CN2664079Y

CN2664079Y - Small-sized memory card structure

Info

Publication number: CN2664079Y
Application number: CN 200320100355
Authority: CN
Inventors: 谢志鸿; 吴志成; 蔡尚节; 陈炳光
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2003-10-14
Filing date: 2003-10-14
Publication date: 2004-12-15
Anticipated expiration: 2013-10-14

Abstract

The utility model relates to a small-sized memory card structure which comprises a foundation plate, a plurality of memory chips, a plurality of wires and an adhesive layer, wherein, the foundation plate is provided with a plurality of hollowed-out slots and a plurality of memory chips; a plurality of pads of the memory chips are hollowed out of the hollowed-out slots and electrically connected to the foundation plate through a plurality of wires; finally a plurality of memory chips are sealed and packaged through the adhesive layer, thereby the utility model has the effects of small packaging volume and relatively convenient manufacture.

Description

Small-sized storage card structure

Technical field

The utility model is a kind of small-sized storage card structure, is meant a kind of compact mini memory card that has especially.

Background technology

The method for making of conventional memory card generally all is earlier Chip Packaging to be become single integrated circuit, and then by surface adhering technology (SMT), integrated circuit is welded on the printed circuit board (PCB), and integrated circuit then can be an internal memory, for example flash memory driving components such as (flash).On tellite, then there is golden finger can insert the slot that computing machine is reserved, removes this, also have passive components such as some electric capacity, inductance, resistance.

Fig. 1 is the schematic side view of conventional memory card, and golden finger 15 is slots that are used for inserting computing machine.On module card, be provided with driving component and passive component (not drawing).Driving component is packaged into integrated circuit 11 usually, integrated circuit 11 inner encapsulation one chips 12, and this chip 12 may be a memory chip, for example flash memory (flash memory).The pin 13 of integrated circuit 11 is to utilize the surface adhering technology to be welded on the circuit substrate 14 of storage card, and 14 of circuit substrates have pad 17 to be connected with pin 13.There is following shortcoming in traditional method:

One, earlier that chip 12 is packaged, be welded in again on the circuit substrate 14, cause step complicated, can increase encapsulation and cost of manufacture.

Two, the integrated circuit on the general storage card is not only one usually, has several, when making module card, just must one one integrated circuit 11 be welded on the circuit substrate 14, causes when taking a lot of work.

Three, it is higher to utilize surface adhering technology (SMT) to be welded to the cost of circuit substrate 14, must increase the equipment cost of SMT after one tin stove.

Four, the chip 12 of mini memory card is to be packaged in the conventional fashion, and can't reach compact demand.

The inventor joins hands in the research and development of storage card in line with the spirit of keeping on improving, innovate breakthrough, creates the utility model mini memory card structure, and it is more convenient that it is made, and can reach compact demand.

Summary of the invention

Fundamental purpose of the present utility model provides a kind of small-sized storage card structure, and it has makes effect easily, reaches the purpose that effectively reduces production costs.

Another purpose of the present utility model provides a kind of small-sized storage card structure, and it has the effect of dwindling package dimension, reaches the purpose of compact demand.

The purpose of this utility model is achieved in that a kind of small-sized storage card structure, it is in order to be installed in the electronic installation, it includes a substrate, a most memory chip, a plurality of wires and an adhesive layer, it is characterized in that: this substrate is provided with a upper surface, a lower surface and most connect hollow slots to lower surface by this upper surface, this upper surface is positioned at this each hollow slots periphery and is formed with most contacts, be provided with most golden fingers in this substrate side and be electrically connected this majority contact, this substrate is to be installed in this electronic installation, and this golden finger is electrically connected with this electronic installation; This majority memory chip is provided with a top surface and a basal surface, and this top surface central part is formed with most weld pads, and the top surface of this each memory chip is the lower surface that is arranged at this substrate, and most weld pads on it are engraved out respectively at corresponding hollow slots; Each lead of this plurality of wires is provided with first contact and second contact, and it is to be placed in the hollow slots of this substrate, and this first contact is electrically connected on the contact of this substrate, and this second contact is to be electrically connected on the weld pad of this memory chip; This adhesive layer is the upper surface that is covered in this substrate, and is filled in this hollow slots, and this plurality of wires is lived in protection, and is covered in the lower surface of this substrate, should cover simultaneously by a majority memory chip.

This substrate is provided with two hollow slots, and this majority memory chip is two.The basal surface of this majority memory chip is exposed by this adhesive body.

Describe in detail below in conjunction with preferred embodiment and accompanying drawing.

Description of drawings

Fig. 1 is the synoptic diagram of conventional small storage card structure.

Fig. 2 is first kind of structural representation of the present utility model.

Fig. 3 is second kind of structural representation of the present utility model.

Fig. 4 is the structural representation of the utility model embodiment.

Embodiment

Embodiment 1

Consult Fig. 2-shown in Figure 3, small-sized storage card structure of the present utility model, it includes a substrate 20, two memory chips 22, plurality of wires 24 and adhesive layers 26, wherein:

Substrate 20 is provided with a upper surface 28, a lower surface 30 and two and connects hollow slots 32 to lower surface 30 by upper surface 28, upper surface 28 is positioned at each hollow slots 32 periphery and is formed with a majority contact 34 and is provided with most contacts 34 of most golden fingers 36 electrical connections in substrate 20 sides, substrate 20 is in order to be installed in the electronic installation (figure does not show), golden finger 36 is electrically connected with this electronic installation.

Memory chip 22 is provided with a top surface 38 and a basal surface 40, and top surface 38 central parts are formed with most weld pads 42, and top surface 38 is the lower surfaces 30 that are arranged at substrate 20, and most weld pads 42 on it are engraved out respectively at corresponding hollow slots 32.

Lead 24 is provided with first contact 44 and second contact 46, and it is to be placed in the hollow slots 32 of substrate 20, and its first contact 44 is electrically connected on the contact 34 of substrate 20, and second contact 46 is to be electrically connected on the weld pad 42 of memory chip 22.

Adhesive layer 26 is the upper surfaces 28 that are covered in substrate 20, and is filled in each hollow slots 32, lives plurality of wires 24 in order to protection, and is covered in the lower surface 30 of substrate 20, in order to a majority memory chip 22 is covered simultaneously.

Embodiment 2

Consult shown in Figure 4, embodiment 2 of the present utility model, when adhesive layer 26 covers a majority memory chip 22 simultaneously, and the basal surface 40 of most memory chips 22 is exposed by adhesive layer 26, can increase the radiating effect of memory chip 22, with fiduciary level that improves storage card and the serviceable life that prolongs storage card.

The utlity model has following advantage:

1, most memory chips 22 are electrically connected the encapsulating structure of substrate 20 in the mode of central authorities' lead-in wire, can make storage card reach compact demand.

2, the basal surface 40 of most memory chips 22 is exposed by adhesive body 26, can increase the radiating effect of memory chip 22, can improve the fiduciary level of storage card and prolong its serviceable life.

3, memory chip 22 is arranged on the substrate 20 in advance, simultaneously a majority memory chip 22 is encapsulated with adhesive layer 26 again, can simplify procedure for producing, can imitate and reduce production costs.

The detailed description of above-mentioned preferred embodiment is only in order to be easy to illustrate technology contents of the present utility model; be not with the utility model narrow sense be limited to embodiment; all according to the spirit many variations of doing enforcement of the present utility model, all belong in the protection domain of the present utility model.

Claims

1, a kind of small-sized storage card structure, it includes a substrate, most memory chips, plurality of wires and adhesive layers, it is characterized in that: this substrate is provided with a upper surface, a lower surface and most and connects hollow slots to lower surface by this upper surface, this upper surface is positioned at this each hollow slots periphery and is formed with most contacts, be provided with most golden fingers in this substrate side and be electrically connected this majority contact, this substrate is to be installed in this electronic installation, and this golden finger is electrically connected with this electronic installation; This majority memory chip is provided with a top surface and a basal surface, and this top surface central part is formed with most weld pads, and the top surface of this each memory chip is the lower surface that is arranged at this substrate, and most weld pads on it are engraved out respectively at corresponding hollow slots; Each lead of this plurality of wires is provided with first contact and second contact, and it is to be placed in the hollow slots of this substrate, and this first contact is electrically connected on the contact of this substrate, and this second contact is to be electrically connected on the weld pad of this memory chip; This adhesive layer is the upper surface that is covered in this substrate, and is filled in this hollow slots, and this plurality of wires is lived in protection, and is covered in the lower surface of this substrate, should cover simultaneously by a majority memory chip.

2, small-sized storage card structure according to claim 1, it is characterized in that: this substrate is provided with two hollow slots, and this majority memory chip is two.

3, small-sized storage card structure according to claim 1, it is characterized in that: the basal surface of this majority memory chip is exposed by this adhesive body.