CN219552317U - Heat conductivity coefficient measuring device based on semiconductor refrigeration technology - Google Patents

Abstract

The utility model discloses a heat conductivity coefficient measuring device based on a semiconductor refrigeration technology, which comprises a power supply assembly and a measuring assembly, wherein the measuring assembly comprises a first copper plate, a first temperature detector is arranged in the first copper plate and is electrically connected with the power supply assembly, an ice plate is arranged on the bottom surface of the first copper plate, a second copper plate is arranged on the bottom surface of the ice plate, a second temperature detector is arranged in the second copper plate and is electrically connected with the power supply assembly, a semiconductor refrigeration sheet is arranged on the bottom surface of the second copper plate and is electrically connected with the power supply assembly, and a heat radiating device is arranged on the bottom surface of the semiconductor refrigeration sheet. The utility model provides a thermal conductivity coefficient measuring device based on a semiconductor refrigeration technology, which is used for measuring the thermal conductivity coefficient of ice in a normal temperature environment.

Description

Heat conductivity coefficient measuring device based on semiconductor refrigeration technology

Technical Field

The utility model relates to the technical field of measurement control, in particular to a device for measuring heat conductivity coefficient based on a semiconductor refrigeration technology.

Background

The heat conductivity coefficient is a parameter for representing the heat conductivity of the material, and has important effects in the fields of chemical industry, energy, power engineering and the like. The measurement of the thermal conductivity of ice is of great significance to the study of the thermal performance parameters of frozen soil.

The existing thermal conductivity measuring instrument mainly comprises a host and a test bench, wherein the host supplies power to the test bench and is connected with a temperature test probe to display temperature data, a main working area in the test bench is divided into three layers, as shown in fig. 1, an upper layer is a heating disc, the upper layer is controlled by the host, a tested object (required to be fixed) is arranged in the middle, and a lower layer is a heat dissipation disc. The device generates heat by using the upper plate, generates relatively stable heat flow (an arrow is a heat flow direction) in the three-layer structure, so that a temperature difference is formed between the upper surface and the lower surface of the tested object, and then the heat conductivity coefficient is solved in a combined way by using the heat dissipation rate of the lower surface and the geometric dimension of the tested object. When the thermal conductivity of ice is measured by using the existing measuring instrument, the ice is easy to melt under the normal temperature condition, and a lower temperature environment needs to be provided, so that the thermal conductivity of ice cannot be measured under the normal temperature, namely, the thermal conductivity of an object below zero ℃ cannot be measured.

Disclosure of Invention

The utility model aims to provide a device for measuring the heat conductivity coefficient based on a semiconductor refrigeration technology, which is used for measuring the heat conductivity coefficient of ice in a normal temperature environment.

The utility model discloses a heat conductivity coefficient measuring device based on a semiconductor refrigeration technology, which adopts the following technical scheme:

the utility model provides a coefficient of heat conductivity survey device based on semiconductor refrigeration technique, includes power supply unit and survey subassembly, survey subassembly includes first copper dish, be equipped with first thermoscope in the first copper dish, first thermoscope and power supply unit electric connection, the bottom surface of first copper dish is equipped with the ice dish, the bottom surface of ice dish is equipped with the second copper dish, be equipped with the second thermoscope in the second copper dish, second thermoscope and power supply unit electric connection, the bottom surface of second copper dish is equipped with the semiconductor refrigeration piece, semiconductor refrigeration piece and power supply unit electric connection, the bottom surface of semiconductor refrigeration piece is equipped with heat abstractor.

As the preferred scheme, heat abstractor includes water tank and basin, the bottom surface of semiconductor refrigeration piece is located to the water tank, the both sides of water tank all communicate with the basin through two raceway, be equipped with first water pump and second water pump in the basin, first water pump and second water pump all with power module electric connection, first water pump communicates with water tank one side through two raceway, second water pump communicates with water tank opposite side through two raceway.

As the preferred scheme, survey subassembly still includes the spacing collar cover, the recess has all been seted up at the both ends of spacing collar cover inner peripheral wall, first copper dish and second copper dish card respectively go into two recesses in, the ice dish is located between first copper dish and the second copper dish.

Preferably, the first temperature detector and the second temperature detector are temperature sensors.

The utility model discloses a heat conductivity coefficient measuring device based on a semiconductor refrigeration technology, which has the beneficial effects that: the power supply assembly converts 220V alternating current into 12V direct current to supply power to the semiconductor refrigerating sheet, the first temperature detector and the second temperature detector, the semiconductor refrigerating sheet can transfer heat from the second copper plate to a radiating device below when the semiconductor refrigerating sheet is electrified, and the radiating device takes away the heat, so that the first copper plate, the ice plate and the second copper plate generate downward heat flow, meanwhile, the first temperature detector and the second temperature detector are respectively arranged in the first copper plate and the second copper plate to record temperature data, and finally, the heat conductivity coefficient of ice is calculated according to a recorded data substitution heat conductivity coefficient calculation formula, and the heat conductivity coefficient of ice is measured in a normal temperature environment.

Drawings

FIG. 1 is a schematic diagram of a conventional test bench according to the present utility model.

Fig. 2 is a schematic structural diagram of a thermal conductivity measuring device based on the semiconductor refrigeration technology according to the present utility model.

Fig. 3 is a schematic structural diagram of a measurement assembly of a thermal conductivity measuring device based on the semiconductor refrigeration technology according to the present utility model.

10. A power supply assembly; 20. a measurement assembly; 21. a first copper plate; 22. a second copper plate; 23. an ice tray; 24. a semiconductor refrigeration sheet; 25. a limiting ring sleeve; 31. a first temperature measurer; 32. a second temperature measurer; 41. a water tank; 42. a water tank; 43. a first water pump; 44. a second water pump; 45. a water pipe; 51. a heating disc; 52. an object to be tested; 53. a heat dissipation disc.

Detailed Description

The utility model is further illustrated and described below in conjunction with the specific embodiments and the accompanying drawings:

referring to fig. 2 and 3, a thermal conductivity measuring device based on a semiconductor refrigeration technology includes a power module 10 and a measuring module 20, the measuring module 20 includes a first copper plate 21, a first temperature detector 31 is disposed in the first copper plate 21, the first temperature detector 31 is electrically connected with the power module 10, an ice plate 23 is disposed on a bottom surface of the first copper plate 21, a second copper plate 22 is disposed on a bottom surface of the ice plate 23, a second temperature detector 32 is disposed in the second copper plate 22, the second temperature detector 32 is electrically connected with the power module 10, the first temperature detector 31 and the second temperature detector 32 are both temperature sensors, a semiconductor refrigeration sheet 24 is disposed on a bottom surface of the second copper plate 22, the semiconductor refrigeration sheet 24 is electrically connected with the power module 10, and a heat dissipation device is disposed on a bottom surface of the semiconductor refrigeration sheet 24.

As can be seen from the above description, the power supply assembly 10 converts 220V ac power into 12V dc power to supply power to the semiconductor refrigeration sheet 24, the first temperature detector 31 and the second temperature detector 32, the semiconductor refrigeration sheet 24 can transfer heat from the second copper plate 22 to the heat dissipation device below when in power-on operation, and the heat dissipation device takes away heat, so that the first copper plate 21, the ice plate 23 and the second copper plate 22 generate downward heat flow, meanwhile, the first copper plate 21 and the second copper plate 22 are respectively provided with the first temperature detector 31 and the second temperature detector 32 to record temperature data, and finally the recorded data are substituted into a thermal conductivity coefficient calculation formula to calculate the thermal conductivity coefficient of ice, thereby realizing measurement of the thermal conductivity coefficient of ice in a normal temperature environment. The specific thermal conductivity coefficient calculation formula is as follows:

referring to fig. 2, the heat dissipating device includes a water tank 41 and a water tank 42, the water tank 41 is disposed on the bottom surface of the semiconductor refrigeration sheet 24, two sides of the water tank 41 are respectively communicated with the water tank 42 through two water pipes 45, a first water pump 43 and a second water pump 44 are disposed in the water tank 42, the first water pump 43 and the second water pump 44 are respectively electrically connected with the power supply assembly 10, the first water pump 43 is communicated with one side of the water tank 41 through two water pipes 45, and the second water pump 44 is communicated with the other side of the water tank 41 through two water pipes 45.

As can be seen from the above description, the heat dissipation device is a water circulation heat dissipation device, and the semiconductor refrigeration piece 24 transfers heat from the second copper plate 22 to the lower water tank 41 during operation, and then the first water pump 43 and the second water pump 44 are operated to form water circulation to take away heat, so that the first copper plate 21, the ice plate 23 and the second copper plate 22 generate downward heat flow.

Referring to fig. 3, the measuring assembly 20 further includes a limiting collar 25, both ends of the inner peripheral wall of the limiting collar 25 are provided with grooves, the first copper plate 21 and the second copper plate 22 are respectively clamped into the two grooves, and the ice plate 23 is disposed between the first copper plate 21 and the second copper plate 22.

As can be seen from the above description, the first copper plate 21, the second copper plate 22 and the ice plate 23 are all installed through the stop collar 25, which is convenient and stable for subsequent measurement.

The utility model provides a heat conductivity coefficient measuring device based on a semiconductor refrigeration technology, wherein a power supply component converts 220V alternating current into 12V direct current to supply power to a semiconductor refrigeration sheet, a first temperature detector and a second temperature detector, the semiconductor refrigeration sheet can transfer heat from a second copper plate to a radiating device below when the semiconductor refrigeration sheet is electrified, and the radiating device takes away the heat, so that the first copper plate, an ice plate and the second copper plate generate downward heat flow, meanwhile, the first copper plate and the second copper plate are respectively provided with the first temperature detector and the second temperature detector to record temperature data, and finally the recorded data are substituted into a heat conductivity coefficient calculation formula to calculate the heat conductivity coefficient of ice, and the heat conductivity coefficient of ice is measured in a normal temperature environment.

Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.

Claims (4)

1. The utility model provides a coefficient of thermal conductivity survey device based on semiconductor refrigeration technique, its characterized in that, includes power supply unit and survey subassembly, survey subassembly includes first copper dish, be equipped with first thermoscope in the first copper dish, first thermoscope and power supply unit electric connection, the bottom surface of first copper dish is equipped with the ice dish, the bottom surface of ice dish is equipped with the second copper dish, be equipped with the second thermoscope in the second copper dish, second thermoscope and power supply unit electric connection, the bottom surface of second copper dish is equipped with the semiconductor refrigeration piece, semiconductor refrigeration piece and power supply unit electric connection, the bottom surface of semiconductor refrigeration piece is equipped with heat abstractor.

2. The device for measuring the heat conductivity coefficient based on the semiconductor refrigeration technology according to claim 1, wherein the heat radiating device comprises a water tank and a water tank, the water tank is arranged on the bottom surface of the semiconductor refrigeration piece, two sides of the water tank are communicated with the water tank through two water pipes, a first water pump and a second water pump are arranged in the water tank and are electrically connected with the power supply assembly, the first water pump is communicated with one side of the water tank through the two water pipes, and the second water pump is communicated with the other side of the water tank through the two water pipes.

3. The device for measuring the heat conductivity coefficient based on the semiconductor refrigeration technology according to claim 1, wherein the measuring assembly further comprises a limiting collar sleeve, grooves are formed in two ends of the inner peripheral wall of the limiting collar sleeve, the first copper plate and the second copper plate are respectively clamped into the two grooves, and the ice plate is arranged between the first copper plate and the second copper plate.

4. The device for measuring thermal conductivity based on semiconductor refrigeration technology as claimed in claim 1, wherein said first temperature measuring device and said second temperature measuring device are temperature sensors.