CN114326988A - Water-cooled cooling device and efficiency detection system thereof - Google Patents
Water-cooled cooling device and efficiency detection system thereof Download PDFInfo
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- CN114326988A CN114326988A CN202111386283.4A CN202111386283A CN114326988A CN 114326988 A CN114326988 A CN 114326988A CN 202111386283 A CN202111386283 A CN 202111386283A CN 114326988 A CN114326988 A CN 114326988A
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Abstract
The invention relates to the technical field of cooling devices, in particular to a water-cooled cooling device and an efficiency detection system thereof; the water tank is provided with a semiconductor refrigerator, one end of the heat conduction column is bonded with the heat absorbing plate, the other end of the heat conduction column is bonded with the heat dissipating plate, one end, far away from the heat conduction column, of the heat dissipating plate is provided with heat dissipating fins, the cooling pipeline corresponds to the heat dissipating fins, the heat absorbing plate is bonded on an object to be cooled, the heat generated by the object is absorbed through the heat absorbing plate, the heat is transmitted to the heat dissipating fins through the heat conduction column, after the semiconductor refrigerator cools water in the water tank, the cooled water is conveyed to the cooling pipeline through the water pump, the cooling pipeline is in contact with the heat dissipating fins, heat dissipation is carried out, the traditional water cooling mode is avoided, the water cooling head is directly in contact with the object with the heat dissipating body, condensate is leaked, and great loss is caused.
Description
Technical Field
The invention relates to the technical field of cooling devices, in particular to a water-cooled cooling device and an efficiency detection system thereof.
Background
The computer CPU is a central data processor with high integration characteristic, which maintains the operation of the whole computer equipment, and the temperature of the central processor can be gradually increased in the operation process of the computer equipment, and the central processor is an electronic chip which has relatively small volume and is easy to store heat.
In order to obtain a better heat dissipation effect, most of the existing CPU processors adopt a water-cooled cooling device for heat dissipation, but a cooling head of the water-cooled cooling device directly contacts with an object to be cooled, and once a cooling liquid in the water-cooled cooling device leaks, a large loss is caused.
Disclosure of Invention
The invention aims to provide a water-cooled cooling device and an efficiency detection system thereof, which solve the problem that the cooling head of the existing water-cooled cooling device in the prior art is directly contacted with an object to be cooled, and once the cooling liquid in the water-cooled head leaks, the large loss is caused.
In order to achieve the purpose, the invention provides a water-cooled cooling device which comprises a water tank, a water pump, a communicating pipe, a cooling pipeline and a heat exchange assembly, wherein one end of the communicating pipe is detachably connected with a water outlet of the water tank, the other end of the communicating pipe is detachably connected with an input end of the water pump, one end of the cooling pipeline is detachably connected with an output end of the water pump, the other end of the cooling pipeline is detachably connected with a water inlet of the water tank, and a semiconductor refrigerator is arranged on the water tank;
the heat exchange assembly comprises a heat absorption plate, a heat conduction column, a heat dissipation plate and heat dissipation fins, one end of the heat conduction column is bonded with the heat absorption plate, the other end of the heat conduction column is bonded with the heat dissipation plate, the heat dissipation fins are arranged at one end, far away from the heat conduction column, of the heat dissipation plate, and the cooling pipeline corresponds to the heat dissipation fins.
The heat absorption plate is adhered to an object to be cooled, heat generated by the object is absorbed through the heat absorption plate, the heat is transmitted to the radiating fins through the heat conduction columns, the semiconductor refrigerator cools water in the water tank and then conveys the cooled water to the cooling pipeline through the water pump, and the cooled water is in contact with the radiating fins through the cooling pipeline so as to dissipate heat, so that the problem that in the traditional water-cooling heat dissipation mode, a water cooling head is in direct contact with the object with the heat dissipation, condensate is leaked, and great loss is caused is solved.
The cooling pipeline comprises a cold water pipe, a coiled pipe and a hot water pipe, one end of the coiled pipe is detachably connected with the cold water pipe, the other end of the coiled pipe is detachably connected with the hot water pipe, the cold water pipe is detachably connected with the output end of the water pump, the hot water pipe is detachably connected with the water inlet of the water tank, and the coiled pipe is embedded between the gaps of the radiating fins.
Cold water is conveyed to the inside of the serpentine coil pipe through the cold water pipe, the serpentine coil pipe is embedded between gaps of the radiating fins, and after the cold water in the serpentine coil pipe and the radiating fins perform sufficient heat exchange, the heat-exchanged water is conveyed to the water tank through the hot water pipe for refrigeration.
The heat exchange assembly further comprises a supporting piece, one end of the supporting piece is detachably connected with the heat dissipation plate, and the other end of the supporting piece is sleeved outside the serpentine coil.
The support piece is arranged on the heat dissipation plate, and the serpentine coil is supported by the support piece, so that the serpentine coil is firmly embedded in the gaps of the heat dissipation fins.
The support piece comprises a connecting plate, a supporting plate and a supporting ring, the connecting plate is detachably connected with the heating panel, one end of the supporting plate is fixedly connected with the connecting plate, the other end of the supporting plate is connected with the supporting ring through a bolt, and the supporting ring is sleeved outside the serpentine coil.
And after the support ring is sleeved outside the serpentine coil, the support ring and the support plate are fixed by using bolts, and the connecting plate is fixed on the heat dissipation plate by using screws, so that the installation of the support piece is completed.
The support ring comprises a first half ring and a second half ring, a first connecting block is arranged at one end of the first half ring, a clamping block is arranged at the other end of the first half ring, a second connecting block is arranged at one end of the second half ring, a clamping groove is formed in the other end of the second half ring, the first connecting block and the second connecting block are both connected with the support plate through bolts, and the clamping block is matched with the clamping groove.
Sleeving the first half ring and the second half ring outside the serpentine coil, clamping the clamping block into the clamping groove, and fixing the first connecting block and the second connecting block with the supporting plate by using bolts, so that the supporting ring is installed.
The invention also provides an efficiency detection system for detecting the water-cooled cooling device, which comprises a first detection assembly, a second detection assembly and a controller, wherein the cold water pipe is provided with the first detection assembly, the hot water pipe is provided with the second detection assembly, the first detection assembly and the second detection assembly respectively comprise a first temperature sensor for detecting the temperature of water flow and a flow velocity sensor for detecting the velocity of the water flow, the water tank is internally provided with a second temperature sensor for detecting the temperature of the water flow, and the two first temperature sensors, the two flow velocity sensors and the second temperature sensor are electrically connected with the controller.
The two temperature sensors and the two flow rate sensors are used for respectively measuring the water flow temperature and the water flow rate at the cold water pipe and the hot water pipe, the heat exchange efficiency of the serpentine coil pipe at different flow rates is measured according to the temperature difference at the cold water pipe and the hot water pipe, the water temperature in the water tank is measured by the second temperature sensor, the refrigeration efficiency of the semiconductor refrigerator is measured, and the output power of the semiconductor refrigerator is adjusted.
The invention relates to a water-cooled cooling device and an efficiency detection system thereof, wherein one end of a cooling pipeline is detachably connected with the output end of a water pump, the other end of the cooling pipeline is detachably connected with the water inlet of a water tank, a semiconductor refrigerator is arranged on the water tank, one end of a heat conduction column is bonded with a heat absorption plate, the other end of the heat conduction column is bonded with a heat dissipation plate, one end of the heat dissipation plate, which is far away from the heat conduction column, is provided with heat dissipation fins, the cooling pipeline corresponds to the heat dissipation fins, the heat absorption plate is bonded on an object to be cooled, heat generated by the object is absorbed by the heat absorption plate, the heat is transmitted to the heat dissipation fins by using the heat conduction column, the semiconductor refrigerator cools water in the water tank and then conveys the cooled water to the cooling pipeline by the water pump, through the cooling pipeline with heat radiation fins contact to dispel the heat, avoid producing traditional water-cooling radiating mode, the water-cooling head directly with take the heat dissipation object contact, the condensate reveals, causes great loss's problem.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a water-cooled cooling device and an efficiency detection system thereof according to the present invention.
Fig. 2 is an enlarged view of a portion of the structure of fig. 1 a according to the present invention.
FIG. 3 is a schematic view of a connection structure of the heat exchange assembly and the serpentine coil provided by the invention.
Fig. 4 is an enlarged view of a portion of the structure of fig. 3 a according to the present invention.
Fig. 5 is a schematic view of a split structure of the support ring provided by the invention.
1-water tank, 11-semiconductor refrigerator, 2-water pump, 3-communicating pipe, 4-cooling pipeline, 41-cold water pipe, 42-serpentine coil pipe, 43-hot water pipe, 5-heat exchange component, 51-heat absorbing plate, 52-heat conducting column, 53-heat radiating plate, 531-heat radiating fin, 54-supporting piece, 541-connecting plate, 542-supporting plate, 543-supporting ring, 544-first half ring, 545-second half ring, 546-first connecting block, 547-clamping block, 548-second connecting block, 549-clamping groove, 55-sealed shell, 551-water discharging pipe, 56-bracket, 561-first fixing plate, 562-supporting rod, 563-second fixing plate, 6-first detecting component, 61-second detecting component, 62-controller, 63-first temperature sensor, 64-flow rate sensor, 65-second temperature sensor.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 5, the present invention provides a water-cooled cooling device, which includes a water tank 1, a water pump 2, a communicating pipe 3, a cooling pipeline 4 and a heat exchange assembly 5, wherein one end of the communicating pipe 3 is detachably connected to a water outlet of the water tank 1, the other end of the communicating pipe 3 is detachably connected to an input end of the water pump 2, one end of the cooling pipeline 4 is detachably connected to an output end of the water pump 2, the other end of the cooling pipeline 4 is detachably connected to a water inlet of the water tank 1, and a semiconductor refrigerator 11 is disposed on the water tank 1;
the heat exchange assembly 5 comprises an absorber plate 51, a heat conduction column 52, a heat dissipation plate 53 and heat dissipation fins 531, wherein one end of the heat conduction column 52 is bonded with the absorber plate 51, the other end of the heat conduction column 52 is bonded with the heat dissipation plate 53, the heat dissipation fins 531 are arranged at one end, away from the heat conduction column 52, of the heat dissipation plate 53, and the cooling pipeline 4 corresponds to the heat dissipation fins 531.
In this embodiment, the heat absorbing plate 51 is adhered to an object to be cooled, the heat absorbing plate 51 absorbs heat generated by the object, the heat conducting column 52 is utilized to transmit the heat to the heat dissipating fins 531, the semiconductor refrigerator 11 cools the water in the water tank 1, the cooled water is conveyed to the cooling pipeline 4 through the water pump 2, and the cooling pipeline 4 is in contact with the heat dissipating fins 531 to dissipate the heat, so that the problem of great loss caused by the fact that a condensate leaks due to direct contact of a water cooling head with the object with heat dissipation in the conventional water cooling heat dissipation mode is solved.
Further, the cooling pipeline 4 includes a cold water pipe 41, a serpentine coil 42 and a hot water pipe 43, one end of the serpentine coil 42 is detachably connected to the cold water pipe 41, the other end of the serpentine coil 42 is detachably connected to the hot water pipe 43, the cold water pipe 41 is detachably connected to the output end of the water pump 2, the hot water pipe 43 is detachably connected to the water inlet of the water tank 1, and the serpentine coil 42 is embedded between the gaps of the heat dissipation fins 531.
In this embodiment, the cold water pipe 41 delivers cold water to the inside of the serpentine coil 42, and the serpentine coil 42 is embedded between the gaps of the heat dissipation fins 531, so that the cold water in the serpentine coil 42 exchanges heat with the heat dissipation fins 531 sufficiently, and then the hot water pipe 43 delivers the heat exchanged water to the water tank 1 for refrigeration.
Further, the heat exchange assembly 5 further includes a supporting member 54, one end of the supporting member 54 is detachably connected to the heat dissipation plate 53, and the other end of the supporting member 54 is sleeved outside the serpentine coil 42.
In the present embodiment, the support 54 is provided on the radiator plate 53, and the serpentine coil 42 is supported by the support 54, so that the serpentine coil 42 is more firmly fitted into the gaps between the radiator fins 531.
Further, the supporting member 54 includes a connecting plate 541, a supporting plate 542 and a supporting ring 543, the connecting plate 541 is detachably connected to the heat dissipation plate 53, one end of the supporting plate 542 is fixedly connected to the connecting plate 541, the other end of the supporting plate 542 is connected to the supporting ring 543 by bolts, the supporting ring 543 is sleeved outside the serpentine coil 42, the supporting ring 543 includes a first half ring 544 and a second half ring 545, one end of the first half ring 544 is provided with a first connecting block 546, the other end of the first half ring 544 is provided with a clamping block 547, one end of the second half ring 545 is provided with a second connecting block 548, the other end of the second half ring 545 is provided with a clamping groove 549, the first connecting block 546 and the second connecting block 548 are both connected to the supporting plate 542 by bolts, and the clamping block 547 is matched with the clamping groove 549.
In this embodiment, the first half ring 544 and the second half ring 545 are sleeved on the outside of the serpentine coil 42, the clamping block 547 is clamped into the clamping groove 549, the first connecting block 546 and the second connecting block 548 are fixed to the supporting plate 542 by bolts, so as to complete the installation of the supporting ring 543, after the supporting ring 543 is sleeved on the outside of the serpentine coil 42, the supporting ring 543 and the supporting plate 542 are fixed by bolts, and the connecting plate 541 is fixed to the heat dissipation plate 53 by bolts, so as to complete the installation of the supporting member 54.
Further, the heat exchange assembly 5 further includes a closed shell 55, the closed box covers the heat dissipation plate 53 and the heat dissipation fins 531, and the heat conduction column 52 penetrates through the closed shell 55.
In this embodiment, the heat dissipation plate 53 and the heat dissipation fins 531 are covered with the sealed shell 55, so that the serpentine coil 42 is located inside the sealed shell 55, thereby preventing the serpentine coil 42 from being damaged, and preventing the coolant from leaking to damage the object.
Further, the outside of airtight shell 55 still is provided with support 56, support 56 includes first fixed plate 561, bracing piece 562 and second fixed plate 563, the one end of bracing piece 562 with first fixed plate 561 fixed connection, the other end of bracing piece 562 with second fixed plate 563 fixed connection, first fixed plate 561 with airtight shell 55 is dismantled and is connected, second fixed plate 563 is dismantled with the shell of waiting to cool off the object and is connected.
In this embodiment, utilize the screw will first fixed plate 561 is fixed on airtight shell 55, utilize the screw will second fixed plate 563 is fixed on the shell to the completion is right airtight shell 55's support makes airtight shell 55's structure is more stable, first fixed plate 561 with second fixed plate 563 all with bracing piece 562 fixed connection adopts the integrated into one piece technique to make during the manufacturing, and the structure is more firm.
Further, the bottom of the closed shell 55 is further provided with a water outlet, the water outlet is provided with the water discharge pipe 551, and one end of the water discharge pipe 551, which is far away from the water outlet, corresponds to the water tank 1 and is located above the water tank 1.
In the present embodiment, when the serpentine coil 42 is damaged and leaks, the coolant is transferred into the drain pipe 551 through the drain port and further into the water tank 1, so that the weight in the sealed case 55 is prevented from being too heavy, the load on the bracket 56 is prevented from being too large, and the structure is not stable enough.
The invention also provides an efficiency detection system for detecting the water-cooled cooling device, which comprises a first detection assembly 6, a second detection assembly 61 and a controller 62, wherein the first detection assembly 6 is arranged on the cold water pipe 41, the second detection assembly 61 is arranged on the hot water pipe 43, the first detection assembly 6 and the second detection assembly 61 respectively comprise a first temperature sensor 63 for detecting the temperature of water flow and a flow rate sensor 64 for detecting the speed of water flow, a second temperature sensor 65 for detecting the temperature of water flow is also arranged in the water tank 1, and the two first temperature sensors 63, the two flow rate sensors 64 and the second temperature sensor 65 are electrically connected with the controller 62.
In the present embodiment, the two temperature sensors and the two flow rate sensors 64 are used to measure the water flow temperature and the water flow rate at the cold water pipe 41 and the hot water pipe 43, respectively, the heat exchange efficiency of the serpentine coil 42 at different flow rates is measured according to the temperature difference at the cold water pipe 41 and the hot water pipe 43, and the water temperature in the water tank 1 is measured by the second temperature sensor 65, so as to measure the refrigeration efficiency of the semiconductor refrigerator 11, thereby adjusting the output power of the semiconductor refrigerator 11.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A water-cooled cooling device is characterized in that,
the water-cooled cooling device comprises a water tank, a water pump, a communicating pipe, a cooling pipeline and a heat exchange assembly, wherein one end of the communicating pipe is detachably connected with a water outlet of the water tank, the other end of the communicating pipe is detachably connected with an input end of the water pump, one end of the cooling pipeline is detachably connected with an output end of the water pump, the other end of the cooling pipeline is detachably connected with a water inlet of the water tank, and a semiconductor refrigerator is arranged on the water tank;
the heat exchange assembly comprises a heat absorption plate, a heat conduction column, a heat dissipation plate and heat dissipation fins, one end of the heat conduction column is bonded with the heat absorption plate, the other end of the heat conduction column is bonded with the heat dissipation plate, the heat dissipation fins are arranged at one end, far away from the heat conduction column, of the heat dissipation plate, and the cooling pipeline corresponds to the heat dissipation fins.
2. The water-cooled cooling device according to claim 1,
the cooling pipeline comprises a cold water pipe, a coiled pipe and a hot water pipe, one end of the coiled pipe is detachably connected with the cold water pipe, the other end of the coiled pipe is detachably connected with the hot water pipe, the cold water pipe is detachably connected with the output end of the water pump, the hot water pipe is detachably connected with the water inlet of the water tank, and the coiled pipe is embedded between the gaps of the heat dissipation fins.
3. The water-cooled cooling device according to claim 2,
the heat exchange assembly further comprises a supporting piece, one end of the supporting piece is detachably connected with the heat dissipation plate, and the other end of the supporting piece is sleeved outside the serpentine coil.
4. The water-cooled cooling device according to claim 3,
the support piece comprises a connecting plate, a supporting plate and a supporting ring, the connecting plate is detachably connected with the heating panel, one end of the supporting plate is fixedly connected with the connecting plate, the other end of the supporting plate is connected with the supporting ring through a bolt, and the supporting ring is arranged outside the serpentine coil.
5. The water-cooled cooling device according to claim 4,
the support ring comprises a first half ring and a second half ring, wherein one end of the first half ring is provided with a first connecting block, the other end of the first half ring is provided with a clamping block, one end of the second half ring is provided with a second connecting block, the other end of the second half ring is provided with a clamping groove, the first connecting block and the second connecting block are both connected with the support plate through bolts, and the clamping block is matched with the clamping groove.
6. An efficiency detecting system for detecting the water-cooled cooling device according to claim 2,
including first determine module, second determine module and controller, be provided with first determine module on the cold water pipe, be provided with second determine module on the hot-water line, first determine module with second determine module all is including the first temperature sensor who is used for detecting rivers temperature and the velocity sensor who is used for detecting water velocity, the inside of water tank still is provided with the second temperature sensor who is used for detecting rivers temperature, two first temperature sensor, two velocity sensor with second temperature sensor all with controller electric connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111386283.4A CN114326988A (en) | 2021-11-22 | 2021-11-22 | Water-cooled cooling device and efficiency detection system thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111386283.4A CN114326988A (en) | 2021-11-22 | 2021-11-22 | Water-cooled cooling device and efficiency detection system thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114326988A true CN114326988A (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111386283.4A Withdrawn CN114326988A (en) | 2021-11-22 | 2021-11-22 | Water-cooled cooling device and efficiency detection system thereof |
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| Country | Link |
|---|---|
| CN (1) | CN114326988A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115554852A (en) * | 2022-10-10 | 2023-01-03 | 江苏新宇天成环保有限公司 | Ceramic fine filtration system |
-
2021
- 2021-11-22 CN CN202111386283.4A patent/CN114326988A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115554852A (en) * | 2022-10-10 | 2023-01-03 | 江苏新宇天成环保有限公司 | Ceramic fine filtration system |
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Application publication date: 20220412 |
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