CN2507136Y - Stress reduced chip package - Google Patents
Stress reduced chip package Download PDFInfo
- Publication number
- CN2507136Y CN2507136Y CN01267389U CN01267389U CN2507136Y CN 2507136 Y CN2507136 Y CN 2507136Y CN 01267389 U CN01267389 U CN 01267389U CN 01267389 U CN01267389 U CN 01267389U CN 2507136 Y CN2507136 Y CN 2507136Y
- Authority
- CN
- China
- Prior art keywords
- support plate
- accommodating body
- wafer
- chip assembly
- room
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A clip package capable of reducing stress mainly comprises a containing body, a carrier plate conglutinated with the containing body and enabling a containing chamber opened upwardly to form between the containing body and the carrier plate. A chip is conglutinated on the carrier plate and is electronically connected with the containing body via a plurality of welding lines. Further, the coefficient of thermal expansion of the chip is similar to that of the carrier body. A covering body covers on the containing body and seals the opening of the containing chamber so as to prevent the chip in the containing chamber from being damaged by outer force or being polluted by foreign materials.
Description
Technical field
The utility model is relevant with chip assembly, more detailed is meant a kind of chip assembly that lowers stress.
Background technology
General existing chip assembly 1, as shown in Figure 1, it has a carrier 2, and this carrier 2 has an end face 2a and a bottom surface 2b, and is formed with the room 2c that an opening makes progress from this end face 2a place to lower recess; One integrated circuit (IC) wafer 3 is to be arranged on the bottom 2d of this carrier 2 room 2c, and by the bonding wire 4 of majority it is electrically conducted on this carrier 2, and can be connected with extraneous by this carrier 2, and then electrically conducting in the external world this wafer 3; In addition, also being covered with a capping 5 on the end face 2a of this carrier 2, is in order to seal the opening of this room 2a, to make this wafer 3 can not be subjected to damage of external force or pollution.
Only, this carrier 2 generally is a kind of made in the materials such as plastic cement, glass fibre or pottery, and this wafer 3 then is made by element silicon; Because the difference of these two kinds of materials, the thermal coefficient of expansion (19 * 10 of this carrier 2 will be made
-6) far above the thermal coefficient of expansion (4 * 10 of this wafer 3
-6), make this structure adorn 1 when carrying out mold pressing or running, the influence that this carrier 2 is changed by ambient temperature very easily, make the entire wafer structure adorn 1 and produce the physical phenomenon of expanding with heat and contract with cold, yet the thermal coefficient of expansion of this wafer 3 and this carrier 2 has under four times the situation differing, have the situation that similar Bimetal (bimetallic) deflection or distortion take place, and and then its stress is directed on this wafer 3, make this wafer 3 understand excessive or unbalance stress, and the facts that deflection takes place or break is arranged because of the stress that is born.
Because above-mentioned various shortcoming, this case creator thinks funiculus through detailed, and accumulates the experience of being engaged in chip assembly manufacturing and research and development for many years, and generation of the present utility model is arranged eventually.
Content of the present utility model
That is main purpose of the present utility model is that a kind of chip assembly that lowers stress is being provided, and is can make this wafer lower suffered stress or make it stressed evenly, and reduces the situation that is damaged.
Edge this, the utility model provides a kind of chip assembly that lowers stress, it consists predominantly of: an accommodating body; One support plate is to cohere with this accommodating body, and makes between this accommodating body and this support plate and be formed with the room that an opening makes progress; One wafer is adhesive on this support plate, and is electrically connected by bonding wire and this accommodating body of majority, and the thermal coefficient of expansion of this support plate and this wafer is close; One cover body, this cover body are to cover on this accommodating body, and seal the opening that props up this room, polluted by damage of external force or foreign material to avoid the wafer in this room.
Wherein this support plate is and this wafer identical material.
Wherein this support plate be for A1loy 42 made.
Wherein this accommodating body seat is to can be plastic cement, reinforced plastic, glass to repent materials such as dimension or pottery made.
Wherein this accommodating body has an end face and a bottom surface, and this room is to form to lower recess from end face, and this room is formed with a bottom; This support plate is to be bonded on this bottom.
Wherein the end face of this accommodating body is provided with most weld pads, and is electrically connected by these bonding wires and this wafer.
Wherein this accommodating body is the framework for hollow, and is formed with an internal face; This support plate is adhesive on this internal face with its side, forms the room that installs for this wafer between this accommodating body and this support plate.
Wherein this accommodating body has an end face and a bottom surface, and this room is to form to lower recess from end face, and this room is formed with a bottom, and is provided with a logical perforate of passing through between this bottom and this end face; This support plate is to be bonded on the bottom of this perforate periphery.
Wherein this cover body is that it has a through hole by opaque plastic cement, the made plate of metal, and this through hole is to position that should wafer, and in this through hole at least envelope establish and be fixed with an eyeglass.
Wherein cohering area between this support plate and this bottom accommodating body, is can supporting and fix the minimum area of this support plate on this accommodating body, and is principle with the lateral margin that is not bonded to this support plate.
Description of drawings
For making juror more detail knowledge actual configuration of the present utility model and characteristics, enumerate now that following examples and conjunction with figs. describe in detail as after, wherein:
Fig. 1 is a kind of cross-sectional schematic of existing crystal wafer assembling structure;
Fig. 2 is the cutaway view of the utility model first preferred embodiment;
Fig. 3 is the cutaway view of the utility model second preferred embodiment;
Fig. 4 is the cutaway view of the utility model the 3rd preferred embodiment;
Fig. 5 is the cutaway view of the utility model the 4th preferred embodiment.
Embodiment
Seeing also Fig. 2, is that the utility model first preferred embodiment provides a kind of chip assembly 10 that lowers stress, and it consists predominantly of the bonding wire 50 and a cover body 60 of an accommodating body 20, a support plate 30, a wafer 40, majority; Wherein,
This accommodating body 20 is to can be plastic cement, reinforced plastic, glass fibre or pottery ... the circuit board made etc. material (Printed Circuit Board, PCB); This accommodating body 20 has an end face 21 and and is positioned at the bottom surface 22 that this end face 21 is tossed about, on this end face 21, extend depression downwards and be formed with the room 23 that an opening makes progress, this room 23 is formed with a bottom 231, and is formed with the circuit (not shown) that is predetermined quantity and aspect on this bottom 231;
This support plate 30 is to be a plate body, and be bonded on the bottom 231 of this room 23 by a glue 31, and 231 of this support plate 30 and this bottoms cohere area, be can support and fix the minimum area of this support plate 30 on this bottom 231, and the lateral margin that is not applied to this support plate 30 with this glue 31 is a principle, and this support plate 30 is by the material close with the thermal coefficient of expansion of this wafer 40 made (as Alloy 42 or element silicon);
This wafer 40, be made by silicon (si) element, and by glass or two-sided tape as Araldite, silicones, LMP ... Deng an adhesive thing (not shown) wherein, directly adhesive and be fixed on this support plate 30, have most weld pad (not shown) on the surface of this wafer 40;
These bonding wires 50, be made by conducting metal materials such as gold or aluminium, and utilize the routing technology that one end of these bonding wires 50 is connected with the weld pad of this wafer 40, the other end then with these accommodating body 20 bottoms 231 on circuit be electric connection, and can be by this accommodating body 20 as the media of this wafer 40 with extraneous conducting;
This cover body 60 is that it has a top 61 and and is positioned at the bottom of tossing about in this top 61 62 by made plates of material such as opaque plastic cement, metal or transparent glass, plastic cement; This bottom 62 is to be incorporated on the end face 21 of this accommodating body 20 by a glue 63, and can seal the opening that props up this room 23, is not subjected to the pollution of damage of external force or foreign material with the wafer 40 of guard bit in this room 23.
What this need specify be: because this wafer 40 is made by element silicon, its thermal coefficient of expansion is about 4 * 10
-6And be the support plate 30 that directly coheres with this wafer 40, the thermal coefficient of expansion of the thermal coefficient of expansion of its material and this wafer 40 is very close again, not only can make the probability that deflection or distortion take place this support plate 30 greatly lower, also can avoid simultaneously 30 pairs of these wafers of this support plate 40 to produce the excessive stress or the bad influence of stress distribution inequality, destroy and this wafer 40 produced, can make this wafer 40 be subjected to the deflection of this support plate 30 and the situation destroyed significantly lowers; And, can reduce bigger etc. the harmful effect of deflection that 20 pairs of these support plates 30 of this accommodating body are produced or stress because the area that coheres of 20 of this support plate 30 and this accommodating bodies reduces.
And because this accommodating body 20 is not direct gluing with this wafer 40, and materials such as can price comparatively cheap plastic cement or pottery are made, and adorn 10 costs on making to lower this structure;
Above-mentioned structure adorns 10 when using, and can utilize the mode of soldering or other electric connection, this accommodating body 20 is connected with the circuit board (not shown) that is assembled with necessary electronic component get final product.
Seeing also Fig. 3, is that the utility model second preferred embodiment provides a kind of chip assembly 70 that lowers stress, and it includes the bonding wire 74 and a cover body 75 of an accommodating body 71, a support plate 72, a wafer 73, majority equally; The main difference of itself and the foregoing description is:
This accommodating body 71 more is provided with a perforate 715 that runs through this room 713 bottoms 714 to this bottom surface 712; And the end face 711 of this accommodating body 71 is provided with the circuit (not shown) that is predetermined quantity and aspect;
This support plate 72 is adhesive on perforate 715 peripheries of position in these room 713 bottoms 714 with all causes one glue 721 of one end;
Secondly, this wafer 73 is adhesive on the other end of support plate 72, and by these bonding wires 74 this wafer 73 is electrically connected at weld pad on these accommodating body 71 bottoms 714 and the end face 711 respectively.
Seeing also Fig. 4, is that the utility model the 3rd preferred embodiment provides a kind of chip assembly 80 that lowers stress, and it includes the bonding wire 84 and a cover body 85 of an accommodating body 81, a support plate 82, a wafer 83, majority equally; The main difference of itself and the foregoing description is:
This accommodating body 81 is the frameworks for a hollow, and partly is formed with an internal face 813 in its hollow;
This support plate 82 is adhesive on the internal face 813 of these accommodating body 81 1 ends with its side 821, make original hollow partly be subjected to the involution of this support plate 82 and form the room 814 that an opening makes progress, and the end face 811 of this accommodating body 81 is provided with some weld pad (not shown), and by these bonding wires 84 earlier and the weld pad (not shown) on this wafer 83 be connected, the mode of extending with almost horizontal is connected with weld pad on this end face 811 again, and the weld pad periphery of this accommodating body 81 is provided with some Qi Ding of running through, bottom surface 811,812 perforation 815, and can place these perforations 815 by scolding tin or other connector, and it is electrically conducted on the circuit board (not shown) in the external world.
Seeing also Fig. 5 is that the utility model the 4th preferred embodiment provides a kind of chip assembly 90 that lowers stress, and it includes the bonding wire 94 and a cover body 95 of an accommodating body 91, a support plate 92, a wafer 93, majority equally; The main difference of itself and above-mentioned preferred embodiment is:
This cover body 95, be that it has a through hole 951 by opaque plastic cement, the made plate of metal, this through hole 951 is to position that should wafer 93, and in this through hole 951 at least envelope establish and be fixed with an eyeglass 952, light from outside is penetrated by this eyeglass 952 and shine on this wafer 93;
Then can be when using by the mode of soldered ball, scolding tin, tin cream or other electric connection, this accommodating body 91 is electrically connected on the extraneous circuit board gets final product.
In sum, the utility model can lower the chip assembly of stress, really has reduction produces stress to wafer effect, its progressive practicality of real tool, and convenience in the use, again, the utility model there is no identical items and sees publication or public use before application, be to have possessed patent condition, so file an application in accordance with the law so that, the utility model is real.
Claims (10)
1. chip assembly that can lower stress is characterized in that it consists predominantly of:
One accommodating body;
One support plate is to cohere with this accommodating body, and makes between this accommodating body and this support plate and be formed with the room that an opening makes progress;
One wafer is adhesive on this support plate, and is electrically connected by bonding wire and this accommodating body of majority, and the thermal coefficient of expansion of this support plate and this wafer is close;
One cover body, this cover body are to cover on this accommodating body, and envelope props up the opening of this room.
2. according to the described chip assembly that lowers stress of claim 1, it is characterized in that wherein this support plate is and this wafer identical material.
3. according to the described chip assembly that lowers stress of claim 1, it is characterized in that, wherein this support plate be for Alloy 42 made.
4. according to the described chip assembly that lowers stress of claim 1, it is characterized in that wherein this accommodating body seat is to can be plastic cement, reinforced plastic, glass to repent materials such as dimension or pottery made.
5. according to the described chip assembly that lowers stress of claim 1, it is characterized in that wherein this accommodating body has an end face and a bottom surface, and this room is to form to lower recess from end face, and this room is formed with a bottom; This support plate is to be bonded on this bottom.
6. according to the described chip assembly that lowers stress of claim 5, it is characterized in that wherein the end face of this accommodating body is provided with most weld pads, and electrically connect by these bonding wires and this wafer.
7. according to the described chip assembly that lowers stress of claim 1, it is characterized in that wherein this accommodating body is the framework for hollow, and is formed with an internal face; This support plate is adhesive on this internal face with its side, forms the room that installs for this wafer between this accommodating body and this support plate.
8. according to the described chip assembly that lowers stress of claim 1, it is characterized in that wherein this accommodating body has an end face and a bottom surface, and this room is to form to lower recess from end face, and this room is formed with a bottom, and is provided with a logical perforate of passing through between this bottom and this end face; This support plate is to be bonded on the bottom of this perforate periphery.
9. according to the described chip assembly that lowers stress of claim 1, it is characterized in that, wherein this cover body, be by opaque plastic cement, the made plate of metal, it has a through hole, and this through hole is to position that should wafer, and in this through hole at least envelope establish and be fixed with an eyeglass.
10. according to the described chip assembly that lowers stress of claim 1, it is characterized in that, wherein cohering area between this support plate and this bottom accommodating body, is can supporting and fix the minimum area of this support plate on this accommodating body, and is principle with the lateral margin that is not bonded to this support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01267389U CN2507136Y (en) | 2001-10-15 | 2001-10-15 | Stress reduced chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01267389U CN2507136Y (en) | 2001-10-15 | 2001-10-15 | Stress reduced chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2507136Y true CN2507136Y (en) | 2002-08-21 |
Family
ID=33673780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01267389U Expired - Fee Related CN2507136Y (en) | 2001-10-15 | 2001-10-15 | Stress reduced chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2507136Y (en) |
-
2001
- 2001-10-15 CN CN01267389U patent/CN2507136Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20020821 Termination date: 20101015 |