CN2485801Y - Structure of low heat resistance LCD - Google Patents
Structure of low heat resistance LCD Download PDFInfo
- Publication number
- CN2485801Y CN2485801Y CN01229222U CN01229222U CN2485801Y CN 2485801 Y CN2485801 Y CN 2485801Y CN 01229222 U CN01229222 U CN 01229222U CN 01229222 U CN01229222 U CN 01229222U CN 2485801 Y CN2485801 Y CN 2485801Y
- Authority
- CN
- China
- Prior art keywords
- low thermal
- led
- thermal resisting
- circuit board
- resisting led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model relates to a low thermal resistance LED. The utility model comprises a low thermal resistance LED, a circuit base board and a heat dispelling base; the low thermal resistance LED is fixed in the heat dispelling base and the circuit base and the heat energy in the core of the low LED is educed from the heat dispelling plate and the heat dispelling base, so that heat in chip of the low thermal resistance LED is leaded out by the heat dispelling plate and athe heat dispelling base; and the utility model can enhance the capability of the LED.
Description
The utility model relates to a kind of low thermal resisting LED structure, relates in particular to a kind of structure that connects surface temperature thermal resistance (R θ ja) to the air that reduces luminescence chip, and improves the usefulness of light-emitting diode.
Traditional light-emitting diode (LED) encapsulation technology is with crystal-bonding adhesive chip to be fixed on the support, is connected stamping metal wire between the liner (pad) of chip and the support, at last again with the epoxy encapsulation moulding again.On using then is that this light-emitting diode is fixedly welded on the printed circuit board (PCB) in the plug-in unit mode.
Because the surface temperature that connects of luminous efficacy, life-span and the chip of light-emitting diode is inversely proportional to, anticipate promptly, chip connect surface temperature height, the brightness decay lost of life of LED.Above-mentioned light-emitting diode is dispelled the heat by support, and therefore, radiating effect is relatively poor.
The purpose of this utility model is to provide the package structure for LED of a low thermal resistance, and it is luminescence chip to be sticked together be fixed on the heating panel; the liner and the printed circuit board (PCB) of this luminescence chip are connected; and form a protective coating, whereby, to reach better heat radiating effect.
Another purpose of the present utility model, be to provide one the light-emitting diode of low thermal resistance encapsulated moulding can be sticked together the structure that is fixed on cooling base and circuit substrate, so that by heating panel low thermal resistance, the good characteristic of thermal conductivity, the interior temperature of luminescence chip of low thermal resisting LED can be derived by heating panel and cooling base, because it is to utilize large-area heating panel heat radiation, so can obtain low R θ ja, and promote the usefulness of light-emitting diode.
For realizing the purpose of this utility model, we propose a kind of low thermal resisting LED structure, and it comprises:
One low thermal resisting LED, it is provided with a heating panel, and heating panel is provided with a luminescence chip, and the liner of luminescence chip and a printed circuit board (PCB) are connected, and form a protective coating;
One cooling base is connected with the heating panel of low thermal resisting LED; And
One circuit substrate is connected with the printed circuit board (PCB) of cooling base or low thermal resisting LED;
Whereby, connect surface temperature thermal resistance to the air to reduce luminescence chip, and improve light-emitting diode usefulness.
Described low thermal resisting LED structure can connect to one by copper foil circuit, pin or connector and circuit substrate and cooling base on the printed circuit board (PCB) of low thermal resisting LED.
Described low thermal resisting LED structure, its printed circuit board (PCB), circuit substrate can be rigid printed circuit board, flexible printed wiring board, metallic support copper sheet or directly apply line layer on metallic plates.
Described low thermal resisting LED structure is provided with via on the position of circuit substrate and cooling base binding, borrow connector or pin to be connected for low thermal resisting LED.
In order to further specify feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet appended icon only for reference with the explanation usefulness, be not to be used for the utility model is limited.
Fig. 1 is an outside drawing of the utility model low thermal resisting LED;
Fig. 2 is the end view of Fig. 1;
Fig. 3 is the first enforcement illustration of the utility model in assembling;
Fig. 4 is the second enforcement illustration of the utility model in assembling;
Fig. 5 is another outside drawing of the utility model low thermal resisting LED;
Fig. 6 is the end view of Fig. 5;
Fig. 7 is the three enforcement illustration of the utility model in assembling.
See also Fig. 1 to Fig. 3, the utility model proposes a kind of " low thermal resisting LED structure ", it comprises a low thermal resisting LED 1, a circuit substrate 2 and a cooling base 3; Wherein:
In low thermal resisting LED 1, be provided with a heating panel 10; this heating panel 10 is provided with a depression 11; supplying a luminescence chip 12 to stick together is fixed on the heating panel 10; the liner of this luminescence chip 12 is to be connected with a printed circuit board (PCB) 13; and form a protective coating 14; form the light-emitting diode of low thermal resistance encapsulation whereby, so that it has better heat radiating effect.
Consult Fig. 1 to Fig. 3 again, the utility model can be provided with copper foil circuit 15 on the printed circuit board (PCB) 13 of low thermal resisting LED 1, to be connected with circuit substrate 2 and cooling base 3, by heating panel low thermal resistance, the good characteristic of thermal conductivity, temperature in the chip can be derived by heating panel 10 and cooling base 3, because it utilizes large-area heating panel heat radiation, thus low R θ ja can be obtained, to promote light-emitting diode usefulness.
See also shown in Figure 4ly, another that is the utility model in assembling implemented illustration.It can borrow copper foil circuit 15 and circuit substrate 2 to be connected on the printed circuit board (PCB) 13 of low thermal resisting LED 1; The bottom surface of heating panel 10 then directly is connected with cooling base 3, whereby, and reducing the R θ ja of luminescence chip 12, and the usefulness of raising light-emitting diode.
See also Fig. 5 to Fig. 7, the utility model also can borrow pin (or connector) 16 and cooling base 3 and circuit substrate 2 to be connected on the printed circuit board (PCB) 13 of low thermal resisting LED 1, whereby, with the R θ ja of reduction luminescence chip 12, and promote light-emitting diode usefulness.
Consult Fig. 7 again, the utility model is provided with a via 4 on the position that cooling base 3 and circuit substrate 2 are connected, borrow the spot welding mode to connect to one for the pin 16 of printed circuit board (PCB) 13, whereby, with the R θ ja of reduction luminescence chip 12, and promote light-emitting diode usefulness.
In sum,, can effectively reduce R θ ja, promote light-emitting diode usefulness, have the usability on the industry, can be applicable to lighting apparatus, traffic sign, alarming device display etc. by package assembly of the present utility model.
The above; it only is the specific embodiment of one of the utility model the best; but structural feature of the present utility model is not limited thereto; anyly be familiar with the people of this technology in field of the present utility model; can think easily and variation or modification; can be rigid printed circuit board, flexible printed wiring board, metallic support copper sheet or on metallic plate, directly apply line layer as printed circuit board (PCB), circuit substrate, all can be encompassed in the protection range of claim of the present utility model.
Claims (4)
1. a low thermal resisting LED structure is characterized in that, comprising:
One low thermal resisting LED, it is provided with a heating panel, and heating panel is provided with a luminescence chip, and the liner of luminescence chip and a printed circuit board (PCB) are connected, and form a protective coating;
One cooling base is connected with the heating panel of low thermal resisting LED; And
One circuit substrate is connected with the printed circuit board (PCB) of cooling base or low thermal resisting LED.
2. low thermal resisting LED structure as claimed in claim 1 is characterized in that: can connect to one by copper foil circuit, pin or connector and circuit substrate and cooling base on the printed circuit board (PCB) of low thermal resisting LED.
3. low thermal resisting LED structure as claimed in claim 1 is characterized in that: described printed circuit board (PCB), circuit substrate can be rigid printed circuit board, flexible printed wiring board, metallic support copper sheet or directly apply line layer on metallic plates.
4. low thermal resisting LED structure as claimed in claim 1 is characterized in that: be provided with via on the position of circuit substrate and cooling base binding, borrow connector or pin to be connected for low thermal resisting LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01229222U CN2485801Y (en) | 2001-06-27 | 2001-06-27 | Structure of low heat resistance LCD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01229222U CN2485801Y (en) | 2001-06-27 | 2001-06-27 | Structure of low heat resistance LCD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2485801Y true CN2485801Y (en) | 2002-04-10 |
Family
ID=33644129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01229222U Expired - Lifetime CN2485801Y (en) | 2001-06-27 | 2001-06-27 | Structure of low heat resistance LCD |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2485801Y (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008119230A1 (en) * | 2007-03-29 | 2008-10-09 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | A lighting device |
| CN100435336C (en) * | 2004-10-18 | 2008-11-19 | 夏普株式会社 | Semiconductor light emitting device, backlight device for liquid crystal display |
| CN100449801C (en) * | 2004-09-30 | 2009-01-07 | 晶元光电股份有限公司 | Semiconductor luminescent element composition |
| US7701055B2 (en) | 2006-11-24 | 2010-04-20 | Hong Applied Science And Technology Research Institute Company Limited | Light emitter assembly |
| CN104009028A (en) * | 2014-05-26 | 2014-08-27 | 上海信耀电子有限公司 | Integrated package method and structure of high-power LED with ceramic substrate and heat dissipation substratum |
| CN104966774A (en) * | 2015-07-07 | 2015-10-07 | 宏齐光电子(深圳)有限公司 | Reverse-buckling type small-dimension large-power LED packaging structure |
| CN106151959A (en) * | 2015-01-15 | 2016-11-23 | 旭德科技股份有限公司 | Lighting device |
| CN107706286A (en) * | 2017-09-27 | 2018-02-16 | 开发晶照明（厦门）有限公司 | LED light emission device and LED support |
| CN108508625A (en) * | 2018-03-12 | 2018-09-07 | 广东欧珀移动通信有限公司 | Structured light projector, image acquiring device and electronic equipment |
-
2001
- 2001-06-27 CN CN01229222U patent/CN2485801Y/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100449801C (en) * | 2004-09-30 | 2009-01-07 | 晶元光电股份有限公司 | Semiconductor luminescent element composition |
| CN100435336C (en) * | 2004-10-18 | 2008-11-19 | 夏普株式会社 | Semiconductor light emitting device, backlight device for liquid crystal display |
| US7663229B2 (en) | 2006-07-12 | 2010-02-16 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Lighting device |
| US7701055B2 (en) | 2006-11-24 | 2010-04-20 | Hong Applied Science And Technology Research Institute Company Limited | Light emitter assembly |
| WO2008119230A1 (en) * | 2007-03-29 | 2008-10-09 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | A lighting device |
| CN104009028A (en) * | 2014-05-26 | 2014-08-27 | 上海信耀电子有限公司 | Integrated package method and structure of high-power LED with ceramic substrate and heat dissipation substratum |
| CN104009028B (en) * | 2014-05-26 | 2017-06-06 | 上海信耀电子有限公司 | The high power LED integration packaging method and structure of ceramic substrate and heat radiation substrate |
| CN106151959B (en) * | 2015-01-15 | 2019-02-15 | 旭德科技股份有限公司 | Lighting device |
| CN106151959A (en) * | 2015-01-15 | 2016-11-23 | 旭德科技股份有限公司 | Lighting device |
| CN104966774A (en) * | 2015-07-07 | 2015-10-07 | 宏齐光电子(深圳)有限公司 | Reverse-buckling type small-dimension large-power LED packaging structure |
| CN104966774B (en) * | 2015-07-07 | 2019-06-11 | 宏齐光电子(深圳)有限公司 | A kind of reverse buckling type small size high-power LED encapsulation structure |
| CN107706286A (en) * | 2017-09-27 | 2018-02-16 | 开发晶照明（厦门）有限公司 | LED light emission device and LED support |
| CN107706286B (en) * | 2017-09-27 | 2019-10-11 | 开发晶照明（厦门）有限公司 | LED light emission device and LED support |
| CN108508625A (en) * | 2018-03-12 | 2018-09-07 | 广东欧珀移动通信有限公司 | Structured light projector, image acquiring device and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: GUANGBAO TECHNOLOGY CO., LTD. Free format text: FORMER NAME OR ADDRESS: GUANGBAO ELECTRONIC CO., LTD., TAIWAN |
|
| CP03 | Change of name, title or address |
Address after: Taipei city of Taiwan Province Patentee after: Lite-On Technology Corporation Address before: Taiwan, China Patentee before: Guangbao Electronic Co., Ltd., Taiwan |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20110627 Granted publication date: 20020410 |