CN221280291U - Industrial detection probe adopting semiconductor refrigeration technology - Google Patents
Industrial detection probe adopting semiconductor refrigeration technology Download PDFInfo
- Publication number
- CN221280291U CN221280291U CN202323029606.1U CN202323029606U CN221280291U CN 221280291 U CN221280291 U CN 221280291U CN 202323029606 U CN202323029606 U CN 202323029606U CN 221280291 U CN221280291 U CN 221280291U
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- industrial
- probe
- semiconductor refrigeration
- temperature
- refrigeration process
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- 239000000523 sample Substances 0.000 title claims abstract description 59
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000005057 refrigeration Methods 0.000 title claims abstract description 20
- 238000001514 detection method Methods 0.000 title claims abstract description 18
- 238000005516 engineering process Methods 0.000 title description 2
- 238000001816 cooling Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000013307 optical fiber Substances 0.000 claims description 13
- 238000007689 inspection Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 3
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 7
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 7
- 238000004321 preservation Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The utility model discloses an industrial detection probe adopting a semiconductor refrigeration process, which is characterized by comprising the following components: the detection assembly comprises an industrial probe, a semiconductor refrigerating sheet and a temperature control PCB, wherein the bottom of the industrial probe is in close contact with the cold face of the semiconductor refrigerating sheet, a PID control loop is arranged in the temperature control PCB, and the semiconductor refrigerating sheet is connected to a control circuit of the temperature control PCB. The utility model has active refrigeration and good cooling effect, and can ensure that the probe stably works for a long time; the cooling temperature is continuously adjustable, so that the probe can work at a constant temperature, and the detection precision of the probe can be improved; the high integration and the compact structure are realized; the over-temperature protection function is achieved, and the safety and reliability are realized; avoid using compressed air to cool, and have low operation cost.
Description
Technical Field
The utility model relates to the field of industrial detection, in particular to an industrial detection probe adopting a semiconductor refrigeration process.
Background
The industrial detection probe generally has a severe working environment, and particularly, detection equipment around an industrial boiler needs to bear the conditions of high environmental temperature, high dust concentration and the like. The harsh industrial environment presents a very difficult challenge to heat dissipation of the detection device itself. The problem of high temperature is solved by generally adopting methods of improving self-tolerance temperature of parts, adopting cooling medium to carry out auxiliary cooling and the like, but the problems of increased cost and operation cost and the like are caused.
The present utility model has been made to solve the above problems.
Disclosure of utility model
The utility model aims to provide detection equipment applied to the periphery of an industrial boiler, namely an industrial detection probe adopting a semiconductor refrigeration process, which is proved by practical application, can effectively detect the conditions of high temperature, high dust concentration and the like around the industrial boiler, thereby solving the defects.
The utility model adopts the technical proposal for solving the technical problems that:
An industrial inspection probe employing a semiconductor refrigeration process, comprising:
The detection assembly comprises an industrial probe 1, a semiconductor refrigerating sheet 4 and a temperature control PCB (printed circuit board) 2, wherein the bottom of the industrial probe 1 is in close contact with the cold surface of the semiconductor refrigerating sheet 4, a PID (proportion integration differentiation) control loop is arranged in the temperature control PCB 2, and the semiconductor refrigerating sheet 4 is connected into the control circuit of the temperature control PCB 2. When the semiconductor refrigerating sheet 4 passes through the current, heat is taken away from the bottom of the industrial probe 1 by the semiconductor refrigerating sheet 4, so that the heat dissipation effect on the industrial probe 1 is realized, and the industrial probe 1 works at a proper constant temperature.
Further, the industrial probe 1 is wrapped by an insulating layer 12 except the bottom area, and the insulating layer 12 is made of refractory fibers with low heat conductivity coefficient. So that ambient heat cannot enter the industrial probe 1 through the insulation layer 12.
Further, a shell 11 is arranged outside the heat preservation layer 12.
Further, an opening is arranged at the lower part of the shell 11, a radiating fin 3 is arranged at the opening, the hot surface of the semiconductor refrigerating fin 4 is in close contact with the radiating fin 3, and heat taken away from the industrial probe 1 and the self-energizing heating value of the semiconductor refrigerating fin 4 are radiated through the radiating fin 3.
Further, a lower housing is provided below the housing, the heat sink 3 is provided inside the lower housing, and the lower housing is provided with a cooling air inlet 501. When the heat radiation fin 3 radiates heat, cooling air is introduced from the cooling air inlet 501 of the lower case 5.
Further, the industrial detection probe further comprises an observation assembly, wherein the observation assembly comprises an inner catheter 6, an outer catheter 7 and an image optical fiber 8, the image optical fiber 8 is arranged inside the inner catheter 6, the outer catheter 7 is arranged outside the inner catheter 6, and a gap is arranged between the inner catheter 6 and the outer catheter 7; the observation assembly is connected with the shell 11 through a pull handle type quick connector 9; the end of the shell 11 connected with the observation assembly is provided with a through hole, and the image optical fiber 8 passes through the through hole to be in contact with the industrial probe 1. After cooling air flows through the cooling fins 3 to dissipate heat, the cooling air enters the inner guide pipe 6 and the outer guide pipe 7 through the internal channel of the shell 11 and the pull handle type quick connector 9, and finally is discharged into the observation area of the industrial probe 1 from the ports of the inner guide pipe 6 and the outer guide pipe 7. The image optical fiber 8 provides optical signals for the industrial probe 1, the image optical fiber 8 is wrapped and protected by the inner guide pipe 6 and the outer guide pipe 7, and cooling air flows through the inner guide pipe 6 and the outer guide pipe 7 and simultaneously dissipates heat of the image optical fiber 8, so that high-temperature damage of the image optical fiber is avoided.
Further, the industrial detection probe further comprises a temperature switch 10 which is mounted on the heat sink 3 and is connected in series with the temperature control PCB 2 and the power supply of the industrial probe 1. The temperature switch 10 provides high temperature protection for the operation of the probe, when the cooling fin 3 is blocked due to dirt or insufficient flow of cooling air, the temperature of the cooling fin 3 is increased, and when the temperature reaches the action temperature of the temperature switch 10, the power supply of the temperature control PCB 2 is disconnected, so that the industrial probe 1 and the semiconductor refrigerating fin 4 are not electrified any more to work, and the high temperature heat preservation function is achieved.
The utility model has the advantages that:
The active refrigeration and cooling effects are good, so that the probe can work stably for a long time; the cooling temperature is continuously adjustable, but the probe works at a constant temperature, so that the detection precision of the probe can be improved; the high integration and the compact structure are realized; the over-temperature protection function is achieved, and the safety and reliability are realized; and compressed air is not used for cooling, and the operation cost is low.
Drawings
FIG. 1 is a front view of an industrial inspection probe employing a semiconductor refrigeration process in accordance with the present utility model;
Fig. 2 is a cross-sectional view of an industrial inspection probe employing a semiconductor refrigeration process in accordance with the present utility model.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 2, the industrial detection probe adopting the semiconductor refrigeration process provided by the utility model comprises an industrial probe 1, a temperature control PCB board 2, a radiating fin 3, a semiconductor refrigeration piece 4, a lower shell 5, an inner conduit 6, an outer conduit 7, an image optical fiber 8, a spanner type quick connector 9, a temperature switch 10, a shell 11 and a heat preservation layer 12.
The industrial probe 1 is wrapped by the heat insulation layer 12 except the bottom area, and the heat insulation layer 12 is made of refractory fibers with low heat conductivity coefficient, so that environmental heat cannot enter the industrial probe 1 through the heat insulation layer 12.
The bottom of the industrial probe 1 is tightly contacted with the cold surface of the semiconductor refrigerating sheet 4, and when the semiconductor refrigerating sheet 4 passes through current, heat is taken away from the bottom of the industrial probe 1 by the semiconductor refrigerating sheet 4, so that the heat dissipation effect of the industrial probe 1 is realized.
The heat carried away from the industrial probe 1 and the self-energizing heating value of the semiconductor refrigerating piece 4 are radiated by the radiating piece 3.
When the cooling fin 3 radiates heat, cooling air is introduced from the cooling air inlet 501 of the lower housing 5, and after the cooling air flows through the cooling fin 3 to radiate heat, the cooling air enters the inner guide tube 6 and the outer guide tube 7 through the internal channel of the housing 11 and the pull-handle type quick connector 9, and is preferably discharged from the ports of the inner guide tube 6 and the outer guide tube 7 into the observation area of the industrial probe 1.
The image optical fiber 8 provides optical signals for the industrial probe 1, the image optical fiber 8 is wrapped and protected by the inner guide pipe 6 and the outer guide pipe 7, and cooling air flows through the inner guide pipe 6 and the outer guide pipe 7 and simultaneously dissipates heat of the image optical fiber 8, so that high-temperature damage of the image optical fiber is avoided.
The temperature control PCB 2 is a control circuit of the semiconductor refrigerating sheet 4, and is internally provided with a PID control loop, so that the industrial probe 1 can work at a proper constant temperature.
The temperature switch 10 is installed on the heat sink 3 and connected in series with the temperature control PCB 2 and the power supply of the industrial probe 1. The temperature switch 10 provides high temperature protection for the operation of the probe, when the cooling fin 3 is blocked due to dirt or insufficient flow of cooling air, the temperature of the cooling fin 3 is increased, and when the temperature reaches the action temperature of the temperature switch 10, the power supply of the temperature control PCB 2 is disconnected, so that the industrial probe 1 and the semiconductor refrigerating fin 4 are not electrified any more to work, and the high temperature heat preservation function is achieved.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "inner", "outer", "left", "right", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in place when the inventive product is used, or are directions or positional relationships conventionally understood by those skilled in the art, are merely for convenience of describing the present utility model and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, terms such as "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Claims (7)
1. An industrial inspection probe employing a semiconductor refrigeration process, comprising: the detection assembly comprises an industrial probe (1), a semiconductor refrigerating sheet (4) and a temperature control PCB (printed circuit board) (2), wherein the bottom of the industrial probe (1) is in close contact with the cold surface of the semiconductor refrigerating sheet (4), a PID control loop is arranged in the temperature control PCB (2), and the semiconductor refrigerating sheet (4) is connected into the control circuit of the temperature control PCB (2).
2. Industrial inspection probe employing semiconductor refrigeration process according to claim 1, characterized in that the industrial probe (1) is surrounded by a heat insulation layer (12) except the bottom area, the heat insulation layer (12) being made of refractory fibers.
3. Industrial inspection probe employing semiconductor refrigeration process according to claim 2, characterized in that the outside of the insulating layer (12) is provided with a housing (11).
4. An industrial inspection probe employing a semiconductor refrigeration process according to claim 3, wherein an opening is provided at the lower part of the housing (11), a heat sink (3) is provided at the opening, and the heat surface of the semiconductor refrigeration sheet (4) is in close contact with the heat sink (3).
5. The industrial inspection probe employing a semiconductor refrigeration process according to claim 4, wherein a lower housing is provided below the housing, the heat sink (3) is provided inside the lower housing, and the lower housing is provided with a cooling air inlet (501).
6. The industrial inspection probe employing a semiconductor refrigeration process according to claim 5, further comprising an inspection assembly comprising an inner conduit (6), an outer conduit (7) and an image fiber (8), the image fiber (8) being disposed inside the inner conduit (6), the outer conduit (7) being disposed outside the inner conduit (6), a gap being provided between the inner conduit (6) and the outer conduit (7); the observation assembly is connected with the shell (11) through a spanner type quick connector (9); the end of the shell (11) connected with the observation assembly is provided with a through hole, and the image optical fiber (8) passes through the through hole to be in contact with the industrial probe (1).
7. Industrial inspection probe employing a semiconductor refrigeration process according to any of claims 1-6, further comprising a temperature switch (10) mounted on the heat sink (3) and connected in series with the temperature-controlled PCB (2) and the power supply of the industrial probe (1).
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221280291U true CN221280291U (en) | 2024-07-05 |
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| Date | Code | Title | Description |
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| GR01 | Patent grant |