CN210667814U - Sensor cooling device - Google Patents
Sensor cooling device Download PDFInfo
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- CN210667814U CN210667814U CN201921931817.5U CN201921931817U CN210667814U CN 210667814 U CN210667814 U CN 210667814U CN 201921931817 U CN201921931817 U CN 201921931817U CN 210667814 U CN210667814 U CN 210667814U
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- sensor
- cooling liquid
- pipe
- cooling
- circulating pipe
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Abstract
The utility model relates to a sensor cooling device, including the first panel that the laminating sensor set up, set up in the coolant liquid circulating pipe of first panel back to sensor one side, set up in the cooling plate of coolant liquid circulating pipe periphery and connect the coolant liquid case of coolant liquid circulating pipe, the first panel is the heat-conducting plate, be provided with the heat dissipation mechanism on the cooling plate, the coolant liquid case is provided with feed liquor pipe and the drain pipe of connecting the coolant liquid circulating pipe, be provided with the circulating pump on the feed liquor pipe, still be provided with inlet and liquid outlet on the coolant liquid case, the inlet is used for filling up the coolant liquid to the coolant liquid case, the liquid outlet is used for discharging the coolant liquid in the water case; this cooling device sets up the heat-conducting plate through laminating the sensor, cooperates coolant liquid circulating pipe, coolant liquid case, heat dissipation mechanism to reach higher radiating effect simultaneously, ensures the safety of the inside device of sensor, increase of service life.
Description
Technical Field
The utility model relates to a cooling device especially relates to a sensor cooling device.
Background
The sensor is a high-precision instrument, the application field is wide, and the use environment is complex, so most sensors need to be subjected to metal welding and packaging due to the environment requirement, heat generated in the welding process has damage to components inside the sensor, and the service life of the sensor is influenced.
SUMMERY OF THE UTILITY MODEL
In order to guarantee that the sensor does not receive the thermal influence of welding, reduce sensor week side temperature, the utility model provides a sensor cooling device, this cooling device sets up the heat-conducting plate through laminating sensor, cooperates coolant liquid circulating pipe, coolant liquid case, heat dissipation mechanism to reach higher radiating effect simultaneously, ensures the safety of the inside device of sensor, increase of service life.
The utility model adopts the technical proposal that: a sensor cooling device comprises a first panel, a cooling liquid circulating pipe, a heat dissipation plate and a cooling liquid box, wherein the first panel is attached to a sensor, the cooling liquid circulating pipe is arranged on one side, back to the sensor, of the first panel, the heat dissipation plate is arranged on the periphery of the cooling liquid circulating pipe, the cooling liquid box is connected with the cooling liquid circulating pipe, the first panel is a heat conduction plate, a heat dissipation mechanism is arranged on the heat dissipation plate, the cooling liquid box is provided with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe and the liquid outlet pipe are connected with the cooling liquid circulating pipe, a circulating pump is arranged on the liquid inlet pipe, the cooling liquid box is further provided with a liquid inlet and a liquid outlet, the liquid inlet is used;
the heat dissipation mechanism comprises a groove and a heat dissipation fan, wherein the groove and the heat dissipation fan are arranged on the heat dissipation plate, and the groove is arranged on one side, facing the outside air, of the heat dissipation plate.
Furthermore, the first panel and the heat dissipation plate enclose a cavity, and the cooling liquid circulation pipe is arranged in the cavity.
Furthermore, a first cooling liquid circulating pipe and a second cooling liquid circulating pipe are arranged on one side, back to the sensor, of the first panel, an inlet of the first cooling liquid circulating pipe is arranged at a first position, an outlet of the first cooling liquid circulating pipe is arranged at a second position, an inlet of the second cooling liquid circulating pipe is arranged at a third position, an outlet of the second cooling liquid circulating pipe is arranged at a fourth position, the first position is adjacent to the fourth position, and the second position is adjacent to the third position.
Further, the first cooling liquid circulating pipe and the second cooling liquid circulating pipe are identical in spiral shape.
Furthermore, a first liquid inlet pipe and a first liquid outlet pipe corresponding to the first cooling liquid circulating pipe are arranged on the cooling liquid tank, and a second liquid inlet pipe and a second liquid outlet pipe corresponding to the second cooling liquid circulating pipe are arranged on the cooling liquid tank.
Furthermore, a temperature sensor used for monitoring the temperature of the sensor is arranged on the heat dissipation surface of the sensor, and the temperature sensor is connected with the circulating pump through the single chip microcomputer.
The utility model discloses produced beneficial effect includes: the utility model provides a sensor cooling device sets up the heat-conducting plate through laminating sensor, cooperates coolant liquid circulating pipe, coolant liquid case, heat dissipation mechanism simultaneously to reach higher radiating effect, ensures the safety of the inside device of sensor, increase of service life. The device is also suitable for the sensor which is in a high-temperature environment for a long time, and the cooling device can be used as a base to be fixed on the sensor.
Drawings
FIG. 1 is a schematic structural view of a sensor cooling device according to the present invention;
FIG. 2 is a schematic structural view of the heat-conducting plate of the present invention;
fig. 3 is a schematic structural view of the heat dissipation plate of the present invention;
FIG. 4 is a schematic view of the structure of the cooling liquid tank of the present invention;
in the figure, 1, a heat conducting plate, 2, a heat radiating plate, 3, a first cooling circulating pipe, 4, a second cooling circulating pipe, 5, an inlet of the first cooling circulating pipe, 6, an outlet of the first cooling circulating pipe, 7, an inlet of the second cooling circulating pipe, 8, an outlet of the second cooling circulating pipe, 9, a first liquid inlet, 10, a second liquid inlet, 11, a groove, 12 and a cooling liquid tank.
Detailed Description
The present invention is explained in further detail below with reference to the drawings and the detailed description, but it should be understood that the scope of the present invention is not limited by the detailed description.
As shown in fig. 1-4, a sensor cooling device in the present invention includes a first panel disposed on a sensor, a coolant circulation pipe disposed on a side of the first panel opposite to the sensor, a heat dissipation plate 2 disposed on a periphery of the coolant circulation pipe, and a coolant tank 12 connected to the coolant circulation pipe, the first panel is a heat conduction plate 1, the heat dissipation plate 2 is provided with a heat dissipation mechanism, the coolant tank 12 is provided with a liquid inlet pipe and a liquid outlet pipe connected to the coolant circulation pipe, the liquid inlet pipe is provided with a circulation pump, the coolant tank 12 is further provided with a liquid inlet and a liquid outlet, the liquid inlet is used for filling coolant into the coolant tank 12, and the liquid outlet is used for discharging coolant in the liquid tank; the heat dissipation mechanism comprises a groove 11 and a heat dissipation fan which are arranged on the heat dissipation plate 2, and the groove 11 is arranged on one side, facing the outside air, of the heat dissipation plate 2; a temperature sensor is arranged on the radiating surface of the sensor and connected with the circulating pump through a single chip microcomputer, and when the temperature is detected to be higher than a set value, the circulating pump is started through the single chip microcomputer to start circulating cooling of the sensor. The first panel and the heat dissipation plate 2 enclose a cavity, the cooling liquid circulating pipe is arranged in the cavity, the first panel is attached to the sensor and used for transferring heat of the sensor to cooling liquid, and the heat dissipation plate 2 is used for timely dissipating the heat in the cavity.
In order to realize uniform heat dissipation at all positions of the sensor and avoid the problems of fast heat dissipation at a coolant inlet end and slow heat dissipation at a coolant outlet end caused by one coolant circulating pipe, in the embodiment, a first coolant circulating pipe 3 and a second coolant circulating pipe 4 are arranged on one side of the first panel, which is opposite to the sensor, an inlet 5 of the first coolant circulating pipe is arranged at a first position, an outlet 6 of the first coolant circulating pipe is arranged at a second position, an inlet 7 of the second coolant circulating pipe is arranged at a third position, an outlet 8 of the second coolant circulating pipe is arranged at a fourth position, the first position is adjacent to the fourth position, and the second position is adjacent to the third position. The first cooling liquid circulation pipe 3 and the second cooling liquid circulation pipe 4 have the same spiral (zigzag) shape, and the two pipes are always parallel. A first liquid inlet 9 and a first liquid outlet corresponding to the first cooling liquid circulating pipe 3 are arranged on the cooling liquid tank 12, and a second liquid inlet 10 and a second liquid outlet corresponding to the second cooling liquid circulating pipe 4 are arranged on the cooling liquid tank 12.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the content of the embodiment. It will be apparent to those skilled in the art that various changes and modifications can be made within the technical scope of the present invention, and any changes and modifications made are within the protective scope of the present invention.
Claims (6)
1. A sensor cooling device, characterized by: the cooling system comprises a first panel, a cooling liquid circulating pipe, a heating panel and a cooling liquid box, wherein the first panel is attached to a sensor, the cooling liquid circulating pipe is arranged on one side, back to the sensor, of the first panel, the heating panel is arranged on the periphery of the cooling liquid circulating pipe, the cooling liquid box is connected with the cooling liquid circulating pipe, the first panel is a heat conducting plate, a heat radiating mechanism is arranged on the heating panel, the cooling liquid box is provided with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is connected with the cooling liquid circulating pipe, a circulating pump is arranged on the liquid inlet pipe, the cooling liquid box is also provided with a liquid inlet and a liquid outlet, the liquid inlet is used for filling cooling liquid into;
the heat dissipation mechanism comprises a groove and a heat dissipation fan, wherein the groove and the heat dissipation fan are arranged on the heat dissipation plate, and the groove is arranged on one side, facing the outside air, of the heat dissipation plate.
2. The sensor cooling arrangement of claim 1, wherein: the first panel and the heat dissipation plate enclose a cavity, and the cooling liquid circulation pipe is arranged in the cavity.
3. The sensor cooling arrangement of claim 1, wherein: the sensor is characterized in that a first cooling liquid circulating pipe and a second cooling liquid circulating pipe are arranged on one side, back to the sensor, of the first panel, an inlet of the first cooling liquid circulating pipe is arranged at a first position, an outlet of the first cooling liquid circulating pipe is arranged at a second position, an inlet of the second cooling liquid circulating pipe is arranged at a third position, an outlet of the second cooling liquid circulating pipe is arranged at a fourth position, the first position is adjacent to the fourth position, and the second position is adjacent to the third position.
4. The sensor cooling arrangement of claim 3, wherein: the first cooling liquid circulating pipe and the second cooling liquid circulating pipe are identical in spiral shape.
5. The sensor cooling arrangement of claim 3, wherein: the cooling liquid box is provided with a first liquid inlet pipe and a first liquid outlet pipe which correspond to the first cooling liquid circulating pipe, and the cooling liquid box is provided with a second liquid inlet pipe and a second liquid outlet pipe which correspond to the second cooling liquid circulating pipe.
6. The sensor cooling arrangement of claim 1, wherein: the heat dissipation surface of the sensor is provided with a temperature sensor for monitoring the temperature of the sensor, and the temperature sensor is connected with the circulating pump through the single chip microcomputer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921931817.5U CN210667814U (en) | 2019-11-11 | 2019-11-11 | Sensor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921931817.5U CN210667814U (en) | 2019-11-11 | 2019-11-11 | Sensor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210667814U true CN210667814U (en) | 2020-06-02 |
Family
ID=70812195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921931817.5U Active CN210667814U (en) | 2019-11-11 | 2019-11-11 | Sensor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210667814U (en) |
-
2019
- 2019-11-11 CN CN201921931817.5U patent/CN210667814U/en active Active
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