CN218765772U

CN218765772U - High-temperature-resistant pressure transmitter

Info

Publication number: CN218765772U
Application number: CN202223504042.8U
Authority: CN
Inventors: 蒋炳周; 于纪瑞; 吴昊; 胡仁锋
Original assignee: Anhui Anruitang Intelligent Equipment Co ltd
Current assignee: Anhui Anruitang Intelligent Equipment Co ltd
Priority date: 2022-12-27
Filing date: 2022-12-27
Publication date: 2023-03-28
Anticipated expiration: 2032-12-27

Abstract

The utility model relates to a high temperature resistant pressure transmitter, including pressure transmitter body and screwed joint, the bottom fixedly connected with heat insulating board of pressure transmitter body, the outside of pressure transmitter body is provided with radiator unit, radiator unit includes the heat dissipation shell, fixed mounting has radiator fan on the inner wall of heat dissipation shell, the cavity has been seted up to the inside of heat dissipation shell, fixed mounting has the water tank on the outer wall of heat dissipation shell, fixedly connected with circulating pipe and first connecting pipe respectively in the outside of water tank, the outside that the water tank was kept away from to first connecting pipe is provided with the water pump, fixed mounting has the second connecting pipe on the output of water pump. This high temperature resistant pressure transmitter for the inside load cell of pressure transmitter body provides the protection, has effectively avoided high temperature to damage load cell and circuit board, has prolonged the life of pressure transmitter body, has improved the practicality.

Description

High-temperature-resistant pressure transmitter

Technical Field

The utility model relates to a pressure transmitter technical field specifically is a high temperature resistant pressure transmitter.

Background

The pressure transmitter is a device for converting pressure into pneumatic signal or electric signal to control and remotely transmit, and can convert the physical pressure parameters of gas, liquid and the like sensed by the load cell sensor into standard electric signals to be supplied to secondary instruments such as indication alarm instruments, recording instruments, regulators and the like for measurement, indication and process regulation.

Pressure transmitters of the prior art, including capacitive pressure transmitters, are generally configured as: the pressure sensitive element is pressed and fixed on the upper end face of the plug shell by a positioning piece and is in abutting contact with the upper end face of the plug shell through four corners of the bottom face.

At present, when the medium temperature measured by the pressure transmitter is higher, the upper end face of the plug shell in contact with the bottom surface of the pressure sensitive element can bear higher temperature, and the plug shell is generally made of thermoplastic plastics for facilitating the requirement of a thermal forming process, so that the contact part of the upper end face of the plug shell and the bottom surface of the pressure sensitive element is easy to generate high-temperature deformation in the measuring working process, further the damage to the pressure measuring element and a circuit board is easy to cause in a high-temperature state, the use effect of the pressure transmitter is seriously influenced, the pressure transmitter cannot normally work, and the high-temperature resistant pressure transmitter is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a high temperature resistant pressure transmitter possesses the heat dissipation of being convenient for, and advantages such as high temperature resistant have solved the destruction that causes pressure cell and circuit board easily under high temperature state, have seriously influenced pressure transmitter's result of use, make pressure transmitter can not normally work's problem.

In order to achieve the above purpose, the utility model provides a following technical scheme: a high-temperature-resistant pressure transmitter comprises a pressure transmitter body and a threaded joint, wherein a heat insulation plate is fixedly connected to the bottom of the pressure transmitter body, and a heat dissipation assembly is arranged on the outer side of the pressure transmitter body;

the heat dissipation assembly comprises a heat dissipation shell, a heat dissipation fan is fixedly mounted on the inner wall of the heat dissipation shell, a cavity is formed in the heat dissipation shell, a water tank is fixedly mounted on the outer wall of the heat dissipation shell, a circulating pipe and a first connecting pipe are fixedly connected to the outer side of the water tank respectively, a water pump is arranged on the outer side, away from the water tank, of the first connecting pipe, a second connecting pipe is fixedly mounted on the output end of the water pump, a semiconductor refrigerator is arranged at one end, away from the water pump, of the second connecting pipe, and a conveying pipe is fixedly mounted on the output end of the semiconductor refrigerator.

Further, the heat dissipation shell is fixedly installed on the outer side of the pressure transmitter body, and the upper end of the threaded connector penetrates through the inner side of the heat insulation plate and is fixedly connected with the bottom of the pressure transmitter body.

Furthermore, the upper side of the water tank is in threaded connection with a tank cover, and one end of the circulating pipe, which is far away from the water tank, is communicated with the inner side of the cavity and is fixedly connected with the inner side of the heat dissipation shell.

Further, the water pump is fixedly mounted on the outer wall of the water tank, and the first connecting pipe is fixedly mounted with the input end of the water pump.

Further, the semiconductor refrigerator is fixedly installed on the outer wall of the heat dissipation shell, and the second connecting pipe is fixedly installed with the input end of the semiconductor refrigerator.

Furthermore, one end of the conveying pipe, which is far away from the semiconductor refrigerator, is communicated with the inner side of the cavity and is fixedly connected with the inner side of the heat dissipation shell.

Furthermore, the number of the cooling fans is two, and the two cooling fans are respectively located on two sides of the pressure transmitter body.

Compared with the prior art, the utility model provides a high temperature resistant pressure transmitter possesses following

Has the advantages that:

1. this high temperature resistant pressure transmitter, can improve air mobility through starting radiator fan, make the heat give off fast, and simultaneously, utilize the coolant liquid of the interior cavity flow of heat dissipation shell and the heat that the pressure transmitter body gived off to carry out the heat exchange, thereby carry out high-efficient heat dissipation to it, the pressure cell for pressure transmitter body inside provides the protection, high temperature has effectively been avoided damaging pressure cell and circuit board, the life of pressure transmitter body has been prolonged, the practicality is improved, the destruction that causes pressure cell and circuit board under high temperature state easily has been solved, pressure transmitter's result of use has been seriously influenced, make pressure transmitter can not normally work the problem.

2. This high temperature resistant pressure transmitter through add the heat insulating board between pressure transmitter body and screwed joint, the material of heat insulating board is glass fiber, and glass fiber has good adiabatic heat insulating ability, has reduced the heat-conduction effect to the influence of pressure transmitter body is taken to the high temperature has effectively been reduced.

Drawings

FIG. 1 is a sectional view of the present invention;

FIG. 2 is an enlarged schematic view of A of FIG. 1 according to the present invention;

fig. 3 is a front view of the structure of the present invention.

In the figure: 1 pressure transmitter body, 2 heat insulating boards, 3 screwed joints, 4 heat dissipation shells, 5 heat dissipation fans, 6 cavities, 7 water tanks, 8 circulating pipes, 9 first connecting pipes, 10 water pumps, 11 second connecting pipes, 12 semiconductor refrigerators, 13 conveying pipes and 14 box covers.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a high temperature resistant pressure transmitter includes a pressure transmitter body 1 and a threaded joint 3, a heat insulation board 2 is fixedly connected to the bottom of the pressure transmitter body 1, wherein the upper end of the threaded joint 3 penetrates through the inner side of the heat insulation board 2 and is fixedly connected to the bottom of the pressure transmitter body 1, the lower end of the threaded joint 3 is a threaded rod structure so as to be connected to a component to be tested, the heat insulation board 2 is made of glass fiber, the glass fiber has good heat insulation performance, heat conduction is reduced, and therefore the influence of high temperature on the pressure transmitter body 1 is effectively reduced.

In this embodiment, the outside of pressure transmitter body 1 is provided with radiator unit, radiator unit includes heat dissipation shell 4, heat dissipation shell 4 fixed mounting is to the outside of pressure transmitter body 1, fixed mounting has radiator fan 5 on heat dissipation shell 4's the inner wall, radiator fan 5's quantity sets up to two, two radiator fan 5 are located the both sides of pressure transmitter body 1 respectively, can improve air mobility through starting radiator fan 5, make the heat give off fast, the radiating effect is improved, the temperature of pressure transmitter body 1 has effectively been reduced.

In this embodiment, a cavity 6 is formed inside the heat dissipation housing 4, a water tank 7 is fixedly mounted on the outer wall of the heat dissipation housing 4, a tank cover 14 is screwed on the upper side of the water tank 7, a circulation pipe 8 and a first connection pipe 9 are fixedly connected to the outer side of the water tank 7, respectively, and one end of the circulation pipe 8, which is far away from the water tank 7, is communicated with the inner side of the cavity 6 and is fixedly connected with the inner side of the heat dissipation housing 4.

It should be noted that a water pump 10 is disposed on an outer side of the first connection pipe 9 away from the water tank 7, wherein the water pump 10 is fixedly mounted on an outer wall of the water tank 7, the first connection pipe 9 is fixedly mounted with an input end of the water pump 10, and a second connection pipe 11 is fixedly mounted on an output end of the water pump 10.

It should be noted that, a semiconductor refrigerator 12 is disposed at an end of the second connecting pipe 11 away from the water pump 10, wherein the semiconductor refrigerator 12 is fixedly mounted on an outer wall of the heat dissipation casing 4, the second connecting pipe 11 is fixedly mounted with an input end of the semiconductor refrigerator 12, a delivery pipe 13 is fixedly mounted on an output end of the semiconductor refrigerator 12, and an end of the delivery pipe 13 away from the semiconductor refrigerator 12 communicates with an inner side of the cavity 6 and is fixedly connected with the inner side of the heat dissipation casing 4.

It should be noted that the heat dissipation housing 4 is made of aluminum alloy, and the aluminum alloy has good thermal conductivity and is convenient for heat dissipation.

This embodiment is when using, through to the inside coolant liquid that injects of water tank 7, make the coolant liquid can get into semiconductor cooler 12 under the operation of water pump 10, utilize semiconductor cooler 12 to carry out refrigeration treatment to the coolant liquid, make the coolant liquid flow into in cavity 6, flow back to in the water tank 7 again, at the inside in-process that flows of cavity 6, improve the air flow nature through starting radiator fan 5, make pressure transmitter body 1's heat give off fast, the coolant liquid carries out the heat exchange through the heat that heat dissipation shell 4 and pressure transmitter body 1 gived off, thereby dispel the heat fast to it.

The beneficial effects of the above embodiment are as follows:

this high temperature resistant pressure transmitter, can improve air mobility through starting radiator fan 5, make the heat give off fast, and simultaneously, the heat that utilizes the interior cooling liquid of cavity 6 of heat dissipation shell 4 interior flow and pressure transmitter body 1 to give off carries out the heat exchange, thereby carry out high-efficient heat dissipation to it, for pressure cell inside pressure transmitter body 1 provides the protection, high temperature has effectively been avoided damaging pressure cell and circuit board, the life of pressure transmitter body 1 has been prolonged, and the practicality is improved.

This high temperature resistant pressure transmitter through add the heat insulating board between pressure transmitter body 1 and screwed joint 3, and the material of heat insulating board 2 is glass fiber, and glass fiber has good thermal insulation heat retaining ability, has reduced the heat-conduction effect to effectively reduced the influence that high temperature was taken for pressure transmitter body 1.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high temperature resistant pressure transmitter, includes pressure transmitter body (1) and screwed joint (3), its characterized in that: the bottom of the pressure transmitter body (1) is fixedly connected with a heat insulation plate (2), and a heat dissipation assembly is arranged on the outer side of the pressure transmitter body (1);

the heat dissipation assembly comprises a heat dissipation shell (4), a heat dissipation fan (5) is fixedly mounted on the inner wall of the heat dissipation shell (4), a cavity (6) is formed in the heat dissipation shell (4), a water tank (7) is fixedly mounted on the outer wall of the heat dissipation shell (4), the outer side of the water tank (7) is fixedly connected with a circulating pipe (8) and a first connecting pipe (9), the outer side, away from the water tank (7), of the first connecting pipe (9) is provided with a water pump (10), a second connecting pipe (11) is fixedly mounted on the output end of the water pump (10), one end, away from the water pump (10), of the second connecting pipe (11) is provided with a semiconductor refrigerator (12), and a conveying pipe (13) is fixedly mounted on the output end of the semiconductor refrigerator (12).

2. The high temperature resistant pressure transmitter of claim 1, wherein: the heat dissipation shell (4) is fixedly installed on the outer side of the pressure transmitter body (1), and the upper end of the threaded connector (3) penetrates through the inner side of the heat insulation plate (2) and is fixedly connected with the bottom of the pressure transmitter body (1).

3. The high temperature resistant pressure transmitter of claim 1, wherein: the upper side of the water tank (7) is in threaded connection with a tank cover (14), and one end, far away from the water tank (7), of the circulating pipe (8) is communicated with the inner side of the cavity (6) and is fixedly connected with the inner side of the heat dissipation shell (4).

4. The high temperature resistant pressure transmitter of claim 1, wherein: the water pump (10) is fixedly mounted on the outer wall of the water tank (7), and the first connecting pipe (9) is fixedly mounted with the input end of the water pump (10).

5. The high temperature resistant pressure transmitter of claim 1, wherein: the semiconductor refrigerator (12) is fixedly installed on the outer wall of the heat dissipation shell (4), and the second connecting pipe (11) is fixedly installed with the input end of the semiconductor refrigerator (12).

6. The high temperature resistant pressure transmitter of claim 1, wherein: one end of the conveying pipe (13) far away from the semiconductor refrigerator (12) is communicated with the inner side of the cavity (6) and is fixedly connected with the inner side of the heat dissipation shell (4).

7. The high temperature resistant pressure transmitter of claim 1, wherein: the number of the heat radiation fans (5) is two, and the two heat radiation fans (5) are respectively positioned on two sides of the pressure transmitter body (1).