CN2493946Y - 小型可插拔光传接模组壳体 - Google Patents
小型可插拔光传接模组壳体 Download PDFInfo
- Publication number
- CN2493946Y CN2493946Y CN01241870U CN01241870U CN2493946Y CN 2493946 Y CN2493946 Y CN 2493946Y CN 01241870 U CN01241870 U CN 01241870U CN 01241870 U CN01241870 U CN 01241870U CN 2493946 Y CN2493946 Y CN 2493946Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- module casing
- printed circuit
- passes
- sidewall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0058—Casings specially adapted for optoelectronic applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
一种小型可插拔光传接模组壳体,是由一单片金属板材制成并包括两侧壁、一侧壁盖、一上盖板、一底板及一后盖。其中每一侧壁的下缘分别设有多个长脚与短脚,该长脚包括一个椭圆形主体,主体的中间部位开设有一槽孔,可固定该壳体于一印刷电路板上。在回流焊接过程中,当电路板通过焊锡池时,具有槽孔的长脚可防止壳体脱离印刷电路板,短脚则抵顶印刷电路板,使得壳体与印刷电路板之间形成一定间隙,从而增强了焊接效果。
Description
【技术领域】
本实用新型涉及一种应用于光通信系统的小型可插拔(SmallForm-Factor Pluggable,SFP)光传接模组,尤指一种用来接收与传送高速率数据信号的小型可插拔光传接模组壳体。
【背景技术】
在光通信系统中,光传接模组用在光传输链路与电接界面之间提供双向数据传输。该模组将来自电界面的编码电信号转换为相应的光信号,并传输到光传输链路。同时,该光传接模组也将来自光传输链路的光编码信号转换成相应的电信号并传送到电界面。
通常,光传接模组安装在主机、输入/输出系统、外围设备或交换机等设备的印刷电路板上,而小型可插拔光传接模组插接于固定在印刷电路板的金属壳体中,该金属壳体应便于和小型可插拔光传接模组连接而且便于安装在印刷电路板上,以用来消除静电并作为电磁辐射的遮蔽壳体。
现有的金属壳体多采用两片式设计,即具有上、下两壳体,该上、下壳体通过特定的卡扣结构相卡配而连接在一起。但是,这种设计机械强度不够,且制造与安装较麻烦。另外,在安装过程中,由于现有的壳体只是具有定位脚,而不具备卡钩,以致于在回流焊接时该金属壳体容易脱离印刷电路板而导致安装失效。
【发明内容】
本实用新型的目的在于提供一种具有良好机械稳定性,且在回流焊接过程中不会脱离印刷电路板的小型可插拔光传接模组壳体。
本实用新型的目的是这样实现的:这种小型可插拔光传接模组壳体是由单片金属材料加工而成,它包括两侧壁、一上盖板、一底板和一后盖。其中每一侧壁的下缘分别设有多个长脚与短脚。该长脚包括一椭圆形主体,该主体中间部位开设有一槽孔,短脚抵顶印刷电路板,使得壳体与印刷电路板之间形成一定间隙。
与现有技术相比,本实用新型的优点在于:这种小型可插拔光传接模组壳体是由单片材料加工而成,使得壳体机械稳定性增强,而且因为壳体的长脚包括一椭圆形主体,可与印刷电路板的孔洞形成干涉配合,因而稳固的将壳体安装在印刷电路板上,可防止回流焊接时壳体脱离印刷电路板。
【附图说明】
图1是本实用新型小型可插拔光传接模组壳体的立体视图。
图2是本实用新型小型可插拔光传接模组壳体未扣合状态下的立体视图。
图3是本实用新型小型可插拔光传接模组壳体部分移除后的立体视图。
图4是图2小型可插拔光传接模组壳体另一角度的立体视图。
图5是图1小型可插拔光传接模组壳体又一角度的立体视图。
图6是图5小型可插拔光传接模组壳体中长脚的放大视图。
【具体实施方式】
在图1至图4所示的实施例中,本实用新型小型可插拔光传接模组壳体1安装在一印刷电路板上(图未示),其包括第一侧壁2a、第二侧壁2b、一侧壁盖3、一上盖板4、一底板5和一后盖,该后盖包括一外板6与一内板7以及两弹片8a、8b。该小型可插拔光传接模组壳体1是由单片金属材料加工而成,相对于已知技术中壳体的两片式设计更具机械稳定性。
该第一侧壁2a与第二侧壁2b上邻近其前端处分别设有接地弹片24a、24b,而且每一侧壁2a、2b下缘分别设有多个长脚22与短脚23。另外,该第一侧壁2a进一步冲设有多个卡扣弹片21,且其后端与内板7交接处开设有一凹槽25。
上盖板4前端设有多个接地弹片41,其它部分开设有若干个孔42。该上盖板4侧壁往下弯折延伸的侧壁盖3上对应第一侧壁2a多个卡扣弹片21的位置上开设有对应数目个开口31,该侧壁盖3上对应第一侧壁2a接地弹片24a处还开设有一开口32,该开口31、32分别与卡扣弹片21、接地弹片24a扣合。
该上盖板4的后端朝下弯折延伸出的外板6上开设有一矩形孔61,而第二侧壁2b后端弯折延伸出的内板7上对应外板6上矩形孔61的位置冲设出一卡片71,组装时是与矩形孔61扣合。该内板7的自由端进一步形成有一凸片73,该凸片73嵌卡于第一侧壁2a的凹槽25中。该内板7下缘朝下延伸出脚72,分别与印刷电路板上的相应孔(图未示)配合。另外,该第一侧壁2a与第二侧壁2b的后端分别弯折相向延伸出两弹片8a、8b,以作为接地用。
如图5至图6所示,安装壳体1到印刷电路板(图未示)时,长脚22穿过印刷电路板上相应的孔洞,而短脚23仅抵顶在印刷电路板上。每一长脚22包括一椭圆形主体221,该主体221的最大宽度稍大于印刷电路板上相应孔洞的直径,为使长脚22能插入印刷电路板的相应孔洞中,并与该孔洞干涉配合以将壳体1固持于印刷电路板上,该主体221上开设有一槽孔222,使得长脚22受挤压时能产生适度变形。每一短脚23包括一伸长体232,该伸长体232具有圆形端部231。回流焊接时,通过长脚22的主体221与印刷电路板孔洞的干涉配合而使壳体1固定在印刷电路板上,从而有效防止壳体1通过焊锡池时脱离印刷电路板。同时,由于该短脚23抵顶印刷电路板,而使得壳体1与印刷电路板之间形成一定间隙,可防止溢锡现象而造成焊锡沾污壳体表面。
又如图5所示,底板5短于上盖板4,该底板5上邻近壳体1的前端设有一折片52及位于该折片52两侧的接地弹片51a、51b,且该底板5上邻近折片52处设有一支撑脚53,而邻近壳体1的后端进一步设有两支撑脚54,用以支撑壳体1。
Claims (10)
1.一种小型可插拔光传接模组壳体,是安装在一印刷电路板上,其特征在于该小型可插拔光传接模组壳体是由单片材料加工而成,包括一上盖板、一底板、一后板、一侧壁盖和第一、第二侧壁,其中第一侧壁与底板相连接,第二侧壁分别与上盖板和底板相连接,且每一侧壁的底部延伸出至少一第一端脚,该第一端脚可产生形变地插入印刷电路板。
2.如权利要求1所述的小型可插拔光传接模组壳体,其特征在于至少有一个第一端脚包括一主体,该主体上开设有一槽孔。
3.如权利要求2所述的小型可插拔光传接模组壳体,其特征在于第一端脚的主体部份宽度大于印刷电路板上所开设的相应孔洞直径。
4.如权利要求2所述的小型可插拔光传接模组壳体,其特征在于单片材料是为单片金属板材。
5.如权利要求2所述的小型可插拔光传接模组壳体,其特征在于第一端脚的主体大致是椭圆形。
6.如权利要求5所述的小型可插拔光传接模组壳体,其特征在于第一端脚的椭圆形主体部份的宽度大于印刷电路板上所开设的相应孔洞直径。
7.如权利要求5所述的小型可插拔光传接模组壳体,其特征在于单片材料是金属板材。
8.如权利要求1所述的小型可插拔光传接模组壳体,其特征在于每一侧壁的底端还延伸出至少一第二端脚,它是抵顶在印刷电路板上。
9.如权利要求1所述的小型可插拔光传接模组壳体,其特征在于侧壁盖是由上盖板的侧壁向下弯折延伸形成。
10.如权利要求1所述的小型可插拔光传接模组壳体,其特征在于侧壁盖是叠盖在第一侧壁上,而且其中一个上面设有一接地片,而另一个上面设有一开口,接地片是与开口配合。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/827,859 | 2001-04-05 | ||
US09/827,859 US20020145856A1 (en) | 2001-04-05 | 2001-04-05 | Small form-factor pluggable transceiver cage |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2493946Y true CN2493946Y (zh) | 2002-05-29 |
Family
ID=25250351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN01241870U Expired - Lifetime CN2493946Y (zh) | 2001-04-05 | 2001-08-09 | 小型可插拔光传接模组壳体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20020145856A1 (zh) |
CN (1) | CN2493946Y (zh) |
TW (1) | TW504116U (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6780053B1 (en) * | 2000-08-09 | 2004-08-24 | Picolight Incorporated | Pluggable small form factor transceivers |
AU2003294490A1 (en) * | 2002-11-20 | 2004-06-18 | Bookham Technology Plc | Small form factor pluggable optoelectronic modules |
TW573867U (en) * | 2003-05-07 | 2004-01-21 | Hon Hai Prec Ind Co Ltd | SFF transceiver module |
US7211739B1 (en) | 2006-03-27 | 2007-05-01 | Emc Corporation | Electromagnetic interference (EMI) shield for a cable-bulkhead interface |
US8339784B2 (en) * | 2010-01-06 | 2012-12-25 | Methode Electronics, Inc. | Thermal management for electronic device housing |
JP2013138110A (ja) * | 2011-12-28 | 2013-07-11 | Honda Tsushin Kogyo Co Ltd | 電気コネクタ用ケージ |
US9391407B1 (en) * | 2015-06-12 | 2016-07-12 | Tyco Electronics Corporation | Electrical connector assembly having stepped surface |
CN107046206B (zh) * | 2017-01-23 | 2021-07-20 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
US11695241B2 (en) * | 2020-07-03 | 2023-07-04 | Dongguan Luxshare Technologies Co., Ltd | Electrical connector assembly with improved shielding effect and locking structure |
-
2001
- 2001-04-05 US US09/827,859 patent/US20020145856A1/en not_active Abandoned
- 2001-07-27 TW TW090212836U patent/TW504116U/zh not_active IP Right Cessation
- 2001-08-09 CN CN01241870U patent/CN2493946Y/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW504116U (en) | 2002-09-21 |
US20020145856A1 (en) | 2002-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20110809 Granted publication date: 20020529 |