CN2348490Y - Semiconductor packing device - Google Patents
Semiconductor packing device Download PDFInfo
- Publication number
- CN2348490Y CN2348490Y CN 98241699 CN98241699U CN2348490Y CN 2348490 Y CN2348490 Y CN 2348490Y CN 98241699 CN98241699 CN 98241699 CN 98241699 U CN98241699 U CN 98241699U CN 2348490 Y CN2348490 Y CN 2348490Y
- Authority
- CN
- China
- Prior art keywords
- material pipe
- frame
- jaw
- pipe support
- collecting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a semiconductor packing device. In every encapsulation workstation of a semiconductor, an automatic material receiving device is used for filling the semiconductor into a material pipe, and the arrangement of the material pipe is used for automatically feeding. The utility model is characterized in that the device is composed of a material pipe rack, a clamping jaw, a footstock and a transport table. Empty material pipes can be pushed and stacked onto the material pipe. The elevation of the footstock and the clamping of the matched clamping jaw are used for dropping a single empty material pipe into the transport table. The transport table can be moved by a screw rod driven by a motor. The empty material pipe is transported onto a material pipe bracket of a material receiving opening and upward supported by the matched clamping for receiving material and packing. Moreover, the device can be matched with the monitoring of a sensor, and thus, when the material pipe is fully packed, the empty material pipes can be automatically transported. Therefore, the purposes of automatically packing and collecting material are achieved.
Description
The utility model relates to a kind of material collecting device of automation, be particularly related to a kind of semiconductor packages rewinding setting, especially refer in the semiconductor process flow, operation post being finished the IC semiconductor of processing loads to expecting in the pipe, be transferred to next operation post, and carry out the semiconductor packages material collecting device of self-feeding processing.
Because human electronics technology is maked rapid progress, must be replaced by integrated circuit (integrated circuit is called for short IC) gradually in conjunction with the work that just can finish by many large-scale electronic circuits in the past, the outstanding feature of IC is to be that its volume ratio is little of thousands of times with the semiconductor construction that the element that separates makes, but density increases, also thereby make the electronic product volume-diminished made from IC many, conform with the human principle of using; General IC makes respectively when finishing at the lead frame of wafer and bearing wafer, must be again via in conjunction with, baking, beat procedure of processings such as bonding wire, encapsulating moulding and cutting, just can produce complete IC individuality, and an IC individuality must pass through every detection and print job again, could be complete errorless provides use.As shown in Figure 1, do in the operation of back segment package detection at IC, IC utilizes the material road to be transferred to discharging mouth 1, the below of discharging mouth 1 promptly is arranged with several rewinding tubes 2, and be accumulated in the rewinding inner core 2 IC is irregular, carry out next operation post at IC and add man-hour, then must IC be arranged pan feeding one by one in rewinding tube 2 with manpower, and this operation procedure labor intensive not only, operating personnel are also taken place most probably arrange the storing mistake, and the situation that causes equipment or IC to damage, therefore with regard to the fail safe of production efficiency and operation, this rewinding mode obviously is necessary to be improved, to increase economic efficiency.
In view of this, this creator satisfies with tool working experience for many years, through continuous research and design, grind the automatic material receiving device of creating a kind of IC eventually, and the IC proper alignment of the processing that will fulfil assignment is carried out next operation and is added man-hour in the material pipe, can be directly by material pipe feed, the carrying out of favourable processing operation, this is the design's aim.
Main purpose of the present utility model is that a kind of semiconductor packages material collecting device will be provided, it mainly is a vertical installing array material pipe support on an inclined-plane frame, put on it and several empty material pipes can be piled up, other is provided with jaw and controls and get vomit pipe, the material pipe that jaw is discharged with a footstock holds to descend and moves on the delivery platform again, this delivery platform is to be moved by a motor-driven screw, and will expect that pipe is transferred to the material pipe support of rewinding mouth position, hold rising with another footstock again, and prop up by jaw, can be positioned the rewinding mouth; When the IC that finishes the processing operation, promptly freely falls with gravity when being transferred to discharging opening through the material road, and being filled in the material pipe of marshalling in regular turn, after the material pipe is filled, sensor promptly can perception and is started this device, and transports feed pipe automatically, and reaches the purpose of automatic filling material.
The purpose of this utility model is achieved in that
A kind of semiconductor packages material collecting device is characterized in that:
Frame: be to be an inclined-plane, lock vertical with the inclined-plane is provided with array and can piles up the material pipe supports that set up several material pipes on it;
Jaw: be to be located at material pipe support below, it is driven by a cylinder pressure and makes opening and closing movement, with clamping or release vomit pipe;
Footstock: be on frame, and corresponding each group material pipe support, it drives lifting by cylinder pressure, and can hold the lifting of material pipe;
The delivery platform: be to be positioned on the frame, it moves along the frame inclined-plane with drive power source, moves with carrying material pipe;
Another jaw: be to be located at another material pipe support below, its downside has guiding incline, and links a spring, to prop up the rewinding of material pipe;
The discharging road: be that linkage frame is located on the jaw of another material pipe support, after the material pipe held with jaw, its open end was corresponding to the discharging road.
This delivery platform is to screw togather-screw rod, and by motor and belt transmission, and the delivery platform can be moved along screw rod.
The side frames of this delivery platform is provided with can guide this guide rod that delivery platform moves.
This frame opposite side is directly to tilt to set up the waste material pipe of collecting defective products.
This material pipe support is to be located on the frame with panel lock, establishes with the corresponding lock of dividing plate again, makes and forms the material pipe support between dividing plate.
This material pipe support is to offer a breach, and this breach connects a discharging road.
The utility model can utilize material Guan Laizuo automation rewinding operation, and being arranged in of IC direction unanimity expected in the pipe, and after finishing rewinding, operating personnel can directly move the material pipe to next operation post, and next operation post can be directly with the feeding of material pipe, do not need fully to arrange with manual work again, except effective saving human resources, also can effectively guarantee the correct feeding of IC, the situation that can avoid generation equipment or IC to damage, and make whole work flow more smooth, significantly improve utilization benefit.
Further specify the technical solution of the utility model and embodiment below in conjunction with accompanying drawing.
Description of drawings:
Fig. 1 is material collecting device schematic diagram commonly used;
Fig. 2 is the schematic diagram of the utility model material pipe;
Fig. 3 is a schematic diagram of the present utility model;
Fig. 4 is the schematic diagram () of the utility model fortune feed pipe;
Fig. 5 is the schematic diagram (two) of the utility model fortune feed pipe;
Fig. 6 is the schematic diagram (three) of the utility model fortune feed pipe;
Fig. 7 is the schematic diagram (four) of the utility model fortune feed pipe;
Fig. 8 is the schematic diagram (five) of the utility model fortune feed pipe;
Fig. 9 is the schematic diagram (six) of the utility model fortune feed pipe;
Figure 10 receives the schematic diagram () of material pipe for the utility model;
Figure 11 receives the schematic diagram (two) of material pipe for the utility model.
As shown in Figure 2, the employed material pipe 10 of the utility model is to be a strip, and having storage tank 101, one ends in it is open end 102, and end then has a block 103 in addition, spills from an end to prevent IC.As shown in Figure 3, the utility model mainly is to have vertical installing two panels 201,202 on the frame 20 on inclined-plane one, corresponding lock is established several dividing plates 203,204 on two panels 201,202 again, the feasible material pipe support 205,206 that every between plate, forms array, in addition a side of frame 20 is can direct oblique placement waste material pipe 104, it is in testing process, is promptly directly received by waste material pipe 104 if any the IC of fault; The material pipe support 205 of side is to place empty material pipe 10, its below is provided with a jaw 208 by cylinder pressure 207 drivings, and can do the action of folding, on inclined-plane frame 20, install a footstock 209 by the cylinder pressure driving in addition, it is the action of making vertical lift along inclined-plane frame 20, and it screws togather delivery platform 30 with screw rod 301, and also there are guide rod 302 bindings both sides, and screw rod 301 can make delivery platform 30 to move to another material pipe support 206 positions along screw rod 301 by belt 303 by the motor driven in the oblique frame 20.As Fig. 3, shown in Figure 10, material pipe support 206 its belows are to be provided with jaw 210, and these jaw 210 belows are a contra bevel, and link a spring 211, make behind jaw 210 Unscrews, can utilize spring 211 to reset, inclined-plane frame 20 is corresponding to material pipe support 206 positions, and other is provided with the footstock 212 that is driven by cylinder pressure, rise with jacking material pipe, in addition offer a breach 213 in jaw 210 tops of material pipe support 206, this breach 213 also links a discharging road 214, IC promptly thus discharging road 214 advance in the feeding pipe.As shown in Figure 4, empty material pipe 10 of the present utility model is to be stacked on the material pipe support 205, and it also utilizes jaw 208 clampings location.As shown in Figure 5, when sky material pipe 10 was desired to transport, at first footstock 209 will drive with cylinder pressure and rise to empty material pipe 10 lower positions and prepare to hold.As shown in Figure 6, after footstock 209 arrived the location, jaw 208 was promptly driven rotation and is discharged empty material pipe 10 by cylinder pressure 207, and this moment, whole row's sky material pipe 10 was promptly held by footstock 209.As shown in Figure 7, footstock 209 lattice that then descend make the 2nd empty material pipe 10 ' drop to jaw 208 height and positions.Show as Fig. 8, behind the 2nd empty material pipe 10 ' drop to jaw 208 positions, jaw 208 drive rotation by cylinder pressure again and be clamped in empty material pipe 10 ' both ends open in, and the 2nd later material pipe is positioned on the material pipe support 205.As shown in Figure 9, behind the 2nd empty material pipe 10 ' be held the location, footstock 209 promptly drops to initial point, because delivery platform 30 highly is the origin position that is higher than footstock 209, therefore after footstock 209 dropped to initial point, empty material pipe 10 promptly dropped down onto on the delivery platform 30, and breaks away from material pipe support 205, this moment, screw rod 301 promptly can rotate, and made delivery platform 30 move to the precalculated position.As shown in figure 10, after sky material pipe 10 is transferred to the position of material pipe support 206 by delivery platform 30, footstock 212 is promptly driven by cylinder pressure and rises, because jaw 210 belows are a contra bevel, when therefore footstock 212 holds 10 risings of material pipe, can its pushing tow be rotated along the contra bevel of jaw 210, and make material pipe 10 by jaw 210.As shown in figure 11, after material pipe 10 passes through, jaw 210 location of promptly can overturning back with the elastic force of spring 211, this moment, footstock 212 promptly dropped to initial point, and material pipe 10 promptly props up the location by jaw 210, and the open end 102 of the material pipe 10 behind the location is to face discharging road 214, the IC that fulfiling assignment stands processes can be by the discharging road with in the sliding feeding pipe 10 of gravity, after the IC filling of arranging in regular turn was full, delivery platform 30 will continue to transport empty material and manage to expecting pipe support 206, with the operation of proceeding to load.
In sum, the utility model utilizes the automation and the normalization of rewinding, and improves the operating efficiency of whole flow process, real dark tool practicality and advance, so not seeing has identical product and publication openly, thereby meets novel patent application important document, so file an application in accordance with the law.
Claims (6)
1, a kind of semiconductor packages material collecting device is characterized in that:
Frame: be to be an inclined-plane, lock vertical with the inclined-plane is provided with array and can piles up the material pipe supports that set up several material pipes on it;
Jaw: be to be located at material pipe support below, it is driven by a cylinder pressure and makes opening and closing movement, with clamping or release vomit pipe;
Footstock: be on frame, and corresponding each group material pipe support, it drives lifting by cylinder pressure, and can hold the lifting of material pipe;
The delivery platform: be to be positioned on the frame, it moves along the frame inclined-plane with drive power source, moves with carrying material pipe;
Another jaw: be to be located at another material pipe support below, its downside has guiding incline, and links a spring, to prop up the rewinding of material pipe;
The discharging road: be that linkage frame is located on the jaw of another material pipe support, after the material pipe held with jaw, its open end was corresponding to the discharging road.
2, semiconductor packages material collecting device as claimed in claim 1 is characterized in that: this delivery platform is to screw togather a screw rod, and by motor and belt transmission, and the delivery platform can be moved along screw rod.
3, semiconductor packages material collecting device as claimed in claim 1 is characterized in that: the side frames of this delivery platform is provided with can guide this guide rod that delivery platform moves.
4, semiconductor packages material collecting device as claimed in claim 1 is characterized in that: this frame opposite side is directly to tilt to set up the waste material pipe of collecting defective products.
5, semiconductor packages material collecting device as claimed in claim 1 is characterized in that: this material pipe support is to be located on the frame with panel lock, establishes with the corresponding lock of dividing plate again, makes and forms the material pipe support between dividing plate.
6, semiconductor packages material collecting device as claimed in claim 1 is characterized in that: this material pipe support is to offer a breach, and this breach connects a discharging road.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98241699 CN2348490Y (en) | 1998-10-26 | 1998-10-26 | Semiconductor packing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98241699 CN2348490Y (en) | 1998-10-26 | 1998-10-26 | Semiconductor packing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2348490Y true CN2348490Y (en) | 1999-11-10 |
Family
ID=33988411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98241699 Expired - Fee Related CN2348490Y (en) | 1998-10-26 | 1998-10-26 | Semiconductor packing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2348490Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101850861A (en) * | 2010-04-26 | 2010-10-06 | 邱木圳 | Automatic box packing machine |
| CN102284977A (en) * | 2011-08-25 | 2011-12-21 | 铜陵三佳山田科技有限公司 | Die-cutting, forming and separating die for integrated circuit without pins |
| CN102500556A (en) * | 2011-10-26 | 2012-06-20 | 无锡圆方半导体测试有限公司 | Automatic uncorking device of semi-conductor separator material pipes |
| CN102832157A (en) * | 2012-09-11 | 2012-12-19 | 苏州均华精密机械有限公司 | Automatic pipe layout mechanism for receiving pipes of integrated circuits |
| CN106238339A (en) * | 2016-08-30 | 2016-12-21 | 福州派利德电子科技有限公司 | IC chip cliff cut style testing, sorting machine feeding conveying device |
-
1998
- 1998-10-26 CN CN 98241699 patent/CN2348490Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101850861A (en) * | 2010-04-26 | 2010-10-06 | 邱木圳 | Automatic box packing machine |
| CN102284977A (en) * | 2011-08-25 | 2011-12-21 | 铜陵三佳山田科技有限公司 | Die-cutting, forming and separating die for integrated circuit without pins |
| CN102500556A (en) * | 2011-10-26 | 2012-06-20 | 无锡圆方半导体测试有限公司 | Automatic uncorking device of semi-conductor separator material pipes |
| CN102500556B (en) * | 2011-10-26 | 2015-05-27 | 无锡圆方半导体测试有限公司 | Automatic uncorking device of semi-conductor separator material pipes |
| CN102832157A (en) * | 2012-09-11 | 2012-12-19 | 苏州均华精密机械有限公司 | Automatic pipe layout mechanism for receiving pipes of integrated circuits |
| CN102832157B (en) * | 2012-09-11 | 2014-09-24 | 苏州均华精密机械有限公司 | Automatic pipe layout mechanism for receiving pipes of integrated circuits |
| CN106238339A (en) * | 2016-08-30 | 2016-12-21 | 福州派利德电子科技有限公司 | IC chip cliff cut style testing, sorting machine feeding conveying device |
| CN106238339B (en) * | 2016-08-30 | 2018-09-25 | 福州派利德电子科技有限公司 | IC chip cliff cut style testing, sorting machine feeding conveying device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |