ltd
Current assignee: GUANGDING ELECTRONIC CO Ltd
Priority date: 2002-03-20
Filing date: 2002-03-20
Publication date: 2003-02-19
Anticipated expiration: 2012-03-20

Abstract

The utility model relates to a power light emitting diode (LED), comprising a conductive support, a light wafer and a rubber wafer; wherein, the conductive support is a power light emitting diode (LED) structure which uses the thin or thick materials to process or manufacture the continuous thin or thick materials, and then fix chips, wire bond, adhesive deposite and pack. A heat dissipation block which can extend to the bottom of the rubber wafer is arranged on the conductive support, ensuring that the manufactured light emitting diode (LED) is provided with an expansive heat dissipation block to dissipate heat to the wafer. In addition, the high luminosity can be generated by using string current, and the power light emitting diode (LED) can be made automatically and quickly with large quantities.

Description

Power led

Technical field

The utility model refers to especially that about power led the thickness material type continuous conduction frame that utilizes thick or thin materials processing to make gives the light-emitting diode that solid crystalline substance, routing, some glue and encapsulation are finished again.

Background technology

Early stage general light-emitting diode mostly is indication (indicators) or shows (displays) usefulness, for example stop lamp etc.Because the optical density that the restriction of the relation of its wafer (Chip) structure sheaf is sent can't be used as illumination.For example, general light-emitting diode is because of its radiator structure, and employed electric current restriction is about 20mA～50mA, can't be used for the LED for illumination of the big electric current of high power.

(Light emitting diodes LEDs) be known solid-state device (Solid state device) for producing light, and its light has the peak shape wavelength (peak wavelength) in the spectrum special area to general light-emitting diode.Because the progress of wafer process makes High Power LED extensively gazed in recent years.For example, aluminum gallium indium nitride can send the peak shape wavelength light of the visible spectrum of indigo plant and green for the light-emitting diode (Aluminum-gallium-indium-nitride (AlGa InN)-based LEDs) on basis, and increases luminous density than general light-emitting diode.Because its superior photism makes the AlGaInN-based light-emitting diode have attractability.

At Lumi Leds Lighting, U.S., the 00-0001 type that LLC produced is power led, as shown in Figures 1 and 2, is exactly present power led structure, and its required electric current is about 350mA, and can produce high luminosity.But the high heat of the generation of following high luminosity and coming, therefore power led must have good heat sinking function.

In the power led structure of Fig. 1 and Fig. 2, wafer 91 is to be directly connected on the circuit board 92, and a sleeve 93 is fixed in colloid 94 encapsulation outside the wafer, to constitute whole power led structure.

During fabrication, be earlier with behind the fixed wafer 91 on the circuit board 92, again that sleeve 93 is cemented around wafer 91, then colloid 94 is forced into the sleeve top with pressure, shown in Figure 1 complete power led to finish.Wherein wafer 91 directly is connected with circuit board 92, and can reach good heat radiation function.But, be very to bother in this known power led manufacturing, must be with each part of artificial combination, assemble numerous covering, and this cost that structure increases, also make production unit cost increase, as desire that its cost will greatly surpass at present general bulb-type or other lighting apparatus with a plurality of power led composition one lighting apparatus.

But with existing light-emitting diode (referring to the annex diagram), its heat sinking function deficiency can't be used for big electric current.

Summary of the invention

Main purpose of the present utility model ties up to provides a kind of power led, and it is to make conduction rack with the thickness material, is used in general LED package processing procedure again, with the power led product of the different external forms of output.So, production is power led fast with automation, and significantly to reduce manufacturing cost, making becomes acceptable product on the market with a plurality of power led composition lighting apparatus.

Power light-emitting diode of the present utility model is made of conduction rack, luminescent wafer and glue cake, and wherein the glue cake is that package is in the ccontaining wafer position in conduction rack upper end; It is characterized in that: above-mentioned conduction rack has the radiating block that extends to glue cake bottom surface, and it is after making the continuous conduction frame with the thickness material, give solid crystalline substance, routing and some glue again, through packaging plastic cake and cutting and a large amount of the manufacturing finished, and extend to the radiating block of glue cake bottom surface can produce big electric current by wafer high thermal transpiration.

The pin that above-mentioned conduction rack extends the plastic emitting cake can be sheet contact, thin contact type, two pin formula, four pin formulas.

Of the present utility model power led, on encapsulation procedure, can be chosen as mould ejection formation (Molding) method, also can be glue-pouring method.

Of the present utility model power led, wherein execute the processing of multi-turn shape with thick or thin material, to finish successional rolling conduction rack, before encapsulation procedure, the conduction rack of rolling is suitably cut into segment-like according to mould encapsulation amount once, the side make conduction rack processing, receive and keep, transport and make.

Description of drawings

Fig. 1 is known power led constitutional diagram;

Fig. 2 is known power led exploded view;

Fig. 3 is the flow chart of a kind of embodiment of the present utility model, and it is to make continuous conduction rack again after making the thickness material with thick copper coin;

Fig. 4 is the flow chart of another kind of embodiment of the present utility model, and it is to make continuous conduction rack again after making the thickness material with sheet copper;

Fig. 5 is the first step schematic diagram of the utility model processing procedure;

Fig. 6 is the second step schematic diagram of the utility model processing procedure;

Fig. 7 is the third step schematic diagram of the utility model processing procedure;

Fig. 8 is the 4th a step schematic diagram of the utility model processing procedure;

Fig. 9 is the 5th a step schematic diagram of the utility model processing procedure;

Figure 10 is the 6th a step schematic diagram of the utility model processing procedure;

Figure 11 is the 7th a step schematic diagram of the utility model processing procedure;

Figure 12 is the 8th a step schematic diagram of the utility model processing procedure;

Figure 13 is the 9th a step schematic diagram of the utility model processing procedure.

Embodiment

See also the simple and easy manufacturing flow chart of Fig. 3 for first kind of embodiment of the utility model, it is to make the continuous conduction frame with thick copper coin, and wherein the thickness of thick copper coin is 2～3mm, and first steps A 1 is the thick copper coin round processing of will reorganize and outfit, as the A-1 among Fig. 5; Second step B1 gives cut with thick copper coin, as the B-1 among Fig. 6; The 3rd step C1 is the thickness material of the thick copper coin of cut being made rolling, as C-1 among Fig. 7 or C-2, by the end view among the figure, will make the ledge c11 that places wafer on the copper coin of conduction rack as can be known and be made into; The 4th step D1 is the conduction rack that the processing of thickness material is cut into continuous rolling, and as D-1 among Fig. 8 or D-2, wherein circle is represented rolling; The 5th step e 1 is the conduction rack that conduction rack is cut into segment-like according to the quantity of each mould ejaculation manufacturing, shown in E-1 or E-2 among Fig. 9; The 6th step F 1 is to give solid brilliant f11, routing f12 and some glue (can be silica gel or epoxy resin) on each conduction rack, as F-1 among Figure 10 or F-2; The 7th step G1 carries out the mould ejection formation, penetrates the glue cake on conduction rack, and shown in G-1 or G-2 among Figure 11, wherein the mould of ejection formation is upper and lower mould g11 and g12, and blob of viscose g13 is injected by mold well hole g14; The 8th step H1 becomes continuous semi-finished product after the demoulding, as H-1 among Figure 12 or H-2; The 9th step I1 cuts the folding pin with continuous semi-finished product to become single finish power led, shown in the I-1 or I-2 of Figure 13.

In Figure 13, the power led I-1 or the I-2 that are finished according to the utility model manufacture method, colloid i11 bottom is extended in conduction rack below wherein a radiating block i12, makes the power led big electric current that utilizes, about 350mA, and can obtain high-intensity light.Wherein manufactured goods I-1 is the power led of sheet contact, and I-2 is the power led of pin formula.

Noticeable, when continuous conduction rack cut into the 7th step G1 of segment-like, the plane formula that can form one n * n extended, and this is the mold design that cooperates next step, and can a large amount of fast production.

In addition, see also shown in Figure 4ly, be the simple and easy manufacturing flow chart of second kind of embodiment of the utility model, it is to make the continuous conduction frame with sheet copper, wherein the thickness of sheet copper is 0.4～0.8mm, and first steps A 2 is the sheet copper round processing of will reorganize and outfit, as the A-2 among Fig. 5; Second step B2 engages thick copper coin with sheet copper, as the B-2 among Fig. 6; The 3rd step C2 is the thickness material of the thick copper coin of cut being made rolling, as C-3 among Fig. 7 or C-4, by the end view among the figure, will make the ledge c11 that places wafer on the copper coin of conduction rack as can be known and be made into; The 4th step D2 is the conduction rack that the processing of thickness material is cut into continuous rolling, and as D-3 among Fig. 8 or D-4, wherein circle is represented rolling; The 5th step e 2 is that conduction rack is cut into the conduction rack of segment-like and gives the folding pin according to encapsulating quantity, shown in E-3 or E-4 among Fig. 9; The 6th step F 2 is to give solid brilliant f11, routing f12 and some glue (can be silica gel or epoxy resin) on each conduction rack, as F-3 among Figure 10 or F-4; The 7th step G2 carries out encapsulating, fixing glue cake g15 on conduction rack, as the G-3 among Figure 11 be directly in mould g16 the perfusion blob of viscose again conduction rack is pressed into mould and finishes, G-4 then be first moulding one shell g17 and then perfusion blob of viscose in this shell, and conduction rack and shell made up; The 8th step H2 makes continuous semi-finished product, as H-3 among Figure 12 or H-4; The 9th step I2 cuts continuous semi-finished product to become single finish power led, shown in the I-3 or I-4 of Figure 13.

The power led I-3 or the I-4 that are finished according to the utility model manufacture method, colloid i11 bottom is extended in conduction rack below wherein a radiating block i12, make the power led big electric current that utilizes, about 350mA, and can obtain high-intensity light.Wherein manufactured goods I-3 is the power led of four pins, and the top is horizontal pin, and the below is vertical pin; And I-4 is the power led of two pin formulas, and the top is horizontal pin, and the below is vertical pin.

By above narration, utilize thick or thin copper coin to be material as can be known, after making the thickness material of rolling earlier, continuous conduction rack is made in cutting again, behind solid crystalline substance, routing and some glue to each conduction rack, encapsulate, cut again finish single power led, such processing procedure utilizes the processing procedure of known power electric crystal, and develops the power led processing procedure that makes new advances, simplify the structure, make that each power led volume production can pragmatize, reduce production unit cost after, just may finish light emitting diode combined becomes illumination and penetrates the possibility that is equipped with.

Claims

1. a power light-emitting diode is made of conduction rack, luminescent wafer and glue cake, and wherein the glue cake is that package is in the ccontaining wafer position in conduction rack upper end; It is characterized in that: above-mentioned conduction rack has the radiating block that extends to glue cake bottom surface, and it is after making the continuous conduction frame with the thickness material, give solid crystalline substance, routing and some glue again, through packaging plastic cake and cutting and a large amount of the manufacturing finished, and extend to the radiating block of glue cake bottom surface can produce big electric current by wafer high thermal transpiration.

2. according to claim 1 power led, it is characterized in that: wherein the pin of conduction rack extension plastic emitting cake is to be the sheet contact.

3. according to claim 1 power led, it is characterized in that: wherein to extend the pin of plastic emitting cake be for thin contact type to conduction rack.

4. according to claim 3 power led, it is characterized in that: wherein the pin of conduction rack extension plastic emitting cake is two pin formulas.

5. according to claim 3 power led, it is characterized in that: wherein the pin of conduction rack extension plastic emitting cake is four pin formulas.